Underfill dispensing system for integrated circuits
Номер патента: MY147815A
Опубликовано: 31-01-2013
Автор(ы): Vemal Raja Manikam, Vittal Raja Manikam, Yit Meng Lee
Принадлежит: FREESCALE SEMICONDUCTOR INC
Опубликовано: 31-01-2013
Автор(ы): Vemal Raja Manikam, Vittal Raja Manikam, Yit Meng Lee
Принадлежит: FREESCALE SEMICONDUCTOR INC
Реферат: A SYSTEM (100) FOR DISPENSING AN UNDERFILL MATERIAL BETWEEN AN INTEGRATED CIRCUIT (IC) CHIP (116) AND A SUBSTRATE (118) INCLUDES A PLATFORM (102) AT WHICH THE UNDERFILL MATERIAL IS SUPPLIED. THE IC CHIP (116) AND THE SUBSTRATE (118) ARE MOUNTED AT THE PERIPHERY OF THE PLATFORM (102) . THE PLATFORM (102) ROTATES AND FACILITATES THE MOVEMENT OF THE UNDERFILL MATERIAL TOWARD THE IC CHIP (116) AND THE SUBSTRATE (118). THE SYSTEM (100) FURTHER INCLUDES A BERNOULLI TUBE (104) THAT IS LOCATED PROXIMATE TO THE IC CHIP (116) AND THE SUBSTRATE (118). THE BERNOULLI TUBE (104) GENERATES A LOW PRESSURE IN THE PROXIMITY OF THE IC PACKAGES (108). THE LOW PRESSURE FACILITATES THE DISPENSING OF THE UNDERFILL MATERIAL BETWEEN THE IC CHIP (116) AND THE SUBSTRATE (118).
Methods and systems for packaging an integrated circuit
Номер патента: US20200013768A1. Автор: Runzi Chang,Winston Lee. Владелец: Marvell Asia Pte Ltd. Дата публикации: 2020-01-09.