Wiring substrate and process for manufacturing the same

17-11-2005 дата публикации

Номер:

US2005253263A1

Принадлежит:

Контакты:

Номер заявки: 7120305

Дата заявки: 04-03-2005

A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the nickel plated copper terminal pads has a phosphorus content of 8.5 to 15.0% by mass and is covered with a gold plating layer.

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/4 H01L21/48 H01L21/484 H01L21/4846 H01L23 H01L23/H01L23/4 H01L23/49 H01L23/498 H01L23/4981 H01L23/49816 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0002 H05 H05K H05K3 H05K3/H05K3/2 H05K3/24 H05K3/244 H05K3/3 H05K3/34 H05K3/345 H05K3/3457

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/4 H01L21/44 H01L21/48 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/49 H01L23/498 H05 H05K H05K1 H05K1/H05K1/1 H05K1/11 H05K3 H05K3/H05K3/1 H05K3/10 H05K3/2 H05K3/24 H05K3/3 H05K3/34