THICKNESS FILM CONDUCTOR COMPOSITION HAVING IMPROVED ADHESIVENESS

PROBLEM TO BE SOLVED: To improve the adhesiveness of soldering while minimizing the reduction of conductive solderability by compounding a metallic conductor phase, inorg. binder phase and specific adhesion accelerator at specific ratios.

SOLUTION: This thick film conductor compsn. is a base paste which consists of (A) 50 to 90 wt.% pulverized metallic conductor phase, (B) 1 to 18 wt.% inorg. binder phase and (C) 0.01 to 3.0 wt.% adhesion accelerator expressed by the general formula: [Ma¹⁺]_x[Mb²⁺]_1-xAl_2-xSi_2+xO₈ (Ma is Na or K; Mb is Ca; (x) is 0 to 1) and in which all of A, B and C are dispersed in an org. medium. C is, for example, crystalline anorthite, orthoclase or albite. The metallic conductor phase consists of, for example, Ag:Ag+Pd:Ag+Pt and the Pd content is 0 to 20 wt.% and the Pt content is 0 to 20 wt.%. The inorg. binder is, for example, one or ≥2 glass (e.g.: bismuthic acid frit) or oxide (e.g.: a mixture composed of copper oxide, pyrochlore compd., cobalt oxide, lead oxide, bismuth oxide).

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