Stacked chip package and method for forming the same

21-08-2017 дата публикации

Номер:

TWI596722B

Автор: 何彥仕, 劉滄宇, 張恕銘, 黃玉龍, 林超彥, 孫唯倫, 陳鍵輝, HO YEN SHIH, LIU TSANG YU, CHANG SHU MING, HUANG YU LUNG, LIN CHAO YEN, SUEN WEI LUEN, CHEN CHIEN HUI, HO, YEN SHIH, LIU, TSANG YU, CHANG, SHU MING, HUANG, YU LUNG, LIN, CHAO YEN, SUEN, WEI LUEN, CHEN, CHIEN HUI

Принадлежит: 精材科技股份有限公司, XINTEX INC, XINTEX INC.

Контакты:

Номер заявки: 24-25-10311

Дата заявки: 24-07-2014

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/02 H01L2224/023 H01L2224/0237 H01L2224/02371 H01L2224/02379 H01L2224/04 H01L2224/040 H01L2224/0404 H01L2224/04042 H01L2224/05 H01L2224/055 H01L2224/0554 H01L2224/05548 H01L2224/0556 H01L2224/05567 H01L2224/3 H01L2224/32 H01L2224/321 H01L2224/3214 H01L2224/32145 H01L2224/322 H01L2224/3222 H01L2224/32227 H01L2224/4 H01L2224/48 H01L2224/480 H01L2224/4809 H01L2224/48091 H01L2224/481 H01L2224/4814 H01L2224/48145 H01L2224/482 H01L2224/4822 H01L2224/48227 H01L2224/7 H01L2224/73 H01L2224/732 H01L2224/7326 H01L2224/73265 H01L23 H01L23/H01L23/3 H01L23/31 H01L23/312 H01L23/3121 H01L24 H01L24/H01L24/0 H01L24/05 H01L29 H01L29/H01L29/0 H01L29/06 H01L29/065 H01L29/0657 H01L292 H01L2924 H01L2924/H01L2924/1 H01L2924/10 H01L2924/101 H01L2924/1015 H01L2924/10156 H01L2924/18 H01L2924/181

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/60 H01L23 H01L23/H01L23/4 H01L23/48

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