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  • System including programmable integrated circuit including first areas having same shape and second areas formed between first areas, and operation processing device and method for controlling the programmable integrated circuit

System including programmable integrated circuit including first areas having same shape and second areas formed between first areas, and operation processing device and method for controlling the programmable integrated circuit

Номер патента: US10319436B2
Опубликовано: 11-06-2019
Автор(ы): Hidetoshi Matsumura
Принадлежит: Fujitsu Ltd
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Tunable protection system for integrated circuits

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Apparatus and system including extraction optics having movable blockers

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Apparatus and system including extraction optics having movable blockers

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Semiconductor integrated circuit including internal circuits and electrostatic discharge protection circuits

Номер патента: US20110310515A1. Автор: Hirofumi Hayashi. Владелец: Renesas Electronics Corp. Дата публикации: 2011-12-22.

Chiller operation system for ess batteries and operating method thereof

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Circuit system and manufacturing and operating method therefor

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Three-dimensional semiconductor memory device andelectronic system including the same

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Integrated circuit system with contact distribution film

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Semiconductor integrated circuit and semiconductor integrated circuit manufacturing method

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Interconnecting mechanism for 3D integrated circuit

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Counterbalancing mechanism and power tool having same

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Electrostatic discharge protection for integrated circuit during back end-of-line processing

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Electromechanical brake system including a force application apparatus

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Signal processing semiconductor integrated circuit device

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Signal processing semiconductor integrated circuit device

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Communication system, communication apparatus, and communication integrated circuit

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Three-dimensional semiconductor memory device and electronic system including the same

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Motor train unit feces collecting system and operating method thereof

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Integrated circuit package system with pad to pad bonding

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Golf club grip with irregular pentagon shape and/or dual shaft receiving apertures

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Leadless integrated circuit packaging system and method of manufacture thereof

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Cleaning Systems Including Dampened Tissues and Methods of Its Use

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Ultrasonic endoscope system and operating method for ultrasonic endoscope system

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Integrated circuit packaging system with vertical interconnects and method of manufacture thereof

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Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof

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Mountable integrated circuit package system with substrate

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Leadless integrated circuit packaging system and method of manufacture thereof

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Fuel cell system and operation method thereof

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Integrated circuit packaging system with film assistance mold and method of manufacture thereof

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Motor train unit feces collecting system and operating method thereof

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Semiconductor device and an electronic system including the same

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Door assemblies and communications cable management systems including the same

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Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof

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Fuel cell system and operation method thereof

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Integrated circuit packaging system with dielectric support and method of manufacture thereof

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Semiconductor device, electronic system including the same, and method of fabricating the same

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Integrated circuit

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Semiconductor Device and Integrated Circuit

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Medical device support system including rotational control mechanism

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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

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INTEGRATED CIRCUIT WAFER DICING METHOD

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Integrated circuit

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GATE ELECTRODE AND GATE CONTACT PLUG LAYOUTS FOR INTEGRATED CIRCUIT FIELD EFFECT TRANSISTORS

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Systems and Methods for Minimizing Static Leakage of an Integrated Circuit

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CLOCK DIVIDER CIRCUIT AND SYSTEM LSI HAVING SAME

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INTEGRATED CIRCUIT DEVICE WITH WELL CONTROLLED SURFACE PROXIMITY AND METHOD OF MANUFACTURING SAME

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FREQUENCY SPECIFIC CLOSED LOOP FEEDBACK CONTROL OF INTEGRATED CIRCUITS

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METHOD OF FABRICATING AN INTEGRATED CIRCUIT DEVICE

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Method for Packaging Electronic Devices and Integrated Circuits

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Irrigation system including electronic independent observer integration with fertigation system

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Vehicle mounted garbage bin cleaning system including power takeoff and drive shaft

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