Россия, г. Королев.

eburdiyg@gmail.com

8 (903) 781-84-63

  • Главная
  • METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE

Номер патента: US20130294034A1
Опубликовано: 07-11-2013
Автор(ы): KANRYO KOICHI, Katsube Akio, KITAMURA Shunsuke
Принадлежит:
Получить PDF файл: Открыть в новом окне

Вам могут быть интересны следующие патенты

Рисунок 1. Взаимосвязь патентов (ближайшие 20).

Method of manufacturing an electronic device

Номер патента: US11856710B2. Автор: Kai Cheng,Tsau-Hua Hsieh,Fang-Ying Lin. Владелец: Innolux Corp. Дата публикации: 2023-12-26.

Method of manufacturing an electronic device

Номер патента: US20240057264A1. Автор: Kai Cheng,Tsau-Hua Hsieh,Fang-Ying Lin. Владелец: Innolux Corp. Дата публикации: 2024-02-15.

Method of manufacturing an electronic device

Номер патента: US20230389191A1. Автор: Kai Cheng,Tsau-Hua Hsieh,Fang-Ying Lin. Владелец: Innolux Corp. Дата публикации: 2023-11-30.

Built-in-electronic-component substrate and manufacturing method therefor

Номер патента: US20160128199A1. Автор: Masaru Takahashi,Choichiro Fujii. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-05-05.

ELECTRONIC COMPONENT AND A METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT

Номер патента: US20170280564A1. Автор: NISHIMURA Isamu. Владелец: ROHM CO., LTD.. Дата публикации: 2017-09-28.

Method of producing electronic unit of radio system and electronic unit

Номер патента: EP1377143A3. Автор: Kimmo Huhtala,Pasi Lehtonen,Marko Kuusikko. Владелец: Nokia Oyj. Дата публикации: 2005-08-10.

Electronic component mounting structure and method

Номер патента: US20200375034A1. Автор: Taiji Watanabe. Владелец: jujube LLC. Дата публикации: 2020-11-26.

Pressure sintering device and method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process

Номер патента: WO2020178143A1. Автор: Dirk Dittmann,Martin Becker. Владелец: Danfoss Silicon Power GmbH. Дата публикации: 2020-09-10.

Electronic component and manufacturing method thereof, and electronic device and manufacturing method thereof

Номер патента: JP6718837B2. Автор: 敦 鷹野,光弘 古川,古川　光弘,一郎 亀山,哲也 上林. Владелец: スカイワークスフィルターソリューションズジャパン株式会社. Дата публикации: 2020-07-08.

Multilayer ceramic electronic component, circuit board, and method of manufacturing multilayer ceramic electronic component

Номер патента: US20230335340A1. Автор: Yasunari Kato,Yuji Tomizawa,Yasutomo SUGA. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2023-10-19.

Method of mounting surface-mounted type electronic components on a printed circuit board

Номер патента: CA1294584C. Автор: Hiroshi Yagi,Sho Masujima,Atsuzo Tamashima,Masakazu Kamoshida. Владелец: TDK Corp. Дата публикации: 1992-01-21.

Electronic component with enclosure frame, circuit board with electronic component, and electronic device

Номер патента: US12127328B2. Автор: Yang Liu,Feng Liu,Yuxiu Liu,Biao Hu. Владелец: Huawei Digital Power Technologies Co Ltd. Дата публикации: 2024-10-22.

Electronic component mounting structure, manufacturing method and electronic component product

Номер патента: US09717163B2. Автор: Gordon C. Ma,Chu Ming Shih. Владелец: INNOGRATION (SUZHOU) CO Ltd. Дата публикации: 2017-07-25.

Multi-layer ceramic electronic component, method of producing a multi-layer ceramic electronic component, and substrate with a built-in electronic component

Номер патента: US11083090B2. Автор: Takashi Sasaki. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2021-08-03.

Multi-layer ceramic electronic component, method of producing a multi-layer ceramic electronic component, and substrate with a built-in electronic component

Номер патента: US20200029438A1. Автор: Takashi Sasaki. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2020-01-23.

Interposer, electronic component including the same, and board having electronic component including the same

Номер патента: US9480158B2. Автор: Sang Soo Park,Soon Ju LEE. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-10-25.

Interposer, electronic component including the same, and board having electronic component including the same

Номер патента: US09480158B2. Автор: Sang Soo Park,Soon Ju LEE. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-10-25.

Electronic component with enclosure frame, circuit board with electronic component, and electronic device

Номер патента: EP4307850A2. Автор: Yang Liu,Feng Liu,Yuxiu Liu,Biao Hu. Владелец: Huawei Digital Power Technologies Co Ltd. Дата публикации: 2024-01-17.

Electronic component with enclosure frame, circuit board with electronic component, and electronic device

Номер патента: EP4307850A3. Автор: Yang Liu,Feng Liu,Yuxiu Liu,Biao Hu. Владелец: Huawei Digital Power Technologies Co Ltd. Дата публикации: 2024-04-17.

Electronic component selection and supply apparatus in automatic electronic component inserting machine

Номер патента: CA1192666A. Автор: Keiichi Ihara,Tetsuro Ito,Kotaro Harigane,Hirokazu Shudo. Владелец: TDK Corp. Дата публикации: 1985-08-27.

Electronic component with enclosure frame, circuit board with electronic component, and electronic device

Номер патента: US20220279643A1. Автор: Yang Liu,Feng Liu,Yuxiu Liu,Biao Hu. Владелец: Huawei Digital Power Technologies Co Ltd. Дата публикации: 2022-09-01.

Connection element for an electronic component arrangement and process to produce same, electronic component arrangement and process to produce the same

Номер патента: US20170294724A1. Автор: Martin Henschel. Владелец: Biotronik SE and Co KG. Дата публикации: 2017-10-12.

Method of manufacturing printed circuit board with embedded electronic components positioned by using solder paste

Номер патента: US09974186B2. Автор: Ming Yi YEH,Shun Yueh Hsu,Kun Chi Chen,Hung Min Chen. Владелец: Unitech Printed Circuit Board Corp. Дата публикации: 2018-05-15.

Method of manufacturing a surface mounted device and corresponding surface mounted device

Номер патента: WO2012084291A1. Автор: Francois Lechleiter. Владелец: Microconnections SAS. Дата публикации: 2012-06-28.

Circuit board assembly and method of manufacturing same

Номер патента: US09693459B2. Автор: Rodrigo Franco. Владелец: Delphi Technologies Inc. Дата публикации: 2017-06-27.

EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20140174800A1. Автор: LEE Byoung Hwa,Kim Hyun Tae,CHANG Mi Jeong. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2014-06-26.

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND SUBSTRATE WITH A BUILT-IN ELECTRONIC COMPONENT

Номер патента: US20210329786A1. Автор: Sasaki Takashi. Владелец: . Дата публикации: 2021-10-21.

ELECTRONIC COMPONENT, ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

Номер патента: US20130299215A1. Автор: FUJIMOTO Isamu,TASEDA Yasunori. Владелец: MURATA MANUFACTURING CO., LTD.. Дата публикации: 2013-11-14.

Electrostatic discharge protection of electronic component embedded in laminate of printed circuit board

Номер патента: US20230164911A1. Автор: Thomas Gebhard,Petteri Palm,Mahadi-Ul Hassan. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2023-05-25.

Method of cutting electronic component, method of removing component, and method of manufacturing electronic device

Номер патента: US20210282267A1. Автор: Norihiro Ishii,Kazuya Nagasawa. Владелец: Kioxia Corp. Дата публикации: 2021-09-09.

Electronic component module

Номер патента: US09704770B2. Автор: Yoshiharu SUEMORI. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-07-11.

METHOD OF FORMING SOLDER RESIST POST, METHOD OF MANUFACTURING ELECTRONIC DEVICE PACKAGE USONG SOLDER RESIST POST, AND ELECTRONIC DEVICE PACKAGE MANUFACTURED BY USING METHODS

Номер патента: US20140126166A1. Автор: CHO Soon Jin,Kim Su Il. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2014-05-08.

Electronic component package and method of manufacturing the same

Номер патента: US20100059876A1. Автор: Hiroyuki Kato,Hiroshi Shimizu,Takahiro Takenouchi. Владелец: Shinko Electric Industries Co Ltd. Дата публикации: 2010-03-11.

Metal-based mounting board and method of manufacturing metal-based mounting board

Номер патента: US20150351225A1. Автор: Toshio Komiyatani,Yoshihide Nii,Yukiharu Yuzuriha. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2015-12-03.

EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN

Номер патента: US20140151101A1. Автор: LEE Byoung Hwa,LEE Hai Joon,JUNG Jin Man. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2014-06-05.

SUBSTRATE EMBEDDING ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SUBSTRATE EMBEDDING ELECTRONIC COMPONENT

Номер патента: US20140293560A1. Автор: Lee Sang Chul. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2014-10-02.

Embedded multilayer ceramic electronic component and method of manufacturing the same, and printed circuit board having embedded multilayer ceramic electronic component therein

Номер патента: CN103854852A. Автор: 李炳华,李海峻,郑镇万. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2014-06-11.

Method of surface-mounting components

Номер патента: US11342489B2. Автор: Anthony Miles,Benjamin MASHEDER. Владелец: DST Innovations Ltd. Дата публикации: 2022-05-24.

Method of manufacturing substrate assembly, substrate assembly, and method of attaching substrate assembly to electronic component

Номер патента: JP6664751B2. Автор: ヒンリッヒ アンドレアス,デュッフ ズサンネ,ミリク アントン,シェーファー ミヒャエル,バクマン クレスチャン,ウルリヒ ホルガ,オスターバルト フランク,ベニング ダービト,ラズキ ヤツェク,ポウルスン ラース,シェフス フランク,ベガ マーティン. Владелец: ヘラエウス ドイチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト. Дата публикации: 2020-03-13.

Electronic component built-in module and method of manufacturing the same

Номер патента: CN1543291A. Автор: ,����һ,中谷诚一,平野浩一,山下嘉久,菅谷康博,朝日俊行,ɽ�¼ξ�. Владелец: Matsushita Electric Industrial Co Ltd. Дата публикации: 2004-11-03.

Printed circuit board and electronic apparatus

Номер патента: US09609741B1. Автор: Koji Noguchi. Владелец: Canon Inc. Дата публикации: 2017-03-28.

Electronic component embedded substrate and manufacturing method thereof

Номер патента: US09510455B2. Автор: Bong-Soo Kim. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-11-29.

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND SUBSTRATE WITH A BUILT-IN ELECTRONIC COMPONENT

Номер патента: US20200029438A1. Автор: Sasaki Takashi. Владелец: . Дата публикации: 2020-01-23.

Method for searching position of electronic component

Номер патента: US20080198029A1. Автор: Cheng-Hsun Ho. Владелец: Inventec Corp. Дата публикации: 2008-08-21.

Built-in-electronic-component substrate and manufacturing method therefor

Номер патента: US09961775B2. Автор: Masaru Takahashi,Choichiro Fujii. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2018-05-01.

Module and method for manufacturing same

Номер патента: US20230013032A1. Автор: Yoshihito OTSUBO,Minoru HATASE. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-01-19.

Electronic component mounting structure and method for manufacturing same

Номер патента: US20230328895A1. Автор: Takashi Kitahara,Kensuke Otake,Kyo SHIN. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-10-12.

Printed circuit board and electronic apparatus

Номер патента: US20170094771A1. Автор: Koji Noguchi. Владелец: Canon Inc. Дата публикации: 2017-03-30.

Electronic component package body, electronic component package assembly, and electronic device

Номер патента: US20220384380A1. Автор: Zhiqiang Xiang. Владелец: Huawei Technologies Co Ltd. Дата публикации: 2022-12-01.

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, MULTI-LAYER CERAMIC ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND MULTI-LAYER CERAMIC ELECTRONIC COMPONENT PACKAGE

Номер патента: US20190198249A1. Автор: Sato Hiroaki. Владелец: . Дата публикации: 2019-06-27.

Electronic Component Mounting Structure, Manufacturing Method and Electronic Component Product

Номер патента: US20160050794A1. Автор: Shih Chu Ming,Ma Gordon C.. Владелец: . Дата публикации: 2016-02-18.

METHOD FOR PREPARING THE AUTOMATED PRODUCTION OF AN ELECTRONIC COMPONENT, METHOD FOR AUTOMATED PRODUCTION AND/OR FOR AUTOMATED POST-PROCESSING OF AN ELECTRONIC COMPONENT, COMPUTING DEVICE, COMPUTER PROGRAM AND ELECTRONICALLY READABLE DATA STORAGE DEVICE

Номер патента: US20210389749A1. Автор: Hörber Johannes,HEDGES Martin. Владелец: . Дата публикации: 2021-12-16.

Multilayer ceramic electronic component and interposer included in multilayer ceramic electronic component

Номер патента: CN111063542B. Автор: 朴祥秀,金虎润,申旴澈,沈原徹. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2023-02-03.

Electronic component fixing structure and method for fixing electronic component

Номер патента: CN104853566A. Автор: 小林知善. Владелец: Omron Automotive Electronics Co Ltd. Дата публикации: 2015-08-19.

Electronic component, circuit substrate, and manufacturing method for electronic component

Номер патента: JP2022038810A. Автор: Toshiki Kondo,Takahisa Fukuda,貴久 福田,潤一 篠▲崎▼,Junichi Shinozaki,稔己 近藤,良介 星野,Ryosuke Hoshino. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2022-03-10.

Lead-type electronic component mounting printed wiring board, lead-type electronic component soldering method, air conditioner.

Номер патента: JP4196979B2. Автор: 剛 三浦. Владелец: Mitsubishi Electric Corp. Дата публикации: 2008-12-17.

Monolithic electronic component and the plate with the monolithic electronic component

Номер патента: CN106504895A. Автор: 郑仁和,金熙昱,成宰硕. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2017-03-15.

Electronic element package, electronic component, voltage regulation module and voltage regulator

Номер патента: CN115551172A. Автор: 缪桦,黄立湘,董晋. Владелец: Shennan Circuit Co Ltd. Дата публикации: 2022-12-30.

ELECTRONIC-COMPONENT MOUNT SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20180116055A1. Автор: MURAKAMI Kensaku. Владелец: KYOCERA CORPORATION. Дата публикации: 2018-04-26.

Electronic component mounting substrate, electronic device, and electronic module

Номер патента: CN107993985B. Автор: 村上健策. Владелец: Kyocera Corp. Дата публикации: 2020-11-03.

Electronic component housing package, electronic device, and electronic module

Номер патента: WO2019017441A1. Автор: 元気 福重,恵佑 澤田. Владелец: 京セラ株式会社. Дата публикации: 2019-01-24.

Electronic component mounting orientation checking system and electronic component mounting orientation checking method

Номер патента: EP3723466A1. Автор: Takahiro Kobayashi,Shuichiro KITO,Yuta YOKOI. Владелец: Fuji Corp. Дата публикации: 2020-10-14.

Electric component module and method of manufacturing the same

Номер патента: US09510461B2. Автор: Jae Cheon Doh,Seung Yong Choi,Il Hyeong LEE. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-11-29.

Electronic component embedded substrate and method of manufacturing electronic component embedded substrate

Номер патента: US09386702B2. Автор: Bong Soo Kim. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-07-05.

Electronic circuit, light source device, and method of manufacturing electronic circuit

Номер патента: US09332655B2. Автор: Katsuhiko Maeda,Masashi Suzuki,Hiroyuki Basho,Yuugo Matsuura. Владелец: Ricoh Co Ltd. Дата публикации: 2016-05-03.

Method of manufacturing electronic component module and electronic component module

Номер патента: US20130294034A1. Автор: Akio Katsube,Koichi Kanryo,Shunsuke KITAMURA. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2013-11-07.

Method of manufacturing electronic board and mounting sheet

Номер патента: US20200163227A1. Автор: Tin-Lup Wong,Tadashi Kosuga. Владелец: Lenovo Singapore Pte Ltd. Дата публикации: 2020-05-21.

Electronic component and method of manufacturing electronic component

Номер патента: US09496088B2. Автор: Masahiko Konno,Osamu Hirose,Yukihiko Shirakawa,Tatsuo Inagaki,Shintaro Kon. Владелец: TDK Corp. Дата публикации: 2016-11-15.

Electronic component module, board, and method of manufacturing electronic component module

Номер патента: US20150003023A1. Автор: Shinya Yamamoto,Tohru Muramatsu,Masakazu MURANAGA. Владелец: Fujitsu Component Ltd. Дата публикации: 2015-01-01.

Electronic component module, board, and method of manufacturing electronic component module

Номер патента: US9572264B2. Автор: Shinya Yamamoto,Tohru Muramatsu,Masakazu MURANAGA. Владелец: Fujitsu Component Ltd. Дата публикации: 2017-02-14.

Electronic textile and method of manufacturing an electronic textile

Номер патента: US09706648B2. Автор: Guofu Zhou,Liesbeth Van Pieterson,Johannes Adrianus Maria Rademakers,Petrus Antonius Henricus Snoeijen,Josephus Henricus Gerardus Bax,Frank Anton Van Abellen. Владелец: Philips Lighting Holding BV. Дата публикации: 2017-07-11.

Substrate structure having electronic components and method of manufacturing substrate structure having electronic components

Номер патента: US09485878B2. Автор: Jae Soo Lee. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-11-01.

Electronic component, board having the same, and method of manufacturing metal frame

Номер патента: US20180268996A1. Автор: Jae Young Na. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-09-20.

Via intersect pad for electronic components and methods of manufacture

Номер патента: US20020195269A1. Автор: Tom Pearson,Jayne Mershon,Carolyn McCormick. Владелец: Intel Corp. Дата публикации: 2002-12-26.

Mother ceramic substrate, ceramic substrate, mother module component, module component, and method of manufacturing mother ceramic substrate

Номер патента: US20170079137A1. Автор: Yukio Maeda,Masashi Matsubara,Daigo Matsubara,Masatoshi Kariya. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-03-16.

Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module

Номер патента: US20080192447A1. Автор: Masaki Kimura,Takanori Uejima,Dai NAKAGAWA,Kunihiro Koyama,Muneyoshi YAMAMOTO. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2008-08-14.

Method of manufacturing a wiring board

Номер патента: US09655248B2. Автор: Daisuke Narumi. Владелец: Kyocera Corp. Дата публикации: 2017-05-16.

Component built-in board mounting body and method of manufacturing the same, and component built-in board

Номер патента: US09635763B2. Автор: Nobuki Ueta. Владелец: Fujikura Ltd. Дата публикации: 2017-04-25.

Method of manufacturing wiring substrate

Номер патента: US09420696B2. Автор: Junji Sato,Katsuya Fukase,Takayuki KIWANAMI. Владелец: Shinko Electric Industries Co Ltd. Дата публикации: 2016-08-16.

Method of forming electrode on ceramic green sheet and method of manufacturing multilayer ceramic electronic component

Номер патента: US5865920A. Автор: Masahiro Sakuratani,Isao Kaizaki. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1999-02-02.

Method of preventing damage to miniature electronic components held by a component carrier

Номер патента: US8622218B2. Автор: William J. Saunders,Douglas J. Garcia,Gerald F. Boe,Nick A. Tubbs. Владелец: Electro Scientific Industries Inc. Дата публикации: 2014-01-07.

Method of transferring heat from ungrounded electronic components

Номер патента: US20230269861A1. Автор: Lori Ann DEORIO,Robert Francis Darveaux,Bhuvaneshwaran Vijayakumar. Владелец: Skyworks Solutions Inc. Дата публикации: 2023-08-24.

Method of manufacturing multi-layer thin film, member including the same and electronic product including the same

Номер патента: US20140355184A1. Автор: Hyun Jun Jung,Jin Hyun Cho,Min Chul JUNG,Jin Sub Kim,Hyong Jun YOO. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2014-12-04.

Method of manufacturing a laminated electronic component

Номер патента: US9466422B2. Автор: Yoshiyuki Motomiya,Shigeto TAKEI,Toru Oowada. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2016-10-11.

Method of manufacturing ceramic multilayer electronic component

Номер патента: US5274916A. Автор: Norio Sakai,Shoichi Kawabata,Kenji Minowa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1994-01-04.

Manufacturing method of a packaging structure of electronic components

Номер патента: US20100285636A1. Автор: Huai-Te Chen. Владелец: ACSIP Tech Inc. Дата публикации: 2010-11-11.

Systems and methods of dissipating heat from an electronic component

Номер патента: US20200296272A1. Автор: Anton Kramarov. Владелец: Smart Supervision System LLC. Дата публикации: 2020-09-17.

Method of manufacturing cards that each include an electronic module and intermediate products

Номер патента: CA2654878C. Автор: Francois Droz. Владелец: NID SA. Дата публикации: 2014-09-02.

Method of controlling contact load in electronic component mounting apparatus

Номер патента: WO2006025595A1. Автор: Hiroyuki Yoshida,Noriaki Yoshida,Shuichi Hirata,Yasuharu Ueno. Владелец: Morikawa, Makoto. Дата публикации: 2006-03-09.

Method of controlling contact load in electronic component mounting apparatus

Номер патента: EP1799388A1. Автор: Shuichi c/o Matsushita Electric Industrial Co. Ltd. HIRATA,Yasuharu c/o Matsushita Electric Industrial Co. Ltd. UENO,Hiroyuki c/o Matsushita Electric Industrial Co. Ltd. YOSHIDA,Noriaki c/o Matsushita Electric Industrial Co. Ltd. YOSHIDA. Владелец: Morikawa Makoto. Дата публикации: 2007-06-27.

Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component

Номер патента: US09443654B2. Автор: Shoichiro Suzuki,Koichi Banno,Taisuke Kanzaki,Akihiro Shiota. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-09-13.

Method of manufacturing multi-layer thin film, member including the same and electronic product including the same

Номер патента: EP3004416A1. Автор: Jin Hyun Cho,Min Chul JUNG,Jin Sub Kim,Hyong Jun YOO,Seo Joon LEE. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2016-04-13.

Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component

Номер патента: US20140175942A1. Автор: Shoichiro Suzuki,Koichi Banno,Taisuke Kanzaki,Akihiro Shiota. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2014-06-26.

Electronic component and double-sided tape for attaching electronic component

Номер патента: US20230074287A1. Автор: Shingo Harada,Yoshihiko Nishizawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-03-09.

Base of surface-mount-type electronic component-use package, and surface-mount-type electronic component-use package

Номер патента: EP2555426A1. Автор: Minoru Iizuka,Yuka Kojo. Владелец: Daishinku Corp. Дата публикации: 2013-02-06.

Electronic component mounting substrate, electronic device, and electronic module

Номер патента: US11004781B2. Автор: Shigeyoshi FUKUZONO,Yuuki BABA. Владелец: Kyocera Corp. Дата публикации: 2021-05-11.

Electronic component and mobile communication device using such electronic component

Номер патента: EP1263038A3. Автор: Yoshitaka NGK Spark Plug Co. Ltd Yoshida,Takakuni NGK Spark Plug Co. Ltd Nasu,Tomoaki NGK Spark Plug Co. Ltd Sakurai,Daisuke NGK Spark Plug Co. Ltd Kato,NGK Spark Plug Co. Ltd Yoshikawa Hajime. Владелец: NGK Spark Plug Co Ltd. Дата публикации: 2005-03-30.

Electronic component and method for manufacturing electronic component

Номер патента: US20230119828A1. Автор: Kiyohiro KASHIUCHI,Hirofumi OIE,Toru Yaso. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-04-20.

METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD WITH COMPONENT MOUNTING SECTION FOR MOUNTING ELECTRONIC COMPONENT AND FLEXIBLE CABLE SECTIONS EXTENDING IN DIFFERENT DIRECTIONS FROM THE COMPONENT MOUNTING SECTION

Номер патента: US20160044797A1. Автор: Matsuda Fumihiko. Владелец: . Дата публикации: 2016-02-11.

Functional package for complex electronic systems and method of fabrication

Номер патента: CA1037615A. Автор: Richard A. Williams,Lewis A. Davidson,Michael C. Duffy,Alvard J. Erickson,Gerard R. Gunther-Mohr. Владелец: International Business Machines Corp. Дата публикации: 1978-08-29.

Method for aligning electronic components

Номер патента: US09510460B2. Автор: Yu Sze Cheung,Yan Yiu LAM. Владелец: ASM TECHNOLOGY SINGAPORE PTE LTD. Дата публикации: 2016-11-29.

Method for manufacturing mounting structure for electronic component, mounting structure for electronic component, electronic module, and wiring sheet

Номер патента: US20210193612A1. Автор: Atsushi Tanaka,Junya Sato,Ryosuke MITSUI,Kosuke MATSUO. Владелец: Japan Aviation Electronics Industry Ltd. Дата публикации: 2021-06-24.

Method for manufacturing mounting structure for electronic component, mounting structure for electronic component, electronic module, and wiring sheet

Номер патента: US11881470B2. Автор: Atsushi Tanaka,Junya Sato,Ryosuke MITSUI,Kosuke MATSUO. Владелец: Japan Aviation Electronics Industry Ltd. Дата публикации: 2024-01-23.

Laminated ceramic electronic component mounting structure

Номер патента: US09953765B2. Автор: Shunsuke Takeuchi,Masashi Nishimura. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2018-04-24.

Circuit board and electronic apparatus

Номер патента: US09867274B2. Автор: Jun Taguchi. Владелец: Fujitsu Ltd. Дата публикации: 2018-01-09.

METHOD OF BRAZING BY REFUSION OF ELECTRONIC COMPONENTS USING SOLDER ALLOY PRE-DEPOSITS AND BRAZING DEVICE FOR CARRYING OUT SUCH A METHOD

Номер патента: FR2781974A1. Автор: Thierry Sindzingre,Claude Carsac,Gilles Conor. Владелец: LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude. Дата публикации: 2000-02-04.

Method of producing a carrier for electronic components for the interconnection of integrated-circuit chips

Номер патента: EP0044247B1. Автор: Jean-Marie Mariotte,Pierre Hamaide. Владелец: Socapex SA. Дата публикации: 1985-10-30.

Laminated ceramic electronic component mounting structure

Номер патента: US20150325367A1. Автор: Shunsuke Takeuchi,Masashi Nishimura. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2015-11-12.

INTERPOSER, ELECTRONIC COMPONENT INCLUDING THE SAME, AND BOARD HAVING ELECTRONIC COMPONENT INCLUDING THE SAME

Номер патента: US20160088733A1. Автор: PARK Sang Soo,LEE Soon Ju. Владелец: . Дата публикации: 2016-03-24.

CONNECTION ELEMENT FOR AN ELECTRONIC COMPONENT ARRANGEMENT AND PROCESS TO PRODUCE SAME, ELECTRONIC COMPONENT ARRANGEMENT AND PROCESS TO PRODUCE THE SAME

Номер патента: US20170294724A1. Автор: Henschel Martin. Владелец: . Дата публикации: 2017-10-12.

ELECTRONIC COMPONENT MOUNTING ORIENTATION CHECKING SYSTEM AND ELECTRONIC COMPONENT MOUNTING ORIENTATION CHECKING METHOD

Номер патента: US20200410663A1. Автор: Kobayashi Takahiro,KITO Shuichiro,YOKOI Yuta. Владелец: FUJI CORPORATION. Дата публикации: 2020-12-31.

Multilayer ceramic electronic component and board for mounting multilayer ceramic electronic component

Номер патента: CN110620012B. Автор: 具贤熙,金汎洙,房惠民,姜熙相. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2022-12-06.

Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate

Номер патента: US09386697B2. Автор: Kenichi Kawabata,Hiroyuki Uematsu. Владелец: TDK Corp. Дата публикации: 2016-07-05.

Electronic component, method of manufacturing electronic component, and electronic device

Номер патента: US09596767B2. Автор: Aki Dote. Владелец: Fujitsu Ltd. Дата публикации: 2017-03-14.

Device and method of device manufacturing

Номер патента: RU2738440C1. Автор: Рико ВЕРХАГЕН,Мариус Иосиф БОАМФА,Франк Антон ВАН АБЕЛЕН,Джонатан Аламбра ПАЛЕРО,Францискус Антониус КНЕПКЕНС,Бастиан Вильгельмус Мария МУСКОПС. Владелец: КОНИНКЛЕЙКЕ ФИЛИПС Н.В.. Дата публикации: 2020-12-14.

Embedded electronic component and method of manufacturing electronic component embedded substrate

Номер патента: US09894770B2. Автор: Doo Hwan Lee. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-02-13.

Flexible printed circuit board with component mounting section for mounting electronic component and flexible cable sections extending in different directions from the component mounting section

Номер патента: US09655239B2. Автор: Fumihiko Matsuda. Владелец: Nippon Mektron KK. Дата публикации: 2017-05-16.

Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device

Номер патента: US09831211B2. Автор: Wonsuk Chang,Kunmo Chu,Chanmoon Chung. Владелец: Industry Academic Cooperation Foundation of Yonsei University. Дата публикации: 2017-11-28.

Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate

Номер патента: US20140293561A1. Автор: Kenichi Kawabata,Hiroyuki Uematsu. Владелец: TDK Corp. Дата публикации: 2014-10-02.

Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate

Номер патента: US20120138346A1. Автор: Kenichi Kawabata,Hiroyuki Uematsu. Владелец: TDK Corp. Дата публикации: 2012-06-07.

Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment

Номер патента: EP1369917A3. Автор: Toshio Ishizaki. Владелец: Matsushita Electric Industrial Co Ltd. Дата публикации: 2006-09-27.

Method of manufacturing laminated electronic component

Номер патента: US20180090268A1. Автор: Takeshi Kobayashi,Makoto Yamamoto,Yutaka Noguchi. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2018-03-29.

Electronic component module and method for manufacturing electronic component module

Номер патента: US11871523B2. Автор: Toru Komatsu,Ryohei OKABE. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-01-09.

Electronic component built-in module and method of manufacturing electronic component built-in module

Номер патента: JP4484831B2. Автор: 秀樹 竹原,良之 新井. Владелец: Panasonic Corp. Дата публикации: 2010-06-16.

Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCB

Номер патента: US09392698B2. Автор: Suk Chang HONG,Sang Kab PARK,Kwang Seop Youm,Jung Soo Byun. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-07-12.

Electronic component embedded substrate

Номер патента: US20240090135A1. Автор: Jae Ho Shin,Ga Young AN. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2024-03-14.

Electronic component module, sub-module, and method for manufacturing same

Номер патента: US20230309230A1. Автор: Tadashi Nomura,Tsuyoshi Takakura,Yoshihito OTSUBO,Hideo Nakagoshi. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-09-28.

Overmolded electronic components for transaction cards and methods of making thereof

Номер патента: CA3116226A1. Автор: Adam Lowe. Владелец: COMPOSECURE LLC. Дата публикации: 2020-04-23.

Overmolded electronic components for transaction cards and methods of making thereof

Номер патента: EP3491584A1. Автор: Adam Lowe. Владелец: COMPOSECURE LLC. Дата публикации: 2019-06-05.

Overmolded electronic components for transaction cards and methods of making thereof

Номер патента: EP3867816A1. Автор: Adam Lowe. Владелец: COMPOSECURE LLC. Дата публикации: 2021-08-25.

Overmolded electronic components for transaction cards and methods of making thereof

Номер патента: CA3116226C. Автор: Adam Lowe. Владелец: COMPOSECURE LLC. Дата публикации: 2023-09-05.

Overmolded electronic components for transaction cards and methods of making thereof

Номер патента: WO2020081790A1. Автор: Adam Lowe. Владелец: CompoSecure, LLC. Дата публикации: 2020-04-23.

Overmolded electronic components for transaction cards and methods of making thereof

Номер патента: AU2019361988A1. Автор: Adam Lowe. Владелец: COMPOSECURE LLC. Дата публикации: 2021-05-20.

Method of manufacturing ceramic electronic component

Номер патента: US11821090B2. Автор: Yoshinori Ueda. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-11-21.

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

Номер патента: US20140332260A1. Автор: Koji Sato,Yukio Sanada,Yasuhiro Nishisaka. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2014-11-13.

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

Номер патента: US9007161B2. Автор: Koji Sato,Yukio Sanada,Yasuhiro Nishisaka. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2015-04-14.

Connection structure, method of manufacturing connection structure, connection material, and coated conductive particle

Номер патента: US20220223315A1. Автор: Masaharu Aoki,Yusuke Tanaka,Hidetsugu Namiki,Saori SUGIOKA,Shoko KUGA. Владелец: Dexerials Corp. Дата публикации: 2022-07-14.

Substrate before insulation, method of manufacturing substrate, method of manufacturing surface acoustic wave transducer, surface acoustic wave device, and electronic equipment

Номер патента: TWI292345B. Автор: Hironori Hasei. Владелец: Seiko Epson Corp. Дата публикации: 2008-01-11.

Method of manufacturing metal film supply body for multilayer ceramic electronic component, method of manufacturing metal film ceramic integrated green sheet supply body, and method of manufacturing multilayer ceramic electronic component

Номер патента: JP3491639B2. Автор: 照男 吉田,紀之 久保寺. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2004-01-26.

MULTILAYER CERAMIC ELECTRONIC COMPONENT, SERIES OF ELECTRONIC COMPONENTS STORED IN A TAPE, AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20150114703A1. Автор: SHIMIZU Kotaro. Владелец: . Дата публикации: 2015-04-30.

Multilayer ceramic electronic component, series of electronic components stored in a tape, and method of manufacturing multilayer ceramic electronic component

Номер патента: CN104576045A. Автор: 清水孝太郎. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2015-04-29.

Multilayer ceramic electronic component, series of electronic components stored in a tape, and method of manufacturing multilayer ceramic electronic component

Номер патента: KR101634598B1. Автор: 코타로 시미즈. Владелец: 가부시키가이샤 무라타 세이사쿠쇼. Дата публикации: 2016-06-29.

Control Device and Method of Manufacturing Thereof

Номер патента: US20080165511A1. Автор: Masahiro Sasaki,Takuya Mayuzumi,Shuji Eguchi,Kiyoomi Kadoya. Владелец: HITACHI LTD. Дата публикации: 2008-07-10.

Method of mounting electronic components

Номер патента: US5867897A. Автор: Takeshi Takeda,Noriaki Yoshida,Kanji Hata,Yoshihiro Mimura. Владелец: Matsushita Electric Industrial Co Ltd. Дата публикации: 1999-02-09.

HEAT TRANSFER STRUCTURE, POWER ELECTRONICS MODULE, COOLING ELEMENT, METHOD OF MANUFACTURING A HEAT TRANSFER STRUCTURE AND METHOD OF MANUFACTURING A POWER ELECTRONICS COMPONENT

Номер патента: US20200006190A1. Автор: Manninen Jorma,Silvennoinen Mika,Ingman Kjell. Владелец: . Дата публикации: 2020-01-02.

Method of manufacturing laminated ceramic electronic component and method of manufacturing laminated inductor

Номер патента: KR100474947B1. Автор: 다츠카와츠요시,도쿠다히로미치. Владелец: 가부시키가이샤 무라타 세이사쿠쇼. Дата публикации: 2005-03-08.

Method of manufacturing laminated ceramic electronic component and method of manufacturing laminated inductor

Номер патента: US6627021B2. Автор: Hiromichi Tokuda,Tsuyoshi Tatsukawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2003-09-30.

Method of manufacturing laminated ceramic electronic component and method of manufacturing laminated inductor

Номер патента: KR20020090852A. Автор: 다츠카와츠요시,도쿠다히로미치. Владелец: 가부시키가이샤 무라타 세이사쿠쇼. Дата публикации: 2002-12-05.

Method of cooling electrical components, device for implementing same and application to vehicle-borne components

Номер патента: US5058391A. Автор: Robert Periot. Владелец: GEC Alsthom SA. Дата публикации: 1991-10-22.

Electronic device and electromagnetic shield and method of forming same

Номер патента: EP2189050B1. Автор: Todd Conklin,Robert Hertlein,Alberto Brewer,Clint Wilber. Владелец: Novatel Wireless Inc. Дата публикации: 2012-07-11.

MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20200126729A1. Автор: MIZUKAMI Miyuki. Владелец: . Дата публикации: 2020-04-23.

Multilayer ceramic electronic component and method of manufacturing multilayer ceramic electronic component

Номер патента: JP2020068226A. Автор: 美由樹 水上,Miyuki Mizukami. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2020-04-30.

Electronic component module manufacturing method and electronic component module

Номер патента: JPWO2012147480A1. Автор: 紳弥 清野,祥明 佐竹. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2014-07-28.

Method of manufacturing laminated ceramic electronic component

Номер патента: US5009744A. Автор: Yukio Tanaka,Takuji Nakagawa,Harufumi Mandai,Shinichi Takakura. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1991-04-23.

Method of producing an electronic device and electronic device

Номер патента: US20030223205A1. Автор: Ralf Jaklin,Werner Wallrafen. Владелец: SIEMENS AG. Дата публикации: 2003-12-04.

Electronic device and electromagnetic shield and method of forming same

Номер патента: EP2189050A1. Автор: Todd Conklin,Robert Hertlein,Alberto Brewer,Clint Wilber. Владелец: Novatel Wireless Inc. Дата публикации: 2010-05-26.

Electronic component mounting method

Номер патента: US7797822B2. Автор: Tadahiko Sakai,Teruaki Nishinaka,Hideki Eifuku. Владелец: Panasonic Corp. Дата публикации: 2010-09-21.

Electronic component board and production method of the same

Номер патента: US20170150612A1. Автор: Takafumi Toda,Takeyuki Hamaguchi. Владелец: Yazaki Corp. Дата публикации: 2017-05-25.

Method of fabricating ceramic laminated electronic component

Номер патента: US5261986A. Автор: Norio Sakai,Shoichi Kawabata,Keiichi Okada,Hiromichi Wakatsuki. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1993-11-16.

Electronic component feeding device and electronic component mounting apparatus with electronic component feeding device

Номер патента: EP1581039A1. Автор: Masahiro Sugita,Takahiro Kitajima. Владелец: Hitachi High Tech Instruments Co Ltd. Дата публикации: 2005-09-28.

Method for removing electronic components connected to a circuit board

Номер патента: US12023756B2. Автор: Matthias Fettke,Andrej Kolbasow. Владелец: Pac Tech Packaging Technologies GmbH. Дата публикации: 2024-07-02.

Electronic component package body, electronic component assembly structure, and electronic device

Номер патента: US12089336B2. Автор: Zhiqiang Xiang. Владелец: Huawei Digital Power Technologies Co Ltd. Дата публикации: 2024-09-10.

Electronic component mounting system and electronic component mounting method

Номер патента: US09706695B2. Автор: Takashi Tamura,Hiroki Yamamoto,Toru Ikeda,Kazuhiro Kishikawa,Shuzo Yagi. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2017-07-11.

Electronic component mounting line and electronic component mounting method

Номер патента: US09439335B2. Автор: Tadashi Maeda,Hiroki Maruo,Tsubasa Saeki. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2016-09-06.

Overmolded electronic components for transaction cards and methods of making thereof

Номер патента: AU2019361988B2. Автор: Adam Lowe. Владелец: COMPOSECURE LLC. Дата публикации: 2022-06-30.

Electrical verification of electronic components

Номер патента: US20220087085A1. Автор: Bobbi FERM,Olle BETZEN. Владелец: Mycronic AB. Дата публикации: 2022-03-17.

Electronic component package for electromagnetic interference shielding and method for manufacturing the same

Номер патента: US09974215B1. Автор: Ju Young Lee,Se Young Jeong,Jin Ho Yoon,Ki Su Joo,Jeong Woo Hwang. Владелец: NTRIUM Inc. Дата публикации: 2018-05-15.

Electronic component device

Номер патента: US09941232B2. Автор: Tomohiro Suzuki,Koichi Tanaka,Masahiro Kyozuka,Satoshi Shiraki. Владелец: Shinko Electric Industries Co Ltd. Дата публикации: 2018-04-10.

Printed circuit board and method of manufacturing the printed circuit board, and memory module and method of manufacturing the memory module

Номер патента: KR101387549B1. Автор: 이영수,이동춘,한성찬. Владелец: 삼성전자주식회사. Дата публикации: 2014-04-24.

Electrode of electronic component part and conductive paste coating device

Номер патента: US6306456B1. Автор: Makoto Fukuda,Tadahiro Nakagawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2001-10-23.

High-frequency module and communication device

Номер патента: US20240038692A1. Автор: Takashi Yamada,Kiyoshi Aikawa,Takanori Uejima,Hiromichi Kitajima,Yoshihiro DAIMON. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-02-01.

Composite electronic component

Номер патента: US20240234389A9. Автор: Yukihiro Fujita,Tatsuya Funaki,Yoshiaki Satake,Ryutaro YAMATO. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-07-11.

Fixing structure of electronic component and in-vehicle charger

Номер патента: EP4145969A1. Автор: Chiaki Chida,Kentaro Imoto. Владелец: Yazaki Corp. Дата публикации: 2023-03-08.

Electronic component cooling device

Номер патента: US11778779B2. Автор: Kazuya Takeuchi,Koji Asagara,Xiaolin GUO. Владелец: Denso Corp. Дата публикации: 2023-10-03.

Fixing structure of electronic component and in-vehicle charger

Номер патента: US12108554B2. Автор: Chiaki Chida,Kentaro Imoto. Владелец: Yazaki Corp. Дата публикации: 2024-10-01.

Radio-frequency module and communication device

Номер патента: US20240015914A1. Автор: Takashi Yamada,Kiyoshi Aikawa,Takanori Uejima,Hiromichi Kitajima,Yoshihiro DAIMON. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-01-11.

Guide rail for electronic components

Номер патента: US20090133984A1. Автор: Tassilo Drogsler. Владелец: Multitest Elektronische Systeme GmbH. Дата публикации: 2009-05-28.

Shielded electronic component package

Номер патента: US12040305B2. Автор: Michael Kelly,Richard Chen,Jong Ok Chun,Nozad Karim,Giuseppe Selli. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2024-07-16.

Guide rail for electronic components

Номер патента: MY146934A. Автор: Drogsler Tassilo. Владелец: Multitest Electronische Systeme Gmbh. Дата публикации: 2012-10-15.

Cover for heat generating electronic component

Номер патента: EP4432346A1. Автор: Akihiro Endo,Junichi Tsukada,Yuuki Sakurai,Ryoichi SUMIYOSHI. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2024-09-18.

Electronic component packaging

Номер патента: EP2185441A1. Автор: Frank P. N. Nelissen. Владелец: Premier Farnell UK Ltd. Дата публикации: 2010-05-19.

Electronic component packaging

Номер патента: WO2009019411A1. Автор: Frank P. N. Nelissen. Владелец: Premier Farnell Uk Limited. Дата публикации: 2009-02-12.

Electronic component mounting machine

Номер патента: US20200113095A1. Автор: Hidetoshi KAWAI,Tomohisa KANDA. Владелец: Fuji Corp. Дата публикации: 2020-04-09.

Electronic component mounting machine

Номер патента: EP3644700A1. Автор: Hidetoshi KAWAI,Tomohisa KANDA. Владелец: Fuji Corp. Дата публикации: 2020-04-29.

The manufacture method of ferrite ceramics composition, ceramic electronic components and ceramic electronic components

Номер патента: CN103764592B. Автор: 中村彰宏,冈田佳子,山本笃史. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-04-20.

METHOD OF MAKING COAXIAL CONNECTIONS FOR ELECTRONIC COMPONENT, AND COMPONENT HOUSING COMPRISING SUCH CONNECTIONS.

Номер патента: FR2674680B1. Автор: Christian Val. Владелец: Thomson CSF SA. Дата публикации: 1993-12-03.

Machine for automatically inserting parallel lead electronic components into a printed circuit board

Номер патента: CA1113613A. Автор: Tetsuo Takahashi,Kotaro Harigane,Yoshinobu Taguchi. Владелец: Individual. Дата публикации: 1981-12-01.

Methods of forming solder areas on electronic components and electronic components having solder areas

Номер патента: TW200527566A. Автор: Nathaniel E Brese,Michael P Toben. Владелец: Rohm & Haas Elect Mat. Дата публикации: 2005-08-16.

The manufacture method of ferrite ceramics composition, ceramic electronic components and ceramic electronic components

Номер патента: CN103764593B. Автор: 中村彰宏,山本笃史. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-06-15.

Electronic component mounting apparatus

Номер патента: EP1521515A2. Автор: Akira Aoki,Jun Asai,Akihiro Kawai,Shigeru Kuribara. Владелец: Hitachi High Tech Instruments Co Ltd. Дата публикации: 2005-04-06.

Self-regulating device and method of component-handling device for electronic components

Номер патента: KR102067203B1. Автор: 프란츠 브란들,마르쿠스 페르슈틀,라이너 미엘리히,콘스탄틴 코흐,시아르하이 라칸다나우. Владелец: 뮐바우어 게엠베하 운트 콤파니 카게. Дата публикации: 2020-01-17.

Methods of forming solder areas on electronic components and electronic components having solder areas

Номер патента: CN100469222C. Автор: N·E·布雷斯,M·P·托本. Владелец: Rohm and Haas Electronic Materials LLC. Дата публикации: 2009-03-11.

Sound-Permeable Film, Electronic Component with Sound-Permeable Film, and Method of Producing Circuit Board Having Electronic Component Mounted Thereon

Номер патента: US20090268928A1. Автор: Yuri Horie,Yoshiki Ikeyama,Kouji Furuuchi. Владелец: Nitto Denko Corp. Дата публикации: 2009-10-29.

Electronic component package body, electronic component assembly structure, and electronic device

Номер патента: EP4258335A2. Автор: Zhiqiang Xiang. Владелец: Huawei Digital Power Technologies Co Ltd. Дата публикации: 2023-10-11.

Electronic component package body, electronic component assembly structure, and electronic device

Номер патента: EP4258335A3. Автор: Zhiqiang Xiang. Владелец: Huawei Digital Power Technologies Co Ltd. Дата публикации: 2023-12-13.

Electronic component installation apparatus

Номер патента: US8196287B2. Автор: Kazuhide Nagao,Wataru Hidese,Yoshiaki Awata,Takuya Tsutsumi. Владелец: Panasonic Corp. Дата публикации: 2012-06-12.

Rework and underfill nozzle for electronic components

Номер патента: US20010006185A1. Автор: Joseph Poole,Wilton Cox,Kris Slesinger. Владелец: Individual. Дата публикации: 2001-07-05.

System for removing an electronic component from a substrate

Номер патента: US20150089802A1. Автор: Nicolas Boyer,Eric Bouchard,Eric Dube,Yvan Bessette,Camille Dube,Sarah Turgeon. Владелец: International Business Machines Corp. Дата публикации: 2015-04-02.

Retaining device for an electronic component

Номер патента: US20190056080A1. Автор: Matthias Mayer,Stefan MITTERLEHNER. Владелец: ZKW Group GmbH. Дата публикации: 2019-02-21.

Electronic component tray

Номер патента: US11812541B2. Автор: Yasuhiro Shimizu,Kiyoyuki Nakagawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-11-07.

System and method for removing an electronic component from a substrate

Номер патента: US20120266459A1. Автор: Nicolas Boyer,Eric Bouchard,Eric Dube,Yvan Bessette,Camille Dube,Sarah Turgeon. Владелец: International Business Machines Corp. Дата публикации: 2012-10-25.

Electronic component tray

Номер патента: EP3901055A1. Автор: Yasuhiro Shimizu,Kiyoyuki Nakagawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2021-10-27.

Building support with concealed electronic component for a structure

Номер патента: CA2901294C. Автор: Christopher P. Macioch,Michael PINGITORE,Frank C. Pingitore. Владелец: CFM Global LLC. Дата публикации: 2020-06-30.

Electrical verification of electronic components

Номер патента: EP3915348A1. Автор: Bobbi FERM,Olle BETZEN. Владелец: Mycronic AB. Дата публикации: 2021-12-01.

Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same

Номер патента: US20100002401A1. Автор: Atsushi Yamaguchi,Hidenori Miyakawa,Hideyuki Tsujimura,Koso Matsuno,Hiroe Kowada. Владелец: Panasonic Corp. Дата публикации: 2010-01-07.

Electronic assembly and electronic apparatus

Номер патента: EP4270684A1. Автор: JIANG Zhu,Jiankang LI,Zongxun CHEN,Huan PEI. Владелец: Huawei Technologies Co Ltd. Дата публикации: 2023-11-01.

Fixing structure of electronic component and in-vehicle charger

Номер патента: US20230062109A1. Автор: Chiaki Chida,Kentaro Imoto. Владелец: Yazaki Corp. Дата публикации: 2023-03-02.

Composite electronic component

Номер патента: US20240136342A1. Автор: Yukihiro Fujita,Tatsuya Funaki,Yoshiaki Satake,Ryutaro YAMATO. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-04-25.

Metal substrate structure and method of manufacturing metal substrate structure for semiconductor power module and semiconductor power module

Номер патента: JP2022159012A. Автор: Harald Bayer,ハラルド・バイヤー,David Guyon,ダビド・ギヨン,ローマン・エルバー,Ehrbar Roman. Владелец: Hitachi Energy Switzerland AG. Дата публикации: 2022-10-17.

Process and apparatus for preparation of electronic components web carrier

Номер патента: CA1109434A. Автор: Hisashi Fujita,Sho Masuzima. Владелец: TDK Corp. Дата публикации: 1981-09-22.

Electronic component mounting method and apparatus

Номер патента: US20030133603A1. Автор: Kazumasa Okumura,Kazuhiro Ikurumi,Mikiya Nakata,Masaharu Tsujimura,Yutaka Mitsumoto. Владелец: Individual. Дата публикации: 2003-07-17.

Electronic components card air deflector

Номер патента: US20050047084A1. Автор: Zbigniew Kabat. Владелец: Lucent Technologies Inc. Дата публикации: 2005-03-03.

Electronic assembly, and electronic apparatus

Номер патента: EP4016613A1. Автор: Yang Zhou,Jianping Fang,Runqing Ye,Haohui LONG,Zhuqiu WANG. Владелец: Huawei Technologies Co Ltd. Дата публикации: 2022-06-22.

Television apparatus and electronic apparatus

Номер патента: US20120274866A1. Автор: Koji Tada. Владелец: Individual. Дата публикации: 2012-11-01.

Method of manufacturing cards that each include an electronic module and intermediate products

Номер патента: US20120206869A1. Автор: Francois Droz. Владелец: NID SA. Дата публикации: 2012-08-16.

SYSTEMS AND METHODS OF DISSIPATING HEAT FROM AN ELECTRONIC COMPONENT

Номер патента: US20200296272A1. Автор: Kramarov Anton. Владелец: Smart Supervision System LLC. Дата публикации: 2020-09-17.

Method of resolving substrate warpage problem due to differences in thermal coefficients and electronic component embedded printed circuit board manufactured thereof

Номер патента: KR101253514B1. Автор: 김기훈,고영주. Владелец: 아페리오(주). Дата публикации: 2013-04-11.

Method of and device for packaging electronic components thus packaged

Номер патента: CN1299555C. Автор: J·W·D·博斯奇. Владелец: KONINKLIJKE PHILIPS ELECTRONICS NV. Дата публикации: 2007-02-07.

Method of and device for packaging electronic components thus packaged

Номер патента: CN1600052A. Автор: J·W·D·博斯奇. Владелец: KONINKLIJKE PHILIPS ELECTRONICS NV. Дата публикации: 2005-03-23.

Method and device of forming a pattern, method of manufacturing a device, conductive film wiring, electric optical device, and electronic apparatus

Номер патента: KR100594836B1. Автор: 히라이도시미츠,하세이히로노리. Владелец: 세이코 엡슨 가부시키가이샤. Дата публикации: 2006-07-03.

Method of manufacturing cards that each include an electronic module and intermediate products

Номер патента: CA2654878A1. Автор: Francois Droz. Владелец: Individual. Дата публикации: 2007-12-27.

Method of and apparatus for cramming electronic components into storage means

Номер патента: GB2257106B. Автор: Kuniaki Takahashi,Manabu Uesugi. Владелец: TDK Corp. Дата публикации: 1995-02-15.

Electronic component mounting body, electronic component with solder bump, solder resin mixture, electronic component mounting method, and electronic component manufacturing method

Номер патента: JPWO2007099866A1. Автор: 孝史 北江,靖治 辛島,中谷　誠一,誠一 中谷,健一 保手浜,享 澤田. Владелец: Panasonic Corp. Дата публикации: 2009-07-16.

Method of and device for packaging electronic components thus packaged

Номер патента: WO2003049522A1. Автор: Johannes W. D. Bosch. Владелец: KONINKLIJKE PHILIPS ELECTRONICS N.V.. Дата публикации: 2003-06-12.

Electronic component lead terminal, electronic component, electronic component lead terminal manufacturing method, and electronic component lead terminal manufacturing apparatus

Номер патента: JP5793902B2. Автор: 史彦 十倉,浩晃 田村. Владелец: Fujitsu Ltd. Дата публикации: 2015-10-14.

Method of controlling contact load in electronic component mounting apparatus

Номер патента: TW200624208A. Автор: Hiroyuki Yoshida,Noriaki Yoshida,Shuichi Hirata,Makoto Morikawa,Yasuharu Ueno. Владелец: Matsushita Electric Ind Co Ltd. Дата публикации: 2006-07-16.

Method of and apparatus for inserting electronic components into printed board

Номер патента: JPS54126962A. Автор: Kouichi Asai,Tousuke Kawada. Владелец: Fuji Machine Manufacturing Co Ltd. Дата публикации: 1979-10-02.

SERIES OF ELECTRONIC COMPONENTS STORED IN A TAPE, MANUFACTURING METHOD FOR SERIES OF ELECTRONIC COMPONENTS STORED IN A TAPE, AND ELECTRONIC COMPONENT

Номер патента: US20160128244A1. Автор: SAWADA Takashi,NAKAZAWA Hirotaka. Владелец: . Дата публикации: 2016-05-05.

MEANS FOR PACKAGING ELECTRONIC COMPONENTS AND MECHANISM AND METHOD FOR SUPPLYING ELECTRONIC COMPONENTS USING THE MEANS FOR PACKING ELECTRONIC COMPONENTS.

Номер патента: FR2691441B1. Автор: Ito Takeshi,Takahashi Kuniaki,Kudo Koji,TAKAHASHI Tetsuo,Araya Shinichi,Mogi Kunio. Владелец: TDK Corp. Дата публикации: 1995-06-09.

Electronic component mounting apparatus, height detection method for electronic component, and optical-axis adjustment method for component height detection unit

Номер патента: US7684061B2. Автор: Tadashi Endo,Hidehiro Saho,Noboru Yamasaki,Masanori HIYOSHI. Владелец: Panasonic Corp. Дата публикации: 2010-03-23.

Series of electronic components stored in a tape, manufacturing method for series of electronic components stored in a tape, and electronic component

Номер патента: US9961815B2. Автор: Takashi Sawada,Hirotaka NAKAZAWA. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2018-05-01.

Base tape and electronic component array

Номер патента: US20210144889A1. Автор: Yasuhiro Shimizu. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2021-05-13.

Base tape and electronic component array

Номер патента: US11737251B2. Автор: Yasuhiro Shimizu. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-08-22.

Electronic component unit

Номер патента: US20240015934A1. Автор: Hiroyuki Takahashi,Kazuaki Kitajima,Kouzou Kosho. Владелец: Yazaki Corp. Дата публикации: 2024-01-11.

METHOD OF MANUFACTURING ELECTROCONDUCTIVE NANOWIRE NETWORK USING ELECTRON BEAM, TRANSPARENT ELECTRODE AND ELECTRONIC DEVICE USING THE SAME

Номер патента: US20170164467A1. Автор: Kim Ji Soo,SONG Myoung Hoon,NAM Yun Seok,Park Hyung Wook. Владелец: UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY). Дата публикации: 2017-06-08.

METHOD OF MANUFACTURING MULTI-LAYER THIN FILM, MEMBER INCLUDING THE SAME AND ELECTRONIC PRODUCT INCLUDING THE SAME

Номер патента: US20140355183A1. Автор: CHO Jin Hyun,KIM Jin Sub,JUNG Min Chul,Lee Seo Joon,YOO Hyong Jun. Владелец: SAMSUNG ELECTRONICS CO., LTD.. Дата публикации: 2014-12-04.

METHOD OF MANUFACTURING MULTI-LAYER THIN FILM, MEMBER INCLUDING THE SAME AND ELECTRONIC PRODUCT INCLUDING THE SAME

Номер патента: US20140355184A1. Автор: JUNG Hyun Jun,CHO Jin Hyun,KIM Jin Sub,JUNG Min Chul,YOO Hyong Jun. Владелец: SAMSUNG ELECTRONICS CO., LTD.. Дата публикации: 2014-12-04.

ELECTRONIC COMPONENT CARRIER TAPE FEEDING DEVICE AND ELECTRONIC COMPONENT CARRIER TAPE FEEDING METHOD

Номер патента: US20140060749A1. Автор: CHOI Hyong-su. Владелец: . Дата публикации: 2014-03-06.

ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

Номер патента: US20190090359A1. Автор: ITO Shingo. Владелец: . Дата публикации: 2019-03-21.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20140175942A1. Автор: Suzuki Shoichiro,Banno Koichi,Kanzaki Taisuke,Shiota Akihiro. Владелец: MURATA MANUFACTURING CO., LTD.. Дата публикации: 2014-06-26.

ELECTRONIC COMPONENT WITH ENCLOSURE FRAME, CIRCUIT BOARD WITH ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

Номер патента: US20220279643A1. Автор: Liu Yang,Liu Feng,Liu Yuxiu,HU Biao. Владелец: . Дата публикации: 2022-09-01.

LC COMPOSITE ELECTRONIC COMPONENT, AND MOUNTING STRUCTURE FOR LC COMPOSITE ELECTRONIC COMPONENT

Номер патента: US20180226935A1. Автор: YAZAKI Hirokazu,Nakaiso Toshiyuki. Владелец: . Дата публикации: 2018-08-09.

Ceramic package, electronic component device, and method for manufacturing the electronic component device

Номер патента: US20160268995A1. Автор: Masami Hasegawa. Владелец: NGK Spark Plug Co Ltd. Дата публикации: 2016-09-15.

ELECTRONIC-COMPONENT MOUNTING DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

Номер патента: US20190373781A1. Автор: IWASAKI Yukio,HIRATA Kazunori. Владелец: KAWASAKI JUKOGYO KABUSHIKI KAISHA. Дата публикации: 2019-12-05.

Circuit board, method for menufacturing of circuit board, electronic component package and method for menufacturing of electronic component package

Номер патента: KR101565690B1. Автор: 이두환,하형기. Владелец: 삼성전기주식회사. Дата публикации: 2015-11-03.

MACHINE FOR PROCESSING AND INSERTING ELECTRONIC COMPONENTS AND METHOD FOR SUPPLYING AND TRANSFERRING ELECTRONIC COMPONENTS

Номер патента: FR2566377A1. Автор: Hiroshi Yagi,Yoshio Harada,Tetsuro Ito. Владелец: TDK Corp. Дата публикации: 1985-12-27.

Electronic component carrier tape feeding device and electronic component carrier tape feeding method

Номер патента: US9345186B2. Автор: Hyong-su CHOI. Владелец: Hanwha Techwin Co Ltd. Дата публикации: 2016-05-17.

Device and method for cooling electronic components and for supplying power to the electronic components

Номер патента: GB201305730D0. Автор: . Владелец: International Business Machines Corp. Дата публикации: 2013-05-15.

Conveying device, electronic component handling device, and conveying method in electronic component handling device

Номер патента: JP4500770B2. Автор: 健一 島田,正 海沼. Владелец: Advantest Corp. Дата публикации: 2010-07-14.

Method for preparing the automated production of an electronic component, method for automated production and/or for automated post-processing of an electronic component, computing device, computer program and electronically readable data storage device

Номер патента: WO2020074215A1. Автор: Martin HEDGES,Johannes HÖRBER. Владелец: Neotech Amt GmbH. Дата публикации: 2020-04-16.

Process for encapsulating electrical or electronic components or assemblies and encapsulating electrical or electronic components or assemblies.

Номер патента: DE59007409D1. Автор: Siegfried Rauchmaul,Horst Scheffler,Karl-Heinz Horsmann,Hanns-Heinz Peltz,Hans-Fr Dr Schmidt,Juergen Dr Bednarz,Ralf Dr Criens. Владелец: SIEMENS AG. Дата публикации: 1994-11-17.

A ceramic substrate for a thin film electronic component, manufacturing method thereof, and thin film electronic component using the same

Номер патента: DE102004048678A1. Автор: Seiji Nagoya Ichiyanagi,Jun Nagoya Otsuka,Manabu Nagoya Sato. Владелец: NGK Spark Plug Co Ltd. Дата публикации: 2005-06-30.

Electronic component mounting device and mounting head of electronic component

Номер патента: CN102177771B. Автор: 田中勇次,木村知博. Владелец: Matsushita Electric Industrial Co Ltd. Дата публикации: 2014-10-08.

Laminated film for installation of electronic components, film carrier tap for installation of electronic components and semiconductor device

Номер патента: TW200908272A. Автор: Noriaki Iwata,Makoto Yamagata. Владелец: Mitsui Mining & Amp Smelting Co Ltd. Дата публикации: 2009-02-16.

Ceramic package, electronic component device, and method for manufacturing the electronic component device

Номер патента: US9490772B2. Автор: Masami Hasegawa. Владелец: NGK Spark Plug Co Ltd. Дата публикации: 2016-11-08.

Connection Device for Connecting an Electronic Component to a Housing Part and Electronic Controller

Номер патента: US20130120915A1. Автор: EICHNER Markus,UHLAND Thomas. Владелец: KNORR-BREMSE SYSTEME FUER NUTZFAHRZEUGE GMBH. Дата публикации: 2013-05-16.

ELECTRONIC COMPONENT MOUNTING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20190008064A1. Автор: KAJISA Sadamu. Владелец: KYOCERA CORPORATION. Дата публикации: 2019-01-03.

Electronic component mounting substrate, electronic device, and electronic module

Номер патента: US20210066180A1. Автор: Shigeyoshi FUKUZONO,Yuuki BABA. Владелец: Kyocera Corp. Дата публикации: 2021-03-04.

METHOD OF SHIELDING AT LEAST THE TOP OF A RADIOCOMMUNICATION MODULE, AND CORRESPONDING RADIOCOMMUNICATION MODULE

Номер патента: FR2808164B1. Автор: Jacky Jouan,Bachir Kordjani. Владелец: Wavecom SA. Дата публикации: 2002-06-07.

Connection device for connecting an electronic component to a housing part and electronic controller

Номер патента: EP2545289A1. Автор: Thomas Uhland,Markus Eichner. Владелец: Knorr Bremse Systeme fuer Nutzfahrzeuge GmbH. Дата публикации: 2013-01-16.

Multi-piece wiring board, electronic component housing package, electronic device, and electronic module

Номер патента: WO2019065724A1. Автор: 鬼塚　善友. Владелец: 京セラ株式会社. Дата публикации: 2019-04-04.

Connection device for connecting an electronic component to a housing part and electronic controller

Номер патента: US9326411B2. Автор: Thomas Uhland,Markus Eichner. Владелец: Knorr Bremse Systeme fuer Nutzfahrzeuge GmbH. Дата публикации: 2016-04-26.

Electronic component mounting substrate, electronic device, and electronic module

Номер патента: WO2018216801A1. Автор: 祐貴 馬場,陽介 森山. Владелец: 京セラ株式会社. Дата публикации: 2018-11-29.

Method of assembling a protective housing, especially for an electronic module, and protective housing obtained by implementing this method

Номер патента: FR2655809A1. Автор: Thirion Christian,François. Владелец: Siemens Automotive SA. Дата публикации: 1991-06-14.

Electronic component board for mounting electronic and electronic installation

Номер патента: CN104321861B. Автор: 舟桥明彦,堀内加奈江,森山阳介,饭山正嗣. Владелец: Kyocera Corp. Дата публикации: 2017-10-20.

METHOD OF MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT AND APPARATUS FOR MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT

Номер патента: US20150017372A1. Автор: Takada Naoki,URAGAMI Hiroshi,Mizuma Keita,Okamoto Ichitaro,Nakamura Mamoru,Yasuda Shinsuke. Владелец: TOWA CORPORATION. Дата публикации: 2015-01-15.

Method of manufacturing electronic component module and electronic component module

Номер патента: US09532495B2. Автор: Yoshiaki Satake,Shinya KIYONO. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-12-27.

Electronic component and method for manufacturing electronic component

Номер патента: EP3852507A1. Автор: Hiroshi Masuda,Yoshiaki Kurihara,Yoshinori Ejiri,Hideo Nakako,Keita Sone,Masaya TOBA,Yuki Kawana,Takaaki Nohdoh,Motoki YONEKURA,Shinichirou Sukata,Kosuke URASHIMA. Владелец: Showa Denko Materials Co Ltd. Дата публикации: 2021-07-21.

Method of manufacturing electronic board, composite sheet, and electronic board

Номер патента: GB2579268A. Автор: Wong Tin-Lup,Kosuga Tadashi. Владелец: Thomas Leffers. Дата публикации: 2020-06-17.

Method of manufacturing element chip, method of manufacturing electronic component-mounted structure, and electronic component-mounted structure

Номер патента: US09953906B2. Автор: Noriyuki Matsubara,Shogo Okita,Atsushi Harikai. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2018-04-24.

Electronic device and method of manufacturing electronic device

Номер патента: US09462693B2. Автор: Seiki Sakuyama,Keishiro Okamoto. Владелец: Fujitsu Ltd. Дата публикации: 2016-10-04.

Method of manufacturing electronic component module, and electronic component module

Номер патента: US11876029B2. Автор: Takashi Iwamoto. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-01-16.

Method of manufacturing transient electronics

Номер патента: US20240080991A1. Автор: Lavinia Andreea Danielescu,Jung Wook Park,Aditi Maheshwari,Tingyu Cheng,Eric Michael Gallo,Taylor Tabb,Luke Fabrice Gockowski. Владелец: Accenture Global Solutions Ltd. Дата публикации: 2024-03-07.

Electronic component module and method for manufacturing electronic component module

Номер патента: US09860989B2. Автор: Sho Fujita,Toshitaka HAYASHI,Shinya KIYONO. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2018-01-02.

Support body, method of manufacturing support body, method of manufacturing wiring board, method of manufacturing electronic component, and wiring structure

Номер патента: US09763332B2. Автор: Kazuhiro Kobayashi. Владелец: Shinko Electric Industries Co Ltd. Дата публикации: 2017-09-12.

Method of manufacturing wiring substrate and method of manufacturing electronic component device

Номер патента: US8176627B2. Автор: Kazuhiro Kobayashi. Владелец: Shinko Electric Industries Co Ltd. Дата публикации: 2012-05-15.

Methods for manufacturing electronic packages and electronic assemblies

Номер патента: US20230402293A1. Автор: Yi Liu,Anthony James LoBianco,Ki Wook Lee. Владелец: Skyworks Solutions Inc. Дата публикации: 2023-12-14.

Substrate holding method and method of manufacturing electronic part

Номер патента: US20050210666A1. Автор: Kazuo Nishi,Hideaki Ninomiya,Hisao Morooka,Junichi Shimamura. Владелец: Semiconductor Energy Laboratory Co Ltd. Дата публикации: 2005-09-29.

Method for manufacturing a plurality of electronic components

Номер патента: US20240321795A1. Автор: Olivier Ory,Michael DE CRUZ. Владелец: STMicroelectronics International NV. Дата публикации: 2024-09-26.

Composite electronic module and method of manufacturing composite electronic module

Номер патента: US20120075032A1. Автор: Yasuhiro Takahashi,Takatoshi Kato. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2012-03-29.

Multilayer module and method of manufacturing the same

Номер патента: US20060261472A1. Автор: Junichi Kimura,Shinji Harada,Kazuhiko Honjo,Eiji Kawamoto,Motoyoshi Kitagawa. Владелец: Individual. Дата публикации: 2006-11-23.

Method of manufacturing electronic device

Номер патента: US20240074037A1. Автор: Ying-Jen Chen,Chih-Yung Hsieh,Yung-Chi Wang. Владелец: Innolux Corp. Дата публикации: 2024-02-29.

Electronic devices and methods of manufacturing electronic devices

Номер патента: US09536817B2. Автор: Hyung-Jun Kim,Jae-Sung Lim. Владелец: Hana Micron Co Ltd. Дата публикации: 2017-01-03.

Method of manufacturing electronic device and electronic device

Номер патента: US09474180B2. Автор: Tetsuya Otsuki. Владелец: Seiko Epson Corp. Дата публикации: 2016-10-18.

Film Carrier Tape for Mounting Electronic Components and Method of Manufacturing the Film Carrier Tape

Номер патента: US20080063838A1. Автор: Hiroaki Kurihara,Naoya Yasui. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2008-03-13.

Method of manufacturing ceramic electronic components

Номер патента: EP1118089A1. Автор: Yoshiyuki Miura,Atsuo Nagai,Yoshiya Sakaguchi,Hideki Kuramitsu. Владелец: Matsushita Electric Industrial Co Ltd. Дата публикации: 2001-07-25.

Method of manufacturing resin sealing module, and resin sealing module

Номер патента: US09873218B2. Автор: Masaaki Hasegawa. Владелец: Shindengen Electric Manufacturing Co Ltd. Дата публикации: 2018-01-23.

Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same

Номер патента: US20090174083A1. Автор: Masahiro Sunohara,Kiyoshi Ol. Владелец: Shinko Electric Industries Co Ltd. Дата публикации: 2009-07-09.

Method of manufacturing electronic module, electronic module, and electronic device

Номер патента: US11632886B2. Автор: Mitsutoshi Hasegawa. Владелец: Canon Inc. Дата публикации: 2023-04-18.

Method of manufacturing electronic device

Номер патента: US09761556B2. Автор: Kosuke Kobayashi,Yoshitada HIGASHIZAWA,Yukinori HATAYAMA. Владелец: Shinko Electric Industries Co Ltd. Дата публикации: 2017-09-12.

Electronic component and method of manufacturing the same

Номер патента: US20130222105A1. Автор: Keishiro Amaya,Satoki Sakai,Eita Tamezawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2013-08-29.

Method of manufacturing electronic component and electronic component

Номер патента: US20210392798A1. Автор: Yoshiharu SUEMORI. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2021-12-16.

Solder reflow apparatus and method of manufacturing electronic device

Номер патента: US20240355640A1. Автор: Youngja KIM,Minwoo Jeon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-10-24.

Package structure and method of manufacturing the same

Номер патента: US09972599B2. Автор: Shih-Ping Hsu,Chao-Chung TSENG. Владелец: Phoenix Pioneer Technology Co Ltd. Дата публикации: 2018-05-15.

Electronic assemblies and methods of manufacturing the same

Номер патента: EP4367986A1. Автор: Aydin Nabovati,Rishabh BHANDARI,William Chang,Vijaykumar Krithivasan,Yong Guo Li. Владелец: Tesla Inc. Дата публикации: 2024-05-15.

Electronic assemblies and methods of manufacturing the same

Номер патента: US20240312863A1. Автор: Aydin Nabovati,Rishabh BHANDARI,William Chang,Vijaykumar Krithivasan,Yong Guo Li. Владелец: Tesla Inc. Дата публикации: 2024-09-19.

Solder reflow apparatus and method of manufacturing electronic device

Номер патента: US20240293884A1. Автор: Youngja KIM,Seungyeop OH. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-09-05.

Method of manufacturing substrate and method of manufacturing electronic device

Номер патента: US09894775B2. Автор: Shin Akasaka,Kentarou Satou,Yuki Oishi,Satoshi Kumon. Владелец: Sony Corp. Дата публикации: 2018-02-13.

Method of manufacturing mounting substrate

Номер патента: US09480195B2. Автор: Hiroaki Kurata. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2016-10-25.

Method and apparatus for manufacturing electronics without PCB

Номер патента: US20200315024A1. Автор: Nikolay V. Khatuntsev. Владелец: Individual. Дата публикации: 2020-10-01.

A packaging unit for protecting electronic components from electrostatic discharge, paper for a packing unit and a method of manufacturing said paper

Номер патента: EP1383690B1. Автор: Lars-Anders Ulfheim,Stefan THORÉN. Владелец: Smurfit Munksjo Packaging AB. Дата публикации: 2006-06-21.

A packaging unit for protecting electronic components from electrostatic discharge, paper for a packing unit and a method of manufacturing said paper

Номер патента: EP1383690A1. Автор: Lars-Anders Ulfheim,Stefan THOR N. Владелец: Smurfit Munksjo Packaging AB. Дата публикации: 2004-01-28.

Method of manufacturing module

Номер патента: US09491846B2. Автор: Yoichi Takagi,Nobuaki Ogawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-11-08.

Method of manufacturing a strap for a wearable device

Номер патента: US20240208117A1. Автор: Richard DINAN,Patrick James FAWCETT. Владелец: Armour Surveillance Security Equipment and Technology Ltd. Дата публикации: 2024-06-27.

Method of manufacturing electronic device

Номер патента: US20240237224A9. Автор: Jungwook Kim,Heechang Kim,Shinya Onoue,KyoungHee Park,Hyeon Deuk Hwang,Eunjoong MUN,Jiyun BANG. Владелец: Samsung Display Co Ltd. Дата публикации: 2024-07-11.

Lithography apparatus, lithography method and method of manufacturing master print for transfer

Номер патента: US20020101460A1. Автор: LEE Chahn,Hiroshi Sasaki,Mitsuru Hasegawa,Akihiro Miyauchi,Mitsuo Hayashibara. Владелец: HITACHI LTD. Дата публикации: 2002-08-01.

Lithography apparatus, lithography method and method of manufacturing master print for transfer

Номер патента: US6635403B2. Автор: LEE Chahn,Hiroshi Sasaki,Mitsuru Hasegawa,Akihiro Miyauchi,Mitsuo Hayashibara. Владелец: HITACHI LTD. Дата публикации: 2003-10-21.

Method of manufacturing battery module and interconnect board assembly with integrated pcb and flex circuit

Номер патента: US20200275555A1. Автор: Evan J. Dawley. Владелец: GM GLOBAL TECHNOLOGY OPERATIONS LLC. Дата публикации: 2020-08-27.

Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method

Номер патента: US20100035021A1. Автор: Chiho Ogihara. Владелец: NEC Electronics Corp. Дата публикации: 2010-02-11.

Electronic module and method of manufacturing the same

Номер патента: US09847274B2. Автор: Ivan Nikitin,Jürgen Högerl,Frank Winter,Ottmar Geitner. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2017-12-19.

Method of manufacturing electronic package module

Номер патента: US09814166B2. Автор: Jen-Chun Chen,Chia-Cheng Liu,Tsung-Jung Cheng. Владелец: Universal Scientific Industrial Shanghai Co Ltd. Дата публикации: 2017-11-07.

Component built-in board and method of manufacturing the same, and component built-in board mounting body

Номер патента: US09591767B2. Автор: Masahiro Okamoto,Kazuhisa Itoi. Владелец: Fujikura Ltd. Дата публикации: 2017-03-07.

Electronic module and method of manufacturing the same

Номер патента: US09532459B2. Автор: Juergen Hoegerl,Ivan Nikitin,Frank Winter,Ottmar Geitner. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2016-12-27.

Composition for manufacturing electronic devices, manufacturing method of composition for manufacturing electronic devices, manufacturing method of organic thin film and organic thin film

Номер патента: JP6984649B2. Автор: 弘志 北,達夫 田中. Владелец: KONICA MINOLTA INC. Дата публикации: 2021-12-22.

Method of manufacturing light-emitting element, light-emitting element, display device and electronic equipment

Номер патента: KR100720051B1. Автор: 가츠유키 모리이. Владелец: 세이코 엡슨 가부시키가이샤. Дата публикации: 2007-05-18.

Thin-layer encapsulation for an opto-electronic component, method for producing same and opto-electronic component

Номер патента: EP2472629A1. Автор: Thomas Dobbertin,Erwin Lang,Dirk Becker,Thilo Reusch. Владелец: OSRAM Opto Semiconductors GmbH. Дата публикации: 2012-07-04.

Method of bonding amorphous carbon material with metal material or ceramic material and electron tube device

Номер патента: US5860584A. Автор: Tutomu Inazuru. Владелец: Hamamatsu Photonics KK. Дата публикации: 1999-01-19.

Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module

Номер патента: US20020185306A1. Автор: Tsutomu Mitani,Takashi Kitae,Hiroaki Takezawa,Yukihiro Ishimaru. Владелец: Individual. Дата публикации: 2002-12-12.

Plasma processing device, plasma processing method and method of manufacturing electronic devices

Номер патента: US09627183B2. Автор: Tomohiro Okumura. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2017-04-18.

Method of manufacturing winding-type electronic component

Номер патента: US12073990B2. Автор: Takayuki Yamakita. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-08-27.

Dielectric composition for low-temperature sintering, multilayer ceramic electronic component containing the same, and method of manufacturing multilayer ceramic electronic component

Номер патента: US09472316B2. Автор: Doo Young Kim,Chang Hoon Kim,Seok Hyun Yoon,Jong Bong LIM,No Hoon PARK. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-10-18.

Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package

Номер патента: US20170133288A1. Автор: Jung Hyun Cho,Jae Hoon Choi,Yong Ho Baek. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2017-05-11.

Ceramic package, method of manufacturing the same, electronic component, and module

Номер патента: US09929067B2. Автор: Koichi Shimizu. Владелец: Canon Inc. Дата публикации: 2018-03-27.

Method of aligning and placing an electronic component and a system for aligning and placing an electronic component

Номер патента: US20230223286A1. Автор: Raymond Rosmalen,Erik Stens,Thijs Kniknie. Владелец: Nexperia BV. Дата публикации: 2023-07-13.

Method of forming a plurality of electronic component packages

Номер патента: US09691734B1. Автор: Brett Arnold Dunlap. Владелец: Amkor Technology Inc. Дата публикации: 2017-06-27.

Method of manufacturing multilayer ceramic electronic component

Номер патента: US5597494A. Автор: Tatsuya Suzuki,Yoshiaki Kohno. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1997-01-28.

Metal structure and method of manufacturing the same and metal wire and semiconductor device and electronic device

Номер патента: US20210028024A1. Автор: Do Yoon Kim,Kenji Takai,Boun Yoon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2021-01-28.

Hardware security module, method of updating integrity check value stored in hardware security module, and method of updating program stored in terminal by using hardware security module

Номер патента: US09904806B2. Автор: Hong Il JU. Владелец: Electronics and Telecommunications Research Institute ETRI. Дата публикации: 2018-02-27.

Electronic component package, circuit module and method for producing electronic component package

Номер патента: US20240312856A1. Автор: Takamitsu Nakamura,Tsuyoshi Takakura,Hideo Nakagoshi,Hiroki YOSHIMORI,Daisuke Kino. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-09-19.

Method of manufacturing multilayer ceramic electronic component

Номер патента: US20160225524A1. Автор: Tae Ho Kim,Doo Young Kim,Byoung HWA Lee,Taek Jung Lee,Jin Kyung JOO,Sin Il GU. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-08-04.

Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package

Номер патента: US20180068911A1. Автор: Jung Hyun Cho,Jae Hoon Choi,Yong Ho Baek. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-03-08.

Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package

Номер патента: US9831142B2. Автор: Jung Hyun Cho,Jae Hoon Choi,Yong Ho Baek. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2017-11-28.

Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package

Номер патента: US20180286770A1. Автор: Jung Hyun Cho,Jae Hoon Choi,Yong Ho Baek. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-10-04.

Method of manufacturing multilayer ceramic electronic component

Номер патента: US20160351334A1. Автор: Togo Matsui,Yuya Takagi,Hikaru OKUDA. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-12-01.

Ceramic electronic component without external electrodes on top surface, substrate arrangement including the same, and method of manufacturing such ceramic electronic component

Номер патента: US11961680B2. Автор: Takashi Shimada. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2024-04-16.

Ceramic package, method of manufacturing the same, electronic component, and module

Номер патента: US20170309533A1. Автор: Koichi Shimizu. Владелец: Canon Inc. Дата публикации: 2017-10-26.

Method of forming electrodes of an electronic component of chip type for connecting to the external

Номер патента: US4756928A. Автор: Atsuo Senda,Takuji Nakagawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1988-07-12.

Method of forming a plurality of electronic component packages

Номер патента: US20170294405A1. Автор: Brett Arnold Dunlap. Владелец: Amkor Technology Inc. Дата публикации: 2017-10-12.

Method of selecting an external electronic device connected with an electronic device and electronic device using same

Номер патента: US09794728B2. Автор: Sungjoon WON,James POWDERLY. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2017-10-17.

Operation method of network controller using unique identification information of cells and clusters and electronic device for performing the same

Номер патента: US20240235660A1. Автор: Jae Hyun HAM,Byung Gak JO,Yong Up JANG. Владелец: Agency for Defence Development. Дата публикации: 2024-07-11.

Heat sink and method of removing heat from power electronics components

Номер патента: WO2003083941A2. Автор: John Makaran. Владелец: Siemens Vdo Automotive Inc.. Дата публикации: 2003-10-09.

Layer structures including two-dimensional channel layer, methods of manufacturing the same, electronic devices including 2d channel layer, and electronic apparatuses including electronic device

Номер патента: US20240038845A1. Автор: Minsu Seol,Kyung-Eun Byun,JunYoung KWON,Minseok YOO. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-02-01.

Method for mounting electronic component and structure having mounted thereon an electronic component

Номер патента: US6586278B1. Автор: Masaaki Minami,Takeshi Osaka,Mototsugu Okamura. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2003-07-01.

Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package

Номер патента: US20130292855A1. Автор: Klaus-Guenter Oppermann,Martin Franosch,Bernhard Gebauer. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2013-11-07.

Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component

Номер патента: US20240274359A1. Автор: Hisashi Sato. Владелец: Kyocera Corp. Дата публикации: 2024-08-15.

Piezoelectric resonator element, piezoelectric device, method of manufacturing the same, cellular phone device utilizing piezoelectric device, and electronic equipment utilizing piezoelectric device

Номер патента: EP1528673B1. Автор: Hideo Tanaya,Atsushi Oshiro,Toshinari Jokura. Владелец: Seiko Epson Corp. Дата публикации: 2008-01-02.

Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component

Номер патента: US09905364B2. Автор: Takahiro Hirao. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2018-02-27.

Bump-equipped electronic component and method for manufacturing bump-equipped electronic component

Номер патента: US09679860B2. Автор: Isao Obu,Shinya Osakabe. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-06-13.

Electronic component, leadframe, and method for producing an electronic component

Номер патента: US9922907B2. Автор: Stefan Gruber,Michael Zitzlsperger,Daniel Richter,Christian Ziereis. Владелец: OSRAM Opto Semiconductors GmbH. Дата публикации: 2018-03-20.

Electronic component connecting apparatus, electronic unit and electronic apparatus

Номер патента: US20090239394A1. Автор: Hiroshi Yamada,Tomomi Okamoto. Владелец: Fujitsu Ltd. Дата публикации: 2009-09-24.

Electronic component mounting board, electronic device, and electronic module

Номер патента: US20180308777A1. Автор: Akihiko FUNAHASHI. Владелец: Kyocera Corp. Дата публикации: 2018-10-25.

Electronic component housing package, electronic device, and electronic module

Номер патента: EP3993024A1. Автор: Takahiro Sasaki. Владелец: Kyocera Corp. Дата публикации: 2022-05-04.

Electronic component, transposing component, method for fabricating the electronic component, and method for transposing a micro-element

Номер патента: US20180240767A1. Автор: Chung-Chan LIU,Yi-Cheng Liu,Ho-Cheng LEE. Владелец: AU OPTRONICS CORP. Дата публикации: 2018-08-23.

Method for producing an electronic component, method for producing a thyristor, method for producing a drain-extended mos filed-effect transistor, electronic component, drain-extended mos field-effect transistor, electronic component arrangement

Номер патента: US20100062573A1. Автор: Thomas Schulz,Harald Gossner,Christian Russ,Gerhard Knoblinger. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2010-03-11.

Organic electronic component and method for producing an organic electronic component

Номер патента: US20180342692A1. Автор: Andreas Rausch,Niels Gerlitzki. Владелец: OSRAM OLED GmbH. Дата публикации: 2018-11-29.

Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component

Номер патента: US20160020029A1. Автор: Takahiro Hirao. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-01-21.

Organic electronic component and method for producing an organic electronic component

Номер патента: US20230180494A1. Автор: Andreas Rausch,Niels Gerlitzki. Владелец: Pictiva Displays International Ltd. Дата публикации: 2023-06-08.

Bump-equipped electronic component and method for manufacturing bump-equipped electronic component

Номер патента: US20170236796A1. Автор: Isao Obu,Shinya Osakabe. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-08-17.

Electronic component housing package, electronic apparatus, and electronic module

Номер патента: US20190326877A1. Автор: Masaki Suzuki,Takuo KISAKI. Владелец: Kyocera Corp. Дата публикации: 2019-10-24.

Electronic component housing package, electronic apparatus, and electronic module

Номер патента: US20180358949A1. Автор: Masaki Suzuki,Takuo KISAKI. Владелец: Kyocera Corp. Дата публикации: 2018-12-13.

Multilayer ceramic electronic component and method for producing multilayer ceramic electronic component

Номер патента: US20240145168A1. Автор: Daisuke Hamada. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-05-02.

Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component

Номер патента: US20240212938A1. Автор: Yasuhiro Matsumoto,Koichiro Morita. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2024-06-27.

Control method of discharge-excitation type laser device, discharge-excitation type laser device, and electronic device manufacturing method

Номер патента: US20240128706A1. Автор: Keisuke Ishida. Владелец: GIGAPHOTON INC. Дата публикации: 2024-04-18.

Method of preparing quantum dot, quantum dot prepared thereby, and optical member and electronic apparatus including the quantum dot

Номер патента: US20230403875A1. Автор: Seungwon PARK,Kawon Pak,Seunghee Jang. Владелец: Samsung Display Co Ltd. Дата публикации: 2023-12-14.

Methods of forming a microelectronic device, and related microelectronic devices, memory devices, and electronic systems

Номер патента: US20220246736A1. Автор: Terrence B. Mcdaniel,Sandeep Ramasamudra Suresha. Владелец: Micron Technology Inc. Дата публикации: 2022-08-04.

Electronic device, method of manufacturing electronic device, and lead

Номер патента: US20200266140A1. Автор: Hisao Motoyama. Владелец: Seiko Epson Corp. Дата публикации: 2020-08-20.

Method for manufacturing electronic device

Номер патента: US20090186454A1. Автор: Dongxu Wang,Yoshiteru Miyawaki. Владелец: Sanyu Rec Co Ltd. Дата публикации: 2009-07-23.

Electronic component package and method of manufacturing the same

Номер патента: US09929100B2. Автор: Hyoung Joon Kim,Doo Hwan Lee,Kyung Seob Oh,Jong Rip Kim,Ung Hui Shin. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-03-27.

Method of manufacturing multilayer electronic component, and multilayer electronic component

Номер патента: US20230207221A1. Автор: Chang Ho Seo,Sung Kwon An. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2023-06-29.

Laminated electronic component manufacturing method, and laminated electronic component

Номер патента: US20150116900A1. Автор: Takashi Sawada. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2015-04-30.

Electronic component and methods relating to same

Номер патента: WO2023137184A1. Автор: Lawrence B. Lestarge,Scott Hess,Andrew Klesyk,Hyeonchul Park. Владелец: Coilcraft, Incorporated. Дата публикации: 2023-07-20.

Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof

Номер патента: US12087676B2. Автор: Seung Woo Lee,Hyung Jun CHO,Jae Min Bae. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2024-09-10.

Multilayer electronic component and method of manufacturing the same

Номер патента: US09916926B2. Автор: Seung Kye LEE. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-03-13.

Manufacturing method for laminated electronic component

Номер патента: US9922765B2. Автор: Takashi Sawada. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2018-03-20.

Method of manufacturing multilayer electronic component

Номер патента: US20240112864A1. Автор: Sun Mi Kim,Eun Jung Lee,Jong Ho Lee,Yong Park,Jung Tae Park,Yong Min Hong,Jung Jin Park,Rak Hyeon BAEK,Yong Ung LEE. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2024-04-04.

Package structure including at least two electronic components

Номер патента: US20240203886A1. Автор: Wu-Der Yang. Владелец: Nanya Technology Corp. Дата публикации: 2024-06-20.

Semiconductor package and method of manufacturing the same

Номер патента: US20210217677A1. Автор: Wen-Long Lu. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2021-07-15.

Semiconductor device package and a method of manufacturing the same

Номер патента: US09953931B1. Автор: Wei-Hsuan Lee,Yu-Chih Lee,Chih Sheng Yao,Huan Wun Li. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2018-04-24.

Method of assembling non-molded radioelectronic components on printed circuit boards for circuits with redundancy

Номер патента: RU2693838C1. Автор: Тальгат Рашитович Газизов,Павел Евгеньевич Орлов,Виталий Расимович Шарафутдинов. Владелец: Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники". Дата публикации: 2019-07-05.

Hybrid device and a method of producing electrically active components by an assembly operation

Номер патента: US6281039B1. Автор: Francois Marion. Владелец: Commissariat a lEnergie Atomique CEA. Дата публикации: 2001-08-28.

Manufacturing method of an electronic device

Номер патента: US20240313187A1. Автор: Tsung-Han Tsai,Kuan-Feng Lee,Yuan-Lin Wu,Jia-Yuan Chen. Владелец: Innolux Corp. Дата публикации: 2024-09-19.

Electronic component package and method of manufacturing the same

Номер патента: US09905526B2. Автор: Ji Hoon Kim,Sun Ho Kim,Kyung Seob Oh,Kyoung Moo Harr. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-02-27.

Wearable device and method of making thereof

Номер патента: RU2605895C2. Автор: И Чжан,Тао ВАН,Юнфэн СЯ,Ниннин ЛИ,Лянь ЧЖАН. Владелец: Сяоми Инк.. Дата публикации: 2016-12-27.

Interlayer insulation sheet for electronic component built-in module, electronic component built-in module, and method of manufacturing electronic component built-in module

Номер патента: JP5309352B2. Автор: 善一 金丸,高章 森田. Владелец: TDK Corp. Дата публикации: 2013-10-09.

Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components

Номер патента: US6990750B2. Автор: Stephane Rabia,Martin Theriault,Kristen Boyce. Владелец: Air Liquide America Corp. Дата публикации: 2006-01-31.

Semiconductor package, method of manufacturing semiconductor package, electronic component, and method of manufacturing electronic component

Номер патента: JP2010129946A. Автор: 忠之 新谷,Tadayuki Shintani. Владелец: Renesas Electronics Corp. Дата публикации: 2010-06-10.

Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components

Номер патента: US20040143989A1. Автор: Stephane Rabia,Martin Theriault,Kristen Boyce. Владелец: Individual. Дата публикации: 2004-07-29.

Method of manufacturing multilayer ceramic electronic component

Номер патента: GB9415870D0. Автор: . Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1994-09-28.

Hv switch unit, pulsing assembly and method of avoiding voltage imbalances in an hv switch

Номер патента: EP3945669A1. Автор: Andrzej Klimczak,Andrzej Gieraltowski,Michał Balcerak. Владелец: Trumpf Huettinger Sp zoo. Дата публикации: 2022-02-02.

Hv switch unit, pulsing assembly and method of avoiding voltage imbalances in an hv switch

Номер патента: EP4189818A1. Автор: Andrzej Klimczak,Andrzej Gieraltowski,Michał Balcerak. Владелец: Trumpf Huettinger Sp zoo. Дата публикации: 2023-06-07.

Hv switch unit, pulsing assembly and method of avoiding voltage imbalances in an hv switch

Номер патента: WO2022023270A1. Автор: Andrzej Klimczak,Andrzej Gieraltowski,Michał Balcerak. Владелец: Trumpf Huettinger Sp. Z O. O.. Дата публикации: 2022-02-03.

Manufacturing method of electronic device

Номер патента: US20240258453A1. Автор: Chun-Hui Huang. Владелец: Innolux Corp. Дата публикации: 2024-08-01.

Method of producing multilayer ceramic electronic component, and multilayer ceramic electronic component

Номер патента: US12080483B2. Автор: Yuichiro Tanaka,Hiroki Awata. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-09-03.

Electronic component conveying apparatus and method of controlling the same

Номер патента: US20080217136A1. Автор: Mitsuru Ikeda. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2008-09-11.

Hv switch unit, pulsing assembly and method of avoiding voltage imbalances in an hv switch

Номер патента: US20230170687A1. Автор: Andrzej Klimczak,Andrzej Gieraltowski,Michał Balcerak. Владелец: Trumpf Huettinger Sp zoo. Дата публикации: 2023-06-01.

Microelectronic contact structure, and method of making same.

Номер патента: US20010002340A1. Автор: Gary Grube,Benjamin Eldridge,Igor Khandros,Gaetan Mathieu. Владелец: Formfactor Inc. Дата публикации: 2001-05-31.

Package structure including at least two electronic components and method for manufacturing the same

Номер патента: US20240203887A1. Автор: Wu-Der Yang. Владелец: Nanya Technology Corp. Дата публикации: 2024-06-20.

Electronic component module and its manufacturing method

Номер патента: US8735736B2. Автор: Masashi Shiraishi,Tamon Kasajima. Владелец: SAE Magnetics HK Ltd. Дата публикации: 2014-05-27.

Ceramic electronic component and method of manufacturing the same

Номер патента: US20120120547A1. Автор: Myung Jun Park,Yoon Sun Lee,Chi Hyoun RO. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2012-05-17.

Electronic component module and its manufacturing method

Номер патента: US20130075143A1. Автор: Masashi Shiraishi,Tamon Kasajima. Владелец: SAE Magnetics HK Ltd. Дата публикации: 2013-03-28.

Electronic component module

Номер патента: US20150255401A1. Автор: Hisayuki Abe,Susumu Taniguchi,Makoto Orikasa,Miyuki Yanagida. Владелец: TDK Corp. Дата публикации: 2015-09-10.

Semiconductor device, semiconductor device package and method of manufacturing the same

Номер патента: US11830834B2. Автор: Chih-Cheng LEE,Hsing Kuo TIEN. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2023-11-28.

Semiconductor devices and methods of manufacturing semiconductor devices

Номер патента: US20230352374A1. Автор: Seung Woo Lee,Hyung Jun CHO,Jae Min Bae. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2023-11-02.

Multilayer electronic component and method of manufacturing multilayer electronic component

Номер патента: US20240145173A1. Автор: Sun Mi Kim,Eun Jung Lee,Jong Ho Lee,Yong Park,Min Woo Kim,Jung Tae Park,Yong Min Hong,Sim Chung KANG,Ji Hyeon Lee. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2024-05-02.

Low dielectric constant materials and methods of preparation thereof

Номер патента: EP1373358A1. Автор: Kreisler Honeywell International Inc. LAU,Feng Quan Honeywell International Inc. LIU,Boris Honeywell International Inc. KOROLEV,Emma Honeywell International Inc. BROUK,Ruslan Honeywell International Inc. ZHEREBIN,Roger Honeywell International Inc. LEUNG,David Honeywell International Inc. NALEWAJEK,Paul HONEYWELL INTERNATIONAL INC. APEN. Владелец: Honeywell International Inc. Дата публикации: 2004-01-02.

Ceramic electronic component and method of manufacturing the same and electronic device

Номер патента: US20200234888A1. Автор: Takayoshi Sasaki,Chan Kwak,Minoru Osada,Youngjin Cho,Yoon Chul SON,Doh Won JUNG. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-07-23.

Ceramic electronic component and method of manufacturing the same and electronic device

Номер патента: US20190131077A1. Автор: Takayoshi Sasaki,Chan Kwak,Minoru Osada,Youngjin Cho,Yoon Chul SON,Doh Won JUNG. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2019-05-02.

Semiconductor package structure and method of manufacturing the same

Номер патента: US20210257988A1. Автор: Lu-Ming Lai,Ching-Han Huang,Kuo-Hua Lai,Chi Sheng Tseng,Hui-Chung Liu. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2021-08-19.

Electronic device package and method of manufacturing the same

Номер патента: US11855034B2. Автор: Teck-Chong Lee,Chin-Li Kao,Chih-Yi Huang,Chung-Hung LAI. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2023-12-26.

Method of manufacturing multilayer electronic component

Номер патента: US20240161977A1. Автор: Tae Gyun Kwon,Eung Seok Lee,So Hyeon HONG. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2024-05-16.

Method of manufacturing multilayer electronic component

Номер патента: US20240071689A1. Автор: Sun Mi Kim,Eun Jung Lee,Jong Ho Lee,Yong Park,Min Woo Kim,Jung Tae Park,Ji Hyeon Lee,Myung Chan Son. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2024-02-29.

Packaged Device, Packaged Module, and Power Conversion Device

Номер патента: US20240096729A1. Автор: DONG Chen,Lei Shi,Yunfeng Liu,Pengcheng Zhang,Yunyu Tang,Fenglong Lu,Shuyi LV. Владелец: Huawei Digital Power Technologies Co Ltd. Дата публикации: 2024-03-21.

Method of Improving Current Balance of Parallel Chips in Power Module and Power Module Employing Same

Номер патента: US20230223330A1. Автор: Yu Cheol PARK. Владелец: Hyundai Mobis Co Ltd. Дата публикации: 2023-07-13.

Radio-frequency module and communication apparatus

Номер патента: US20240259036A1. Автор: Keisuke Nishio. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-08-01.

Extendable Vehicle Electronics System, Extension Module, and Associated Methods

Номер патента: US20230267182A1. Автор: Markus Neumann,Tim Welsch. Владелец: Aptiv Technologies Ltd. Дата публикации: 2023-08-24.

METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT MANUFACTURED THEREBY

Номер патента: US20140376151A1. Автор: Choi Jae Yeol,Lee Jong Ho,Kim Yu Na,KIM Sung Woo. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2014-12-25.

Light sensing device and method of manufacturing the same, image sensor including light sensing device, and electronic apparatus including image sensor

Номер патента: US20240243216A1. Автор: Yooseong Yang,Kyungsang Cho,Chanwook BAIK. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-18.

BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE

Номер патента: US20180068911A1. Автор: CHOI Jae Hoon,CHO Jung Hyun,BAEK Yong Ho. Владелец: . Дата публикации: 2018-03-08.

BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE

Номер патента: US20170133288A1. Автор: CHOI Jae Hoon,CHO Jung Hyun,BAEK Yong Ho. Владелец: . Дата публикации: 2017-05-11.

BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE

Номер патента: US20180286770A1. Автор: CHOI Jae Hoon,CHO Jung Hyun,BAEK Yong Ho. Владелец: . Дата публикации: 2018-10-04.

Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component

Номер патента: US8755167B2. Автор: Kwang Jik LEE,Suk Jin Ham,Ji Hyuk Lim. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2014-06-17.

Semiconductor Device and Method of Forming Conductive Structure for EMI Shielding and Heat Dissipation

Номер патента: US20240030154A1. Автор: Heesoo Lee,Seunghyun Lee. Владелец: Jcet Stats Chippac Korea Ltd. Дата публикации: 2024-01-25.

Anisotropic conductive interconnect material for electronic devices, method of use and resulting product

Номер патента: US6011307A. Автор: Tongbi Jiang,Zhiqiang Wu,David Kao,Rongsheng Yang. Владелец: Micron Technology Inc. Дата публикации: 2000-01-04.

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Номер патента: CN1841688A. Автор: 芳村淳,大久保忠宣. Владелец: Toshiba Corp. Дата публикации: 2006-10-04.

Dielectric composition for low-temperature sintering, multilayer ceramic electronic component containing the same, and method of manufacturing multilayer ceramic electronic component

Номер патента: US20160055933A1. Автор: Doo Young Kim,Chang Hoon Kim,Seok Hyun Yoon,Jong Bong LIM,No Hoon PARK. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-02-25.

METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20170301469A1. Автор: Kim Doo Young,CHOI Hye Young,Hong Ki Pyo,KIM You Na,JUHNG Bong Jun. Владелец: . Дата публикации: 2017-10-19.

Method of manufacturing multilayer ceramic electronic component and multilayer ceramic electronic component using the same

Номер патента: US20120151763A1. Автор: Hyo Jung Kim,Doo Young Kim,Jin Hyung Lim,Seon Gu JUNG. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2012-06-21.

DIELECTRIC COMPOSITION FOR LOW-TEMPERATURE SINTERING, MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20150029637A1. Автор: Kim Doo Young,Kim Sang Huk,Yoon Seok Hyun,LIM Jong Bong. Владелец: . Дата публикации: 2015-01-29.

METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20200111616A1. Автор: Woo Seok Kyoon,CHOI Du Won,JO Ji Hong. Владелец: . Дата публикации: 2020-04-09.

Coil electronic component and method of manufacturing the coil electronic component

Номер патента: US20180268979A1. Автор: Jin Seong Kim,Sung Sik Shin. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-09-20.

High frequency electronic component and method of manufacturing high frequency electronic component

Номер патента: JP2871591B2. Автор: 卓 佐藤,潤一 田中,清治 市川,友明 廣川,伴昭 木村,智司 村田,勧 窪田,全夫 荻原,建次 内田,雅俊 小原. Владелец: Nippon Electric Co Ltd. Дата публикации: 1999-03-17.

Monolithic ceramic electronic component and method of manufacturing monolithic ceramic electronic component

Номер патента: US20090303656A1. Автор: Makoto Ogawa,Kenichi Kawasaki,Tatsuo Kunishi,Shunsuke Takeuchi,Akihiro Motoki. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2009-12-10.

Monolithic ceramic electronic component and method of manufacturing monolithic ceramic electronic component

Номер патента: CN101604574B. Автор: 小川诚,国司多通夫,川崎健一,元木章博,竹内俊介. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2012-04-04.

Heat sink and method of removing heat from power electronics components

Номер патента: AU2003212172A8. Автор: John Makaran. Владелец: Siemens VDO Automotive Inc. Дата публикации: 2003-10-13.

Heat sink and method of removing heat from power electronics components

Номер патента: AU2003212172A1. Автор: John Makaran. Владелец: Siemens VDO Automotive Inc. Дата публикации: 2003-10-13.

Packaged electronic component

Номер патента: CA1137607A. Автор: Lawrence D. Radosevich,Allan V. Kouchich,John C. Blanchard,Neal F. Thomas. Владелец: Allen Bradley Co LLC. Дата публикации: 1982-12-14.

Semiconductor component and method of fabrication

Номер патента: US5918112A. Автор: Mahesh K. Shah,John W. Hart, Jr.. Владелец: Motorola Inc. Дата публикации: 1999-06-29.

Method of electrode deposition for solid oxide fuel cells

Номер патента: WO2006135594A2. Автор: Toshio Suzuki,Harlan Anderson,Piotr Jasinski,Vladimir Petrovsky,Xiao-Dong Zhou. Владелец: Curators of the University of Missouri. Дата публикации: 2006-12-21.

Method of electrode deposition for solid oxide fuel cells

Номер патента: EP1893347A2. Автор: Toshio Suzuki,Harlan Anderson,Piotr Jasinski,Vladimir Petrovsky,Xiao-Dong Zhou. Владелец: University of Missouri System. Дата публикации: 2008-03-05.

Method of conversion of image of external power effects to electric signal and electron-beam vacuum device intended for its realization

Номер патента: RU2100866C1. Автор: Ю.А. Крутяков. Владелец: Плотников Михаил Ильич. Дата публикации: 1997-12-27.

METHOD OF MANUFACTURING WINDING-TYPE ELECTRONIC COMPONENT

Номер патента: US20200126718A1. Автор: YAMAKITA Takayuki. Владелец: MURATA MANUFACTURING CO., LTD.. Дата публикации: 2020-04-23.

METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20160225524A1. Автор: Kim Tae Ho,Kim Doo Young,LEE Byoung Hwa,Lee Taek Jung,Joo Jin Kyung,GU Sin Il. Владелец: . Дата публикации: 2016-08-04.

Method of manufacturing resin-encapsulated electronic component

Номер патента: JP2822678B2. Автор: 隆昭 横山. Владелец: Sanken Electric Co Ltd. Дата публикации: 1998-11-11.

Method of manufacturing wire wound electronic component

Номер патента: US20020190832A1. Автор: Kazuhiko Otsuka,Iwao Fujikawa,Katsuo Koizumi,Nobuyasu Shiba,Takayuki Uehara,Yoshihiro Amada,Nobuo Mamada,Hideo Aoba,Nobuhiro Umeyama. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2002-12-19.

Method of manufacturing laminated ceramic electronic component

Номер патента: KR101018261B1. Автор: 정지훈,김효정,김두영,장동익,조순삼. Владелец: 삼성전기주식회사. Дата публикации: 2011-03-04.

Separable endpoints and methods of using the same

Номер патента: EP3248231A1. Автор: Serge Bulteau,Denis Guillot,Ronan Tissier. Владелец: Itron Global SARL. Дата публикации: 2017-11-29.

A method of manufacturing a ceramic electronic component and a ceramic electronic part

Номер патента: TWI425536B. Автор: Takashi Sakurai,Yoshikazu Ito,Masahiko Konno,Hisayuki Abe,Hiroshi Shindo,Genichi Watanabe,Shinya Yoshihara,Ko Onodera,Satoshi Kurimoto,Akihiro Horita. Владелец: TDK Corp. Дата публикации: 2014-02-01.

Method of manufacturing a ceramic electronic component

Номер патента: AU497648B2. Автор: G. KURAMITSU H. TAKADA Y. KURODA T. IRIE Y. SATO N i ITAKURA. Владелец: Matsushita Electric Industrial Co Ltd. Дата публикации: 1978-12-21.

Fan-out electronic component package

Номер патента: US20180337136A1. Автор: Chan Yong Jeong,Myeong Woo HAN. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-11-22.

Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components

Номер патента: WO2014133390A1. Автор: Michel Hendrikus Lambertus Teunissen. Владелец: BESI NETHERLANDS B.V.. Дата публикации: 2014-09-04.

Conveyance apparatus for electronic components

Номер патента: US09926145B2. Автор: Tomoyuki Otani,Hideaki Nozawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2018-03-27.

METHOD OF MANUFACTURING WINDING-TYPE ELECTRONIC COMPONENT

Номер патента: US20170069425A1. Автор: YAMAKITA Takayuki. Владелец: MURATA MANUFACTURING CO., LTD.. Дата публикации: 2017-03-09.

CERAMIC PACKAGE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC COMPONENT, AND MODULE

Номер патента: US20170309533A1. Автор: Shimizu Koichi. Владелец: . Дата публикации: 2017-10-26.

METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20160351334A1. Автор: MATSUI Togo,OKUDA Hikaru,TAKAGI Yuya. Владелец: . Дата публикации: 2016-12-01.

Casting material, method of manufacturing casting material, electronic component and automobile

Номер патента: JP2019518631A. Автор: ニコ ベーレント ライナー,ニコ ベーレント ライナー. Владелец: VOLKSWAGEN AG. Дата публикации: 2019-07-04.

Method of manufacturing a novel electronic component package

Номер патента: CN111130483A. Автор: 不公告发明人. Владелец: Zhuhai Crystal Resonance Technologies Co Ltd. Дата публикации: 2020-05-08.

Method, mould, and housing for forming an electronic component package

Номер патента: WO2024085748A1. Автор: Wilhelmus Gerardus Joseph Gal,Sebastianus Hubertus Maria Kersjes. Владелец: BESI NETHERLANDS B.V.. Дата публикации: 2024-04-25.

Direct transfer apparatus for electronic components

Номер патента: US20210206585A1. Автор: Ka Yee Mak,Kui Kam Lam,Yen Hsi Tang,Kai Siu LAM,Hung Kit CHAN. Владелец: ASM TECHNOLOGY SINGAPORE PTE LTD. Дата публикации: 2021-07-08.

Method, mould, and housing for forming an electronic component package

Номер патента: NL2033364B1. Автор: Hubertus Maria Kersjes Sebastianus,Gerardus Joseph Gal Wilhelmus. Владелец: Besi Netherlands Bv. Дата публикации: 2024-05-08.

Electronic component transfer system and method

Номер патента: US20240282611A1. Автор: Jasper Wesselingh,Johannes Hubertus Antonius van de Rijdt, JR.. Владелец: Nexperia BV. Дата публикации: 2024-08-22.

Electronic component transfer system and method

Номер патента: EP4421855A2. Автор: Jasper Wesselingh. Владелец: Nexperia BV. Дата публикации: 2024-08-28.

Electronic component transfer system and method

Номер патента: EP4421854A1. Автор: Johannes Hubertus Antonius Van De Rijdt,Jasper Wesselingh. Владелец: Nexperia BV. Дата публикации: 2024-08-28.

Electronic component

Номер патента: US09972426B2. Автор: Franz Rinner,Christoph Auer,Manfred Schweinzger. Владелец: EPCOS AG. Дата публикации: 2018-05-15.

Packaged device, packaged module, and power conversion device

Номер патента: EP4340016A1. Автор: DONG Chen,Lei Shi,Yunfeng Liu,Pengcheng Zhang,Yunyu Tang,Fenglong Lu,Shuyi LV. Владелец: Huawei Digital Power Technologies Co Ltd. Дата публикации: 2024-03-20.

Electronic component transfer system and method

Номер патента: US20240312813A1. Автор: Johannes Hubertus Antonius Van De Rijdt,Jasper Wesselingh. Владелец: Nexperia BV. Дата публикации: 2024-09-19.

Cooling method and device for an electronic component

Номер патента: US20070274037A1. Автор: Keng-Wen Tseng. Владелец: Individual. Дата публикации: 2007-11-29.

Alignment platform and electronic component transmission apparatus

Номер патента: US12131935B2. Автор: Yuan-Long Chang,Ting Wei Chou. Владелец: Hon Precision Inc. Дата публикации: 2024-10-29.

Plastic Latching System For Securement of Electronic Component to a DIN Rail

Номер патента: US20230080025A1. Автор: Rudy Mark D. Halcon,Kyle Vergel R. Maan,Gajanan R. Muttepawar,Roderick P. De Castro. Владелец: Appleton Grp Llc. Дата публикации: 2023-03-16.

Plastic latching system for securement of electronic component to a DIN rail

Номер патента: US12107377B2. Автор: Rudy Mark D. Halcon,Kyle Vergel R. Maan,Gajanan R. Muttepawar,Roderick P. De Castro. Владелец: Appleton Grp Llc. Дата публикации: 2024-10-01.

Method of Producing Multi-Layer Ceramic Electronic Component and Multi-Layer Ceramic Electronic Component

Номер патента: US20170287643A1. Автор: SATO Yosuke,KATO Yasunari,Wakayanagi Hidenori,Kobayashi Joji,Kogure Toshimitsu. Владелец: . Дата публикации: 2017-10-05.

METHOD OF PRODUCING LEAD FRAMES FOR ELECTRONIC COMPONENTS, CORRESPONDING COMPONENT AND COMPUTER PROGRAM PRODUCT

Номер патента: US20170294370A1. Автор: MARCHISI Fabio. Владелец: . Дата публикации: 2017-10-12.

METHOD OF PRODUCING LEAD FRAMES FOR ELECTRONIC COMPONENTS, CORRESPONDING COMPONENT AND COMPUTER PROGRAM PRODUCT

Номер патента: US20160315035A1. Автор: MARCHISI Fabio. Владелец: . Дата публикации: 2016-10-27.

Nonvolatile memory device, method of manufacturing the nonvolatile memory device, and memory module and system including the nonvolatile memory device

Номер патента: US8877626B2. Автор: Young-woo Park,Jae-Goo Lee,Byung-Kwan You,Dong-Sik Lee,Sang-Yong Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2014-11-04.

Manufacturing method of electronic component mounting board, electronic device and electronic component mounting board

Номер патента: JP6890496B2. Автор: 康雄 福田,美津雄 宮▲崎▼,福田　康雄. Владелец: Kyocera Corp. Дата публикации: 2021-06-18.

Manufacturing method of multilayer board with built-in electronic component, and multilayer board with built-in electronic component

Номер патента: JP2009302563A. Автор: Masashi Miyazaki,Yusuke Inoue,Yuichi Sugiyama,佑介 井上,英児 麦谷,政志 宮崎,達郎 猿渡,裕一 杉山,Hideji Mugitani,Tatsuro Saruwatari. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2009-12-24.

Potting materials, methods of electrically insulating electrical or electronic components, and electrically insulating components

Номер патента: JP7271656B2. Автор: へネック シュテファン,ハイトマン ゲオアク,ケスナー シュテファン. Владелец: ROBERT BOSCH GMBH. Дата публикации: 2023-05-11.

Camera module and manufacturing method thereof

Номер патента: US20220360694A1. Автор: Li Liu,Jiawei Chen,Zhen Huang,Bojie ZHAO,Zhewen Mei,Zongchun Yang,Chenxiang Xu,Qimin MEI. Владелец: Ningbo Sunny Opotech Co Ltd. Дата публикации: 2022-11-10.

Camera Module and Manufacturing Method Thereof

Номер патента: US20210250477A1. Автор: Li Liu,Jiawei Chen,Zhen Huang,Bojie ZHAO,Zhewen Mei,Zongchun Yang,Chenxiang Xu,Qimin MEI. Владелец: Ningbo Sunny Opotech Co Ltd. Дата публикации: 2021-08-12.

Camera module and manufacturing method thereof

Номер патента: US11758255B2. Автор: Li Liu,Jiawei Chen,Zhen Huang,Bojie ZHAO,Zhewen Mei,Zongchun Yang,Chenxiang Xu,Qimin MEI. Владелец: Ningbo Sunny Opotech Co Ltd. Дата публикации: 2023-09-12.

Camera Module and Manufacturing Method Thereof

Номер патента: US20210195074A1. Автор: Li Liu,Jiawei Chen,Zhen Huang,Bojie ZHAO,Zhewen Mei,Zongchun Yang,Chenxiang Xu,Qimin MEI. Владелец: Ningbo Sunny Opotech Co Ltd. Дата публикации: 2021-06-24.

Modular System for Moulding Electronic Components and Kit-of-Parts for Assembling Such a Modular System

Номер патента: US20180068874A1. Автор: Johannes Lambertus Gerardus Maria Venrooij,Jeroen Kleijburg. Владелец: Besi Netherlands Bv. Дата публикации: 2018-03-08.

Modular system for moulding electronic components and kit-of-parts for assembling such a modular system.

Номер патента: NL2014802A. Автор: Kleijburg Jeroen,Lambertus Gerardus Maria Venrooij Johannes. Владелец: Besi Netherlands Bv. Дата публикации: 2016-11-24.

Connector incorporating electronic component, method for manufacturing connector incorporating electronic component, and apparatus for manufacturing connector incorporating electronic component

Номер патента: EP2312704A4. Автор: Shinji Yamaguchi,Kenichi Abe,Tetsu Hirose. Владелец: Union Machinery Co Ltd. Дата публикации: 2012-10-10.

Transmission line and electronic component

Номер патента: US20160013535A1. Автор: Toshio Sakurai,Takashi Fukui,Kiyoshi Hatanaka,Shigemitsu Tomaki. Владелец: TDK Corp. Дата публикации: 2016-01-14.

Integrated liquid cooling device with immersed electronic components

Номер патента: WO2006010018A2. Автор: Robert S. Symons. Владелец: Symons Robert S. Дата публикации: 2006-01-26.

Method and device for selectively separating electronic components from a frame with electronic components

Номер патента: US11887872B2. Автор: Johannes Gerhardus Augustinus Zweers,Arjan Joan Berendsen. Владелец: Besi Netherlands Bv. Дата публикации: 2024-01-30.

Core for a wire-wound electronic component, a wire-wound electronic component and a method for manufacturing a core for a wire-wound electronic component

Номер патента: US20150028985A1. Автор: Toshikazu INUBUSHI,Osamu MONGUCHI. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2015-01-29.

Method and system for public key infrastructure for serviceable electronic components in software defined vehicles

Номер патента: US20230396417A1. Автор: Kenneth William Junk. Владелец: GM GLOBAL TECHNOLOGY OPERATIONS LLC. Дата публикации: 2023-12-07.

Electronic component testing socket and electronic component testing apparatus using the same

Номер патента: MY128634A. Автор: Hiroto Nakamura,Takaji Ishikawa. Владелец: Advantest Corp. Дата публикации: 2007-02-28.

Electronic component-equipped resin casing and method for producing same

Номер патента: US20240031713A1. Автор: Jun Sasaki,Eiji Kawashima,Chuzo TANIGUCHI,Yasuisa TAKINISHI. Владелец: Nissha Co Ltd. Дата публикации: 2024-01-25.

Component aligning apparatus and electronic component manufacturing method

Номер патента: US20120297608A1. Автор: Toshiki Miyazaki. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2012-11-29.

Electronic Component Handler And Electronic Component Tester

Номер патента: US20190005639A1. Автор: Hirokazu Ishida,Daisuke Ishida,Takahito SANEKATA. Владелец: Seiko Epson Corp. Дата публикации: 2019-01-03.

Device and method for controlling a transfer of information from a plurality of electronic components through a communication bus to a host device

Номер патента: WO2019206724A2. Автор: Chenghan LI. Владелец: Inivation AG. Дата публикации: 2019-10-31.

Semiconductor film and method of producing the same, photoelectric conversion element, solid-state imaging element and electronic apparatus

Номер патента: US11758743B2. Автор: Michinori Shiomi,Syuuiti TAKIZAWA. Владелец: Sony Corp. Дата публикации: 2023-09-12.

Holding tool for fixing an electronic component and circular table manufacturing unit

Номер патента: US20070125830A1. Автор: Frank Bajahr,Ruprecht WISKOTT,Markus Spreng. Владелец: Sokymat Automotive GmbH. Дата публикации: 2007-06-07.

Semiconductor film and method of producing the same, photoelectric conversion element, solid-state imaging element and electronic apparatus

Номер патента: US12120894B2. Автор: Michinori Shiomi,Syuuiti TAKIZAWA. Владелец: Sony Group Corp. Дата публикации: 2024-10-15.

Optical element, optical element wafer, optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device

Номер патента: US20100073532A1. Автор: Yuji Yano,Shigeru Yasukawa. Владелец: Sharp Corp. Дата публикации: 2010-03-25.

Data transmission interface system and method for electronic component

Номер патента: US7694039B2. Автор: Jun Zhang. Владелец: Hongfujin Precision Industry Shenzhen Co Ltd. Дата публикации: 2010-04-06.

Electronic component chip holder including two adhesive surfaces having different adhesiveness

Номер патента: US5571594A. Автор: Norio Sakai,Toshimi Yoshimura,Kenji Minowa,Tetsuro Saito. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1996-11-05.

Enclosure for an electronic component

Номер патента: US20200098655A1. Автор: Digvijay A. Raorane,Vijay K. Nair. Владелец: Intel Corp. Дата публикации: 2020-03-26.

Multilayer ceramic electronic component with metal terminals for high withstand voltage and reduced mounting area

Номер патента: US11848162B2. Автор: Makoto Togawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-12-19.

Electronic component mounting board, electric device, and light emitting device

Номер патента: EP3863046A1. Автор: Takafumi Yamaguchi,Youji Furukubo,Toshifumi HIGASHI. Владелец: Kyocera Corp. Дата публикации: 2021-08-11.

Electronic component and method for producing the same

Номер патента: US20090261942A1. Автор: Masahiro Kimura,Seiji Goto. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2009-10-22.

Header for a package including an electronic component for radio frequency signal transmission

Номер патента: US11777189B2. Автор: Karsten Drögemüller,Artit Aowudomsuk. Владелец: SCHOTT AG. Дата публикации: 2023-10-03.

Electronic component transfer apparatus

Номер патента: MY182117A. Автор: KIMURA Hiroyuki. Владелец: Ueno Seiki Co Ltd. Дата публикации: 2021-01-18.

Electronic component, electronic component manufacturing method, capacitor, and capacitor manufacturing method

Номер патента: US20230223194A1. Автор: Takayuki Hattori,Hiroki Takeoka,Yukihiro Shimasaki. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2023-07-13.

NONVOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE NONVOLATILE MEMORY DEVICE, AND MEMORY MODULE AND SYSTEM INCLUDING THE NONVOLATILE MEMORY DEVICE

Номер патента: US20130252391A1. Автор: PARK Sang-Yong,You Byung-Kwan,Park Young-Woo,Lee Jae-Goo,Lee Dong-sik. Владелец: . Дата публикации: 2013-09-26.

Nonvolatile memory device, method of manufacturing the nonvolatile memory device, and memory module and system including the nonvolatile memory device

Номер патента: US20150060993A1. Автор: Young-woo Park,Jae-Goo Lee,Byung-Kwan You,Dong-Sik Lee,Sang-Yong Park. Владелец: Individual. Дата публикации: 2015-03-05.

METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES

Номер патента: US20170294405A1. Автор: Dunlap Brett Arnold. Владелец: . Дата публикации: 2017-10-12.

Method of forming a plurality of electronic component packages and packages formed thereby

Номер патента: US20200335476A1. Автор: Brett Arnold Dunlap. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2020-10-22.

METHOD OF CHARACTERIZING THE SENSITIVITY OF ELECTRONIC COMPONENTS TO DESTRUCTIVE MECHANISMS

Номер патента: FR2962225B1. Автор: Florent Miller,Sebastien Morand. Владелец: AIRBUS GROUP SAS. Дата публикации: 2012-08-17.

Method of manufacturing display device, display device manufactured by the same, and electronic device having the display device

Номер патента: KR20220167843A. Автор: 김민지,조현준,심진용,이용혁. Владелец: 삼성디스플레이 주식회사. Дата публикации: 2022-12-22.

METHOD OF CHARACTERIZING THE SENSITIVITY OF ELECTRONIC COMPONENTS TO DESTRUCTIVE MECHANISMS

Номер патента: FR2962225A1. Автор: Florent Miller,Sebastien Morand. Владелец: AIRBUS GROUP SAS. Дата публикации: 2012-01-06.

Electronic component and signal transmission method using the electronic component

Номер патента: US20110260808A1. Автор: Shinichi Uchida. Владелец: Renesas Electronics Corp. Дата публикации: 2011-10-27.

Method of implementing self-organizing network for plurality of access network devices and electronic device for performing the same

Номер патента: EP4183160A4. Автор: Minsuk Choi,Seowoo JANG,Taeseop LEE,Taejeoung Kim,Juhwan Song,Haksung KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-01-10.

Piezoelectric Driving Device, Driving Method Of Piezoelectric Driving Device, Robot, Electronic Component Transport Apparatus, Printer, And Projector

Номер патента: US20190036001A1. Автор: Arakawa Yutaka,KAJINO Kiichi. Владелец: . Дата публикации: 2019-01-31.

COMPONENT MODULE, MATING CONNECTOR, AND CONNECTION STRUCTURE BETWEEN COMPONENT MODULE AND MATING CONNECTOR

Номер патента: US20140148019A1. Автор: SASAKI Daisuke,NAGATA Takayuki. Владелец: HOSIDEN CORPORATION. Дата публикации: 2014-05-29.

PIEZOELECTRIC DRIVE DEVICE, DRIVE METHOD OF PIEZOELECTRIC DRIVE DEVICE, ROBOT, ELECTRONIC COMPONENT TRANSPORT APPARATUS, PRINTER, AND PROJECTOR

Номер патента: US20180287042A1. Автор: Takahashi Tomoaki. Владелец: . Дата публикации: 2018-10-04.

PIEZOELECTRIC DRIVE DEVICE, DRIVE METHOD OF PIEZOELECTRIC DRIVE DEVICE, ROBOT, ELECTRONIC COMPONENT TRANSPORT APPARATUS, PRINTER, AND PROJECTOR

Номер патента: US20180287515A1. Автор: Takahashi Tomoaki. Владелец: . Дата публикации: 2018-10-04.

Control Device For Vibration Actuator, Method Of Controlling Vibration Actuator, Robot, Electronic Component Conveyance Apparatus, Printer, Projector, And Vibration Device

Номер патента: US20180316282A1. Автор: Arakawa Yutaka,KAJINO Kiichi. Владелец: . Дата публикации: 2018-11-01.

PIEZOELECTRIC DRIVE DEVICE, DRIVE METHOD OF PIEZOELECTRIC DRIVE DEVICE, ROBOT, ELECTRONIC COMPONENT TRANSPORT APPARATUS, PRINTER, AND PROJECTOR

Номер патента: US20180316283A1. Автор: Takahashi Tomoaki. Владелец: . Дата публикации: 2018-11-01.

Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

Номер патента: US5084071A. Автор: Anton Nenadic,Robert W. Pasco. Владелец: International Business Machines Corp. Дата публикации: 1992-01-28.

Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

Номер патента: US4954142A. Автор: Lawrence D. David,William L. Guthrie,William J. Patrick,Anton Nenadic,Robert W. Pasco,Jeffrey W. Carr,Frank B. Kaufman,Kenneth P. Rodbell. Владелец: International Business Machines Corp. Дата публикации: 1990-09-04.

A method of chemically-mechanically polishing an electronic component

Номер патента: EP0779655A3. Автор: Maria Ronay. Владелец: International Business Machines Corp. Дата публикации: 1997-07-16.

A method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

Номер патента: EP0401147A2. Автор: Anton Nenadic,Jeffrey William Carr,Lawrence Daniel David,William Leslie Guthrie,Frank Benjamin Kaufman,William John Patrick,Kenneth Parker Rodbell,Robert William Pasco. Владелец: International Business Machines Corp. Дата публикации: 1990-12-05.

Method of chemically mechanically polishing an electronic component using a non-selective ammonium persulfate slurry

Номер патента: US5726099A. Автор: Mark Anthony Jaso. Владелец: International Business Machines Corp. Дата публикации: 1998-03-10.

A method of chemically mechanically polishing an electronic component

Номер патента: EP0773580A1. Автор: Mark Anthony Jaso. Владелец: International Business Machines Corp. Дата публикации: 1997-05-14.

A method of chemically mechanically polishing an electronic component

Номер патента: EP0774777A1. Автор: David Mark Dobuzinsky,Mark Anthony Jaso,Michael David Armacost,Jeffery Peter Gambino. Владелец: International Business Machines Corp. Дата публикации: 1997-05-21.

Method of chemically mechanically polishing an electronic component

Номер патента: US5573633A. Автор: Mark A. Jaso,Jeffrey P. Gambino,Larry A. Nesbit. Владелец: International Business Machines Corp. Дата публикации: 1996-11-12.

Method of chemically mechanically polishing an electronic component using a non-selective ammonium hydroxide slurry

Номер патента: US5885899A. Автор: David Mark Dobuzinsky,Mark Anthony Jaso,Michael David Armacost,Jeffery Peter Gambino. Владелец: International Business Machines Corp. Дата публикации: 1999-03-23.

Method of chemically mechanically polishing an electronic component

Номер патента: US5795826A. Автор: Mark Anthony Jaso,Jeffrey Peter Gambino,Larry Allan Nesbit. Владелец: International Business Machines Corp. Дата публикации: 1998-08-18.

Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

Номер патента: CA2011709C. Автор: Lawrence D. David,William L. Guthrie,William J. Patrick,Jeffrey W. Carr,Frank B. Kaufman,Kenneth P. Rodbell. Владелец: International Business Machines Corp. Дата публикации: 1993-12-21.

Method of chemically-mechanically polishing an electronic component

Номер патента: US5752875A. Автор: Maria Ronay. Владелец: International Business Machines Corp. Дата публикации: 1998-05-19.

Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

Номер патента: CA2011709A1. Автор: Lawrence D. David,William L. Guthrie,William J. Patrick,Jeffrey W. Carr,Frank B. Kaufman,Kenneth P. Rodbell. Владелец: International Business Machines Corp. Дата публикации: 1990-09-07.

A method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

Номер патента: EP0401147A3. Автор: Anton Nenadic,Jeffrey William Carr,Lawrence Daniel David,William Leslie Guthrie,Frank Benjamin Kaufman,William John Patrick,Kenneth Parker Rodbell,Robert William Pasco. Владелец: International Business Machines Corp. Дата публикации: 1991-12-04.

A method of chemically mechanically polishing an electronic component

Номер патента: KR100233349B1. Автор: 마크 안소니 자소. Владелец: 포만 제프리 엘. Дата публикации: 1999-12-01.

Solid electrolytic capacitor, manufacturing method of the same and chip electronic component

Номер патента: KR102194712B1. Автор: 김혜진,박종훈,조영수. Владелец: 삼성전기주식회사. Дата публикации: 2020-12-23.

Piezoelectric drive device, drive method of piezoelectric drive device, robot, electronic component transport apparatus, printer, and projector

Номер патента: US10957842B2. Автор: Tomoaki Takahashi. Владелец: Seiko Epson Corp. Дата публикации: 2021-03-23.

A method of chemically mechanically polishing an electronic component

Номер патента: EP0773580B1. Автор: Mark Anthony Jaso. Владелец: International Business Machines Corp. Дата публикации: 2002-01-16.

Piezoelectric drive device, drive method of piezoelectric drive device, robot, electronic component transfer device, printer and projector

Номер патента: JP6879015B2. Автор: 智明 ▲高▼橋. Владелец: Seiko Epson Corp. Дата публикации: 2021-06-02.

Photosensitive resin composition, method of forming patterned cured film by using the photosensitive resin composition, and electronic component

Номер патента: TWI430021B. Автор: Tomonori Minegishi,Kenichi Iwashita,Rika Nogita. Владелец: HITACHI CHEM DUPONT MICROSYS. Дата публикации: 2014-03-11.

Electronic component and method for fabricating the same

Номер патента: US20150348894A1. Автор: Jing-Yi Yan,Wei-Han Chen,Wu-Wei Tsai,Wei-Cheng Kao. Владелец: Industrial Technology Research Institute ITRI. Дата публикации: 2015-12-03.

Ferrite ceramic composition, ceramic electronic component, and process for producing ceramic electronic component

Номер патента: US20130057376A1. Автор: Akihiro Nakamura,Atsushi Yamamoto,Wataru Kanami. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2013-03-07.

Multilayer ceramic electronic component

Номер патента: US20210125784A1. Автор: Satoshi Miyauchi. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2021-04-29.

Semiconductor unit, method of manufacturing the semiconductor unit, solid-state image pickup unit, and electronic apparatus

Номер патента: US20180204872A1. Автор: Hiroshi Ozaki,Satoru Wakiyama. Владелец: Sony Corp. Дата публикации: 2018-07-19.

Semiconductor unit, method of manufacturing the semiconductor unit, solid-state image pickup unit, and electronic apparatus

Номер патента: US20160043128A1. Автор: Hiroshi Ozaki,Satoru Wakiyama. Владелец: Sony Corp. Дата публикации: 2016-02-11.

Semiconductor unit, method of manufacturing the semiconductor unit, solid-state image pickup unit, and electronic apparatus

Номер патента: US10672822B2. Автор: Hiroshi Ozaki,Satoru Wakiyama. Владелец: Sony Corp. Дата публикации: 2020-06-02.

Semiconductor unit, method of manufacturing the semiconductor unit, solid-state image pickup unit, and electronic apparatus

Номер патента: US9202941B2. Автор: Hiroshi Ozaki,Satoru Wakiyama. Владелец: Sony Corp. Дата публикации: 2015-12-01.

ELECTRONIC COMPONENT, ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

Номер патента: US20160211076A1. Автор: FUJIMOTO Isamu,TASEDA Yasunori. Владелец: . Дата публикации: 2016-07-21.

ELECTRONIC COMPONENT, TRANSPOSING COMPONENT, METHOD FOR FABRICATING THE ELECTRONIC COMPONENT, AND METHOD FOR TRANSPOSING A MICRO-ELEMENT

Номер патента: US20180240767A1. Автор: LIU YI-CHENG,LEE Ho-Cheng,Liu Chung-Chan. Владелец: . Дата публикации: 2018-08-23.

Electronic component and imaging device

Номер патента: US10459188B2. Автор: Tetsuma Sakamoto. Владелец: Iriso Electronics Co Ltd. Дата публикации: 2019-10-29.

Vertical type nitride semiconductor light emitting device and method of of manufacturing the same

Номер патента: KR100723150B1. Автор: 김태준,오방원,백두고. Владелец: 삼성전기주식회사. Дата публикации: 2007-05-30.

Electronic component, electronic component mounted structure, and process for producing electronic component

Номер патента: KR100918913B1. Автор: 유타카 오타,시게유키 호리,준 니시카와. Владелец: 가부시키가이샤 무라타 세이사쿠쇼. Дата публикации: 2009-09-23.

Electronic component, electronic component mounted structure, and process for producing electronic component

Номер патента: WO2007007677A1. Автор: Yutaka Ota,Jun Nishikawa,Shigeyuki Horie. Владелец: MURATA MANUFACTURING CO., LTD.. Дата публикации: 2007-01-18.

Resin composition for sealing electrical and electronic components, method for manufacturing sealant for electrical and electronic components, and sealant for electrical and electronic components

Номер патента: EP2891681A1. Автор: Kenji Shiga,Yosuke Watanabe. Владелец: Toyobo Co Ltd. Дата публикации: 2015-07-08.

Electronic component for wiring, method for manufacturing the electronic component, electronic device package to be used with the electronic component packaged therein, and method for manufacturing the electronic device package

Номер патента: WO2010067548A1. Автор: 政道 石原. Владелец: 国立大学法人九州工業大学. Дата публикации: 2010-06-17.

Organic electronic component for implementing an encapsulated partially organic electronic component has components like a flexible foil as an antenna, a diode or capacitor and an organic transistor.

Номер патента: DE10151440C1. Автор: Wolfgang Clemens,Walter Fix,Joerg Zapf. Владелец: SIEMENS AG. Дата публикации: 2003-02-06.

A package for an electronic component, a substrate for packaging an electronic component, and a bonding structure between an electronic component package and a circuit substrate

Номер патента: TWI469278B. Автор: Minoru Iizuka,Koichi Kishimoto,Kozo Shibutani,Kentaro Nakanishi. Владелец: Daishinku Corp. Дата публикации: 2015-01-11.

Electronic component

Номер патента: US20080135995A1. Автор: Heng Wan Hong,Wu Hu Li. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2008-06-12.

Transmission line and electronic component

Номер патента: US9698464B2. Автор: Toshio Sakurai,Takashi Fukui,Kiyoshi Hatanaka,Shigemitsu Tomaki. Владелец: TDK Corp. Дата публикации: 2017-07-04.

Semiconductor unit, method of manufacturing the semiconductor unit, solid-state image pickup unit, and electronic apparatus

Номер патента: US20130181317A1. Автор: Hiroshi Ozaki,Satoru Wakiyama. Владелец: Sony Corp. Дата публикации: 2013-07-18.

METHOD OF MANUFACTURING SOLID-STATE IMAGING ELEMENT, SOLID-STATE IMAGING ELEMENT AND ELECTRONIC APPARATUS

Номер патента: US20150002711A1. Автор: Itonaga Kazuichiro. Владелец: . Дата публикации: 2015-01-01.

THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME AND THIN FILM TRANSISTOR ARRAY PANEL AND ELECTRONIC DEVICE

Номер патента: US20210013435A1. Автор: Kim Joo Young,PARK Jeong II,JUNG Jiyoung,SONG Byong Gwon. Владелец: SAMSUNG ELECTRONICS CO., LTD.. Дата публикации: 2021-01-14.

METAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME AND METAL WIRE AND SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

Номер патента: US20210028024A1. Автор: Yoon Boun,KIM Do Yoon,TAKAI Kenji. Владелец: . Дата публикации: 2021-01-28.

METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS

Номер патента: US20140117482A1. Автор: Suzuki Ryoji,Natori Taichi,Noda Tomomi. Владелец: SONY CORPORATION. Дата публикации: 2014-05-01.

SEMICONDUCTOR UNIT, METHOD OF MANUFACTURING THE SEMICONDUCTOR UNIT, SOLID-STATE IMAGE PICKUP UNIT, AND ELECTRONIC APPARATUS

Номер патента: US20160043128A1. Автор: WAKIYAMA Satoru,Ozaki Hiroshi. Владелец: . Дата публикации: 2016-02-11.

SEMICONDUCTOR UNIT, METHOD OF MANUFACTURING THE SEMICONDUCTOR UNIT, SOLID-STATE IMAGE PICKUP UNIT, AND ELECTRONIC APPARATUS

Номер патента: US20180204872A1. Автор: WAKIYAMA Satoru,Ozaki Hiroshi. Владелец: . Дата публикации: 2018-07-19.

Method of manufacturing solid-state imaging element, solid-state imaging element and electronic apparatus

Номер патента: US8878116B2. Автор: Kazuichiro Itonaga. Владелец: Sony Corp. Дата публикации: 2014-11-04.

Organic thin film transistor and method of manufacturing the same and thin film transistor array panel and electronic device

Номер патента: KR20230057017A. Автор: 함석규,윤영준,정종원,야스타카 쿠즈모토. Владелец: 삼성전자주식회사. Дата публикации: 2023-04-28.

Quantum dot, method of manufacturing the same, and quantum dot composite, display device and electronic device including the same

Номер патента: CN114381267A. Автор: 金善英,金智荣,黄成宇,金龙郁,权秀暻. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2022-04-22.

Optical camera lens, including at least three smooth regions for reflecting a light beam emitted by distance measuring equipment camera module and assembly method thereof

Номер патента: US11974033B2. Автор: Lin Liu,Liefeng CHEN,Chao Ye,Shuijia CHU,Xiaoming DING. Владелец: Ningbo Sunny Opotech Co Ltd. Дата публикации: 2024-04-30.

Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package

Номер патента: US20130292855A1. Автор: Oppermann Klaus-Guenter,Franosch Martin,Gebauer Bernhard. Владелец: . Дата публикации: 2013-11-07.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20160020029A1. Автор: HIRAO Takahiro. Владелец: . Дата публикации: 2016-01-21.

METALLIC MATERIAL FOR ELECTRONIC COMPONENTS, AND CONNECTOR TERMINALS, CONNECTORS AND ELECTRONIC COMPONENTS USING SAME

Номер патента: US20150047879A1. Автор: Shibuya Yoshitaka,KODAMA Atsushi,Fukamachi Kazuhiko. Владелец: . Дата публикации: 2015-02-19.

BUMP-EQUIPPED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING BUMP-EQUIPPED ELECTRONIC COMPONENT

Номер патента: US20140151874A1. Автор: OSAKABE Shinya,OBU Isao. Владелец: MURATA MANUFACTURING CO., LTD.. Дата публикации: 2014-06-05.

MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND MOUNTING STRUCTURE FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20200118761A1. Автор: TERASHITA Yosuke,OKA Katsumi. Владелец: . Дата публикации: 2020-04-16.

Electrochemically actuatable electronic component and process for producing the actuatable electronic component

Номер патента: US20170138900A1. Автор: Raphael Salot,Sami Oukassi. Владелец: Commissariat a lEnergie Atomique et aux Energies Alternatives CEA. Дата публикации: 2017-05-18.

METHOD FOR PRODUCING AN ELECTRONIC COMPONENT WITH A CARRIER ELEMENT AND ELECTRONIC COMPONENT WITH A CARRIER ELEMENT

Номер патента: US20180159009A1. Автор: Zitzlsperger Michael,SCHWARZ Thomas. Владелец: . Дата публикации: 2018-06-07.

MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD UNDERFILL ENCAPSULATION, ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT

Номер патента: US20220310546A1. Автор: Mori Daisuke,NOMURA Eiichi,Kan Katsushi,ASAHARA Masahiro. Владелец: . Дата публикации: 2022-09-29.

Electronic Component, Leadframe, and Method for Producing an Electronic Component

Номер патента: US20170179353A1. Автор: Stefan Gruber,Michael Zitzlsperger,Daniel Richter,Christian Ziereis. Владелец: OSRAM Opto Semiconductors GmbH. Дата публикации: 2017-06-22.

Bump-equipped electronic component and method for manufacturing bump-equipped electronic component

Номер патента: US20160197052A1. Автор: Isao Obu,Shinya Osakabe. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-07-07.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNT STRUCTURE FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20210241976A1. Автор: Tanaka Akira,Muramatsu Satoshi,NISHIKAWA Toru,NAKANO Suguru,HOJO Risa. Владелец: . Дата публикации: 2021-08-05.

BUMP-EQUIPPED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING BUMP-EQUIPPED ELECTRONIC COMPONENT

Номер патента: US20170236796A1. Автор: OSAKABE Shinya,OBU Isao. Владелец: . Дата публикации: 2017-08-17.

LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING LAMINATED CERAMIC ELECTRONIC COMPONENT

Номер патента: US20150332854A1. Автор: NAKAMURA Masanori,Suzuki Shoichiro,Banno Koichi,Kanzaki Taisuke,Shiota Akihiro,Otsuka Masahiro,JONO Seiichi. Владелец: . Дата публикации: 2015-11-19.

ORGANIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ORGANIC ELECTRONIC COMPONENT

Номер патента: US20180342692A1. Автор: Rausch Andreas,Gerlitzki Niels. Владелец: . Дата публикации: 2018-11-29.

Organic electronic component and method for producing an organic electronic component

Номер патента: US20200343468A1. Автор: Andreas Rausch,Niels Gerlitzki. Владелец: Pictiva Displays International Ltd. Дата публикации: 2020-10-29.

Method for producing SIC electronic components with reduced processing steps and SIC electronic components

Номер патента: CN113363153A. Автор: S·拉斯库纳,P·巴达拉,A·巴西,M·G·萨吉奥,G·弗兰科. Владелец: STMICROELECTRONICS SRL. Дата публикации: 2021-09-07.

Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component

Номер патента: JP2009302128A. Автор: 誠 小川,Makoto Ogawa,Kenichi Kawasaki,多通夫 国司,章博 元木,健一 川崎,俊介 竹内,Tatsuo Kunishi,Shunsuke Takeuchi,Akihiro Motoki. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2009-12-24.

Electronic component testing apparatus and method for configuring electronic component testing apparatus

Номер патента: KR100889573B1. Автор: 카즈유키 야마시타,요시유키 마스오. Владелец: 가부시키가이샤 아드반테스트. Дата публикации: 2009-03-23.

ELECTRONIC COMPONENT ELEMENT, ITS MANUFACTURING METHOD, AND ELECTRONIC COMPONENT DEVICE

Номер патента: JP3687601B2. Автор: 坂口　　健二. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2005-08-24.

Wound-type electronic component and method for manufacturing wound-type electronic component

Номер патента: JP6065122B2. Автор: 謙一郎 牧. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-01-25.

LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT

Номер патента: JP7192741B2. Автор: 雄介 横田. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2022-12-20.

Molecular electronic component used to construct nanoelectronic circuits, molecular electronic component, electronic circuit and method for producing the same

Номер патента: WO2003041182A3. Автор: Harald Lossau,Gerhard Hartwich. Владелец: Friz Biochem Gmbh. Дата публикации: 2003-10-30.

Multilayer ceramic electronic component and manufacturing method for multilayer ceramic electronic component

Номер патента: JP2021052132A. Автор: Atsushi Imai,敦史 今井,秀弥 寺岡,Hideya Teraoka,今井　敦史. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2021-04-01.

Laminated ceramic electronic component and method for producing laminated ceramic electronic component

Номер патента: TW201125005A. Автор: Shoichiro Suzuki,Masanori Nakamura,Masahiro Otsuka,Koichi Banno,Seiichi Jono,Taisuke Kanzaki,Akihiro Shiota. Владелец: Murata Manufacturing Co. Дата публикации: 2011-07-16.

Electronic component, connector, connector production method, and electronic component connecting method

Номер патента: KR102423319B1. Автор: 겐이치 히라야마. Владелец: 데쿠세리아루즈 가부시키가이샤. Дата публикации: 2022-07-21.

Laminated ceramic electronic component and method for producing laminated ceramic electronic component

Номер патента: CN102034606A. Автор: 中村将典,大塚正博,神崎泰介,铃木祥一郎,伴野晃一,城野精一,盐田彰宏. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2011-04-27.

Multilayer ceramic electronic component and the method manufacturing multilayer ceramic electronic component

Номер патента: CN106158366A. Автор: 崔畅学,刘正勋,朴今珍,辛敏基,李治和. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-11-23.

Electronic component handling device insert, tray and electronic component handling device

Номер патента: JP4310310B2. Автор: 明浩 筬部. Владелец: Advantest Corp. Дата публикации: 2009-08-05.

Terminal blocks with electronic components, electronic devices, and mounting aids for electronic components

Номер патента: JP7006643B2. Автор: 啓紀 宇都宮,亮平 吉岡,晋也 岩崎. Владелец: Omron Corp. Дата публикации: 2022-01-24.

Monolithic electronic component and the method for manufacturing monolithic electronic component

Номер патента: CN109585166A. Автор: 赵成珉,吴东俊,韩昇勳. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2019-04-05.

Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component

Номер патента: CN116417245A. Автор: 郑瑞元,吴源根,延圭浩,李瑞浩. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2023-07-11.

Monolithic ceramic electronic component and method for manufacturing monolithic ceramic electronic component

Номер патента: CN1577655A. Автор: 高泽知生. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2005-02-09.

WIRING ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE PACKAGE USING THE WIRING ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD

Номер патента: JP5429890B2. Автор: 政道 石原. Владелец: Kyushu Institute of Technology NUC. Дата публикации: 2014-02-26.

Electronic component testing method, insert, tray, and electronic component testing apparatus

Номер патента: CN102084260A. Автор: 筬部明浩. Владелец: Advantest Corp. Дата публикации: 2011-06-01.

Electronic component, method for manufacturing same, and electronic component manufacturing device

Номер патента: WO2017104169A1. Автор: 山本　雅之,幹司 石橋,勝則 傳藤. Владелец: Ｔｏｗａ株式会社. Дата публикации: 2017-06-22.

Multilayer ceramic electronic component and mount structure for multilayer ceramic electronic component

Номер патента: US11791102B2. Автор: Akira Tanaka,Satoshi Muramatsu,Toru Nishikawa,Suguru Nakano,Risa HOJO. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-10-17.

Metal material for electrical/electronic component, manufacturing method therefor, and the electrical/electronic component using the metal material

Номер патента: TW200738905A. Автор: Toshio Tani,Akira Morii,Chikahito Sugahara,Akihiro Suzukine. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2007-10-16.

Electronic component and signal transmission method using the electronic component

Номер патента: US8754721B2. Автор: Shinichi Uchida. Владелец: Renesas Electronics Corp. Дата публикации: 2014-06-17.

Electronic component housing package, electronic device, and electronic module

Номер патента: EP3993024A4. Автор: Takahiro Sasaki. Владелец: Kyocera Corp. Дата публикации: 2023-08-09.

Terminal of rechargeable battery, method of assembling the terminal of rechargeable battery, rechargeable battery module and method of assembling the rechargeable battery module

Номер патента: US20120107675A1. Автор: Dukjung Kim. Владелец: SB LiMotive Co Ltd. Дата публикации: 2012-05-03.

Terminal of rechargeable battery, method of assembling the terminal of rechargeable battery, rechargeable battery module and method of assembling the same

Номер патента: KR101222371B1. Автор: 김덕중. Владелец: 로베르트 보쉬 게엠베하. Дата публикации: 2013-01-16.

Thin film device supply body, method of fabricating thin film device, method of transfer, method of fabricating semiconductor device, and electronic equipment

Номер патента: US7456059B2. Автор: Taimei Kodaira,Sumio Utsunomiya. Владелец: Seiko Epson Corp. Дата публикации: 2008-11-25.

Terminal of rechargeable battery, method of assembling the terminal of rechargeable battery, rechargeable battery module and method of assembling the rechargeabe battery module

Номер патента: EP2450984A2. Автор: Dukjung Kim. Владелец: SB LiMotive Co Ltd. Дата публикации: 2012-05-09.

Method of re-establishing the stability of a sigma-delta modulator and a circuit for implementing the method

Номер патента: US6489907B2. Автор: Andrea Baschirotto,Paolo Cusinato,Fabio Pasolini. Владелец: STMICROELECTRONICS SRL. Дата публикации: 2002-12-03.

Method of producing thin-film single-crystal device, solar cell module and method of producing the same

Номер патента: AU4863800A. Автор: Takao Yonehara,Kiyofumi Sakaguchi,Yasuyoshi Takai,Katsumi Nakagawa,Masaaki Iwane,Noritaka Ukiyo,Yukiko Iwasaki. Владелец: Canon Inc. Дата публикации: 2001-01-18.

ELECTRONIC COMPONENT MOUNTING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20190035701A1. Автор: IWAMOTO Hiroki. Владелец: KYOCERA CORPORATION. Дата публикации: 2019-01-31.

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20180061751A1. Автор: Moriyama Yousuke,MURAKAMI Kensaku. Владелец: KYOCERA CORPORATION. Дата публикации: 2018-03-01.

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20200105658A1. Автор: Moriyama Yousuke,BABA Yuuki. Владелец: KYOCERA CORPORATION. Дата публикации: 2020-04-02.

ELECTRONIC COMPONENT HOUSING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20200136011A1. Автор: Sawada Keisuke,FUKUSHIGE Motoki. Владелец: KYOCERA CORPORATION. Дата публикации: 2020-04-30.

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20190148278A1. Автор: IMAYOSHI Michio. Владелец: KYOCERA CORPORATION. Дата публикации: 2019-05-16.

ELECTRONIC COMPONENT MOUNTING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20180240746A1. Автор: TSUJITA Toshihide,HIJIKURO Naoki. Владелец: KYOCERA CORPORATION. Дата публикации: 2018-08-23.

MULTI-PIECE WIRING SUBSTRATE, ELECTRONIC COMPONENT HOUSING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20200287517A1. Автор: ONITSUKA Yoshitomo. Владелец: KYOCERA CORPORATION. Дата публикации: 2020-09-10.

Electronic component mounting board, electronic device, and electronic module

Номер патента: US20180308777A1. Автор: Akihiko FUNAHASHI. Владелец: Kyocera Corp. Дата публикации: 2018-10-25.

ELECTRONIC COMPONENT HOUSING PACKAGE, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE

Номер патента: US20190326877A1. Автор: Suzuki Masaki,KISAKI Takuo. Владелец: KYOCERA CORPORATION. Дата публикации: 2019-10-24.

ELECTRONIC COMPONENT HOUSING PACKAGE, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE

Номер патента: US20180358949A1. Автор: Suzuki Masaki,KISAKI Takuo. Владелец: KYOCERA CORPORATION. Дата публикации: 2018-12-13.

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, BATTERY PACK, AND ELECTRONIC DEVICE

Номер патента: US20200358140A1. Автор: Mori Yasushi. Владелец: . Дата публикации: 2020-11-12.

ELECTRONIC COMPONENT MOUNTING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Номер патента: US20200381592A1. Автор: Itakura Yoshiaki,KITAGAWA Akihiko. Владелец: KYOCERA CORPORATION. Дата публикации: 2020-12-03.

Electronic component mounting substrate, electronic device, and electronic module

Номер патента: CN109075133B. Автор: 今吉三千男. Владелец: Kyocera Corp. Дата публикации: 2022-08-09.

Electronic component mounting package, electronic device, and electronic module

Номер патента: JP6406547B2. Автор: 秀樹 水原,亮太 利,水原　秀樹. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2018-10-17.

A method of service provision in a communications network and program modules and means therefor

Номер патента: EP1170962B1. Автор: Ludo Gys. Владелец: Alcatel Lucent SAS. Дата публикации: 2007-07-11.

Preparation method of IBC solar cell with passivation contact structure, cell, module and system

Номер патента: CN115274913A. Автор: 陈嘉,陆俊宇,林建伟,季根华,杜哲仁,包杰,沈承焕. Владелец: Jolywood Taizhou Solar Technology Co ltd. Дата публикации: 2022-11-01.

Method of generating driving signal for driving Dual-Mode Supply Modulator and thereof device

Номер патента: KR102052394B1. Автор: 정재호,이성준,이광천. Владелец: 한국전자통신연구원. Дата публикации: 2019-12-05.

Manufacturing method of thermoelectric conversion module, bonding material for thermoelectric conversion module and thermoelectric conversion module

Номер патента: JPWO2019082932A1. Автор: 石川　大,大 石川,偉夫 中子,芳則 江尻,千絵 須鎌,祐貴 川名,征央 根岸. Владелец: Resonac Corp. Дата публикации: 2020-11-12.

Method of processing image data, system for processing images, software module and machine-readable medium

Номер патента: KR100896668B1. Автор: 레옹 보튜,패트릭 가이 하프너. Владелец: 에이티 앤드 티 코포레이션. Дата публикации: 2009-05-14.

Semiconductor film and method of producing the same, photoelectric conversion element, solid-state imaging element and electronic apparatus

Номер патента: US20230363186A1. Автор: Michinori Shiomi,Syuuiti TAKIZAWA. Владелец: Sony Group Corp. Дата публикации: 2023-11-09.

METHOD OF PROVIDING INFORMATION-OF-USERS' INTEREST WHEN VIDEO CALL IS MADE, AND ELECTRONIC APPARATUS THEREOF

Номер патента: US20140125757A1. Автор: CHO Bong-hyun,LEE Jun-Ho,Lee Seung-hwan,YOON Soo-yeoun,LEE Sang-Joon,LEE Jeong-Yeon,Jeong Seong-Hoon,MOON Pill-kyoung. Владелец: SAMSUNG ELECTRONICS CO., LTD.. Дата публикации: 2014-05-08.

METHOD OF IMPLEMENTING SELF-ORGANIZING NETWORK FOR PLURALITY OF ACCESS NETWORK DEVICES AND ELECTRONIC DEVICE FOR PERFORMING THE SAME

Номер патента: US20220104113A1. Автор: LEE Taeseop,KIM Taejeoung,KIM Haksung,SONG Juhwan,JANG Seowoo,CHOI Minsuk. Владелец: . Дата публикации: 2022-03-31.

Method of preventing organic contamination from the atmosphere of electronic device substrates and electronic device substrates treated therewith

Номер патента: US20030138552A1. Автор: Hisashi Muraoka. Владелец: Purex Co Ltd. Дата публикации: 2003-07-24.

Method of providing information-of-users' interest when video call is made, and electronic apparatus thereof

Номер патента: US9247199B2. Автор: Jun-Ho Lee,Seung-Hwan Lee,Jeong-yeon Lee,Soo-yeoun Yoon,Bong-Hyun Cho,Pill-kyoung Moon,Sang-Joon Lee,Seong-Hoon Jeong. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2016-01-26.

Photoelectric conversion element, method of manufacutring photoelectric conversion element, electrolyte layer for photoelectric conversion element, and electronic apparatus

Номер патента: US20120085396A1. Автор: Ryohei Tsuda,Kiyoshi Kumagae. Владелец: Sony Corp. Дата публикации: 2012-04-12.

SEMICONDUCTOR FILM AND METHOD OF PRODUCING THE SAME, PHOTOELECTRIC CONVERSION ELEMENT, SOLID-STATE IMAGING ELEMENT AND ELECTRONIC APPARATUS

Номер патента: US20190229279A1. Автор: Shiomi Michinori,TAKIZAWA Syuuiti. Владелец: SONY CORPORATION. Дата публикации: 2019-07-25.

METHOD OF SELECTING AN EXTERNAL ELECTRONIC DEVICE CONNECTED WITH AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING SAME

Номер патента: US20170251330A1. Автор: WON Sungjoon,POWDERLY James. Владелец: . Дата публикации: 2017-08-31.

SOLID BATTERY, MANUFACTURING METHOD OF SOLID BATTERY, BATTERY PACK, VEHICLE, POWER STORAGE SYSTEM, POWER TOOL, AND ELECTRONIC EQUIPMENT

Номер патента: US20190252728A1. Автор: Shimizu Keisuke,SUZUKI Masamitsu,Fukasawa Norio. Владелец: . Дата публикации: 2019-08-15.

METHOD OF SELECTING AN EXTERNAL ELECTRONIC DEVICE CONNECTED WITH AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING SAME

Номер патента: US20150296322A1. Автор: WON Sungjoon,POWDERLY James. Владелец: . Дата публикации: 2015-10-15.

Method of preparing thin film, thin film, apparatus for manufacturing thin film and electronic device including the thin film

Номер патента: KR101830780B1. Автор: 이상윤,선종백,류명관. Владелец: 삼성디스플레이 주식회사. Дата публикации: 2018-04-05.

Method of preparing thin film, thin film, apparatus for preparing thin film, and electronic device including thin film

Номер патента: US9245779B2. Автор: Sang-yoon Lee,Myung-kwan Ryu,Jong-baek Seon. Владелец: Samsung Display Co Ltd. Дата публикации: 2016-01-26.

Target image detection device, controlling method of the same, control program and recording medium recorded with program, and electronic apparatus equipped with target image detection device

Номер патента: US20090231458A1. Автор: Kozo Moriyama. Владелец: Omron Corp. Дата публикации: 2009-09-17.

Photoelectric conversion element, method of manufacutring photoelectric conversion element, electrolyte layer for photoelectric conversion element, and electronic apparatus

Номер патента: CN102543493A. Автор: 熊谷洁,津田辽平. Владелец: Sony Corp. Дата публикации: 2012-07-04.

Method of selecting an external electronic device connected with an electronic device and electronic device using same

Номер патента: US10278042B2. Автор: Sungjoon WON,James POWDERLY. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2019-04-30.

Composition, Methods of Forming Low-Permittivity Film from the Composition, Low-Permittivity Film, and Electronic Part Having the Low-Permittivity Film

Номер патента: KR100732089B1. Автор: 시게루 노베,가즈히로 에노모또,다께노리 나리따,히로유끼 모리시마,하루아끼 사꾸라이,노부꼬 데라다. Владелец: 히다치 가세고교 가부시끼가이샤. Дата публикации: 2007-06-27.

Method of a measurement report for selecting a frequency in electronic device and electronic device

Номер патента: KR20220113005A. Автор: 한용규,이형주,김준석,임채만,김태윤,정의창,양민호. Владелец: 삼성전자주식회사. Дата публикации: 2022-08-12.

Method of manufacturing an assembly to couple an optical fiber to an opto-electronic component

Номер патента: US09592578B2. Автор: Wolfgang Gottfried Tobias Schweiker,Karsten Contag,Angela Rief,Dirk Richter,Joachim Rudolf Beier,Markus Meinelt. Владелец: CCS Technology Inc. Дата публикации: 2017-03-14.

Method of measuring physical properties, method of evaluating member, method of manufacturing electronic component device, method of manufacturing material for electronic component device, and physical property measurement system

Номер патента: US20230204530A1. Автор: Hirokazu Noma. Владелец: Resonac Corp. Дата публикации: 2023-06-29.

Method of measuring hexavalent chromium in electronic components and assemblies

Номер патента: WO2007047209A2. Автор: Michael Riess,Julia Smirnow,Heike Schumacher. Владелец: Motorola Inc.. Дата публикации: 2007-04-26.

Method of manufacturing multi-layer thin film, member including the same and electronic product including the same

Номер патента: US09845535B2. Автор: Hyun Jun Jung,Jin Hyun Cho,Min Chul JUNG,Jin Sub Kim,Hyong Jun YOO. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2017-12-19.

Electronic component management method, and housing body for electronic components

Номер патента: US20240086673A1. Автор: Yasuhiro Shimizu,Naoto Ikeda,Kiyoyuki Nakagawa,Nobuto YAMADA. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-03-14.

Methods of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package, and related methods

Номер патента: WO2023200540A1. Автор: Wei Qin,Basil Milton. Владелец: KULICKE AND SOFFA INDUSTRIES, INC.. Дата публикации: 2023-10-19.

Methods of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package, and related methods

Номер патента: US20230325578A1. Автор: Wei Qin,Basil Milton. Владелец: Kulicke and Soffa Industries Inc. Дата публикации: 2023-10-12.

Method of manufacturing strengthened glass, strengthened glass obtained by the method, and electronic device including the strengthened glass

Номер патента: US20180099904A1. Автор: Woo Jin Cho,Seung Ho Kim,Jeong Woo Park,Hyun Joon Oh,Hee Kyun SHIN,Hoi Kwan Lee,Jong Hoon YEUM. Владелец: Samsung Display Co Ltd. Дата публикации: 2018-04-12.

Cleaning unit for a mould for encapsulating electronic components, moulding system and method for encapsulating electronic components

Номер патента: NL2033591B1. Автор: Franciscus Gerardus Van Driel Albertus. Владелец: Besi Netherlands Bv. Дата публикации: 2024-05-30.

Method for positioning a carrier with a plurality of electronic components in a device for testing the electronic components

Номер патента: US09541600B2. Автор: Bernhard Lorenz,Helmut Scheibenzuber,Andreas BURSIAN. Владелец: Multitest Elektronische Systeme GmbH. Дата публикации: 2017-01-10.

Method of manufacturing multi-layer thin film, member including the same and electronic product including the same

Номер патента: EP2961861A1. Автор: Hyun Jun Jung,Jin Hyun Cho,Min Chul JUNG,Jin Sub Kim,Hyong Jun YOO. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2016-01-06.

Cleaning unit for a mould for encapsulating electronic components, moulding system and method for encapsulating electronic components

Номер патента: WO2024112192A1. Автор: Albertus Franciscus Gerardus Van Driel. Владелец: BESI NETHERLANDS B.V.. Дата публикации: 2024-05-30.

Method of operating and monitoring a group of filter membrane modules, and a group of modules implementing the method

Номер патента: US6001254A. Автор: Jean-Michel Espenan,Franc Saux. Владелец: Aquasource SAS. Дата публикации: 1999-12-14.

Method of producing a wetroom floor module, a wetroom floor module and a floor module frame

Номер патента: WO2015057152A1. Автор: Magnus Johansson. Владелец: Racks I Olofström Ab. Дата публикации: 2015-04-23.

Method of operating system-on-chip, system-on-chip performing the same and electronic system including the same

Номер патента: US20190129490A1. Автор: Dae-yeong LEE,Dong-Hee Han. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2019-05-02.

Electronic component, method of manufacturing the electronic component, and method of manufacturing electronic circuit device

Номер патента: US20020100964A1. Автор: Keiji Onishi,Akihiko Namba,Katsunori Moritoki. Владелец: Matsushita Electric Industrial Co Ltd. Дата публикации: 2002-08-01.

Electronic module, method of manufacturing electronic module, and endoscope

Номер патента: US12082784B2. Автор: Takanori Sekido. Владелец: Olympus Corp. Дата публикации: 2024-09-10.

Method of manufacturing electronic component and electronic-component manufacturing apparatus

Номер патента: US20150221453A1. Автор: Takashi Sawada. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2015-08-06.

Method of manufacturing element chip, method of manufacturing electronic component-mounted structure, and electronic component-mounted structure

Номер патента: US09780021B2. Автор: Noriyuki Matsubara,Shogo Okita,Atsushi Harikai. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2017-10-03.

Electronic circuit board, laminated board, and method of manufacturing electronic circuit board

Номер патента: US20180122776A1. Автор: Takuro Suyama. Владелец: Olympus Corp. Дата публикации: 2018-05-03.

Method of manufacturing electronic component

Номер патента: US09576736B2. Автор: Kengo TSUBOKAWA. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-02-21.

Electronic devices with a redistribution layer and methods of manufacturing electronic devices with a redistribution layer

Номер патента: US20240194550A1. Автор: Seung Nam Son,Dong Hyun Khim,Jin Kun Yoo. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2024-06-13.

Method of manufacturing electronic component

Номер патента: US12068111B2. Автор: Akira Sumi. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-08-20.

Electronic devices and methods of manufacturing electronic devices

Номер патента: US20220393039A1. Автор: Jae Ho Lee,Ji Young Chung,Sung Hwan Yang. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2022-12-08.

Electronic devices and methods of manufacturing electronic devices

Номер патента: US20240186213A1. Автор: Yi Seul Han,Sang Hyeon Lee,Jae Jin REE,Geon Du GIM,Hun Jung LIM. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2024-06-06.

Semiconductor devices and methods of manufacturing electronic devices

Номер патента: US12107037B2. Автор: Jae Hun Bae,George Scott,Ki Yeul YANG. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2024-10-01.

Method of manufacturing element chip and method of manufacturing electronic component-mounted structure using plasma etch to singulate element chip

Номер патента: US09698052B2. Автор: Noriyuki Matsubara,Shogo Okita,Atsushi Harikai. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2017-07-04.

Method of manufacturing glass substrate and method of manufacturing electronic components

Номер патента: EP2405472A3. Автор: Eiji Terao. Владелец: Seiko Instruments Inc. Дата публикации: 2013-05-29.

Method of manufacturing electronic part and mounting electronic part

Номер патента: US7060602B2. Автор: Atsushi Saito. Владелец: Seiko Epson Corp. Дата публикации: 2006-06-13.

Electronic component and method of manufacturing electronic component

Номер патента: US20220278668A1. Автор: Masahiro Fukushima,Kazunori Inoue,Koichiro Kawasaki,Hidefumi Nakanishi,Shintaro OTSUKA,Yasuyuki TOYOTA,Masakazu ATARASHI. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2022-09-01.

Electronic devices and methods of manufacturing electronic devices

Номер патента: US20240249986A1. Автор: Sang Hyoun Lee,Hun Jung LIM,Jong Min BARK,Hyun Il Moon. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2024-07-25.

Methods of manufacturing electron-emitting device, electron source, and image forming apparatus

Номер патента: EP1302968A3. Автор: Takashi Iwaki. Владелец: Canon Inc. Дата публикации: 2007-07-25.

Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby

Номер патента: US20240274445A1. Автор: Andre Cardoso,Suresh Jayaraman,Bora Baloglu,Ronald Huemoeller,Fernando Teixeira,Luís ALVES,Eoin O'Toole,Marta Sa Santos,Jose Moreira da Silva,Jose Luis Silva. Владелец: Amkor Technology Portugal SA. Дата публикации: 2024-08-15.

Electronic component and method of manufacturing electronic component

Номер патента: US20200152556A1. Автор: Takayuki Matsumoto,Tsukasa NAKANISHI,Tadaaki Katsuyama. Владелец: Shinko Electric Industries Co Ltd. Дата публикации: 2020-05-14.

Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof

Номер патента: US12125771B2. Автор: Chayathorn Saklang,Chanon Suwankasab,Amornthep Saiyajitara,Verapath Vareesantichai. Владелец: NXP BV. Дата публикации: 2024-10-22.

Electronic component, module, and method of manufacturing electronic component

Номер патента: US20230197632A1. Автор: Ryohei OKABE. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2023-06-22.

Method of manufacturing electron-emitting device, electron source and image-forming apparatus, and apparatus of manufacturing electron source

Номер патента: US20020127941A1. Автор: Toshikazu Ohnishi,Miki Tamura,Kazuhiro Jindai. Владелец: Canon Inc. Дата публикации: 2002-09-12.

Electronic devices and methods of manufacturing electronic devices

Номер патента: US12119319B2. Автор: Ki Yeul YANG,Eun Taek JEONG,Du Young LEE. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2024-10-15.

Cooling module and manufacturing method

Номер патента: RU2559214C2. Автор: БОРК Феликс ФОН,Бьерн ЭБЕРЛЕ. Владелец: Акасол Гмбх. Дата публикации: 2015-08-10.

Construction of thin-film solar module and method of its manufacture

Номер патента: RU2648341C2. Автор: Евгений Иванович Теруков,Александр Вячеславович Семенов,Алексей Валерьевич Кукин,Дмитрий Александрович Андроников,Алексей Станиславович Абрамов. Владелец: Общество с ограниченной ответственностью "НТЦ тонкопленочных технологий в энергетике", ООО "НТЦ ТПТ". Дата публикации: 2018-03-23.

Method of manufacturing electronic device using cyclic doping process, and electronic device manufactured by the same

Номер патента: US20240136187A1. Автор: Ki Hyun Kim,Ki Seok Kim,Hee Ju Kim,Ji Eun Kang,Seong Jae Yu,Hyun Woo Tak,Geun Young Yeom,Doo San KIM,You Jin JI,Yun Jong JANG. Владелец: Sungkyunkwan University Research and Business Foundation. Дата публикации: 2024-04-25.

Method of manufacturing electronic device using cyclic doping process, and electronic device manufactured by the same

Номер патента: US20240234146A9. Автор: Ki Hyun Kim,Ki Seok Kim,Hee Ju Kim,Ji Eun Kang,Seong Jae Yu,Hyun Woo Tak,Geun Young Yeom,Doo San KIM,You Jin JI,Yun Jong JANG. Владелец: Sungkyunkwan University Research and Business Foundation. Дата публикации: 2024-07-11.

Electronic component and method of manufacturing the same

Номер патента: US20140159849A1. Автор: Yong Suk Kim,Sung Kwon Wi,Sang Moon Lee,Jun Hee Bae. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2014-06-12.

Method of manufacturing electron multiplier body, photomultiplier tube, and photomultiplier

Номер патента: US09892892B2. Автор: Hiroshi Kobayashi,Motohiro Suyama,Shinya Hattori. Владелец: Hamamatsu Photonics KK. Дата публикации: 2018-02-13.

Method of manufacturing electronic device and method of manufacturing photoelectric conversion device

Номер патента: US20160268329A1. Автор: Tetsuya Kimura,Koki Takami. Владелец: Canon Inc. Дата публикации: 2016-09-15.

Light-emitting module and method of manufacturing the same

Номер патента: US20200343422A1. Автор: Shinya Matsuoka,Saiki Yamamoto. Владелец: Nichia Corp. Дата публикации: 2020-10-29.

Method of manufacturing electron multiplier body, photomultiplier tube, and photomultiplier

Номер патента: US20160260592A1. Автор: Hiroshi Kobayashi,Motohiro Suyama,Shinya Hattori. Владелец: Hamamatsu Photonics KK. Дата публикации: 2016-09-08.

Method of manufacturing electron multiplier body, photomultiplier tube, and photomultiplier

Номер патента: US20180144914A1. Автор: Hiroshi Kobayashi,Motohiro Suyama,Shinya Hattori. Владелец: Hamamatsu Photonics KK. Дата публикации: 2018-05-24.

Semiconductor device package and method of manufacturing the same

Номер патента: US20210082782A1. Автор: Ian HU,Ming-Han WANG. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2021-03-18.

Defect removal device, defect removal method, pattern forming method, and method of manufacturing electronic device

Номер патента: US20230395366A1. Автор: Ryo Saito,Masahiro Yoshidome,Akihiko Ohtsu,Yukihisa KAWADA. Владелец: Fujifilm Corp. Дата публикации: 2023-12-07.

Method of production control and method of manufacturing electronic apparatus

Номер патента: US7031785B2. Автор: Kazuhiro Watanabe,Hideo Ishii,Yuuichi Kubo. Владелец: Sharp Corp. Дата публикации: 2006-04-18.

Method of manufacturing member pattern, method of manufacturing wiring structure, method of manufacturing electron source, and method of manufacturing image display device

Номер патента: US20040018449A1. Автор: Shuji Yamada,Takahiro Hachisu,Tadayasu Meguro. Владелец: Canon Inc. Дата публикации: 2004-01-29.

Method of manufacturing electronic device and method of manufacturing photoelectric conversion device

Номер патента: US09666629B2. Автор: Tetsuya Kimura,Koki Takami. Владелец: Canon Inc. Дата публикации: 2017-05-30.

Electronic component, method of manufacturing same, composite module including electronic component, and method of manufacturing same

Номер патента: US09543268B2. Автор: Tadaji Takemura. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-01-10.

Method of manufacturing an electronic component

Номер патента: US20140120721A1. Автор: Hjalmar Edzer Ayco Huitema,Christoph Wilhelm Sele,Gerwin Hermanus Gelinck,Monica Johanna Beenhakkers,Nicollaas Aldegonda Jan Maria VAN AERLE. Владелец: Creator Technology BV. Дата публикации: 2014-05-01.

Solder reflow apparatus and method of manufacturing electronic device

Номер патента: US20240363579A1. Автор: Youngja KIM,Seungyeop OH. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-10-31.

Method of manufacturing electronic device, electronic apparatus, and mobile apparatus

Номер патента: US09660176B2. Автор: Hideo Miyasaka. Владелец: Seiko Epson Corp. Дата публикации: 2017-05-23.

Semiconductor devices and methods of manufacturing semiconductor devices

Номер патента: US20210066204A1. Автор: Min Jae Lee,Dong Hyun Bang,Ji Hoon Oh,Young Ik Kwon,Soo Jin Shin,Tae Kyeong HWANG. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2021-03-04.

A method of manufacturing a strap for a wearable device

Номер патента: GB2625835A. Автор: Dinan Richard,James Fawcett Patrick. Владелец: Armour Surveillance Security Equipment and Technology Ltd. Дата публикации: 2024-07-03.

Nonplanar antenna embedded package structure and method of manufacturing the same

Номер патента: US20150303574A1. Автор: Chih Wang,Chun-Yu Lee,Chia-Hua Chang,Chi-Haw Chiang. Владелец: National Chung Shan Institute of Science and Technology NCSIST. Дата публикации: 2015-10-22.

Nonplanar antenna embedded package structure and method of manufacturing the same

Номер патента: US9472851B2. Автор: Chih Wang,Chun-Yu Lee,Chia-Hua Chang,Chi-Haw Chiang. Владелец: National Chung Shan Institute of Science and Technology NCSIST. Дата публикации: 2016-10-18.

Optical element module and method of manufacturing the same

Номер патента: US20100142886A1. Автор: Masayuki Ishida,Yoshihisa Warashina. Владелец: Hamamatsu Photonics KK. Дата публикации: 2010-06-10.

Multilayer ceramic electronic component and method of manufacturing the same

Номер патента: US20130242460A1. Автор: Sung Woo Kim,Jong Ho Lee,Jae Yeol Choi,Yu Na Kim,Sung Chul Bae. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2013-09-19.

Wearable component, ear tip, and method of manufacturing a wearable component

Номер патента: US20230199362A1. Автор: Jenchun Chen,Hung Yi Lin,Chang Yi WU. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2023-06-22.

Method of manufacturing photoelectric conversion element, photoelectric conversion element manufactured by the same, method of manufacturing photoelectric conversion element module, and photoelectric conversion element module manufactured by the same

Номер патента: US20110088773A1. Автор: Hiroki Usui. Владелец: Fujikura Ltd. Дата публикации: 2011-04-21.

Method of manufacturing an electronic device, and electronic device manufacturing apparatus

Номер патента: US09911642B2. Автор: Taiji Sakai,Nobuhiro Imaizumi. Владелец: Fujitsu Ltd. Дата публикации: 2018-03-06.

Laminate, method of manufacturing the same, and method of manufacturing electronic component

Номер патента: US20220227096A1. Автор: Hiroshi Fukui,Yoshito Ushio,Ryota Dogen,Kyoko TOYAMA. Владелец: Dow Toray Co Ltd. Дата публикации: 2022-07-21.

Laminate, method of manufacturing the same, and method of manufacturing electronic component

Номер патента: US20200164613A1. Автор: Hiroshi Fukui,Yoshito Ushio,Ryota Dogen,Kyoko TOYAMA. Владелец: Dow Corning Toray Co Ltd. Дата публикации: 2020-05-28.

Method of manufacturing electronic apparatus

Номер патента: US20180012861A1. Автор: Sang Seok Lee,Jae Bon Koo,Soon Won Jung,Chan Woo Park,Bock Soon Na,Ji-Young Oh,Keunsoo Lee,Joo Yeon Kim,Chi-Sun Hwang,Nae-Man Park. Владелец: Electronics and Telecommunications Research Institute ETRI. Дата публикации: 2018-01-11.

Method of treating inorganic oxide film, electronic device substrate, method of manufacturing electronic device substrate, liquid crystal panel, and electronic apparatus

Номер патента: US20060231839A1. Автор: Koichi Terao,Yuji Shinohara. Владелец: Seiko Epson Corp. Дата публикации: 2006-10-19.

Method of treating inorganic oxide film, electronic device substrate, method of manufacturing electronic device substrate, liquid crystal panel, and electronic apparatus

Номер патента: US7632553B2. Автор: Koichi Terao,Yuji Shinohara. Владелец: Seiko Epson Corp. Дата публикации: 2009-12-15.

Semiconductor devices and methods of manufacturing semiconductor devices

Номер патента: US20210082891A1. Автор: Dong Hee Kang,Ron Huemoeller,Hyun Goo Cha,Sang Yun Ma,Sang Hyeok Cho,Jae Yeong Bae. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2021-03-18.

Semiconductor devices and methods of manufacturing semiconductor devices

Номер патента: US20220093576A1. Автор: Dong Hee Kang,Ron Huemoeller,Hyun Goo Cha,Sang Yun Ma,Sang Hyeok Cho,Jae Yeong Bae. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2022-03-24.

Electronic component and method of manufacturing the same

Номер патента: US09543076B2. Автор: Moon Il Kim,Byoung HWA Lee,Doo Hwan Lee. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2017-01-10.

Semiconductor devices and methods of manufacturing semiconductor devices

Номер патента: US20240203803A1. Автор: Jae Yun Kim. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2024-06-20.

Semiconductor devices and methods of manufacturing semiconductor devices

Номер патента: US20240194610A1. Автор: Jin Seong Kim,Kwang Seok Oh,Sung Woo Lim,Jo Hyun Bae,Yeong Beom Ko,Yun Ah KIM,Yong Jae Ko,Ji Chang Lee. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2024-06-13.

Electronic component and method of manufacturing an electronic component

Номер патента: US20230237319A1. Автор: Karl Leo,Hans Kleemann,Matteo Cucchi. Владелец: TECHNISCHE UNIVERSITAET DRESDEN. Дата публикации: 2023-07-27.

Method of manufacturing chip-type ceramic electronic component

Номер патента: US20040064940A1. Автор: Masahiko Kawase,Noburu Furukawa. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2004-04-08.

Method of manufacturing electronic device

Номер патента: US20230072729A1. Автор: Tzu-Min Yan,Ming-Chang Lin. Владелец: Innolux Corp. Дата публикации: 2023-03-09.

Semiconductor devices and methods of manufacturing semiconductor devices

Номер патента: US20220181265A1. Автор: Jin Seong Kim,Kwang Seok Oh,Sung Woo Lim,Jo Hyun Bae,Yeong Beom Ko,Yun Ah KIM,Yong Jae Ko,Ji Chang Lee. Владелец: Amkor Technology Singapore Holding Pte Ltd. Дата публикации: 2022-06-09.

Semiconductor device package and method of manufacturing the same

Номер патента: US20240249988A1. Автор: Yu-Chang Chen,Jen-Chieh Kao,Wei-Tung CHANG. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2024-07-25.

Semiconductor device package and method of manufacturing the same

Номер патента: US20240304606A1. Автор: Wei-Hao Chang. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2024-09-12.

Method of manufacturing solar cell module

Номер патента: US20240322065A1. Автор: Changjiang LIN,Kaiyin CAO. Владелец: Anhui Huasun Energy Co Ltd. Дата публикации: 2024-09-26.

Display apparatus and method of manufacturing the same

Номер патента: US12120929B2. Автор: Yunseok Han,Dowon Yi,Myounghee LEE,Jungmi Jang. Владелец: Samsung Display Co Ltd. Дата публикации: 2024-10-15.

Method of manufacturing an article with integral active electronic component

Номер патента: US09905389B2. Автор: Robert Ghanea-Hercock. Владелец: British Telecommunications plc. Дата публикации: 2018-02-27.

Ceramic electronic component and method of manufacturing the same

Номер патента: US09672963B2. Автор: Kenichi Hamanaka,Kiyotaka Maegawa,Kota ZENZAI,Taku DEKURA. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-06-06.

Light-emitting module, light-emitting device, method of manufacturing the light-emitting module, and method of manufacturing the light-emitting device

Номер патента: US09577219B2. Автор: Shunpei Yamazaki,Satoshi Seo,Akihiro Chida,Kaoru Hatano. Владелец: Semiconductor Energy Laboratory Co Ltd. Дата публикации: 2017-02-21.

Method of manufacturing chip electronic component

Номер патента: US09496084B2. Автор: Moon Soo Park,Tae Young Kim,Jin Ok HAN. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2016-11-15.

Solder reflow apparatus and method of manufacturing electronic device

Номер патента: US20240178181A1. Автор: Youngja KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-30.

Fuel cell module and manufacturing method of the same

Номер патента: US20120107727A1. Автор: Ho-jin Kweon,Jun-Won Suh,Jan-Dee Kim. Владелец: Samsung SDI Co Ltd. Дата публикации: 2012-05-03.

Conductive heat radiation film, method of manufacturing the same, and method of manufacturing electronic device

Номер патента: US12027441B2. Автор: Shinichi Hirose,Daiyu Kondo. Владелец: Fujitsu Ltd. Дата публикации: 2024-07-02.

Semiconductor laser device and method of manufacturing the same, and optical transmission module and optical disk apparatus using the semiconductor laser device

Номер патента: US20070243644A1. Автор: Katsuhiko Kishimoto,Shuichi Hirukawa. Владелец: Individual. Дата публикации: 2007-10-18.

Multilayer ceramic electronic component and method of manufacturing the same

Номер патента: US20200066454A1. Автор: Kyoung Jin CHA,Jeong Ryeol Kim. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2020-02-27.

Manufacturing method of flexible thin film solar cell module and the flexible thin film solar cell module using the same

Номер патента: US20210135029A1. Автор: Jeung-Hyun Jeong,Won Mok Kim,Hyeonggeun Yu,Jong-Keuk Park,Eunpyung CHOI. Владелец: Korea Advanced Institute of Science and Technology KAIST. Дата публикации: 2021-05-06.

Semiconductor device, method of manufacturing semiconductor device, and antenna switch module

Номер патента: US20160293759A1. Автор: Hideo Yamagata,Yoshikazu Motoyama,Hiroki Tsunemi. Владелец: Sony Corp. Дата публикации: 2016-10-06.

Semiconductor device, method of manufacturing semiconductor device, and antenna switch module

Номер патента: US20170069586A1. Автор: Hideo Yamagata,Yoshikazu Motoyama,Hiroki Tsunemi. Владелец: Sony Corp. Дата публикации: 2017-03-09.

Foldable electrical connector-housing system and method of manufacture thereof

Номер патента: US20150227176A1. Автор: Simon B. Johnson,Lev M. Bolotin. Владелец: Clevx LLC. Дата публикации: 2015-08-13.

Method of manufacturing a semiconductor device package having dummy dies

Номер патента: US12125822B2. Автор: Ming-Chih Yew,Shin-puu Jeng,Po-Yao Lin,Po-Chen LAI,Shu-Shen Yeh,Che-Chia Yang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-10-22.

Method of manufacturing an electronic component

Номер патента: US09735340B2. Автор: Takeo Sato,Yuichiro Nagamine,Hidekazu Oishibashi. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-08-15.

Semiconductor device, method of manufacturing semiconductor device, and antenna switch module

Номер патента: US09537005B2. Автор: Hideo Yamagata,Yoshikazu Motoyama,Hiroki Tsunemi. Владелец: Sony Corp. Дата публикации: 2017-01-03.

Method of manufacturing electronic device and electronic device

Номер патента: US20120080219A1. Автор: Tetsuya Takahashi,Shuichi Takeuchi,Naoki Ishikawa,Yoshiyuki Satoh,Takeshi Miyakoshi,Kenji Kobae. Владелец: Fujitsu Ltd. Дата публикации: 2012-04-05.

Method of manufacturing electronic device

Номер патента: US11858226B2. Автор: Kenji Yamamoto,Ryosuke Takahashi,Masataka Kazuno. Владелец: Seiko Epson Corp. Дата публикации: 2024-01-02.

Method of manufacturing electronic component and electronic-component manufacturing apparatus

Номер патента: US9978536B2. Автор: Takashi Sawada. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2018-05-22.

Multilayer ceramic electronic component and method of manufacturing the same

Номер патента: US20200058442A1. Автор: Jun Oh Kim,Kyoung Jin CHA,Young Joon Oh,Kyung Ryul LEE,Jeong Ryeol Kim,Hyo Min KANG. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2020-02-20.

Multilayer ceramic electronic component and method of manufacturing the same

Номер патента: US20200126727A1. Автор: Kyoung Jin CHA,Ji Hong Jo,Seok Kyoon Woo,Jeong Ryeol Kim. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2020-04-23.

Compound component device and method of manufacturing the same

Номер патента: US20240213130A1. Автор: Wataru Doi. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2024-06-27.

Structure Combining an IC Integrated Substrate and a Carrier, and Method of Manufacturing such Structure

Номер патента: US20070145602A1. Автор: Chih-Kuang Yang. Владелец: Princo Corp. Дата публикации: 2007-06-28.

FK Module and Method for the Production Thereof

Номер патента: US20100219420A1. Автор: Olaf Ruediger Hild. Владелец: Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV. Дата публикации: 2010-09-02.

Packaging systems incorporating thin film liquid crystal polymer (lcp) and methods of manufacture

Номер патента: WO2007050101A3. Автор: Guoan Wang,Emmanouil M Tentzeris,Nickolas Kingsley,Dane Thompson,Loannis Papapolymerou. Владелец: Loannis Papapolymerou. Дата публикации: 2007-11-22.

Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder

Номер патента: US20230048272A1. Автор: Nicolaas Ten Kate,Nina Vladimirovna DZIOMKINA,Raymond Wilhelmus Louis Lafarre,Yogesh Pramod KARADE. Владелец: ASML Netherlands BV. Дата публикации: 2023-02-16.

Method of manufacturing solar cell module and method of manufacturing solar cell

Номер патента: US20100022047A1. Автор: Shinji Kobayashi,Atsuko Yamazaki. Владелец: Sanyo Electric Co Ltd. Дата публикации: 2010-01-28.

Method of manufacturing power semiconductor module, and power semiconductor module manufactured thereby

Номер патента: US20240321676A1. Автор: Jihyung LEE. Владелец: Amosense Co Ltd. Дата публикации: 2024-09-26.

Ceramic electronic component and method of manufacturing the same

Номер патента: US09799452B2. Автор: Kenichi Hamanaka,Kiyotaka Maegawa,Kota ZENZAI,Taku DEKURA. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2017-10-24.

Apparatus and method of manufacturing semiconductor package module

Номер патента: US09673066B2. Автор: Seung Wook Park,Tae Sung Jeong,No Il PARK,Eung Suek Lee. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2017-06-06.

Electronic module and method of manufacturing the same

Номер патента: US09589922B2. Автор: Alexander Schwarz,Christian Neugirg,Andreas Grassmann,Inpil Yoo,Frank Winter,Wolfram Hable,Ottmar Geitner. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2017-03-07.

Method of testing electronic components

Номер патента: RU2643239C1. Автор: Франческо Таяриол,Филиппо Велья,Пьеро Дегаспери,Мирко Кинелли. Владелец: Общество с ограниченной ответственностью "Тау Индастриз". Дата публикации: 2018-01-31.

Light guide plate, manufacturing method thereof, backlight module and display device

Номер патента: US20190033509A1. Автор: Xuerong Wang. Владелец: Beijing BOE Optoelectronics Technology Co Ltd. Дата публикации: 2019-01-31.

C17-heteroaryl derivatives of oleanolic acid and methods of use thereof

Номер патента: US09889143B2. Автор: Xin Jiang,Melean Visnick,Christopher F. Bender. Владелец: Reata Pharmaceuticals Inc. Дата публикации: 2018-02-13.

A-ring epoxidized triterpenoid-based anti-inflammation modulators and methods of use thereof

Номер патента: US09556222B2. Автор: Xin Jiang,Haizhou Sun,Xiaofeng Liu,Eric Anderson,Melean Visnick,Christopher F. Bender. Владелец: Reata Pharmaceuticals Inc. Дата публикации: 2017-01-31.

C17-heteroaryl derivatives of oleanolic acid and methods of use thereof

Номер патента: US09512094B2. Автор: Xin Jiang,Melean Visnick,Christopher F. Bender. Владелец: Reata Pharmaceuticals Inc. Дата публикации: 2016-12-06.

Optical transformation module and optical measurement system, and method of manufacturing a semiconductor device using optical transformation module and optical measurement system

Номер патента: US09897552B2. Автор: Kwang-Soo Kim,Yu-Sin Yang,Chung-Sam Jun,Byeong-Hwan Jeon,Sang-Kil Lee,Tae-Joong Kim,Yong-Deok Jeong. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2018-02-20.

Smart surgical instrument patch, instruments, and methods of application

Номер патента: US20240245531A1. Автор: Catherine Krawiec,Mary Siepierski,Jared Carboy. Владелец: Globus Medical Inc. Дата публикации: 2024-07-25.

Method of data management in data storage system, data indexing module, and data storage system

Номер патента: WO2022248045A1. Автор: Assaf Natanzon,Idan Zach. Владелец: Huawei Technologies Co., Ltd.. Дата публикации: 2022-12-01.

Method of manufacturing integrated circuit with opposed spatial light modulator and processor.

Номер патента: HK1046038A1. Автор: Kannan Raj,Ronald D Smith. Владелец: Intel Corp. Дата публикации: 2002-12-20.

A droplet ejection head and method of operation

Номер патента: WO2024105377A1. Автор: Justin NOBLE,Neil DARRACOTT,Artur JEDYNAK. Владелец: XAAR TECHNOLOGY LIMITED. Дата публикации: 2024-05-23.

Wavelength variable interference filter, manufacturing method of wavelength variable interference filter, optical filter device, optical module, and electronic apparatus

Номер патента: US20140168775A1. Автор: Katsuji Arakawa. Владелец: Seiko Epson Corp. Дата публикации: 2014-06-19.

Electrochromic material and method of manufacturing the same and electrochromic device and optical device and electronic device

Номер патента: US20200341341A1. Автор: Haeng Deog Koh,Ha Jin Kim,Min Jong BAE. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-10-29.

Method of inputting character and associated computer program product, cloud system, and electronic device, and method of indexing character

Номер патента: US20240329805A1. Автор: Por-Sen Jaw,Yin-Ping Chao. Владелец: Individual. Дата публикации: 2024-10-03.

Method of testing memory device, method of manufacturing memory device, apparatus for testing memory device, method of testing memory module, method of manufacturing memory module, apparatus for testing memory module and method of manufacturing computer

Номер патента: US20020046374A1. Автор: Takeshi Wada,Hideyuki Aoki,Yuji Wada,Noboru Uchida,Masaaki Mochiduki,Masaaki Namba,Shigeki Katsumi. Владелец: Hitachi Electronics Engineering Co Ltd. Дата публикации: 2002-04-18.

METHOD OF MANUFACTURING AN ASSEMBLY TO COUPLE AN OPTICAL FIBER TO AN OPTO-ELECTRONIC COMPONENT

Номер патента: US20140208562A1. Автор: Schweiker Wolfgang Gottfried Tobias,Richter Dirk,Beier Joachim Rudolf,Contag Karsten,Meinelt Markus,Rief Angela. Владелец: CCS Technology, Inc.. Дата публикации: 2014-07-31.

METHOD OF MANUFACTURING A CERAMIC ELECTRONIC COMPONENT

Номер патента: US20140356637A1. Автор: LEE Ji-yeon. Владелец: E I DU PONT DE NEMOURS AND COMPANY. Дата публикации: 2014-12-04.

Electronic component handler and electronic component tester

Номер патента: US20190035074A1. Автор: Tatsunori Takahashi,Hirokazu Ishida,Yuya Kimura. Владелец: Seiko Epson Corp. Дата публикации: 2019-01-31.

Electronic Component Handler, Electronic Component Transport Unit, And Electronic Component Tester

Номер патента: US20200071090A1. Автор: Fuyumi Takata,Noriaki KOTANI. Владелец: Seiko Epson Corp. Дата публикации: 2020-03-05.

Device for pressing electronic component with different downward forces

Номер патента: MY186825A. Автор: Chien-Ming Chen,Meng-Kung Lu,Yun-Jui Cheng,Chi-Chen Wu. Владелец: Chroma ATE Inc. Дата публикации: 2021-08-23.

CRYSTALLINE RADICAL POLYMERIZABLE COMPOSITION FOR ELECTRICAL AND ELECTRONIC COMPONENT, MOLDED ARTICLE OF ELECTRICAL AND ELECTRONIC COMPONENT USING THE COMPOSITION, AND METHOD OF THE MOLDED ARTICLE OF ELECTRICAL AND ELECTRONIC COMPONENT

Номер патента: US20200231714A1. Автор: Ozawa Yuichi,Oyama Tomohito. Владелец: Japan U-Pica Company, Ltd.. Дата публикации: 2020-07-23.

Method for correcting measurement error, method of determining quality of electronic component, and device for measuring characteristic of electronic component

Номер патента: US20040059529A1. Автор: Gaku Kamitani. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2004-03-25.

Method of determining scattering parameters using measurement arrangement having a calibration substrate and electronic circuit

Номер патента: US09470713B2. Автор: Thomas Zelder,Bernd Geck. Владелец: Rosenberger Hochfrequenztechnik GmbH and Co KG. Дата публикации: 2016-10-18.

Generating method of post spacer array pattern of display panel, generating device thereof, and electronic device

Номер патента: US12135482B2. Автор: Zui Wang,Siyang Liu. Владелец: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd. Дата публикации: 2024-11-05.

Carrier tape, package and packaging method of electronic component using same, and method for mounting electronic component packaged using same

Номер патента: WO2011132243A1. Автор: 楢岡浩喜. Владелец: パナソニック株式会社. Дата публикации: 2011-10-27.

Devices, systems, and methods for releasably sealing a port for a wearable electronic component

Номер патента: US09886005B2. Автор: Tyson White,Joe Babcock,Nick Everist. Владелец: Nixon Inc. Дата публикации: 2018-02-06.

Optical modulator, method of achieving velocity matching and impedance matching of optical modulator, and method of manufacturing optical modulator

Номер патента: EP1445642A3. Автор: Jungo NGK Insulators Ltd. KONDO,Osamu NGK Insulators Ltd. MITOMI,Kenji NGK Insulators Ltd. AOKI,Atsuo NGK Insulators Ltd. Kondo. Владелец: NGK Insulators Ltd. Дата публикации: 2006-06-07.

Electronic component pressing apparatus and electronic component testing apparatus

Номер патента: US20220082613A1. Автор: Yasuyuki Kato,Natsuki Shiota. Владелец: Advantest Corp. Дата публикации: 2022-03-17.

Electronic component failure indicator

Номер патента: US5673028A. Автор: Henry A. Levy. Владелец: Levy; Henry A.. Дата публикации: 1997-09-30.

Electronic component production method and burn-in apparatus

Номер патента: US20040052025A1. Автор: Gaku Kamitani. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2004-03-18.

Robotic apparatus for performing maintenance operations on an electronic component

Номер патента: WO2023275845A1. Автор: Alessandro BONO. Владелец: Fastweb S.P.A.. Дата публикации: 2023-01-05.

Optical transformation module and optical measurement system, and method of manufacturing a semiconductor device using optical transformation module and optical measurement system

Номер патента: US20160018328A1. Автор: Kwang-Soo Kim,Yu-Sin Yang,Chung-Sam Jun,Byeong-Hwan Jeon,Sang-Kil Lee,Tae-Joong Kim,Yong-Deok Jeong. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2016-01-21.

METHOD OF MANUFACTURING A MODULE FOR THERMOFORMED SOLE, ADAPTABLE MODULE AND THERMOFORMED SOLE WITH A SPECIFIC CUT IN MEDIO-FOOT OR NOT ALLOWING THE NATURAL MOVEMENTS OF THE FOOT AND MEDIO-FOOT

Номер патента: FR2975873B1. Автор: Svene Sebastien Gouache. Владелец: Individual. Дата публикации: 2014-07-25.

Surgical devices including sealed electronic components

Номер патента: WO2023237978A1. Автор: Ramiro D. Cabrera,Anthony Sgroi Jr.. Владелец: COVIDIEN LP. Дата публикации: 2023-12-14.

METHOD OF INSTALLING A GEOMETRIC REFERENTIAL ON A FLOOR FOR CALIBRATION OF ELECTRIC OR ELECTRONIC COMPONENTS OF A MOTOR VEHICLE AND ADAPTED EQUIPMENT

Номер патента: FR3056171A1. Автор: Frederico FERREIRA,Cedric HOLLART. Владелец: RENAULT SAS. Дата публикации: 2018-03-23.

Resin composition, adhesive for electronic component, cured products of these, and electronic component

Номер патента: EP4403596A1. Автор: Yohei Uesugi,Hiroki Uechi. Владелец: Namics Corp. Дата публикации: 2024-07-24.

Electronic component testing apparatus and method for transferring electronic component

Номер патента: TW200907369A. Автор: Yoshiyuki Masuo. Владелец: Advantest Corp. Дата публикации: 2009-02-16.

METHOD OF REMOVING PARTICLES FROM AN ELECTRONIC COMPONENT

Номер патента: US20190062940A1. Автор: Khan Zubair Ahmed. Владелец: . Дата публикации: 2019-02-28.

Use method of automatic dispensing equipment for electronic components

Номер патента: CN109604108B. Автор: 张子武. Владелец: Shenzhen Huaweiye Electromechanical Co Ltd. Дата публикации: 2020-04-21.

Polyimide film, method of producing the same, multilayer film, flexible metal foil clad laminate and electronic component containing the same

Номер патента: TW202225290A. Автор: 李吉男,金廷柱. Владелец: 南韓商聚酰亞胺先端材料有限公司. Дата публикации: 2022-07-01.

Pin shearing machine for electronic components

Номер патента: NZ764130A. Автор: Xiaoming Hu. Владелец: Hengdian Group Innuovo Electric Co Ltd. Дата публикации: 2023-09-29.

Pin shearing machine for electronic components

Номер патента: NZ764130B2. Автор: Xiaoming Hu. Владелец: Hengdian Group Innuovo Electric Co Ltd. Дата публикации: 2024-01-04.

METHOD OF MANUFACTURING STRENGTHENED GLASS, STRENGTHENED GLASS OBTAINED BY THE METHOD, AND ELECTRONIC DEVICE INCLUDING THE STRENGTHENED GLASS

Номер патента: US20180099904A1. Автор: Park Jeong Woo,Kim Seung Ho,SHIN Hee Kyun,CHO Woo Jin,OH Hyun Joon,LEE Hoi Kwan,YEUM Jong Hoon. Владелец: . Дата публикации: 2018-04-12.

Thermal power station with orc-module circuit and with heat pump and method of its work

Номер патента: RU2662259C2. Автор: Евгений Глебович Шадек. Владелец: Евгений Глебович Шадек. Дата публикации: 2018-07-25.

LCD Module and Manufacturing Method Thereof

Номер патента: US20130120696A1. Автор: MENG Li,Ming-Hung Shih. Владелец: Shenzhen China Star Optoelectronics Technology Co Ltd. Дата публикации: 2013-05-16.

METHOD OF MANUFACTURING ELECTROPHORESIS DISPERSION LIQUID, ELECTROPHORESIS DISPERSION LIQUID, DISPLAY DEVICE AND ELECTRONIC APPARATUS

Номер патента: US20150205180A1. Автор: Inoue Keiichi,YOKOKAWA Shinobu,Nakazawa Masahiko,KAMAKURA Kei. Владелец: . Дата публикации: 2015-07-23.

ELECTROCHROMIC MATERIAL AND METHOD OF MANUFACTURING THE SAME AND ELECTROCHROMIC DEVICE AND OPTICAL DEVICE AND ELECTRONIC DEVICE

Номер патента: US20200341341A1. Автор: KOH Haeng Deog,KIM Ha Jin,BAE Min Jong. Владелец: . Дата публикации: 2020-10-29.

Method of manufacturing optical sheet, optical sheet, backlight unit, display device, and electronic apparatus

Номер патента: US20060291065A1. Автор: Hironori Hasei,Akira Inagaki,Mitsuru Kuribayashi. Владелец: Seiko Epson Corp. Дата публикации: 2006-12-28.

Method of manufacturing optical sheet, optical sheet, backlight unit, display device, and electronic apparatus

Номер патента: CN1892260A. Автор: 长谷井宏宣,稻垣显,栗林满. Владелец: Seiko Epson Corp. Дата публикации: 2007-01-10.

Substrate for electro-optical device, method of manufacturing substrate for electro-optical device, electro-optical device and electronic apparatus

Номер патента: US20040183084A1. Автор: Reiko Wachi. Владелец: Seiko Epson Corp. Дата публикации: 2004-09-23.

Method of manufacturing color filter substrate, color filter substrate, display device and electronic appratus

Номер патента: TW200710450A. Автор: Toshimitsu Hirai,Atsushi Denda. Владелец: Seiko Epson Corp. Дата публикации: 2007-03-16.

Color filter substrate, method of manufacturing color filter substrate, display device, electro-optical device, and electronic equipment

Номер патента: KR100660588B1. Автор: 아루가히사시,가타가미사토루,다키자와게이지,우시야마도시히로,마루야마구니오. Владелец: 세이코 엡슨 가부시키가이샤. Дата публикации: 2006-12-22.

Copper Alloy Plate, Electronic Component For Passage Of Electricity, And Electronic Component For Heat Dissipation

Номер патента: US20220178005A1. Автор: Muto Yuki. Владелец: . Дата публикации: 2022-06-09.

METHOD FOR POSITIONING A CARRIER WITH A PLURALITY OF ELECTRONIC COMPONENTS IN A DEVICE FOR TESTING THE ELECTRONIC COMPONENTS

Номер патента: US20150160292A1. Автор: Lorenz Bernhard,Scheibenzuber Helmut,BURSIAN Andreas. Владелец: . Дата публикации: 2015-06-11.

Electronic component data sheet retrieving apparatus and electronic component data sheet retrieving method

Номер патента: US20020107845A1. Автор: Hiroki Takahashi. Владелец: Mitsubishi Electric Corp. Дата публикации: 2002-08-08.

A method for positioning a carrier with a plurality of electronic components in a device for testing the electronic components

Номер патента: DE102013113580A1. Автор: Bernhard Lorenz,Helmut Scheibenzuber,Andreas BURSIAN. Владелец: Multitest Elektronische Systeme GmbH. Дата публикации: 2015-06-25.

Method and system for identifying electronic component poles, method and system for marking electronic component poles

Номер патента: CN105513046A. Автор: 杨铭. Владелец: Guangzhou Shiyuan Electronics Thecnology Co Ltd. Дата публикации: 2016-04-20.

Electronic component separation and collection method and electronic component separation and collection device

Номер патента: JP5040780B2. Автор: 克仁 中澤. Владелец: Fujitsu Ltd. Дата публикации: 2012-10-03.

Method of forming touch control module, touch control module and touch control display device

Номер патента: US20210055830A1. Автор: Jing Wang,Tsungchieh Kuo,Wenjie Xu,Feifei Yu,Weiwei CHU. Владелец: Hefei Xinsheng Optoelectronics Technology Co Ltd. Дата публикации: 2021-02-25.

Methods of Treating Cancer Comprising Administration of a Glucocorticoid Receptor Modulator and a Cancer Chemotherapy Agent

Номер патента: US20200197381A1. Автор: Andreas G. MORAITIS,Andrew GREENSTEIN,Stacie SHEPHERD. Владелец: Corcept Therapeutics Inc. Дата публикации: 2020-06-25.

Method of operating and monitoring a group of permeable membrane modules and a group of modules performing this method

Номер патента: JP3701682B2. Автор: ミシェル エスペナン，ジャン,ソクス，フランク. Владелец: アクアソース. Дата публикации: 2005-10-05.

HARDWARE SECURITY MODULE, METHOD OF UPDATING INTEGRITY CHECK VALUE STORED IN HARDWARE SECURITY MODULE, AND METHOD OF UPDATING PROGRAM STORED IN TERMINAL BY USING HARDWARE SECURITY MODULE

Номер патента: US20160232381A1. Автор: JU Hong Il. Владелец: . Дата публикации: 2016-08-11.

Methods of Treating Cancer Comprising Administration of a Glucocorticoid Receptor Modulator and a Cancer Chemotherapy Agent

Номер патента: US20200197373A1. Автор: MORAITIS Andreas G.,Greenstein Andrew,Shepherd Stacie. Владелец: . Дата публикации: 2020-06-25.

Methods of Treating Cancer Comprising Administration of a Glucocorticoid Receptor Modulator and a Cancer Chemotherapy Agent

Номер патента: US20200197381A1. Автор: Andreas G. MORAITIS,Andrew GREENSTEIN,Stacie SHEPHERD. Владелец: Corcept Therapeutics Inc. Дата публикации: 2020-06-25.

A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie

Номер патента: CN107132608A. Автор: 冯杰,曹传春,丁进新. Владелец: SHENZHEN HUICHUANGDA TECHNOLOGY Co Ltd. Дата публикации: 2017-09-05.

Manufacturing method of multi-order grating film of micron LED display module and display module

Номер патента: CN107783213B. Автор: 程君,严敏,周鸣波. Владелец: Look Around Advanced Digital Display Wuxi Co Ltd. Дата публикации: 2019-12-10.

Methods of treating cancer comprising administration of a glucocorticoid receptor modulator and a cancer chemotherapy agent

Номер патента: WO2020132046A1. Автор: Andreas G. MORAITIS,Andrew GREENSTEIN,Stacie SHEPHERD. Владелец: Corcept Therapeutics Incorporated. Дата публикации: 2020-06-25.

The installation method of aircraft cockpit module including the aircraft of the module and the module in driving cabin

Номер патента: CN107585288A. Автор: O·卡扎尔斯,J·让蒂德拉萨涅. Владелец: AIRBUS OPERATIONS SAS. Дата публикации: 2018-01-16.

METHOD OF EVALUATING PERFORMANCE OF BIO-SENSOR, AUTHENTICATION METHOD USING BIO-IMAGE, AND ELECTRONIC APPARATUS ADOPTING THE AUTHENTICATION METHOD

Номер патента: US20190057270A1. Автор: HWANG Hyoseok,HEO Jingu,LEE Byungkyu. Владелец: SAMSUNG ELECTRONICS CO., LTD.. Дата публикации: 2019-02-21.

METHOD OF IDENTIFYING DRIVING SPACE USING ARTIFICIAL INTELLIGENCE, AND LEARNING MODULE AND ROBOT IMPLEMENTING SAME

Номер патента: US20200393831A1. Автор: KIM Sunryang,KIM Yoonsik,KIM Joohan,SA Jaecheon. Владелец: LG ELECTRONICS INC.. Дата публикации: 2020-12-17.

The preparation method of light guide plate and light guide plate, backlight module and display device

Номер патента: CN108957620A. Автор: 王兴,刘祥,张启平,凌遵干,许业顺. Владелец: Hefei BOE Display Lighting Co Ltd. Дата публикации: 2018-12-07.

Generating method of post spacer array pattern of display panel, generating device thereof, and electronic device

Номер патента: US20240012293A1. Автор: Zui Wang,Siyang Liu. Владелец: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd. Дата публикации: 2024-01-11.

Electro-optical device, method of driving electro-optical device, control circuit of electro-optical device, and electronic apparatus

Номер патента: US20110221732A1. Автор: Masato Nishizawa,Kota Muto. Владелец: Seiko Epson Corp. Дата публикации: 2011-09-15.

WAVELENGTH VARIABLE INTERFERENCE FILTER, MANUFACTURING METHOD OF WAVELENGTH VARIABLE INTERFERENCE FILTER, OPTICAL FILTER DEVICE, OPTICAL MODULE, AND ELECTRONIC APPARATUS

Номер патента: US20140168775A1. Автор: ARAKAWA Katsuji. Владелец: SEIKO EPSON CORPORATION. Дата публикации: 2014-06-19.

Updating method of production line equipment central control system, external updating module and storage medium

Номер патента: CN112631252B. Автор: 郭海涛,李世康,周小和. Владелец: Guangdong Jaten Robot and Automation Co Ltd. Дата публикации: 2022-07-12.

Actinic ray sensitive or radiation sensitive composition, purification method of actinic ray sensitive or radiation sensitive composition, pattern forming method, and electronic device manufacturing method

Номер патента: JPWO2017163922A1. Автор: 英明 椿,亘 二橋. Владелец: Fujifilm Corp. Дата публикации: 2018-11-08.

Updating method of production line equipment central control system, external updating module and storage medium

Номер патента: CN112631252A. Автор: 郭海涛,李世康,周小和. Владелец: Guangdong Jaten Robot and Automation Co Ltd. Дата публикации: 2021-04-09.

METHOD OF TOUCH INTERACTION OF A USER AND OF AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE IMPLEMENTING THE PROCESS

Номер патента: FR3068499B1. Автор: Frank Beruscha. Владелец: ROBERT BOSCH GMBH. Дата публикации: 2021-04-23.

Method of filling up void between adjacent fiber blanket insulating modules and its device

Номер патента: JPS54143932A. Автор: Oo Baiido Jiyunia Kaarisuru. Владелец: JOHNS MANVILLE. Дата публикации: 1979-11-09.

METHOD OF ADJUSTING SCREEN MAGNIFICATION OF ELECTRONIC DEVICE, MACHINE-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE

Номер патента: US20150062183A1. Автор: LEE Sang-hyup,JUN Jin-Ha,HONG Duk-ki. Владелец: . Дата публикации: 2015-03-05.

METHODS OF ENHANCING BIOMASS IN A PLANT THROUGH STIMULATION OF RUBP REGENERATION AND ELECTRON TRANSPORT

Номер патента: US20220145318A1. Автор: LAWSON Tracy,RAINES Christine A.,LÓPEZ-CALCAGNO Patricia E.. Владелец: University of Essex Enterprises Limited. Дата публикации: 2022-05-12.

CAPACITANCE DETECTION METHOD OF TOUCH DISPLAY PANEL, CAPACITANCE DETECTION CIRCUIT OF TOUCH DISPLAY PANEL, AND ELECTRONIC DEVICE

Номер патента: US20200387283A1. Автор: Jiang Hong,LI Guopao. Владелец: . Дата публикации: 2020-12-10.

METHOD OF WRITING IN A NON-VOLATILE MEMORY OF AN ELECTRONIC ENTITY AND ELECTRONIC ENTITY THEREFOR

Номер патента: FR3045184B1. Автор: Guillaume Barbu,Philippe Andouard. Владелец: Idemia France SAS. Дата публикации: 2018-07-20.

Methods of enhancing biomass in a plant through stimulation of RubP regeneration and electron transport

Номер патента: AU2020244191A1. Автор: Tracy LAWSON,Patricia E. LÓPEZ-CALCAGNO,Christine A. RAINES. Владелец: University of Essex Enterprises Ltd. Дата публикации: 2021-09-30.

METHOD OF WRITING IN A NON-VOLATILE MEMORY OF AN ELECTRONIC ENTITY AND ELECTRONIC ENTITY THEREFOR

Номер патента: FR3045184A1. Автор: Guillaume Barbu,Philippe Andouard. Владелец: Oberthur Technologies SA. Дата публикации: 2017-06-16.

The control method of the display screen cover board of electronic equipment, electronic equipment and electronic equipment

Номер патента: CN109459902A. Автор: 王小伟. Владелец: Oppo Chongqing Intelligent Technology Co Ltd. Дата публикации: 2019-03-12.

Method of adjusting screen magnification of electronic device, machine-readable storage medium, and electronic device

Номер патента: EP2846242B1. Автор: Jin Ha Jun,Sang Hyup Lee,Duk Ki Hong. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2017-01-25.

Method of adjusting screen magnification of electronic device, machine-readable storage medium, and electronic device

Номер патента: US9633412B2. Автор: Jin-Ha Jun,Duk-Ki HONG,Sang-Hyup Lee. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2017-04-25.

Methods of enhancing biomass in a plant through stimulation of rubp regeneration and electron transport

Номер патента: EP3942052A1. Автор: Tracy LAWSON,Patricia E. LÓPEZ-CALCAGNO,Christine A. RAINES. Владелец: University of Essex Enterprises Ltd. Дата публикации: 2022-01-26.

METHOD OF OPERATING SYSTEM-ON-CHIP, SYSTEM-ON-CHIP PERFORMING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME

Номер патента: US20190129490A1. Автор: LEE Dae-yeong,Han Dong-Hee. Владелец: SAMSUNG ELECTRONICS CO., LTD.. Дата публикации: 2019-05-02.

METHOD OF OPERATING SYSTEM-ON-CHIP, SYSTEM-ON-CHIP PERFORMING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME

Номер патента: US20180188789A1. Автор: PARK Jong-lae,JUNG Lak-Kyung,LEE Young-Tae,YOON Seok-Ju. Владелец: SAMSUNG ELECTRONICS CO., LTD.. Дата публикации: 2018-07-05.

METHOD OF DETERMINING SCATTERING PARAMETERS USING MEASUREMENT ARRANGEMENT HAVING A CALIBRATION SUBSTRATE AND ELECTRONIC CIRCUIT

Номер патента: US20140300380A1. Автор: Zelder Thomas,Geck Bernd. Владелец: . Дата публикации: 2014-10-09.

Electro-optical device, method of driving the same, data line driving circuit, signal processing circuit, and electronic apparatus

Номер патента: KR100726856B1. Автор: 도시유키 가사이,히로아키 조,다케시 노자와,히로시 호리우치. Владелец: 세이코 엡슨 가부시키가이샤. Дата публикации: 2007-06-12.

Method for manufacturing electronic component carrier tape

Номер патента: MY200723A. Автор: AIZAWA Junichi. Владелец: Shin Etsu Polymer Co Ltd. Дата публикации: 2024-01-12.

Method of manufacturing electronic devices and corresponding electronic device

Номер патента: US12017910B2. Автор: Marco Del Sarto,Kevin Formosa. Владелец: STMicroelectronics Malta Ltd. Дата публикации: 2024-06-25.

Electronic measuring, conditioning and regulating instrument and corresponding method of production

Номер патента: RU2657213C2. Автор: ЗОРЗИ Лука ДЕ,ФАРРА Стефано ДАЛЬ. Владелец: Элиуэлл Контролз С.Р.Л. Кон Унико Сочо. Дата публикации: 2018-06-08.

Method of manufacturing a staircase volumetric module

Номер патента: RU2747028C1. Автор: Александр Сергеевич Мещеряков,Сергей Александрович Амбарцумян. Владелец: Общество с ограниченной ответственностью «Комбинат Инновационных Технологий-МонАрх». Дата публикации: 2021-04-23.

Method of manufacturing supporting substrate and led display device

Номер патента: RU2591771C1. Автор: Ся ЛАНЬ. Владелец: Бейджин Глукс Криэйтив Текнолоджи Ко., Лтд. Дата публикации: 2016-07-20.

Method of treating inorganic oxide film, electronic device substrate, method of manufacturing electronic device substrate, liquid crystal panel, and electronic apparatus

Номер патента: US20060233971A1. Автор: Koichi Terao,Yuji Shinohara. Владелец: Seiko Epson Corp. Дата публикации: 2006-10-19.

Semiconductor package structure and method of manufacturing the same

Номер патента: US12050350B2. Автор: Jun-Wei Chen,Yu-Yuan Yeh,Chang-Feng You. Владелец: Advanced Semiconductor Engineering Inc. Дата публикации: 2024-07-30.

Method of manufacturing electronic device

Номер патента: US09688532B2. Автор: Atsuki NARUSE. Владелец: Seiko Epson Corp. Дата публикации: 2017-06-27.

Method of making construction slabs

Номер патента: RU2602628C1. Автор: Владислав Петрович Полиновский,Вячеслав Александрович Селезнев,Анна Константиновна Иванова,Алексей Анатольевич Речкин. Владелец: Открытое акционерное общество "Тверьстеклопластик". Дата публикации: 2016-11-20.

Method of manufacture of the thermoinsulating cylindrical vacuum boards and the board manufactured by the method

Номер патента: RU2295445C2. Автор: ГРЕГОРИО Пьераттилио ДИ. Владелец: Саес Геттерс С.П.А.. Дата публикации: 2007-03-20.

Method of manufacturing stand for toothpicks, method of manufacturing holder for toothpicks, method of manufacturing of guide for toothpicks and method of manufacturing bearing surface for toothpicks

Номер патента: RU2465801C1. Автор: Александр Иванович Максимов. Владелец: Александр Иванович Максимов. Дата публикации: 2012-11-10.

Method of manufacturing a strap for a wearable device

Номер патента: US20240206606A1. Автор: Richard DINAN,Patrick James FAWCETT. Владелец: Armour Surveillance Security Equipment and Technology Ltd. Дата публикации: 2024-06-27.

Wafer-level lens array, method of manufacturing wafer-level lens array, lens module and imaging unit

Номер патента: US20110063487A1. Автор: Daisuke Yamada,Ryo Matsuno. Владелец: Fujifilm Corp. Дата публикации: 2011-03-17.

Method of maintenance of thermal conditions in space rocket head module and device for realization of this method

Номер патента: RU2293044C2. Автор: Вячеслав Михайлович Филин,Михаил Викторович Рожков,Виктор Николаевич Веселов,Владимир Петрович Клиппа,Виктор Иванович Негодяев,В чеслав Михайлович Филин,ев Виктор Иванович Негод. Владелец: Открытое акционерное общество "Ракетно-космическая корпорация "Энергия" имени С.П. Королева". Дата публикации: 2007-02-10.

Wall and method of constructing a wall comprising first, second, and end modules and a connection means for tying adjoining modules together in tension

Номер патента: MY121408A. Автор: George Hanna. Владелец: George Hanna. Дата публикации: 2006-01-28.

ELECTRONIC COMPONENT

Номер патента: US20120001703A1. Автор: . Владелец: MURATA MANUFACTURING CO., LTD.. Дата публикации: 2012-01-05.

Method of manufacturing a ceramic electronic component

Номер патента: AU3311078A. Автор: G. KURAMITSU H. TAKADA Y. KURODA T. IRIE Y. SATO N i ITAKURA. Владелец: Matsushita Electric Industrial Co Ltd. Дата публикации: 1978-12-21.

METHOD OF MANUFACTURING CERAMIC PASTE FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING THE SAME

Номер патента: US20120048452A1. Автор: . Владелец: . Дата публикации: 2012-03-01.

NON-MAGNETIC MATERIAL COMPOSITION FOR CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT MANUFACTURED BY USING THE SAME, AND METHOD OF MANUFACTURING THE CERAMIC ELECTRONIC COMPONENT

Номер патента: US20120119866A1. Автор: An Sung Yong,Kim Ic Seob,SON Soo Hwan,KIM Sung Lyoung,HAHN Jin Woo. Владелец: . Дата публикации: 2012-05-17.

CERAMIC SHEET PRODUCT FOR CERAMIC ELECTRONIC COMPONENT, MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер патента: US20120268861A1. Автор: . Владелец: . Дата публикации: 2012-10-25.

Method of heat removal from heat-emitting electronic components in form of electromagnetic energy based on tunnel diodes

Номер патента: RU2562746C2. Автор: Тагир Абдурашидович Исмаилов,Хаджимурат Магомедович Гаджиев,Татьяна Алексеевна Челушкина,Тимур Декартович Нежведилов. Владелец: федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Дагестанский государственный технический университет". Дата публикации: 2015-09-10.

METHOD OF TESTS AND CONTROL OF ELECTRONIC COMPONENTS

Номер патента: RU2003133172A. Автор: Юрий Дмитриевич Сасов,Юрий Дмитриевич Сасов (RU). Владелец: Юрий Дмитриевич Сасов (RU). Дата публикации: 2005-04-20.

Method of estimating service life of electronic components

Номер патента: PL290016A1. Автор: Ludwik Spiralski,Alicja Konczakowska. Владелец: Politechnika Gdanska. Дата публикации: 1992-11-02.

Method of manufacturing laminated ceramic electronic component and laminated electronic component

Номер патента: JP2003243247A. Автор: 正孝 宮下,Masataka Miyashita. Владелец: TDK Corp. Дата публикации: 2003-08-29.

Multilayer ceramic electronic component, method of manufacturing multilayer ceramic electronic component, and conductive paste for forming internal electrode

Номер патента: JP3514117B2. Автор: 孝夫 細川,英治 伊藤. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2004-03-31.

Method of temperature increase identification for electronic component

Номер патента: TW200417938A. Автор: Chia-Shun Lai,Kuo Chao Lin,Jan-Wei Liu. Владелец: Ind Tech Res Inst. Дата публикации: 2004-09-16.

Method of temperature increase identification for electronic component

Номер патента: TWI226590B. Автор: Chia-Shun Lai,Kuo-Chao Lin,Jan-Wei Liu. Владелец: Ind Tech Res Inst. Дата публикации: 2005-01-11.

Method of producing backing plates for electronic components

Номер патента: PL256871A1. Автор: Andrzej Mościcki. Владелец: Andrzej Mościcki. Дата публикации: 1987-10-05.

Device for production of carbon nanopipes using a method of arc-discharge

Номер патента: RU2220905C2. Автор: Н.Н. Колесников,Д.Н. Борисенко,В.В. Кведер,М.П. Кулаков. Владелец: ИНСТИТУТ ФИЗИКИ ТВЕРДОГО ТЕЛА РАН. Дата публикации: 2004-01-10.

Liquid crystal display device with transmission and reflective display modes and method of displaying balanced chromaticity image for the same, LCD module, and electronic device

Номер патента: TW200622427A. Автор: Dai-Liang Ting,Li-Sen Chuang,Wei-Chih Chang. Владелец: Toppoly Optoelectronics Corp. Дата публикации: 2006-07-01.

Liquid crystal display device with transmission and reflective display modes and method of displaying balanced chromaticity image for the same, lcd module, and electronic device

Номер патента: TWI341413B. Автор: Wei Chih Chang,Li Sen Chuang,Dai Liang Ting. Владелец: Chimei Innolux Corp. Дата публикации: 2011-05-01.

Method of manufacturing PCB having electronic components embedded therein

Номер патента: US20120017435A1. Автор: . Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD. Дата публикации: 2012-01-26.

Method of metering of power requirement on rolling stock of electric transport and electronic meter for its realization

Номер патента: RU2140654C1. Автор: В.А. Коровин,Б.И. Грубер,А.Г. Тишунов. Владелец: Общество с ограниченной ответственностью "Научно-производственное предприятие "Резонанс". Дата публикации: 1999-10-27.

Semiconductor porcelain and method of manufacturing semiconductor porcelain electronic component

Номер патента: JP3220846B2. Автор: 徳之 真渕,典之 神津. Владелец: TAIYO YUDEN CO LTD. Дата публикации: 2001-10-22.

Gravure roll, gravure printing machine, and method of manufacturing multilayer ceramic electronic component

Номер патента: JP4123301B2. Автор: 和寛 田畑,浩嘉 高島,憲 橋本,吉広 金山,孝広 西澤. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2008-07-23.

Gravure roll, gravure printing machine, and method of manufacturing multilayer ceramic electronic component

Номер патента: JP4225265B2. Автор: 和寛 田畑,浩嘉 高島,憲 橋本,吉広 金山. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2009-02-18.

Gravure roll, gravure printing machine, and method of manufacturing multilayer ceramic electronic component

Номер патента: JP4012990B2. Автор: 和寛 田畑,浩嘉 高島,憲 橋本,吉広 金山. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2007-11-28.

Manufacturing method of resin film for embedding electronic component, manufacturing method of electronic component device

Номер патента: JP6390434B2. Автор: 豊 野村,野村　豊,大輔 藤本,雅彦 鈴木,鈴木　雅彦,藤本　大輔,裕介 渡瀬,弘邦 荻原,知世 金子. Владелец: Showa Denko Materials Co Ltd. Дата публикации: 2018-09-19.

Combined electronic component and interconnection module and method for the manufacture thereof

Номер патента: IL36687A0. Автор: . Владелец: Bunker Ramo. Дата публикации: 1971-06-23.

Method of manufacturing light reflector of edge-lit backlight module and light reflector thereof

Номер патента: TW200938313A. Автор: Wei-Sheng Weng. Владелец: Longeval Prec Tech Corp. Дата публикации: 2009-09-16.

Method of capturing e-mail fingerprint, spam identification method, computer program product, and electronic device

Номер патента: TW201143331A. Автор: Jie-Huan Shi,Ming-Dao Liu,Jian-Tong Bi. Владелец: Softnext Technologies Corp. Дата публикации: 2011-12-01.

Method of measuring electric characteristic of electronic component, and measuring instrument therefor

Номер патента: JP2006010572A. Автор: Shinichiro Nakatani,信一郎 中谷. Владелец: Sharp Corp. Дата публикации: 2006-01-12.

Method of changing the arrangement of electronic components

Номер патента: TWI653703B. Автор: 鄭博文,蔡志豪,陳贊仁,偉宗 黃. Владелец: 東捷科技股份有限公司. Дата публикации: 2019-03-11.

Method of mounting lead terminal in electronic component

Номер патента: JPS6139513A. Автор: 金田　忠士,敏之 福田. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1986-02-25.

Method of attaching external electrode for electronic components

Номер патента: JPS54103536A. Автор: Yoshiharu Katou,Ichirou Nozaki. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 1979-08-15.

Method of bonding dam frame to electronic component mounting board, dam frame bonding device

Номер патента: JP3014834B2. Автор: 徹 野原,和則 星田. Владелец: Ibiden Co Ltd. Дата публикации: 2000-02-28.

ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT PACKAGE SEALING MEMBER

Номер патента: US20120055708A1. Автор: . Владелец: DAISHINKU CORPORATION. Дата публикации: 2012-03-08.

Electronic component supply device, electronic component mounting device, and control method for electronic component supply device

Номер патента: CN107635393B. Автор: 佐藤纪昭. Владелец: Juki Corp. Дата публикации: 2020-12-29.

METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS

Номер патента: US20120075509A1. Автор: Suzuki Ryoji,Natori Taichi,ITO Tomomi. Владелец: SONY CORPORATION. Дата публикации: 2012-03-29.

METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS

Номер патента: US20120146173A1. Автор: Ohta Kazuo,Yoshihara Ikuo. Владелец: SONY CORPORATION. Дата публикации: 2012-06-14.

METHOD OF MANUFACTURING SOLID-STATE IMAGING ELEMENT, SOLID-STATE IMAGING ELEMENT AND ELECTRONIC APPARATUS

Номер патента: US20120217606A1. Автор: Itonaga Kazuichiro. Владелец: SONY CORPORATION. Дата публикации: 2012-08-30.

Ceramic substrate for thin film electronic component, manufacturing method thereof, and thin film electronic component using the same

Номер патента: JP4668577B2. Автор: 学 佐藤,淳 大塚,星児 一▲柳▼. Владелец: NGK Spark Plug Co Ltd. Дата публикации: 2011-04-13.

Method for searching region of interest of electronic component, defect inspection method and device of electronic component using the searching method conducting image binarization on inspection items

Номер патента: TW201702584A. Автор: Bo-Zheng Yu,zi-chen Lin. Владелец: All Ring Tech Co Ltd. Дата публикации: 2017-01-16.

Surface mount electronic component and method for manufacturing surface mount electronic component

Номер патента: JP4798539B2. Автор: 巌 三浦,幸彦 白川,清久 鈴木,仁 工藤. Владелец: TDK Corp. Дата публикации: 2011-10-19.

Method for manufacturing multilayer unit for multilayer ceramic electronic component and multilayer unit for multilayer ceramic electronic component

Номер патента: JP3921454B2. Автор: 佐藤　　茂樹,晃 山口. Владелец: TDK Corp. Дата публикации: 2007-05-30.

Electronic component case and sensor device using the electronic component case

Номер патента: JP5697253B2. Автор: 泰治 菅原,聡 麻山. Владелец: Alps Electric Co Ltd. Дата публикации: 2015-04-08.

Electronic component mounting apparatus, mounting system, and electronic component mounting method

Номер патента: JP4186562B2. Автор: 洋一 中村,博 那須. Владелец: Panasonic Corp. Дата публикации: 2008-11-26.

Electronic component irregular portion detection device and electronic component irregular portion detection method

Номер патента: JP2016090451A. Автор: Takeshi Inao,健 稲男. Владелец: Murata Manufacturing Co Ltd. Дата публикации: 2016-05-23.

Electronic component supply apparatus and supply method in electronic component insertion machine

Номер патента: JP3315830B2. Автор: 厚志 青柳,譲司 永石,克美 上野. Владелец: Citizen Watch Co Ltd. Дата публикации: 2002-08-19.

Supply container for electronic components and method and apparatus for supplying electronic components using the same

Номер патента: JP3409571B2. Автор: 真一 中村. Владелец: Seiko Epson Corp. Дата публикации: 2003-05-26.

Method for evaluating electronic component using semiconductor and method for managing electronic component using semiconductor

Номер патента: JP4505634B2. Автор: 忠弘 大見,章伸 寺本,一史 渡辺,浩史 赤堀. Владелец: Tohoku University NUC. Дата публикации: 2010-07-21.

Terminal of rechargeable battery, method of assembling the terminal of rechargeable battery, rechargeable battery module and method of assembling the rechargeable battery module

Номер патента: US20120121966A1. Автор: Kim Dukjung. Владелец: . Дата публикации: 2012-05-17.

Electronic component storage package, electronic device, and electronic device mounted device

Номер патента: JP4854469B2. Автор: 善友 鬼塚. Владелец: Kyocera Corp. Дата публикации: 2012-01-18.

Electronic component mounting substrate, electronic device and electronic module

Номер патента: JP6595308B2. Автор: 陽介 森山,晃一 川崎. Владелец: Kyocera Corp. Дата публикации: 2019-10-23.

Alignment method of materials, manufacturing method of electronic device, film-forming device, electro-optic device, electronic device, and electronic apparatus

Номер патента: JP2003243165A. Автор: Takashi Miyazawa,貴士 宮澤. Владелец: Seiko Epson Corp. Дата публикации: 2003-08-29.

Optical device, manufacturing method of optical device, wavelength variable filter, wavelength variable filter module and optical spectrum analyzer

Номер патента: JP2008116669A. Автор: Ryosuke Nakamura,亮介 中村. Владелец: Seiko Epson Corp. Дата публикации: 2008-05-22.

Setting, computing method of Chinese medicine multi-component PK-PD combined mathematical module and software fit

Номер патента: CN101046831A. Автор: 黄坚,王新宏,陈少清,安叡,陈长功. Владелец: Shanghai University of Traditional Chinese Medicine. Дата публикации: 2007-10-03.

Method of generating three-phase inverter control pulseswith pulse width modulation and circuit arrangement therefor

Номер патента: PL265195A1. Автор: . Владелец: . Дата публикации: 1988-11-10.

METHOD OF PREPARING THIN FILM, THIN FILM, APPARATUS FOR PREPARING THIN FILM, AND ELECTRONIC DEVICE INCLUDING THIN FILM

Номер патента: US20130034708A1. Автор: LEE Sang-Yoon,SEON Jong-Baek,RYU Myung-kwan. Владелец: . Дата публикации: 2013-02-07.

Apparatus for and method of manufacturing electronic components

Номер патента: SG143196A1. Автор: Masayuki Yamamoto,Satoru Uebayashi,Shingo Hinatsu. Владелец: Towa Corp. Дата публикации: 2008-06-27.

Method of manufacturing printed circuit board having flow preventing dam

Номер патента: US20120000067A1. Автор: CHOI Jin Won,KIM Seung Wan. Владелец: SAMSUNG ELLECTRO-MECHANICS CO., LTD.. Дата публикации: 2012-01-05.

SEPARATOR FOR AN ELECTRICITY STORAGE DEVICE AND METHOD OF MANUFACTURING SAME

Номер патента: US20120003525A1. Автор: . Владелец: TOMOEGAWA CO., LTD.. Дата публикации: 2012-01-05.

METHOD OF CONTINUOUSLY PRODUCING ELECTRONIC FILM COMPONENTS

Номер патента: US20120000065A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

PHOTOELECTRIC CONVERSION DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120000518A1. Автор: Tokioka Hidetada,ORITA Tae,YAMARIN Hiroya. Владелец: Mitsubishi Electric Corporation. Дата публикации: 2012-01-05.

UNDERSIDE PROTECTIVE SHEET FOR SOLAR CELL, SOLAR CELL MODULE, AND GAS-BARRIER FILM

Номер патента: US20120000527A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

PHOTOVOLTAIC MODULE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120000506A1. Автор: Kim Dong-Jin,KANG Ku-Hyun,NAM Yuk-Hyun,Lee Jung-Eun. Владелец: . Дата публикации: 2012-01-05.

LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM

Номер патента: US20120001196A1. Автор: CHOI Kwang Ki,JEONG Hwan Hee,MOON Ji hyung,LEE Sang Youl,SONG June O,JUNG Se Yeon,SEONG Tae Yeon. Владелец: LG INNOTEK CO., LTD.. Дата публикации: 2012-01-05.

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120001308A1. Автор: FUKUTANI Keita,NISHIHATA Masayoshi,Mamitsu Kuniaki,Ookura Yasushi,Wado Hiroyuki,Sugiura Syun. Владелец: Denso Corporation. Дата публикации: 2012-01-05.

METHOD OF MANUFACTURING SEMICONDUCTOR MODULES AND SEMICONDUCTOR MODULE

Номер патента: US20120001349A1. Автор: Suzuki Yoshikazu,KANEKO Takahisa,HARADA Daisuke,ISHIYAMA Hiroshi. Владелец: . Дата публикации: 2012-01-05.

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120001544A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

Optical Module, and Optical Printed Circuit Board and Method of Manufacturing the Same

Номер патента: US20120002916A1. Автор: . Владелец: LG Innoteck Co., LTD.. Дата публикации: 2012-01-05.

Methods of manufacturing semiconductor devices with Si and SiGe epitaxial layers

Номер патента: US20120003799A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

MOLDED ELASTOMERIC FLEXURAL ELEMENTS FOR USE IN A LASER SCANNING ASSEMBLIES AND SCANNERS, AND METHODS OF MANUFACTURING, TUNING AND ADJUSTING THE SAME

Номер патента: US20120002259A1. Автор: Plesko George. Владелец: . Дата публикации: 2012-01-05.

MEMORY SYSTEM, MEMORY TEST SYSTEM AND METHOD OF TESTING MEMORY SYSTEM AND MEMORY TEST SYSTEM

Номер патента: US20120002495A1. Автор: SUH Sung-Dong,HA Kyoung-Ho,Song Ki-Jae,KIM Seong-gu,JOE In-sung,Cho Soo-Haeng,Kim Yeoung-kum. Владелец: . Дата публикации: 2012-01-05.

METHOD OF MANUFACTURING CRYSTALLINE SILICON SOLAR CELLS USING EPITAXIAL DEPOSITION

Номер патента: US20120000511A1. Автор: . Владелец: Applied Materials, Inc.. Дата публикации: 2012-01-05.

Method of spatial mini module manufacturing for radio electronic devices

Номер патента: RU2336595C2. Автор: Александр Иванович Завадский. Владелец: Александр Иванович Завадский. Дата публикации: 2008-10-20.

Method of determining gold in wastes from manufacturing electronic components

Номер патента: RU2464546C1. Автор: Светлана Ивановна Усенко. Владелец: Федеральное государственное унитарное предприятие "Российский Федеральный ядерный центр - Всероссийский научно-исследовательский институт экспериментальной физики" - ФГУП "РФЯЦ-ВНИИЭФ". Дата публикации: 2012-10-20.

SYSTEM AND METHOD OF ILLUMINATING INTERFEROMETRIC MODULATORS USING BACKLIGHTING

Номер патента: US20120001962A1. Автор: Tung Ming-Hau,Chui Clarence. Владелец: QUALCOMM MEMS Technologies, Inc.. Дата публикации: 2012-01-05.

SEMICONDUCTOR DEVICE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR MODULE AND ELECTRONIC SYSTEM INCLUDING THE SEMICONDUCTOR DEVICE

Номер патента: US20120001272A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

Method of manufacture of electrolytic cell for treatment of parts from hangers

Номер патента: RU2165480C1. Автор: А.Н. Алексеев. Владелец: Алексеев Андрей Николаевич. Дата публикации: 2001-04-20.

Method of batch production of gas-turbine engine, and gas-turbine engine made by means of this method

Номер патента: RU2551013C1. Автор: Дмитрий Юрьевич Еричев,Николай Павлович Селиванов,Евгений Ювенальевич Марчуков,Виктор Викторович Куприк,Владимир Валентинович Кирюхин,Ирик Усманович Манапов,Сергей Анатольевич Симонов,Юрий Геннадьевич Шабаев,Игорь Александрович Кондрашов,Александр Викторович Артюхов,Дмитрий Алексеевич Мовмыга. Владелец: Открытое Акционерное Общество "Уфимское Моторостроительное Производственное Объединение" (Оао "Умпо"). Дата публикации: 2015-05-20.

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Номер патента: US20120003795A1. Автор: . Владелец: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.. Дата публикации: 2012-01-05.

DIELECTRIC CERAMIC, METHOD FOR PRODUCING DIELECTRIC CERAMIC, AND ELECTRONIC COMPONENT

Номер патента: US20120004090A1. Автор: Nakano Takahiro,SAKURAI Toshio,ARASHI Tomohiro,KOBUKE Hisashi,NAKAMURA Tomoko,MIYAUCHI Yasuharu. Владелец: TDK Corporation. Дата публикации: 2012-01-05.

SYNTHETIC RESIN CAP AND METHOD OF MANUFACTURING SYNTHETIC RESIN CAP

Номер патента: US20120000881A1. Автор: SUDO Nobuo. Владелец: DAIKYO SEIKO, LTD.. Дата публикации: 2012-01-05.

STAMPER, METHOD OF MANUFACTURING THE STAMPER, AND MAGNETIC RECORDING MEDIUM MANUFACTURING METHOD USING THE STAMPER

Номер патента: US20120000885A1. Автор: . Владелец: KABUSHIKI KAISHA TOSHIBA. Дата публикации: 2012-01-05.

Manufacturing Method of Electrode Material

Номер патента: US20120001120A1. Автор: Yamakaji Masaki,Miwa Takuya. Владелец: . Дата публикации: 2012-01-05.

Antireflective Coatings for Via Fill and Photolithography Applications and Methods of Preparation Thereof

Номер патента: US20120001135A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

ORGANIC EL DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120001186A1. Автор: ONO Shinya,KONDOH Tetsuro. Владелец: Panasonic Corporation. Дата публикации: 2012-01-05.

GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME, AND LAMP

Номер патента: US20120001220A1. Автор: . Владелец: SHOWA DENKO K.K.. Дата публикации: 2012-01-05.

System For Monitoring Foreign Particles, Process Processing Apparatus And Method Of Electronic Commerce

Номер патента: US20120002196A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

BATTERY MANUFACTURING METHOD, BATTERY MANUFACTURED BY SUCH METHOD, VEHICLE AND ELECTRONIC DEVICE

Номер патента: US20120002359A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

MAGNETIC RECORDING MEDIUM AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120003503A1. Автор: . Владелец: FUJIFILM Corporation. Дата публикации: 2012-01-05.

METHOD OF MANUFACTURING POSITIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM ION BATTERY, POSITIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM ION BATTERY, ELECTRODE FOR LITHIUM ION BATTERY, AND LITHIUM ION BATTERY

Номер патента: US20120003540A1. Автор: Nakano Masatsugu,YAMAZAKI Akinori. Владелец: Sumitomo Osaka Cement Co., Ltd.. Дата публикации: 2012-01-05.

Manufacturing Method of Semiconductor Film, Manufacturing Method of Semiconductor Device, and Manufacturing Method of Photoelectric Conversion Device

Номер патента: US20120003787A1. Автор: TANAKA Tetsuhiro,KATO Erika. Владелец: . Дата публикации: 2012-01-05.

METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE

Номер патента: US20120003812A1. Автор: Sasaki Makoto,NISHIGUCHI Taro,HARADA Shin,Okita Kyoko,Namikawa Yasuo. Владелец: Sumitomo Electric Industries, Ltd.. Дата публикации: 2012-01-05.

Method of manufacture of bath for jet washing of parts, such as plates, printed circuit boards in particular

Номер патента: RU2166005C1. Автор: А.Н. Алексеев. Владелец: Алексеев Андрей Николаевич. Дата публикации: 2001-04-27.

ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120001182A1. Автор: Choi Jong-Hyun,Lee Dae-Woo. Владелец: Samsung Mobile Display Co., Ltd.. Дата публикации: 2012-01-05.

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREFOR

Номер патента: US20120001244A1. Автор: Yamazaki Shunpei,KOYAMA Jun,MURAKAMI Satoshi,Tanaka Yukio,KITAKADO Hidehito. Владелец: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.. Дата публикации: 2012-01-05.

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120001257A1. Автор: MURAKAWA Kouichi. Владелец: RENESAS ELECTRONICS CORPORATION. Дата публикации: 2012-01-05.

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SOLID-STATE IMAGE SENSOR

Номер патента: US20120001291A1. Автор: Kokumai Kazuo. Владелец: CANON KABUSHIKI KAISHA. Дата публикации: 2012-01-05.

Method of Manufacturing Vertical Pin Diodes

Номер патента: US20120001305A1. Автор: Peroni Marco,Pantellini Alessio. Владелец: SELEX SISTEMI INTEGRATI S.P.A.. Дата публикации: 2012-01-05.

PIEZORESISTIVE DEVICE, METHOD OF MANUFACTURING THE SAME AND PIEZORESISTIVE-TYPE TOUCH PANEL HAVING THE SAME

Номер патента: US20120001870A1. Автор: LEE Kang Won,Lee Seung Seob. Владелец: . Дата публикации: 2012-01-05.

COORDINATE INPUT APPARATUS, LIGHT RECEIVING APPARATUS OF THE COORDINATE INPUT APPARATUS, AND MANUFACTURING METHOD OF THE SAME

Номер патента: US20120002217A1. Автор: Kobayashi Katsuyuki,Yoshimura Yuichiro. Владелец: CANON KABUSHIKI KAISHA. Дата публикации: 2012-01-05.

Perpendicular Magnetic Write head and method of manufacturing the same

Номер патента: US20120002326A1. Автор: Matono Naoto,SASAKI Kenji,Mino Tetsuya,Onodera Ikuhito,Nishiyama Kazushi,Tsuchiya Michitoshi. Владелец: SAE Magnetics (H.K.) Ltd.. Дата публикации: 2012-01-05.

ELECTROPHOTOGRAPHY PHOTORECEPTOR, METHOD OF MANUFACTURING THE SAME, AND ELECTROPHOTOGRAPHY DEVICE USING THE SAME

Номер патента: US20120003574A1. Автор: Tanaka Yasushi,Nakamura Yoichi,Kitagawa Seizo,EMORI Hiroshi,Ichiyanagi Hiroyuki. Владелец: FUJI ELECTRIC SYSTEMS CO., LTD.. Дата публикации: 2012-01-05.

METHOD OF MANUFACTURING WAX-CONTAINING POLYMER PARTICLES

Номер патента: US20120003581A1. Автор: Yang Xiqiang,Bennett James R.. Владелец: . Дата публикации: 2012-01-05.

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME

Номер патента: US20120003828A1. Автор: Chang Sung-Il,Choe Byeong-In,KANG Changseok. Владелец: . Дата публикации: 2012-01-05.

METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Номер патента: US20120003841A1. Автор: . Владелец: ULVAC, INC.. Дата публикации: 2012-01-05.

METHOD OF STRETCHING ORGANIC PIEZOELECTRIC MATERIAL, METHOD OF MANUFACTURING ORGANIC PIEZOELECTRIC MATERIAL, ULTRASONIC TRANSDUCER, ULTRASONIC WAVE PROBE AND ULTRASONIC WAVE MEDICAL IMAGE DIAGNOSIS DEVICE

Номер патента: US20120004555A1. Автор: . Владелец: Konica Minolta Medical & Graphic, Inc.. Дата публикации: 2012-01-05.

Method of manufacturing nickel powder, apparatus for manufacturing nickel powder, and crucible for manufacturing nickel powder

Номер патента: CA2503994A1. Автор: Makoto Takahashi,Kazuhiko Oda,Shuichi Miura,Kouji Tanaka,Tetsuji Maruno,Kazuya Miura. Владелец: TDK Corp. Дата публикации: 2005-10-16.

SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME, RADIOLOGICAL IMAGING APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF TESTING SOLID-STATE IMAGING DEVICE

Номер патента: US20120001081A1. Автор: . Владелец: HAMAMATSU PHOTONICS K.K.. Дата публикации: 2012-01-05.

ARRAY SUBSTRATE, METHOD OF MANUFACTURING THE ARRAY SUBSTRATE, AND DISPLAY APPARATUS INCLUDING THE ARRAY SUBSTRATE

Номер патента: US20120001191A1. Автор: . Владелец: Samsung Mobile Display Co., Ltd.. Дата публикации: 2012-01-05.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WHICH A PLURALITY OF TYPES OF TRANSISTORS ARE MOUNTED

Номер патента: US20120001265A1. Автор: . Владелец: FUJITSU SEMICONDUCTOR LIMITED. Дата публикации: 2012-01-05.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Номер патента: US20120001300A1. Автор: Ito Takayuki,ISHIDA Tatsuya,Yoshino Kenichi,Naito Tatsuya. Владелец: KABUSHIKI KAISHA TOSHIBA. Дата публикации: 2012-01-05.

STATOR FOR ELECTRIC ROTATING MACHINE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120001516A1. Автор: . Владелец: Denso Corporation. Дата публикации: 2012-01-05.

OPTICAL WAVEGUIDE DEVICE AND METHOD OF MANUFACTURING THEREOF

Номер патента: US20120002931A1. Автор: Watanabe Shinya. Владелец: NEC Corporation. Дата публикации: 2012-01-05.

VIRUS LIKE PARTICLE COMPOSITIONS AND METHODS OF USE

Номер патента: US20120003266A1. Автор: . Владелец: The United States of America,as represented by The Secretary, National Institues of Health. Дата публикации: 2012-01-05.

MANURACTURING METHOD OF EGG WITH EDIBLE COMPOSITION

Номер патента: US20120003368A1. Автор: LEE Hye-Jin. Владелец: . Дата публикации: 2012-01-05.

METHOD OF MANUFACTURING OPTICAL WAVEGUIDE

Номер патента: US20120003385A1. Автор: Naito Ryusuke. Владелец: NITTO DENKO CORPORATION. Дата публикации: 2012-01-05.

Field emission electrode, method of manufacturing the same, and field emission device comprising the same

Номер патента: US20120003895A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

Method of manufacture of the construction product made out of the foamed concrete and the formwork for the method realization

Номер патента: RU2302943C1. Автор: Михаил Юрьевич Слесарев,Елена Анатольевна Король,Валерий Иванович Теличенко. Владелец: Московский государственный строительный университет. Дата публикации: 2007-07-20.

Method of manufacturing composite parts

Номер патента: US20120000597A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120000697A1. Автор: KIM Kwang Soo,Choi Seog Moon,PARK Sung Keun,Lim Chang Hyun,KANG Jung Eun. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2012-01-05.

METHODS OF ARC DETECTION AND SUPPRESSION DURING RF SPUTTERING OF A THIN FILM ON A SUBSTRATE

Номер патента: US20120000765A1. Автор: Halloran Sean Timothy. Владелец: PRIMESTAR SOLAR, INC.. Дата публикации: 2012-01-05.

Knuckle Formed Through The Use Of Improved External and Internal Sand Cores and Method of Manufacture

Номер патента: US20120000877A1. Автор: Smerecky Jerry R.,Nibouar F. Andrew,SMITH Douglas. Владелец: . Дата публикации: 2012-01-05.

SOLID-STATE IMAGING DEVICE MANUFACTURING METHOD, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS

Номер патента: US20120001290A1. Автор: Sawada Ken. Владелец: SONY CORPORATION. Дата публикации: 2012-01-05.

PACKAGE FOR SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE

Номер патента: US20120001312A1. Автор: . Владелец: Panasonic Corporation. Дата публикации: 2012-01-05.

THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120001345A1. Автор: Hwang Kihyun,YANG Junkyu,Choi Hanmei,Park ChanJin,Min Gyungjin,Yoo Dongchul,Kong Yoochul. Владелец: . Дата публикации: 2012-01-05.

FLAT PANEL DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120001534A1. Автор: KIM Tae-Woong. Владелец: . Дата публикации: 2012-01-05.

SOLID ELECTROLYTIC CAPACITOR WITH SMALL LEAKAGE CURRENT AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120002350A1. Автор: Suzuki Satoshi,NOBUTA Tomoki,TAKAHASHI Naoki,Nishiyama Toshihiko,Kobayakawa Ryuta. Владелец: NEC TOKlN CORPORATION. Дата публикации: 2012-01-05.

WAVELENGTH MULTIPLEXER/DEMULTIPLEXER AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120002918A1. Автор: . Владелец: FURUKAWA ELECTRIC CO., LTD.. Дата публикации: 2012-01-05.

Бесплатный поиск патентной информации. Построение патентных ландшафтов и отчетов.

Главная
Проекты и услуги
Контакты

© 2021-2022 - All Rights Reserved - разработано Ecoruspace.me.