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Interconnect structure for stacked device and method

Номер патента: US20160276383A1
Опубликовано: 22-09-2016
Автор(ы): Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Min-Feng KAO, Shu-Ting Tsai, Tzu-Hsuan Hsu
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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