Strain-compensating fill patterns for controlling semiconductor chip package interactions

14-05-2013 дата публикации

Номер:

US8441131B2

Автор: Vivian W. Ryan

Принадлежит: Globalfoundries Inc

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/02 H01L2224/021 H01L2224/0212 H01L2224/02125 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/05 H01L2224/050 H01L2224/0509 H01L2224/05096 H01L2224/055 H01L2224/0555 H01L2224/05554 H01L2224/0556 H01L2224/05567 H01L2224/06 H01L2224/061 H01L2224/0616 H01L2224/06164 H01L2224/0617 H01L2224/06179 H01L2224/1 H01L2224/13 H01L2224/130 H01L2224/1302 H01L2224/13022 H01L2224/131 H01L2224/16 H01L2224/162 H01L2224/1622 H01L2224/16225 H01L23 H01L23/H01L23/5 H01L23/52 H01L23/522 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/06 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00014 H01L2924/3 H01L2924/35 H01L2924/351 H01L2924/3511

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/482 H01L23/4824 H01L23/488 H01L24 H01L24/H01L24/8 H01L24/81

Получить PDF