Semiconductor device and manufacturing method of semiconductor device

01-02-2024 дата публикации

Номер:

US20240038590A1

Автор: Akira Mori, Masakazu Takeda, Masaru OKUDA, Masashi UECHA, Masatake Nagaya, Mitsuru Kitaichi, naoya Kiyama, Yuji NAGUMO

Принадлежит: Denso Corp, Mirise Technologies Corp, Mitsuboshi Diamond Industrial Co Ltd, Toyota Motor Corp

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/3 H01L21/30 H01L21/304 H01L21/3043 H01L21/7 H01L21/78 H01L29 H01L29/H01L29/0 H01L29/06 H01L29/065 H01L29/0657

IPC - классификация

B B2 B23 B23K B23K2 B23K26 B23K26/B23K26/3 B23K26/36 B23K26/364 H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/7 H01L21/76 H01L21/762 H01L21/7625 H01L21/76254 H01L21/78

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