Chip package and method for forming the same.

Chip package and method for forming the same

Номер патента: US20150279808A1
Опубликовано: 01-10-2015
Автор(ы): Chia-Lun SHEN, Tsang-Yu Liu, Yen-Shih Ho, Yi-Ming Chang
Принадлежит: XinTec Inc
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Рисунок 1. Взаимосвязь патентов (ближайшие 20).

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