Flux-free hard solder paste
Номер патента: EP1032483A1
Опубликовано: 06-09-2000
Автор(ы): Jurgen Koch, Leander Staab, Sandra Wittpahl
Принадлежит: Degussa GmbH, Degussa Huels AG
Опубликовано: 06-09-2000
Автор(ы): Jurgen Koch, Leander Staab, Sandra Wittpahl
Принадлежит: Degussa GmbH, Degussa Huels AG
Реферат: The invention relates to a flux-free hard solder paste, consisting of a fine solder with a copper-phosphor alloy base and a working temperature of not more than 700 °C, and a thermoplastic organic binder system. Said binder system consists of a mixture of polyisobutene with a relative molar mass of 50,000 to 500,000 and paraffin with a melting range of 40 to 90 °C.
Solid solder, hard soldering method, soldered article and paste containing said hard solder
Номер патента: RU2458770C2. Автор: Пер ШЁДИН. Владелец: Альфа Лаваль Корпорейт Аб. Дата публикации: 2012-08-20.