Wafer mapping process control with indicator line
Номер патента: EP2973675A1
Опубликовано: 20-01-2016
Автор(ы): Ekgachai Kenganantanon, Matthew Bunker, Matthew Gibson, Prem Na-Namchiew
Принадлежит: Microchip Technology Inc
Опубликовано: 20-01-2016
Автор(ы): Ekgachai Kenganantanon, Matthew Bunker, Matthew Gibson, Prem Na-Namchiew
Принадлежит: Microchip Technology Inc
Реферат: A method for providing alignment in a die picking process may include aligning a semiconductor wafer based on a reference die, forming an indicator line relative to the reference die by picking a number of dice along a line extending across the wafer, and using the reference line to monitor a position of the picking machine relative to the wafer. A die attach machine may include a control system for automatically implementing such method.
Apparatus for integrated monitoring of wafers and for process control in semiconductor manufacturing and a method for use thereof
Номер патента: US20020179841A1. Автор: Moshe Finarov. Владелец: Individual. Дата публикации: 2002-12-05.