Wire Bonding For Semiconductor Devices

17-02-2022 дата публикации

Номер:

US20220052014A1

Автор: Di Xiaofeng, Lei Yang, Lou Yuyun, Qian Zhonghua, Yan Junrong

Принадлежит: WESTERN DIGITAL TECHNOLOGIES, INC.

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/04 H01L2224/040 H01L2224/0404 H01L2224/04042 H01L2224/4 H01L2224/48 H01L2224/484 H01L2224/4845 H01L2224/4846 H01L2224/48463 H01L2224/4848 H01L2224/48482 H01L2224/7 H01L2224/78 H01L2224/789 H01L2224/7895 H01L2224/8 H01L2224/85 H01L2224/850 H01L2224/8503 H01L24 H01L24/H01L24/0 H01L24/04 H01L24/4 H01L24/48 H01L24/7 H01L24/78 H01L24/8 H01L24/85 H01L29 H01L292 H01L2924 H01L2924/H01L2924/3 H01L2924/38 H01L2924/381

IPC - классификация

B B2 B23 B23K B23K2 B23K20 B23K20/B23K20/1 B23K20/10 H H0 H01 H01L H01L2 H01L24 H01L24/H01L24/4 H01L24/48 H01L24/7 H01L24/78

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