Packaging integrated circuits

An integrated circuit (12) is mounted on a flag portion (11) of a leadframe. The leadframe also includes lead posts (10) to which are connected electrical connectors or bond wires (13) extending between the posts (10) and the integrated circuit (12). A plastic package (A) is moulded around the lead posts (10), the flag (11), the integrated circuit (12) and the bond wires (13). A polymer material is coated on all surfaces exposed prior to moulding of the package (A). The polymer material used for this encapsulation is is of very low molecular weight and viscosity and provides protection of the integrated circuit from corrosion by being chemisorbed onto its surface. This effectively seals any problem in the integrity of the passivation layer preventing moisture ingress, collection and therefore corrosion. <IMAGE>