METHOD FOR MOUNTING A CIRCUIT ON A SUBSTRATE.
Номер патента: FR2696582B1
Опубликовано: 30-06-1995
Автор(ы): Bustrich Gunther, Lundstrom Pontus
Принадлежит: Telefonaktiebolaget LM Ericsson AB
Опубликовано: 30-06-1995
Автор(ы): Bustrich Gunther, Lundstrom Pontus
Принадлежит: Telefonaktiebolaget LM Ericsson AB
Реферат: The present invention provides a method when using chips for tape automated bonding, or TAB structures, whereby a demand of having particular cutting and bending tools for each type of TAB structure as well as a particular thermod will no longer be necessary for the mounting of the TAB structures in a final circuit configuration. The terminal leads of a TAB structure are cut along the four sides by means of a particular cutting tool. Furthermore either the chip is glued to the substrate and/or the remaining portions of the cut terminal leads of the TAB structure are glued to the substrate, whereby if desirable intermediate shielding or dielectric layers simply may be arranged, whereupon all terminals are wire-bonded to the substrate according to prior art. TAB structures hereby may conveniently be used also for low levels of production without a raised investment cost for particular different tools for the respective chips.
Method for improving the alignment of holes with other elements on a printed circuit board
Номер патента: US5710063A. Автор: Douglas W. Forehand,Karl A. Sauter. Владелец: Sun Microsystems Inc. Дата публикации: 1998-01-20.