Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same .

Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same

Номер патента: KR100990316B1
Опубликовано: 26-10-2010
Автор(ы): 가즈히토 고바야시, 다이스케 후지모토, 다카유키 스에요시, 야스유키 미즈노, 히로시 시미즈
Принадлежит: 히다치 가세고교 가부시끼가이샤
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Рисунок 1. Взаимосвязь патентов (ближайшие 20).

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