RELIABILITY BARRIER INTEGRATION FOR CU METALLISATION

19-11-1998 дата публикации

Номер:

WO1998052219A1

Автор: CHEN, Fusen, CHEN, Liang-Yuh, MOSELY, Roderick, Craig, EIZENBERG, Moshe

Принадлежит: Applied Materials, Inc.

Контакты:

Номер заявки: US9809751

Дата заявки: 13-05-1998

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The present invention provides a process sequence and related hardware for filling a hole with copper. The sequence comprises first forming a reliable barrier layer in the hole to prevent diffusion of the copper into the dielectric layer through which the hole is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the bottom of the hole, depositing a second barrier, and then filling the hole with copper. An alternative sequence comprises depositing a first barrier layer over a blanket dielectric layer, forming a hole through both the barrier layer and the dielectric layer, depositing a generally conformal second barrier layer in the hole, removing the barrier layer from the bottom of the hole, and selectively filling the hole with copper.

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CPC - классификация

C C2 C25 C25D C25D5 C25D5/C25D5/0 C25D5/02 H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/2 H01L21/28 H01L21/285 H01L21/2855 H01L21/28556 H01L21/2856 H01L21/28562 H01L21/7 H01L21/76 H01L21/768 H01L21/7680 H01L21/76804 H01L21/7683 H01L21/76831 H01L21/7684 H01L21/76843 H01L21/76844 H01L21/76846 H01L21/7687 H01L21/76877 H01L23 H01L23/H01L23/5 H01L23/52 H01L23/522 H01L23/5226 H01L23/53 H01L23/532 H01L23/5323 H01L23/53238 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0002

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/2 H01L21/28 H01L21/285 H01L21/7 H01L21/76 H01L21/768

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