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INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

Номер патента: US20190096791A1
Опубликовано: 28-03-2019
Автор(ы): Chih-Hsien Lin, Dai-Jang CHEN, Hsiang-Tai Lu, Hsien-Wen Liu, Po-Yao Chuang, Shih-Ting Hung, Shin-puu Jeng
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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