Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
Номер патента: AU1082801A
Опубликовано: 30-04-2001
Автор(ы): E. Jennings Taylor, Jenny J. Sun, Maria E. Inman
Принадлежит: Faraday Technology Inc
Опубликовано: 30-04-2001
Автор(ы): E. Jennings Taylor, Jenny J. Sun, Maria E. Inman
Принадлежит: Faraday Technology Inc
Method for manufacturing copper foil for printed circuit board and copper foil for printed circuit board
Номер патента: WO2012039285A1. Автор: 晃正 森山. Владелец: Jx日鉱日石金属株式会社. Дата публикации: 2012-03-29.