Semiconductor bond pad structures and methods of manufacturing thereof

02-01-2007 дата публикации

Номер:

US7157734B2

Автор: Pei-Haw Tsao, Chender Huang, Shang-Yu Hou, Chao-Yuan Su, Chia-Hsiung Hsu

Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L22/H01L22/3 H01L22/32 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/04 H01L2224/040 H01L2224/0404 H01L2224/04042 H01L2224/05 H01L2224/050 H01L2224/0509 H01L2224/05093 H01L2224/05096 H01L2224/055 H01L2224/0555 H01L2224/05554 H01L2224/05556 H01L2224/056 H01L2224/0562 H01L2224/05624 H01L2224/0564 H01L2224/05644 H01L2224/05647 H01L2224/4 H01L2224/45 H01L2224/451 H01L2224/4512 H01L2224/45124 H01L2224/4514 H01L2224/45144 H01L2224/45147 H01L2224/48 H01L2224/480 H01L2224/4807 H01L2224/4809 H01L2224/48091 H01L2224/484 H01L2224/4845 H01L2224/48453 H01L2224/4846 H01L2224/48463 H01L2224/486 H01L2224/4862 H01L2224/48624 H01L2224/4864 H01L2224/48644 H01L2224/48647 H01L2224/487 H01L2224/4872 H01L2224/48724 H01L2224/4874 H01L2224/48747 H01L2224/488 H01L2224/4884 H01L2224/48844 H01L2224/48847 H01L2224/8 H01L2224/85 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/4 H01L24/45 H01L24/48 H01L24/8 H01L24/85 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00014 H01L2924/01 H01L2924/010 H01L2924/0100 H01L2924/01006 H01L2924/0101 H01L2924/01013 H01L2924/01014 H01L2924/0102 H01L2924/01029 H01L2924/0103 H01L2924/01033 H01L2924/0107 H01L2924/01074 H01L2924/01079 H01L2924/0108 H01L2924/01082 H01L2924/014 H01L2924/05 H01L2924/050 H01L2924/0504 H01L2924/05042 H01L2924/1 H01L2924/10 H01L2924/101 H01L2924/1016 H01L2924/10161 H01L2924/14 H01L2924/19 H01L2924/190 H01L2924/1904 H01L2924/19041

Получить PDF