Process for chemical mechanical polishing of a semiconductor substrate of an electronic component and polishing composition for this process
Номер патента: DE69024263T2
Опубликовано: 11-07-1996
Автор(ы): Anton Nenadic, Frank Benjamin Kaufman, Jeffrey William Carr, Kenneth Parker Rodbell, Lawrence Daniel David, Robert William Pasco, William John Patrick, William Leslie Guthrie
Принадлежит: International Business Machines Corp
Опубликовано: 11-07-1996
Автор(ы): Anton Nenadic, Frank Benjamin Kaufman, Jeffrey William Carr, Kenneth Parker Rodbell, Lawrence Daniel David, Robert William Pasco, William John Patrick, William Leslie Guthrie
Принадлежит: International Business Machines Corp
Use of an aqueous dispersion for chemical mechanical polishing and method for producing a semiconductor device
Номер патента: DE60325809D1. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Masayuki Motonari. Владелец: JSR Corp. Дата публикации: 2009-03-05.