Burn-in board with adaptable heat sink device
Номер патента: IE980828A1
Опубликовано: 07-04-1999
Автор(ы): James E Johnson, Ronald J. Darcy
Принадлежит: Reliability Inc
Опубликовано: 07-04-1999
Автор(ы): James E Johnson, Ronald J. Darcy
Принадлежит: Reliability Inc
Реферат: A system and method for burning-in an integrated circuit comprises a socket capable of receiving and supporting the IC, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. A first thermal interface provides releasable thermal contact between the integrated circuit in the socket and a resiliently mounted heat absorbing member. A second thermal interface is provided between the heat absorbing member and the heat sink. <Figure 1>.
Burn in board, system, and method
Номер патента: US20130300444A1. Автор: Kin Sun Wong,Che Chin Wu. Владелец: Macronix International Co Ltd. Дата публикации: 2013-11-14.