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Optoelectronic package assemblies including solder reflow compatible fiber array units and methods for assembling the same

Номер патента: EP3828609A1
Опубликовано: 02-06-2021
Автор(ы): Douglas Llewellyn Butler, James Scott Sutherland
Принадлежит: Corning Research and Development Corp
Получить PDF файл: Открыть в новом окне

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