A method for attaching chips to a transponder
(19)AUSTRALIAN PATENT OFFICE (54) Title A method for attaching chips to a transponcer (51)6 International Patent Classification(s) H01L 021/50 H01L 021/98 (21) Application No: 2003282145 (22) Application Date: 2003 .11.18 (87) WIPO No: WO04/051701 (30) Priority Data (31) Number (32) Date 20022107 2002.11.29 (33) Country Fl 200511037 (43) Publication Date : 2004 .06.23 (43) Publication Journal Date : 2004 .07.29 (71) Applicant(s) UPM Rafsec Oy (72) Inventor(s) Stromberg, Juhani(-1-1) Application NoAU2003282145 A8(19)AUSTRALIAN PATENT OFFICE (54) Title A method for attaching chips to a transponcer (51)6 International Patent Classification(s) H01L 021/50 H01L 021/98 (21) Application No: 2003282145 (22) Application Date: 2003 .11.18 (87) WIPO No: WO04/051701 (30) Priority Data (31) Number (32) Date 20022107 2002.11.29 (33) Country Fl 200511037 (43) Publication Date : 2004 .06.23 (43) Publication Journal Date : 2004 .07.29 (71) Applicant(s) UPM Rafsec Oy (72) Inventor(s) Stromberg, Juhani-1- The present invention relates to a method for supplying chips (2) to cavities (5) of a chip carrier web (4) by allowing the chips (2) to flow over the chip carrier web (4) in a medium. The medium is a gas. The presentinvention also relates to a method for attaching chips (2) to transponders on a transponder web (1)comprising successive and/or adjacent circuitry patterns (3), or to a structural part web, from which structuralparts are separated and attached to the transponder web. The chips (2), which are located in cavities (5) of achip carrier web (4), are attached to precise locations on the transponder web (1), or the structural part web by bringing the transponder web (1), or the structural part web and the chips (2) in contact with each other in a nip (N1). Claims : 1. A method for supplying chips (2) to cavities (5) of a chip carrier web (4) by allowing the chips (2) to flow over the chip carrier web (4) in a medium, characterized in that the medium is a gas.
2. The method according to claim 1, characterized in that the chips (2) are supplied on a surface of the chip carrier web (4), and a gas stream is directed to the chips to move them along the chip carrier web (4) in such a manner that the chips are forced to drop into the cavities (5).
3. The method according to claim 1 or 2, characterized in that the chips (2) are held in the cavities (5) by a difference in pressure.
4. A method for attaching chips (2) to transponders on a transponder web (1) comprising successive and/or adjacent circuitry patterns (3), or to a structural part web, from which structural parts are separated and attached to the transponder web, characterized in that the chips (2), which are located in cavities (5) of a chip carrier web (4), are attached to precise locations on the transponder web (1), or the structural part web by bringing the transponder web (1), or the structural part web and the chips (2) in contact with each other in a nip (N1).
5. The method according to claim 4, characterized in that the speeds of the transponder web (1), or the structural part web and the chip carrier web (4) are synchronized.
6. The method according to claim 4 or 5, characterized in that the chips (2) are held in the cavities (5) by a difference in pressure.
7. The method according to any preceding claim 4-6, characterized in that the chips (2) are released from the cavities (5) by a difference in pressure.
8. The method according to any preceding claim 4-7, characterized in that the nip (N1) is formed between a roll and the chip carrier web (4).