Device and Method for Printed Circuit Board with Embedded Cable
Номер патента: EP2870837A1
Опубликовано: 13-05-2015
Автор(ы): FEI Yu, Feng Gao, Hang YANG
Принадлежит: Huawei Technologies Co Ltd
Опубликовано: 13-05-2015
Автор(ы): FEI Yu, Feng Gao, Hang YANG
Принадлежит: Huawei Technologies Co Ltd
Реферат: A printed circuit board (PCB) includes a first dielectric layer and a differential cable structure embedded in the dielectric layer. The differential cable structure includes a first inner conductor, a second inner conductor, a dielectric surrounding portions of the first inner conductor and portions of the second inner conductor, and a ground shield surrounding the dielectric.
Method for producing a printed circuit board with multilayer sub-areas in sections
Номер патента: US09750134B2. Автор: Alexander Kasper,Dietmar Drofenik,Ravi Hanyal SHIVARUDRAPPA,Michael GÖSSLER. Владелец: AT&S Austria Technologie und Systemtechnik AG. Дата публикации: 2017-08-29.