Stacked structure with interposer
Номер патента: EP4396872A1
Опубликовано: 10-07-2024
Автор(ы): Belgacem Haba
Принадлежит: Adeia Semiconductor Technologies LLC
Опубликовано: 10-07-2024
Автор(ы): Belgacem Haba
Принадлежит: Adeia Semiconductor Technologies LLC
Реферат: Stacked structures having interposers adhered to packaging substrates are disclosed. In one example, a stacked structure can include a laminate substrate. The stacked structure can also include an interposer mounted on the laminate substrate without solder, for example by an electrically nonconductive adhesive layer. A plurality of conductive vias can be extending through the interposer, and through the nonconductive adhesive layer if present, and connecting to the laminate substrate. The stacked structure can also include a redistribution layer (RDL) adjacent to the interposer. The RDL can be configured to electrically connect to an electronic device. Methods for forming such stacked structures are also disclosed.
Semiconductor chip stack structure, semiconductor package, and methods of manufacturing them
Номер патента: US20240032312A1. Автор: Taeyoung Lee,Kyungdon Mun. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-01-25.