Three-dimensional memory structure with multi-component contact via structure and method of making thereof

04-07-2017 дата публикации

Номер:

US09698152B2

Автор: Jayavel Pachamuthu, Johann Alsmeier, Matthias Baenninger, Raghuveer S. Makala, Rahul Sharangpani, Sateesh KOKA, Somesh Peri

Принадлежит: SanDisk Technologies LLC

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/2 H01L21/28 H01L21/285 H01L21/2851 H01L21/28512 H01L21/2856 H01L21/28562 H01L21/28568 H01L21/7 H01L21/76 H01L21/768 H01L21/7687 H01L21/76877 H01L23 H01L23/H01L23/5 H01L23/53 H01L23/532 H01L23/5326 H01L23/53266 H01L27 H01L27/H01L27/1 H01L27/11 H01L27/115 H01L27/1157 H01L27/1158 H01L27/11582 H01L29 H01L29/H01L29/6 H01L29/66 H01L29/665 H01L29/6655 H01L29/66553 H01L29/7 H01L29/78 H1 H10 H10B H10B4 H10B43 H10B43/H10B43/2 H10B43/27 H10B43/3 H10B43/35

IPC - классификация

H H0 H01 H01L H01L2 H01L27 H01L27/H01L27/1 H01L27/11 H01L27/110 H01L27/1104 H01L27/115 H01L27/1158 H01L27/11582

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