Россия, г. Королев.

eburdiyg@gmail.com

8 (903) 781-84-63

  • Главная
  • Methods of forming an abrasive slurry and methods for chemical-mechanical polishing

Methods of forming an abrasive slurry and methods for chemical-mechanical polishing

Номер патента: US10937691B2
Опубликовано: 02-03-2021
Автор(ы): Chi-hsiang Shen, Chi-Jen Liu, Chia Hsuan Lee, Chia-Wei Ho, Chun-Wei Hsu, Jian-Ci Lin, Kei-Wei Chen, Kuo-Hsiu Wei, Li-Chieh Wu, Liang-Guang Chen, Yang-chun Cheng, Yi-Sheng Lin
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd
Получить PDF файл: Открыть в новом окне

Вам могут быть интересны следующие патенты

Рисунок 1. Взаимосвязь патентов (ближайшие 20).

Chemical mechanical polishing method and method for fabricating semiconductor device using the same

Номер патента: US20230352310A1. Автор: Sang Kyun Kim,Hyo San LEE,In Kwon Kim,Yearin BYUN. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-11-02.

Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing

Номер патента: US20220384245A1. Автор: Chia Hsuan Lee,Chun-Wei Hsu,Chia-Wei Ho,Chi-hsiang Shen,Li-Chieh Wu,Jian-Ci Lin,Chi-Jen Liu,Yi-Sheng Lin,Yang-chun Cheng,Liang-Guang Chen,Kuo-Hsiu Wei,Kei-Wei Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2022-12-01.

Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing

Номер патента: US20210183688A1. Автор: Hsu Chun-Wei,LIN YI-SHENG,Wu Li-Chieh,Liu Chi-Jen,Chen Liang-Guang,Chen Kei-Wei,Lee Chia Hsuan,Ho Chia-Wei,Shen Chi-Hsiang,Lin Jian-Ci,Cheng Yang-Chun,Wei Kuo-Hsiu. Владелец: . Дата публикации: 2021-06-17.

Methods of forming an abrasive slurry and methods for chemical- mechanical polishing

Номер патента: US11482450B2. Автор: Chia Hsuan Lee,Chun-Wei Hsu,Chia-Wei Ho,Chi-hsiang Shen,Li-Chieh Wu,Jian-Ci Lin,Chi-Jen Liu,Yi-Sheng Lin,Yang-chun Cheng,Liang-Guang Chen,Kuo-Hsiu Wei,Kei-Wei Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2022-10-25.

METHODS OF FORMING AN ABRASIVE SLURRY AND METHODS FOR CHEMICAL-MECHANICAL POLISHING

Номер патента: US20200105580A1. Автор: Hsu Chun-Wei,LIN YI-SHENG,Wu Li-Chieh,Liu Chi-Jen,Chen Liang-Guang,Chen Kei-Wei,Lee Chia Hsuan,Ho Chia-Wei,Shen Chi-Hsiang,Lin Jian-Ci,Cheng Yang-Chun,Wei Kuo-Hsiu. Владелец: . Дата публикации: 2020-04-02.

Composition for chemical-mechanical polishing and chemical-mechanical polishing method

Номер патента: US12104087B2. Автор: Pengyu Wang,Yasutaka Kamei,Norihiko Sugie,Yuuya YAMADA. Владелец: JSR Corp. Дата публикации: 2024-10-01.

Chemical mechanical polishing composition and polishing method

Номер патента: US20240254365A1. Автор: Yasutaka Kamei,Kohei Nishimura,Koki Ishimaki,Shuhei Nakamura. Владелец: JSR Corp. Дата публикации: 2024-08-01.

Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate

Номер патента: US11718769B2. Автор: Yi Guo. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-08-08.

PROCESS FOR MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING CHEMICAL MECHANICAL POLISHING OF ELEMENTAL GERMANIUM AND/OR Si1-x Gex MATERIAL IN PRESENCE OF CMP (CHEMICAL MECHANICAL POLISHING) COMPOSITION COMPRISING A SPECIFIC ORGANIC COMPOUND

Номер патента: RU2605941C2. Автор: Бастиан Мартен НОЛЛЕР,Южуо ЛИ,Беттина ДРЕШЕР,Кристоф ЖИЛЛО. Владелец: БАСФ СЕ. Дата публикации: 2016-12-27.

Polishing liquid and chemical mechanical polishing method

Номер патента: US12006446B2. Автор: Tetsuya Kamimura. Владелец: Fujifilm Corp. Дата публикации: 2024-06-11.

Aqueous polishing composition and method for chemical-mechanical polishing of substrates, having structured or unstructured dielectric layers with low dielectric constant

Номер патента: RU2589482C2. Автор: Виджай Иммануэль РАМАН,Франк РИТТИГ,Юйчжо ЛИ,Вей Лан Уильям ЧИУ. Владелец: БАСФ СЕ. Дата публикации: 2016-07-10.

Cerium oxide particles, chemical mechanical polishing slurry composition comprising same, and method for manufacturing semiconductor device

Номер патента: US20230348753A1. Автор: Jeong Ho Lee,Seok Joo Kim. Владелец: Soulbrain Co Ltd. Дата публикации: 2023-11-02.

Chemical-mechanical polishing composition and chemical-mechanical polishing method using the same

Номер патента: US20240263039A1. Автор: Hiroshi Kitamura,Tsuyoshi Masuda,Yoshiyuki Matsumura,Akihisa NAMIKI. Владелец: Entegris Inc. Дата публикации: 2024-08-08.

Suspension for chemical mechanical planarization (cmp) and method employing the same

Номер патента: EP4314179A1. Автор: Sridevi R. ALETY,Mark CYFFKA,Niraj Mahadev. Владелец: Entegris Inc. Дата публикации: 2024-02-07.

Chemical-mechanical polishing (cmp) composition comprising benzotriazole derivatives as corrosion inhibitors

Номер патента: RU2669598C2. Автор: Южуо ЛИ,Роберт РАЙХАРДТ,Мартин КАЛЛЕР,Михаэль ЛАУТЕР,Андреас КЛИПП. Владелец: БАСФ СЕ. Дата публикации: 2018-10-12.

Cerium oxide particle, method for producing the same, chemical-mechanical polishing slurry composition comprising the same and method of manufacturing semiconductor devices

Номер патента: TW202212262A. Автор: 金錫主,李正浩. Владелец: 南韓商秀博瑞殷股份有限公司. Дата публикации: 2022-04-01.

Method of chemical-mechanical polishing of thick layers of cobalt-containing alloys

Номер патента: RU2687649C2. Автор: Валентина Александровна Гайдедей. Владелец: Общество с ограниченной ответственностью "КРОКУС НАНОЭЛЕКТРОНИКА". Дата публикации: 2019-05-15.

Methods for chemical mechanical polishing and forming interconnect structure

Номер патента: US12002684B2. Автор: Chi-hsiang Shen,Li-Chieh Wu,Chi-Jen Liu,Liang-Guang Chen,Kei-Wei Chen,Ji Cui,Ting-Hsun CHANG,Chun-Chieh Lin,Tang-Kuei Chang,Fu-Ming HUANG,Ting-Kui CHANG,Hung Yen,Wei-Wei Liang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-06-04.

Methods for chemical mechanical polishing and forming interconnect structure

Номер патента: US20240290629A1. Автор: Chi-hsiang Shen,Li-Chieh Wu,Chi-Jen Liu,Liang-Guang Chen,Kei-Wei Chen,Ji Cui,Ting-Hsun CHANG,Chun-Chieh Lin,Tang-Kuei Chang,Fu-Ming HUANG,Ting-Kui CHANG,Hung Yen,Wei-Wei Liang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-08-29.

Methods for chemical mechanical polishing and forming interconnect structure

Номер патента: US20230082084A1. Автор: Chi-hsiang Shen,Li-Chieh Wu,Chi-Jen Liu,Liang-Guang Chen,Kei-Wei Chen,Ji Cui,Ting-Hsun CHANG,Chun-Chieh Lin,Tang-Kuei Chang,Fu-Ming HUANG,Ting-Kui CHANG,Hung Yen,Wei-Wei Liang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-03-16.

Methods for chemical mechanical polishing and forming interconnect structure

Номер патента: US20210391186A1. Автор: Chi-hsiang Shen,Li-Chieh Wu,Chi-Jen Liu,Liang-Guang Chen,Kei-Wei Chen,Ji Cui,Ting-Hsun CHANG,Chun-Chieh Lin,Tang-Kuei Chang,Fu-Ming HUANG,Ting-Kui CHANG,Hung Yen,Wei-Wei Liang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2021-12-16.

Slurry Compositions For Chemical Mechanical Planarization

Номер патента: US20230058800A1. Автор: Teng-Chun Tsai,Chun-Hung LIAO,An-Hsuan Lee,Shen-Nan Lee,Chen-Hao WU,Huang-Lin Chao. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-02-23.

Chemical mechanical polishing (cmp) slurry, semiconductor structure, and manufacturing method of semiconductor structure

Номер патента: US20230057872A1. Автор: Chang-Yi Tsai. Владелец: Changxin Memory Technologies Inc. Дата публикации: 2023-02-23.

Economical and environmentally friendly chemical mechanical polishing for III-V compound semiconductor device fabrication

Номер патента: US09601482B1. Автор: Alexander Reznicek,Devendra K. Sadana,Keith E. Fogel,Charan V. Surisetty. Владелец: International Business Machines Corp. Дата публикации: 2017-03-21.

Method of increasing resistivity of silicon carbide wafer and high-frequency device and method of manufacturing the same

Номер патента: US20230207386A1. Автор: Mao-Nan Chang,Ta-Ching HSIAO,Kuo-Lun Huang,Pei-Ying Chen. Владелец: Industrial Technology Research Institute ITRI. Дата публикации: 2023-06-29.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: US20090124172A1. Автор: Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi,Gaku Minamihara. Владелец: JSR Corp. Дата публикации: 2009-05-14.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: EP2006890A4. Автор: Gaku Minamihaba,Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi. Владелец: JSR Corp. Дата публикации: 2011-02-16.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: KR101330960B1. Автор: 히로유끼 야노,가꾸 미나미하바,가즈히또 우찌꾸라,히로따까 시다,유우이찌 하시구찌,다이 후꾸시마,요시꾸니 다떼야마. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2013-11-18.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: US20110250756A1. Автор: Gaku Minamihaba,Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi. Владелец: JSR Corp. Дата публикации: 2011-10-13.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: TW200801168A. Автор: Yano Hiroyuki,Gaku Minamihaba,Dai Fukushima,Hirotaka Shida,Kazuhito Uchikura,TATEYAMA Yoshikuni,Yuuichi Hashiguchi. Владелец: Toshiba Kk. Дата публикации: 2008-01-01.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: EP2006890A2. Автор: Gaku Minamihaba,Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi. Владелец: JSR Corp. Дата публикации: 2008-12-24.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: EP2006890A9. Автор: Gaku Minamihaba,Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi. Владелец: JSR Corp. Дата публикации: 2009-07-22.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: US20090302266A1. Автор: Hirotaka Shida,Akihiro Takemura,Masatoshi Ikeda. Владелец: JSR Corp. Дата публикации: 2009-12-10.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: KR101406642B1. Автор: 히로따까 시다,아끼히로 다께무라,마사또시 이께다. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2014-06-11.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: EP2006891A1. Автор: Hirotaka Shida,Akihiro Takemura,Masatoshi Ikeda. Владелец: JSR Corp. Дата публикации: 2008-12-24.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: EP2006891A4. Автор: Hirotaka Shida,Akihiro Takemura,Masatoshi Ikeda. Владелец: JSR Corp. Дата публикации: 2011-02-23.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: TW200734435A. Автор: Masayuki Motonari,Eiichirou KUNITANI. Владелец: JSR Corp. Дата публикации: 2007-09-16.

Composition for chemical mechanical polishing and method for reducing chemical mechanical polishing surface defects

Номер патента: US10066127B2. Автор: Chi-Ming Yang,An-Dih Yu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-09-04.

Polishing medium for chemical-mechanical polishing, and method of polishing substrate member

Номер патента: US20060037251A1. Автор: Yasushi Kurata,Yasuo Kamigata,Takeshi Uchida,Hiroki Terasaki,Akiko Igarashi. Владелец: Akiko Igarashi. Дата публикации: 2006-02-23.

Aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: KR101202720B1. Автор: 신동목,최은미,조승범,하현철. Владелец: 주식회사 엘지화학. Дата публикации: 2012-11-19.

An aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: WO2009107986A1. Автор: Seung-Beom Cho,Dong-Mok Shin,Eun-Mi Choi,Hyun-Chul Ha. Владелец: LG CHEM, LTD.. Дата публикации: 2009-09-03.

Polishing medium for chemical-mechanical polishing, and method of polishing substrate member

Номер патента: US7744666B2. Автор: Yasushi Kurata,Yasuo Kamigata,Takeshi Uchida,Hiroki Terasaki,Akiko Igarashi. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2010-06-29.

Polishing medium for chemical-mechanical polishing, and method of polishing substrate member

Номер патента: US7319072B2. Автор: Yasushi Kurata,Yasuo Kamigata,Takeshi Uchida,Hiroki Terasaki,Akiko Igarashi. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2008-01-15.

Aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: US20100184291A1. Автор: Seung-Beom Cho,Dong-Mok Shin,Eun-Mi Choi,Hyun-Chul Ha. Владелец: LG Chem Ltd. Дата публикации: 2010-07-22.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: WO2007060869A1. Автор: Masayuki Motonari,Eiichirou KUNITANI. Владелец: JSR Corporation. Дата публикации: 2007-05-31.

Treatment composition for chemical mechanical polishing, chemical mechanical polishing method, and cleaning method

Номер патента: WO2016170942A1. Автор: 英一郎 國谷,達也 山中,達慶 河本,清孝 三ツ元,愛 荒川,雅史 飯田. Владелец: Jsr株式会社. Дата публикации: 2016-10-27.

An aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: EP2247682A4. Автор: Seung-Beom Cho,Dong-Mok Shin,Eun-Mi Choi,Hyun-Chul Ha. Владелец: LG Chem Ltd. Дата публикации: 2012-03-14.

An aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: EP2247682A1. Автор: Seung-Beom Cho,Dong-Mok Shin,Eun-Mi Choi,Hyun-Chul Ha. Владелец: LG Chem Ltd. Дата публикации: 2010-11-10.

Polishing medium for chemical-mechanical polishing, and method of polishing substrate member

Номер патента: US20060124597A1. Автор: Yasushi Kurata,Yasuo Kamigata,Takeshi Uchida,Hiroki Terasaki,Akiko Igarashi. Владелец: Akiko Igarashi. Дата публикации: 2006-06-15.

Slurry composition for chemical mechanical polishing, method of polishing using the same and method of manufacturing a semiconductor memory device

Номер патента: KR100852242B1. Автор: 이효선,이동준,김남수,김종우,안봉수. Владелец: 삼성전자주식회사. Дата публикации: 2008-08-13.

An aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: TW200948940A. Автор: Seung-Beom Cho,Dong-Mok Shin,Eun-Mi Choi,Hyun-Chul Ha. Владелец: Lg Chemical Ltd. Дата публикации: 2009-12-01.

Treatment composition for chemical mechanical polishing, chemical mechanical polishing method, and cleaning method

Номер патента: KR101731523B1. Автор: 키요타카 미츠모토,마사시 이이다,타츠요시 가와모토,타츠야 야마나카,메구미 아라카와,에이이치로우 구니타니. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2017-04-28.

Composition for chemical-mechanical polishing and chemical-mechanical polishing method

Номер патента: TW202120658A. Автор: 山田裕也,王鵬宇,杉江紀彦,亀井康孝. Владелец: 日商Ｊｓｒ股份有限公司. Дата публикации: 2021-06-01.

Composition for chemical-mechanical polishing and chemical-mechanical polishing method

Номер патента: US20220389279A1. Автор: Pengyu Wang,Yasutaka Kamei,Norihiko Sugie,Yuuya YAMADA. Владелец: JSR Corp. Дата публикации: 2022-12-08.

Composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: JPWO2021095414A1. Автор: 康孝 亀井,裕也 山田,鵬宇 王,紀彦 杉江. Владелец: JSR Corp. Дата публикации: 2021-11-25.

Polishing compound for chemical mechanical polishing and method for polishing substrate

Номер патента: TW501197B. Автор: Yasushi Kurata,Yasuo Kamigata,Takeshi Uchida,Hiroki Terasaki,Akiko Igarashi. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2002-09-01.

Composition for post chemical-mechanical-polishing cleaning

Номер патента: WO2017211653A1. Автор: Andreas Klipp,Peter Przybylski,Julian Proelss,Michael Lauter,Max SIEBERT,Haci Osman GUEVENC,Leonardus Leunissen,Christian Daeschlein,Ivan GARCIA ROMERO. Владелец: BASF SE. Дата публикации: 2017-12-14.

Composition for post chemical-mechanical-polishing cleaning

Номер патента: WO2017108748A2. Автор: Andreas Klipp,Peter Przybylski,Julian Proelss,Michael Lauter,Max SIEBERT,Haci Osman GUEVENC,Leonardus Leunissen,Te Yu Wei,Christian DÄSCHLEIN,Roelf-Peter BAUMANN. Владелец: BASF SE. Дата публикации: 2017-06-29.

Method of Forming Conductive Material of a Buried Transistor Gate Line and Method of Forming a Buried Transistor Gate Line

Номер патента: US20170317086A1. Автор: Hidekazu Nobuto. Владелец: Micron Technology Inc. Дата публикации: 2017-11-02.

Method of forming conductive material of a buried transistor gate line and method of forming a buried transistor gate line

Номер патента: US10002874B2. Автор: Hidekazu Nobuto. Владелец: Micron Technology Inc. Дата публикации: 2018-06-19.

Method of forming conductive material of a buried transistor gate line and method of forming a buried transistor gate line

Номер патента: US09768177B2. Автор: Hidekazu Nobuto. Владелец: Micron Technology Inc. Дата публикации: 2017-09-19.

Erosion inhibitor for chemical mechanical polishing, slurry for chemical mechanical polishing, and chemical mechanical polishing method

Номер патента: WO2012161202A1. Автор: 穣 竹越,加藤　充,知大 岡本,晋哉 加藤. Владелец: 株式会社クラレ. Дата публикации: 2012-11-29.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing

Номер патента: US20040132305A1. Автор: Akihiro Takemura,Masayuki Hattori,Atsushi Shigeta,Nobuo Kawahashi,Kazuo Nishimoto,Naoto Miyashita,Tatsuaki Sakano,Yoshitaka Matsui,Kazuhiko Ida. Владелец: JSR Corp. Дата публикации: 2004-07-08.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing

Номер патента: US7005382B2. Автор: Akihiro Takemura,Masayuki Hattori,Atsushi Shigeta,Nobuo Kawahashi,Kazuo Nishimoto,Naoto Miyashita,Tatsuaki Sakano,Yoshitaka Matsui,Kazuhiko Ida. Владелец: JSR Corp. Дата публикации: 2006-02-28.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing

Номер патента: TWI296282B. Автор: Akihiro Takemura,Masayuki Hattori,Atsushi Shigeta,Nobuo Kawahashi,Kazuo Nishimoto,Naoto Miyashita,Tatsuaki Sakano,Yoshitaka Matsui,Kazuhiko Ida. Владелец: Toshiba Kk. Дата публикации: 2008-05-01.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing

Номер патента: EP1416025A1. Автор: Akihiro Takemura,Masayuki Hattori,Atsushi Shigeta,Nobuo Kawahashi,Kazuo Nishimoto,Naoto Miyashita,Tatsuaki Sakano,Yoshitaka Matsui,Kazuhiko Ida. Владелец: JSR Corp. Дата публикации: 2004-05-06.

Erosion inhibitor for chemical mechanical polishing, slurrry for chemical mechanical polishing, and chemical mechanical polishing method

Номер патента: IL229522A0. Автор: . Владелец: Kuraray Co. Дата публикации: 2014-01-30.

Aqueous dispersion for chemical mechanical polish, kit for formulating the aqueous dispersion, chemical mechanical polishing method and method for producing semiconductor device

Номер патента: TW200714697A. Автор: Gaku Minamihaba,Dai Fukushima,Nobuyuki Kurashima,Susumu Yamamoto,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Akihiro Takemura,Masayuki Hattori. Владелец: Toshiba Kk. Дата публикации: 2007-04-16.

COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR REDUCING CHEMICAL MECHANICAL POLISHING SURFACE DEFECTS

Номер патента: US20180016467A1. Автор: Yang Chi-Ming,YU AN-DIH. Владелец: . Дата публикации: 2018-01-18.

TREATMENT COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND CLEANING METHOD

Номер патента: US20180111248A1. Автор: Yamanaka Tatsuya,MITSUMOTO Kiyotaka,KAWAMOTO Tatsuyoshi,ARAKAWA Megumi,KUNITANI Eiichirou,IIDA Masashi. Владелец: JSR Corporation. Дата публикации: 2018-04-26.

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices

Номер патента: US20070049180A1. Автор: Gaku Minamihaba,Dai Fukushima,Nobuyuki Kurashima,Susumu Yamamoto,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Akihiro Takemura,Masayuki Hattori. Владелец: JSR Corp. Дата публикации: 2007-03-01.

Slurry for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: WO2013180079A1. Автор: 加藤　充,知大 岡本,晋哉 加藤. Владелец: 株式会社クラレ. Дата публикации: 2013-12-05.

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices

Номер патента: EP1757665B8. Автор: Gaku Minamihaba,Dai Fukushima,Nobuyuki Kurashima,Susumu Yamamoto,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Akihiro Takemura,Masayuki Hattori. Владелец: JSR Corp. Дата публикации: 2012-04-11.

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices

Номер патента: EP1757665B1. Автор: Gaku Minamihaba,Dai Fukushima,Nobuyuki Kurashima,Susumu Yamamoto,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Akihiro Takemura,Masayuki Hattori. Владелец: JSR Corp. Дата публикации: 2012-02-22.

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices

Номер патента: EP1757665A1. Автор: Gaku Minamihaba,Dai Fukushima,Nobuyuki Kurashima,Susumu Yamamoto,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Akihiro Takemura,Masayuki Hattori. Владелец: JSR Corp. Дата публикации: 2007-02-28.

Slurry for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: EP2858097A4. Автор: Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co Ltd. Дата публикации: 2016-01-06.

Slurry for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: US9437446B2. Автор: Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co Ltd. Дата публикации: 2016-09-06.

Slurry for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: KR101726486B1. Автор: 미츠루 가토,신야 가토,지히로 오카모토. Владелец: 주식회사 쿠라레. Дата публикации: 2017-04-26.

Slurry for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: TW201412961A. Автор: Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co. Дата публикации: 2014-04-01.

Slurry for chemical mechanical polishing and polishing method for substrate using same

Номер патента: US9536752B2. Автор: Minori Takegoshi,Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co Ltd. Дата публикации: 2017-01-03.

Slurry for chemical mechanical polishing and polishing method for substrate using same

Номер патента: WO2011058952A1. Автор: 穣 竹越,加藤　充,知大 岡本,晋哉 加藤. Владелец: 株式会社クラレ. Дата публикации: 2011-05-19.

Slurry for chemical mechanical polishing and polishing method for substrate using same

Номер патента: EP2500929B1. Автор: Minori Takegoshi,Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co Ltd. Дата публикации: 2018-06-20.

Slurry for chemical mechanical polishing and polishing method for substrate using same

Номер патента: KR101359092B1. Автор: 미노리 다케고시,미츠루 가토,치히로 오카모토,신야 가토. Владелец: 가부시키가이샤 구라레. Дата публикации: 2014-02-05.

Slurry for chemical mechanical polishing and method for polishing substrate using the same

Номер патента: TW201124515A. Автор: Minori Takegoshi,Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co. Дата публикации: 2011-07-16.

Slurry for chemical mechanical polishing and polishing method for substrate using same

Номер патента: EP2500929A4. Автор: Minori Takegoshi,Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co Ltd. Дата публикации: 2013-08-14.

Slurry for chemical mechanical polishing and polishing method for substrate using same

Номер патента: EP2500929A1. Автор: Minori Takegoshi,Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co Ltd. Дата публикации: 2012-09-19.

Slurry for chemical mechanical polishing and polishing method for substrate using same

Номер патента: IL219703D0. Автор: . Владелец: Kuraray Co. Дата публикации: 2012-07-31.

Apparatus and method for supplying chemicals in chemical mechanical polishing systems

Номер патента: US20030089456A1. Автор: Sue-ryeon Kim,Seung-un Kim,Seung-ki Chae,Je-Gu Lee. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2003-05-15.

Cleaning composition and method for cleaning a semiconductor device substrate after chemical mechanical polishing

Номер патента: US09481855B2. Автор: Atsushi Otake,Akira Kuroda. Владелец: EKC Technology Inc. Дата публикации: 2016-11-01.

PVDF-TrFE co-polymer having improved ferroelectric properties, methods of making a PVDF-TrFE co-polymer having improved ferroelectric properties and methods of changing the end group of a PVDF-TrFE co-polymer

Номер патента: US09735004B2. Автор: Jakob NILSSON,Christian BROX-NILSEN. Владелец: Thin Film Electronics ASA. Дата публикации: 2017-08-15.

METHOD OF GROWING THIN MONOCRYSTALLINE FILM, LIGHT-EMITTING DEVICE BASED ON Ga2O3, AND A METHOD FOR MANUFACTURING THE SAME

Номер патента: RU2313623C2. Автор: Нобору ИТИНОСЕ,Киеси СИМАМУРА,Казуо АОКИ,ВИЛЛОРА Энкарнасьон Антониа ГАРСИЯ. Владелец: Васеда Юниверсити. Дата публикации: 2007-12-27.

CHEMICAL MECHANICAL POLISHING SLURRY, METHOD FOR CHEMICAL MECHANICAL POLISHING AND MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

Номер патента: US20170338123A1. Автор: Huang Shu-Hao. Владелец: . Дата публикации: 2017-11-23.

SLURRY FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD

Номер патента: US20150147884A1. Автор: Kato Shinya,KATO Mitsuru,OKAMOTO Chihiro. Владелец: KURARAY CO., LTD.. Дата публикации: 2015-05-28.

Polishing composition, method for fabricating thereof and method of chemical mechanical polishing using the same

Номер патента: US09493677B2. Автор: Dae Soon Lim,Dong Hee Shin,Dong Hyeon LEE,Il Ho YANG,Yang Bok Lee,Seung Koo Lee. Владелец: SK hynix Inc. Дата публикации: 2016-11-15.

Composition for chemical mechanical polishing and method for polishing

Номер патента: US20230203344A1. Автор: Kouhei Yoshio,Yuuya YAMADA. Владелец: JSR Corp. Дата публикации: 2023-06-29.

Composition for chemical-mechanical polishing (cmp), containing inorganic particles and polymer particles

Номер патента: RU2579597C2. Автор: Южуо ЛИ,Виджай Иммануэль РАМАН,Михаэль ЛАУТЕР,Шиям Сундар ВЕНКАТАРАМАН,Даниэль Кво-Хунг ШЕН. Владелец: БАСФ СЕ. Дата публикации: 2016-04-10.

Chemical mechanical polishing slurry composition for polishing boron silicon compound, chemical mechanical polishing method and method of fabricating semiconductor device using the same

Номер патента: US20230123263A1. Автор: Ungyu Paik,Hyun Goo Kang,Dong Hyeok Kim,Cheolmin SHIN,Taeseup SONG,Jong Young Cho. Владелец: Industry University Cooperation Foundation IUCF HYU. Дата публикации: 2023-04-20.

Aqueous polishing composition and method for chemical-mechanical polishing of substrates having polysilicon and silicon oxide dielectric films

Номер патента: RU2573672C2. Автор: Шиам Сундар ВЕНКАТАРАМАН,Южуо ЛИ,Джеа-Джу ЧУ,Вей Лан Уиллиам ЧИУ,Харви Уэйн ПИНДЕР. Владелец: БАСФ СЕ. Дата публикации: 2016-01-27.

Polishing liquid and chemical mechanical polishing method

Номер патента: US12098301B2. Автор: Tetsuya Kamimura. Владелец: Fujifilm Corp. Дата публикации: 2024-09-24.

Composition for chemical-mechanical polishing containing polyvinyl phosphon acid and derivatives thereof

Номер патента: RU2598046C2. Автор: Шиам Сундар ВЕНКАТАРАМАН,ИБРАХИМ Шейк Ансар УСМАН,Виджай Иммануил РАМАН,Южио ЛИ,Кристиан ШАДЕ,Исон Ю-Шен СУ. Владелец: БАСФ СЕ. Дата публикации: 2016-09-20.

Stabilized Chemical Mechanical Polishing Composition And Method Of Polishing A Substrate

Номер патента: US20110306211A1. Автор: Yi Guo,Zhendong Liu,Kancharla-Arun Kumar Reddy,Guangyun Zhang. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2011-12-15.

Composition for chemical-mechanical polishing (cmp) containing non-ion surfactant and carbonate salt

Номер патента: RU2643541C9. Автор: Южуо ЛИ,Вей Лан Уильям ЧИУ,Роберт РАЙХАРДТ,Михаэль ЛАУТЕР. Владелец: БАСФ СЕ. Дата публикации: 2018-03-16.

Composition for chemical-mechanical polishing (cmp) containing non-ion surfactant and carbonate salt

Номер патента: RU2643541C2. Автор: Южуо ЛИ,Вей Лан Уильям ЧИУ,Роберт РАЙХАРДТ,Михаэль ЛАУТЕР. Владелец: БАСФ СЕ. Дата публикации: 2018-02-02.

Composition for chemical-mechanical polishing (cmp), containing non-ionic surfactant and aromatic compound containing acid group

Номер патента: RU2636511C2. Автор: Южуо ЛИ,Роберт РАЙХАРДТ,Михаэль ЛАУТЕР. Владелец: БАСФ СЕ. Дата публикации: 2017-11-23.

Slurry compositions for polishing metal layers, chemical mechanical polishing apparatuses using the same, and methods for fabricating semiconductor devices using the same

Номер патента: US20230193080A1. Автор: Sang Kyun Kim,Byung Keun Hwang,Hyo San LEE,Yea Rin Byun,In Kwon Kim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-06-22.

Aqueous polishing composition and method for chemical-mechanical polishing of substrates, containing film based on silicon oxide dielectric and based on polycrystalline silicon

Номер патента: RU2588620C2. Автор: Шиам Сундар ВЕНКАТАРАМАН,Исон Юй-Шен СУ,Аренд Йоукэ КИНГМА,Бастиан Мартен НОЛЛЕР. Владелец: БАСФ СЕ. Дата публикации: 2016-07-10.

Composition for chemical-mechanical polishing (cmp) containing protein

Номер патента: RU2631875C2. Автор: Бастиан Мартен НОЛЛЕР,Южуо ЛИ,Михаэль ЛАУТЕР,Роланд ЛАНГЕ. Владелец: БАСФ СЕ. Дата публикации: 2017-09-28.

Chemical mechanical polishing of substrates containing copper and ruthenium

Номер патента: US11725117B2. Автор: Julian Proelss,Michael Lauter,Haci Osman GUEVENC,Leonardus Leunissen,Reza M. Golzarian,Te Yu Wei,Wei Lan Chiu. Владелец: BASF SE. Дата публикации: 2023-08-15.

Chemical mechanical polishing of substrates containing copper and ruthenium

Номер патента: US20240002698A1. Автор: Julian Proelss,Michael Lauter,Haci Osman GUEVENC,Leonardus Leunissen,Reza M. Golzarian,Te Yu Wei,Wei Lan Chiu. Владелец: BASF SE. Дата публикации: 2024-01-04.

Chemical mechanical polishing of substrates containing copper and ruthenium

Номер патента: US20230416570A1. Автор: Julian Proelss,Michael Lauter,Haci Osman GUEVENC,Leonardus Leunissen,Reza M. Golzarian,Te Yu Wei,Wei Lan Chiu. Владелец: BASF Corp. Дата публикации: 2023-12-28.

Chemical-mechanical polishing composition and method for using the same

Номер патента: IL176669A0. Автор: . Владелец: Cabot Microelectronics Corp. Дата публикации: 2006-10-31.

Slurry composition for chemical mechanical polishing

Номер патента: US20230104949A1. Автор: Sangkyun Kim,Hyosan Lee,Sanghyun Park,Yearin BYUN,Inkwon KIM,Wonki HUR. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-04-06.

Chemical-mechanical polishing composition for heavily-doped boron silicon films

Номер патента: WO2024081201A1. Автор: Brian Reiss,Elliot KNAPTON,Alex Villani-Gale. Владелец: CMC Materials LLC. Дата публикации: 2024-04-18.

Silicon nitride chemical mechanical polishing slurry with silicon nitride removal rate enhancers and methods of use thereof

Номер патента: US20220315800A1. Автор: Jimmy Granstrom. Владелец: Fujimi Inc. Дата публикации: 2022-10-06.

Water polishing composition and method of chemical-mechanical polishing of substrate materials for electric, mechanical and optical devices

Номер патента: RU2577281C2. Автор: Шиам Сундар ВЕНКАТАРАМАН,Южуо ЛИ,Джеа-Джу ЧУ,Харви Уэйн ПИНДЕР,ИБРАХИМ Шейк Ансар УСМАН. Владелец: БАСФ СЕ. Дата публикации: 2016-03-10.

Chemical mechanical polishing slurry composition for polishing multiple films and polishing method using the same

Номер патента: US20210009859A1. Автор: Jae Ik Lee,Jae Woo Lee,Ji Hye Kim,Bo Hyeok Choi. Владелец: KCTech Co Ltd. Дата публикации: 2021-01-14.

Chemical-mechanical polishing composition for heavily-doped boron silicon films

Номер патента: US20240117220A1. Автор: Brian Reiss,Elliot KNAPTON,Alex Villani-Gale. Владелец: CMC Materials LLC. Дата публикации: 2024-04-11.

Silicon nitride chemical mechanical polishing slurry with silicon nitride removal rate enhancers and methods of use thereof

Номер патента: US11999877B2. Автор: Jimmy Granstrom. Владелец: Fujimi Inc. Дата публикации: 2024-06-04.

Neutral to alkaline chemical mechanical polishing compositions and methods for tungsten

Номер патента: US11591495B2. Автор: Yi Guo,Tony Quan Tran. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-02-28.

Chemical mechanical polishing apparatus and method for performing cerium oxide-based chemical mechanical polishing

Номер патента: CN111318955A. Автор: 李善雄. Владелец: Xia Tai Xin Semiconductor Qing Dao Ltd. Дата публикации: 2020-06-23.

Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of n-vinyl-homopolymers and n-vinyl copolymers

Номер патента: MY177867A. Автор: Yongqing Lan,Peter Przybylski,Zhenyu Bao,Julian Prol?. Владелец: BASF SE. Дата публикации: 2020-09-23.

Cerium oxide chemical mechanical polishing slurry composition that enhanced polishing non-uniformity

Номер патента: KR20060123878A. Автор: 박종대,공현구,이봉상,손정현. Владелец: 주식회사 동진쎄미켐. Дата публикации: 2006-12-05.

Method for producing abrasive particles, chemical mechanical polishing composition and chemical mechanical polishing method

Номер патента: KR20230029618A. Автор: 유야 야마다,아츠시 바바,타카노리 야나기,펑위 왕,코지 나카니시. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2023-03-03.

Chemical mechanical polishing composition

Номер патента: US11993729B2. Автор: Yongqing Lan,Sheik Ansar Usman Ibrahim,Julian Proelss,Michael Lauter,Max SIEBERT,Haci Osman GUEVENC,Leonardus Leunissen,Te Yu Wei,Christian Daeschlein,Reza M Golzarian. Владелец: BASF SE. Дата публикации: 2024-05-28.

Structure comprising tunable anti-reflective coating and method of forming thereof

Номер патента: WO2005053011A1. Автор: Dorel Ioan Toma,Jeffrey T. Wetzel,David C. Wang,Eric M. Lee. Владелец: TOKYO ELECTRON LIMITED. Дата публикации: 2005-06-09.

Vertical structure and method of forming semiconductor device

Номер патента: US20160027917A1. Автор: Teng-Chun Tsai,Ming-Hsing Tsai,Huang-Yi Huang,De-Fang Chen,Li-Ting Wang,Hui-Cheng Chang,Cheng-Tung Lin,Huan-Just Lin,Bing-Hung Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2016-01-28.

Vertical structure and method of forming semiconductor device

Номер патента: US9577093B2. Автор: Teng-Chun Tsai,Ming-Hsing Tsai,Huang-Yi Huang,De-Fang Chen,Li-Ting Wang,Hui-Cheng Chang,Cheng-Tung Lin,Huan-Just Lin,Bing-Hung Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-02-21.

Vertical Structure and Method of Forming Semiconductor Device

Номер патента: US20170154807A1. Автор: Teng-Chun Tsai,Ming-Hsing Tsai,Huang-Yi Huang,De-Fang Chen,Li-Ting Wang,Hui-Cheng Chang,Cheng-Tung Lin,Huan-Just Lin,Bing-Hung Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-06-01.

Slurry for chemical mechanical polishing

Номер патента: US20040021125A1. Автор: Yasuaki Tsuchiya,Shin Sakurai,Kenichi Aoyagi,Toshiji Taiji,Tomoyuki Ito. Владелец: NEC Electronics Corp. Дата публикации: 2004-02-05.

Chemical mechanical polishing slurry composition and method of manufacturing semiconductor device using the same

Номер патента: US20240318040A1. Автор: Seungho Park,Sanghyun Park,Boyun KIM,Yearin BYUN,Jeongwon Lim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-09-26.

Double-sided adhesive tape for adhering polishing pad allowing easy air bubble discharge, and chemical-mechanical polishing apparatus using same

Номер патента: EP4450577A1. Автор: JEONG Yeon Jeong,Seung Geun Kim,Byung Ju Min,Seok Ji HONG,Kang Mun Cho. Владелец: KPX CHEMICAL CO Ltd. Дата публикации: 2024-10-23.

Chemical mechanical polishing solution

Номер патента: US11746257B2. Автор: JIAN Ma,Kai Song,Ying Yao,Jianfen JING,Xinyuan CAI,Guohao WANG,Junya YANG,Pengcheng BIAN. Владелец: Anji Microelectronics Shanghai Co Ltd. Дата публикации: 2023-09-05.

Semiconductor Chemical Mechanical Polishing Sludge Recycling Method

Номер патента: US20240316608A1. Автор: Shao-Hua Hu,Hsin-Hui Chou,Ya-Min Hsieh,Wen-Ming Cheng,Hsing-Wen HSIEH,Chin-An KUAN. Владелец: Transcene Corp. Дата публикации: 2024-09-26.

Removal of defects by in-situ etching during chemical-mechanical polishing processing

Номер патента: EP4235751A2. Автор: Scott B. Singer,Joseph C. Boisvert,Daniel C. Law,Christopher M. Fetzer. Владелец: Boeing Co. Дата публикации: 2023-08-30.

Removal of defects by in-situ etching during chemical-mechanical polishing processing

Номер патента: EP4235751A3. Автор: Scott B. Singer,Joseph C. Boisvert,Daniel C. Law,Christopher M. Fetzer. Владелец: Boeing Co. Дата публикации: 2023-11-15.

Methods for forming interconnections between top electrodes in memory cells by a two-step chemical-mechanical polishing (CMP) process

Номер патента: US09443763B2. Автор: Samuele Sciarrillo. Владелец: Micron Technology Inc. Дата публикации: 2016-09-13.

Method for chemical mechanical polishing of semiconductor device

Номер патента: KR100732308B1. Автор: 권판기,이상익. Владелец: 주식회사 하이닉스반도체. Дата публикации: 2007-06-25.

Use of stop layer for chemical mechanical polishing of CU damascene

Номер патента: US6051496A. Автор: Syun-Ming Jang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2000-04-18.

Chemical mechanical polishing method suitable for highly accurate planarization

Номер патента: US6132292A. Автор: Akira Kubo. Владелец: NEC Corp. Дата публикации: 2000-10-17.

Chemical-mechanical polishing proximity correction method and correction pattern thereof

Номер патента: US7138654B2. Автор: Tu-Hao Yu,Yu-Chia Chen,Pai-Hsuan Sun. Владелец: Winbond Electronics Corp. Дата публикации: 2006-11-21.

Chemical mechanical polishing method, method of manufacturing semiconductor device, and semiconductor manufacturing apparatus

Номер патента: US20180104792A1. Автор: Hyo-san Lee,Myung-Ki Hong,Joo-Han LEE,Sung-Oh Park,Yung-Jun Kim,Kyu-min Oh,Sun-gyu PARK,Seh-Kwang Lee,Chan-ki Yang. Владелец: EHWA Diamond Industrial Co Ltd. Дата публикации: 2018-04-19.

Method of fabricating self-aligned contact pad using chemical mechanical polishing process

Номер патента: US20070072407A1. Автор: Bo-Un Yoon,Chang-ki Hong,Joon-Sang Park,Ho-Young Kim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2007-03-29.

Method of fabricating self-aligned contact pad using chemical mechanical polishing process

Номер патента: US7781281B2. Автор: Bo-Un Yoon,Chang-ki Hong,Joon-Sang Park,Ho-Young Kim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2010-08-24.

Method of fabricating self-aligned contact pad using chemical mechanical polishing process

Номер патента: US20100124817A1. Автор: Bo-Un Yoon,Chang-ki Hong,Joon-Sang Park,Ho-Young Kim. Владелец: Individual. Дата публикации: 2010-05-20.

Chemical-mechanical polishing proximity correction method and correction pattern thereof

Номер патента: US20050142877A1. Автор: Tu-Hao Yu,Yu-Chia Chen,Pai-Hsuan Sun. Владелец: Winbond Electronics Corp. Дата публикации: 2005-06-30.

Chemical mechanical polishing for hybrid bonding

Номер патента: US20230268308A1. Автор: Chandrasekhar MANDALAPU,Cyprian Emeka Uzoh,Jeremy Alfred Theil,Gaius Gillman Fountain, Jr.. Владелец: Adeia Semiconductor Bonding Technologies Inc. Дата публикации: 2023-08-24.

Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices

Номер патента: RU2607214C2. Автор: Шиам Сундар ВЕНКАТАРАМАН,Южуо ЛИ,Джеа-Джу ЧУ,Харви Уэйн ПИНДЕР,ИБРАХИМ Шейк Ансар УСМАН. Владелец: БАСФ СЕ. Дата публикации: 2017-01-10.

Chemical mechanical polishing slurry composition and method of polishing metal layer

Номер патента: US12024651B2. Автор: Teng-Chun Tsai,Chun-Hung LIAO,An-Hsuan Lee,Shen-Nan Lee,Chen-Hao WU,Huang-Lin Chao. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-07-02.

Methods and systems for chemical mechanical polish and clean

Номер патента: US09449841B2. Автор: Li-Chieh Wu,Chi-Jen Liu,Liang-Guang Chen,Shich-Chang Suen,Ying-Liang Chuang,Ming-Liang Yen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2016-09-20.

Process for chemical-mechanical polishing of iii-v semiconductor materials

Номер патента: CA1044580A. Автор: Robert J. Walsh. Владелец: Monsanto Co. Дата публикации: 1978-12-19.

Methods and systems for chemical mechanical polish cleaning

Номер патента: US09966281B2. Автор: Hui-Chi Huang,Chien-Ping Lee. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-05-08.

Method and system for chemical mechanical polishing process

Номер патента: US20230274929A1. Автор: Yi-Chang Liu,Chih-I Peng,Hsiu-Ming Yeh. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-08-31.

Chemical mechanical polishing apparatus, chemical mechanical polishing method and method for fabricating semiconductor device

Номер патента: US11986921B2. Автор: Byoung Ho Kwon,Yong Hee Lee,Myung-Ki Hong,Kun Tack LEE. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-21.

Chemical mechanical polishing apparatus, chemical mechanical polishing method and method for fabricating semiconductor device

Номер патента: US20220118582A1. Автор: Byoung Ho Kwon,Myung-Ki Hong,Kun Tack LEE,Youg Hee LEE. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2022-04-21.

Mechanisms for forming oxide layer over exposed polysilicon during a chemical mechanical polishing (CMP) process

Номер патента: US09711374B2. Автор: William Weilun HONG,Ying-Tsung Chen,Chih-Yu Chang,Che-Hao Tu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-07-18.

Chemical mechanical polishing apparatus and method of fabricating semiconductor device using the same

Номер патента: US20240145254A1. Автор: Hyo-Jung Kim,Dong Hoon KWON. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-02.

Light sensitive chemical-mechanical polishing aggregate

Номер патента: US20010028052A1. Автор: David Carlson. Владелец: Individual. Дата публикации: 2001-10-11.

Chemical-mechanical polishing for shallow trench isolation

Номер патента: US5958795A. Автор: Juan-Yuan Wu,Water Lur,Coming Chen. Владелец: United Microelectronics Corp. Дата публикации: 1999-09-28.

Chemical mechanical polishing process for forming shallow trench isolation structure

Номер патента: US20080029478A1. Автор: Teng-Chun Tsai,Hsiao-Ling Lu,Chia-Jung Hsu,Art Yu. Владелец: United Microelectronics Corp. Дата публикации: 2008-02-07.

Light sensitive chemical-mechanical polishing method

Номер патента: US20010053606A1. Автор: David Carlson. Владелец: Individual. Дата публикации: 2001-12-20.

Surface conversion in chemical mechanical polishing

Номер патента: US11804378B2. Автор: Chih-Chao Yang,Cornelius Brown Peethala,Donald F Canaperi,Raghuveer R Patlolla,Mary Breton. Владелец: International Business Machines Corp. Дата публикации: 2023-10-31.

Chemical mechanical polishing cleaning system with temperature control for defect reduction

Номер патента: US20230326736A1. Автор: Kei-Wei Chen,Gin-Chen Huang,Ying-Tsung Chen,Ya-Ting Tsai,Ssutzu Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-10-12.

Methods for reducing delamination during chemical mechanical polishing

Номер патента: US20040116052A1. Автор: Lizhong Sun,Yufei Chen,Doohan Lee,Wei-Yung Hsu. Владелец: Applied Materials Inc. Дата публикации: 2004-06-17.

Methods for reducing delamination during chemical mechanical polishing

Номер патента: US7037174B2. Автор: Lizhong Sun,Yufei Chen,Doohan Lee,Wei-Yung Hsu. Владелец: Applied Materials Inc. Дата публикации: 2006-05-02.

Methods for reducing delamination during chemical mechanical polishing

Номер патента: US20060172664A1. Автор: Lizhong Sun,Yufei Chen,Doohan Lee,Wei-Yung Hsu. Владелец: Applied Materials Inc. Дата публикации: 2006-08-03.

Methods for reducing delamination during chemical mechanical polishing

Номер патента: US7244168B2. Автор: Lizhong Sun,Yufei Chen,Doohan Lee,Wei-Yung Hsu. Владелец: Applied Materials Inc. Дата публикации: 2007-07-17.

Chemical mechanical polishing composition and process

Номер патента: US09676966B2. Автор: Akitoshi Yoshida,Haruki Nojo,Pascal Berar,Hirofumi Kashihara. Владелец: Air Products and Chemicals Inc. Дата публикации: 2017-06-13.

Slurry composition for a chemical mechanical polishing

Номер патента: US20240271006A1. Автор: Ungyu Paik,Cheol Min Shin,Hyun Goo Kang,Hojin Jeong,Taeseup SONG. Владелец: Industry University Cooperation Foundation IUCF HYU. Дата публикации: 2024-08-15.

Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing

Номер патента: EP1936674A3. Автор: Junaid Ahmed Siddiqui,Rachel Dianne Mcconnell,Saifi Usmani. Владелец: DuPont Air Products NanoMaterials LLC. Дата публикации: 2010-04-28.

Polishing liquid and chemical mechanical polishing method

Номер патента: US20200354609A1. Автор: Tetsuya Kamimura. Владелец: Fujifilm Corp. Дата публикации: 2020-11-12.

Chemical mechanical polishing composition for polishing sapphire surface and methods of using same

Номер патента: RU2661219C2. Автор: Аллен С. БЬЮЛИК,Хидеаки НИСИЗАВА,Казуки МОРИЯМА,Коити ЙОСИДА,Сундзи ЕЗАВА,Селванатхан АРУМУГАМ. Владелец: РОМ ЭНД ХААС ЭЛЕКТРОНИК МАТИРИАЛЗ СиЭмПи ХОЛДИНГЗ, ИНК.. Дата публикации: 2018-07-13.

Composition for chemical mechanical polishing

Номер патента: KR20010096326A. Автор: 김석진,이길성,이재석,장두원. Владелец: 안복현. Дата публикации: 2001-11-07.

Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices

Номер патента: US20200312708A1. Автор: Shih-Kang Fu,Ming-Han Lee,Shau-Lin Shue. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2020-10-01.

Methods of performing chemical-mechanical polishing process in semiconductor devices

Номер патента: US11742239B2. Автор: Shih-Kang Fu,Ming-Han Lee,Shau-Lin Shue. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-08-29.

Chemical mechanical polishing for copper dishing control

Номер патента: US12033964B2. Автор: Ki Cheol Ahn,Joseph F. Salfelder,Kai Ma,Raghav SREENIVASAN,Tyler Sherwood,Jason Appell. Владелец: Applied Materials Inc. Дата публикации: 2024-07-09.

Method of forming a silicide interconnect over a silicon comprising substrate and method of forming a stack of refractory metal nitride over refractory metal silicide over silicon

Номер патента: US20010014532A1. Автор: Yongjun Jeff Hu. Владелец: Individual. Дата публикации: 2001-08-16.

Method of intercalating insulating layer between metal catalyst layer and graphene layer and method of fabricating semiconductor device using the same

Номер патента: US20170170012A1. Автор: Insu Jeon,Jiyeon Ku,Hyowon KIM,Wonhee KO. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2017-06-15.

Stacked container capacitor using chemical mechanical polishing

Номер патента: US5627094A. Автор: Lap Chan,Yeow M. Teo. Владелец: Chartered Semiconductor Manufacturing Pte Ltd. Дата публикации: 1997-05-06.

Manufacturing method for manufacturing substrate of nitride crystal of group 13 element in periodic table

Номер патента: US20240293912A1. Автор: Yuri Ono,Mari YOSHIMORI HIGUCHI. Владелец: Kyocera Corp. Дата публикации: 2024-09-05.

Chemical mechanical polishing slurry

Номер патента: US20020100895A1. Автор: Ting-Chang Chang,Cheng-Jer Yang,Huang-Chung Cheng. Владелец: United Microelectronics Corp. Дата публикации: 2002-08-01.

Membrane coating compound for chemical mechanical polishing process, membrane including the same, and polishing apparatus including the same

Номер патента: US20240189960A1. Автор: Sangkyun Kim,Yearin BYUN,Inkwon KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-06-13.

Fabrication of a Polishing Pad for Chemical Mechanical Polishing

Номер патента: US20230347471A1. Автор: Teng-Chun Tsai,Ming-Shiuan She,Chun-Hung LIAO,An-Hsuan Lee,Shen-Nan Lee,Chen-Hao WU. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-02.

Polishing etchant composition for chemical-mechanical polishing of cadmium-zinc telluride

Номер патента: RU2627711C1. Автор: Алексей Сергеевич Кашуба,Медина Рефатовна Лакманова,Анна Владимировна Погожева. Владелец: Акционерное общество "НПО "Орион". Дата публикации: 2017-08-10.

Chemical mechanical polishing pad and method of making same

Номер патента: US09776300B2. Автор: Yuhua Tong,Bainian Qian,Julia KOZHUKH,Tony Quan Tran,Marty W. Degroot,George C. Jacob,Teresa Brugarolas Brufau,Fengji Yeh,David Michael Veneziale,Diego Lugo,Andrew Wank,Jeffrey B. Miller,Marc R. Stack. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-10-03.

Chemical mechanical polishing apparatus, slurry, and method of using the same

Номер патента: US11351648B2. Автор: Hsun-Chung KUANG,Tung-He Chou. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2022-06-07.

Chemical mechanical polishing apparatus, slurry, and method of using the same

Номер патента: US20180361525A1. Автор: Hsun-Chung KUANG,Tung-He Chou. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-12-20.

Detergent composition and chemical-mechanical polishing composition

Номер патента: US20230174892A1. Автор: Yuichi Sakanishi. Владелец: Daicel Corp. Дата публикации: 2023-06-08.

Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces

Номер патента: EP1633526A2. Автор: Jason B. Elledge. Владелец: Micron Technology Inc. Дата публикации: 2006-03-15.

Methods of reducing a registration error of a photomask, and related photomasks and methods of manufacturing an integrated circuit

Номер патента: US9176375B2. Автор: CHALYKH Roman,Sang-Hyun Kim,Seong-Sue Kim,Dong-gun Lee,Mun-Ja KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2015-11-03.

Method of decomposing layout of semiconductor device for quadruple patterning technology process and method of manufacturing semiconductor device using the same

Номер патента: US20160070848A1. Автор: Dong-Gyun Kim,Ji-Young JUNG,Dae-Kwon Kang,Jae-Seok Yang,Sung-Wook Hwang. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2016-03-10.

Methods of manufacturing semiconductor devices, method sof performing extreme ultraviolet ray exposure, and methods of performing optical proximity correction

Номер патента: US20200064728A1. Автор: Ki-Soo Kim,No-Young Chung,Akio Misaka. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-02-27.

Method of decomposing layout of semiconductor device for quadruple patterning technology process and method of manufacturing semiconductor device using the same

Номер патента: US09841672B2. Автор: Dong-Gyun Kim,Ji-Young JUNG,Dae-Kwon Kang,Jae-Seok Yang,Sung-Wook Hwang. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2017-12-12.

Chemical mechanical polishing stop layer for fully amorphous phase change memory pore cell

Номер патента: US8492194B2. Автор: Chung H. Lam,Matthew J. Breitwisch. Владелец: International Business Machines Corp. Дата публикации: 2013-07-23.

Method Of Making Split Gate Non-volatile Flash Memory Cell

Номер патента: US20200013882A1. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2020-01-09.

Method of making split gate non-volatile flash memory cell

Номер патента: EP3913656A1. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2021-11-24.

Method Of Making Split Gate Non-volatile Flash Memory Cell

Номер патента: US20190198647A1. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2019-06-27.

Method Of Making Split Gate Non-volatile Flash Memory Cell

Номер патента: US20200013883A1. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2020-01-09.

Method Of Making Split Gate Non-volatile Flash Memory Cell

Номер патента: US20200020789A1. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2020-01-16.

Method of making split gate non-volatile flash memory cell

Номер патента: US10644139B2. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2020-05-05.

Method of making split gate non-volatile flash memory cell

Номер патента: US10833179B2. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2020-11-10.

Method of making split gate non-volatile flash memory cell

Номер патента: US10276696B2. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2019-04-30.

Method Of Making Split Gate Non-volatile Flash Memory Cell

Номер патента: US20170338330A1. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2017-11-23.

Method of making split gate non-volatile flash memory cell

Номер патента: US10615270B2. Автор: Chunming Wang,Nhan Do,Xian Liu,Andy Liu,Leo XING,Melvin DIAO. Владелец: Silicon Storage Technology Inc. Дата публикации: 2020-04-07.

Transparent Adhesive Composition, Film-Shaped Transparent Adhesive, Method of Producing Transparent Adhesive Cured Layer-Attached Member, and Electronic Component and Method of Producing the Same

Номер патента: MY196339A. Автор: Morita Minoru,WATAHIKI Keita,SAKAI Koyuki. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2023-03-24.

Preparation set for chemical mechanical polishing aqueous dispersion, preparation method for chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method

Номер патента: TW200900491A. Автор: Hirotaka Shida,Kazuhito Uchikura,Eiichirou KUNITANI. Владелец: JSR Corp. Дата публикации: 2009-01-01.

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for chemical mechanical polishing, and method of chemical mechanical polishing

Номер патента: WO2009133793A1. Автор: 裕貴 仕田,英一郎 國谷,崇文 清水,馬場　淳. Владелец: Jsr株式会社. Дата публикации: 2009-11-05.

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for chemical mechanical polishing, and method of chemical mechanical polishing

Номер патента: KR101610976B1. Автор: 히로타카 시다,다카후미 시미즈,아츠시 바바,에이치로 구니타니. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2016-04-08.

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for chemical mechanical polishing, and method of chemical mechanical polishing

Номер патента: TW201000614A. Автор: Hirotaka Shida,Takafumi Shimizu,Eiichirou KUNITANI,Atsushi Baba. Владелец: JSR Corp. Дата публикации: 2010-01-01.

Method of enhancing the removal rate of polysilicon

Номер патента: US20230099954A1. Автор: Yi Guo. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-03-30.

Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device

Номер патента: US20100221918A1. Автор: Hirotaka Shida,Akihiro Takemura,Mitsuru Meno,Yuuji Shimoyama. Владелец: JSR Corp. Дата публикации: 2010-09-02.

Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device

Номер патента: WO2009031389A1. Автор: Hirotaka Shida,Akihiro Takemura,Mitsuru Meno,Yuuji Shimoyama. Владелец: JSR Corporation. Дата публикации: 2009-03-12.

Composition for chemical mechanical polishing, chemical mechanical polishing method, and method for manufacturing particles for chemical mechanical polishing

Номер патента: WO2021124771A1. Автор: 達也 山中,鵬宇 王,康二 中西. Владелец: Jsr株式会社. Дата публикации: 2021-06-24.

Aqueous dispersion for chemical mechanical polishing, kit for preparing the dispersion, method for preparing aqueous dispersion for chemical mechanical polishing using the kit, and chemical mechanical polishing method for semiconductor device

Номер патента: WO2009098951A1. Автор: Hirotaka Shida,Akihiro Takemura. Владелец: JSR Corporation. Дата публикации: 2009-08-13.

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: US6276996B1. Автор: Dinesh Chopra. Владелец: Micron Technology Inc. Дата публикации: 2001-08-21.

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: WO2000028586A2. Автор: Dinesh Chopra. Владелец: MICRON TECHNOLOGY, INC.. Дата публикации: 2000-05-18.

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: US6676484B2. Автор: Dinesh Chopra. Владелец: Micron Technology Inc. Дата публикации: 2004-01-13.

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: WO2000028586A3. Автор: Dinesh Chopra. Владелец: Micron Technology Inc. Дата публикации: 2000-10-12.

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: US20010016469A1. Автор: Dinesh Chopra. Владелец: Individual. Дата публикации: 2001-08-23.

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: EP1138069A2. Автор: Dinesh Chopra. Владелец: Micron Technology Inc. Дата публикации: 2001-10-04.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: KR101276026B1. Автор: 노리히꼬 이께다,도미까즈 우에노. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2013-06-19.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: EP1962334A1. Автор: Norihiko Ikeda,Tomikazu Ueno. Владелец: JSR Corp. Дата публикации: 2008-08-27.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: EP1962334A4. Автор: Norihiko Ikeda,Tomikazu Ueno. Владелец: JSR Corp. Дата публикации: 2010-11-17.

Slurry for chemical mechanical polishing, method of chemical mechanical polishing and process for manufacturing electronic device

Номер патента: WO2007135794A1. Автор: Toranosuke Ashizawa,Naoyuki Koyama,Takayuki Nakakawaji,Ryo Ota. Владелец: HITACHI CHEMICAL COMPANY, LTD.. Дата публикации: 2007-11-29.

Slurry composition for chemical-mechanical polishing and method of chemical-mechanical polishing with the same

Номер патента: US20090203213A1. Автор: Jong-Won Lee,Chang-ki Hong,Sang-Yeob Han. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2009-08-13.

Slurry composition for chemical-mechanical polishing and method of chemical-mechanical polishing with the same

Номер патента: US8338300B2. Автор: Jong-Won Lee,Chang-ki Hong,Sang-Yeob Han. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2012-12-25.

Method of manufacturing slurry for chemical mechanical polishing and slurry for chemical mechanical polishing using the same

Номер патента: KR101105480B1. Автор: 한명훈,황준하,서명원,윤영호,정우영. Владелец: 주식회사 케이씨텍. Дата публикации: 2012-01-13.

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and method for manufacturing semiconductor device

Номер патента: TW200845175A. Автор: Hirotaka Shida,Akihiro Takemura,Masatoshi Ikeda. Владелец: JSR Corp. Дата публикации: 2008-11-16.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: EP2131389A1. Автор: Taichi Matsumoto,Tomikazu Ueno,Michiaki Andou. Владелец: JSR Corp. Дата публикации: 2009-12-09.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: US20090221213A1. Автор: Hirotaka Shida,Akihiro Takemura,Tomohisa Konno,Masayuki Motonari,Yuuji Namie. Владелец: JSR Corp. Дата публикации: 2009-09-03.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: WO2008044477A1. Автор: Hirotaka Shida,Akihiro Takemura,Tomohisa Konno,Masayuki Motonari,Yuuji Namie. Владелец: JSR Corporation. Дата публикации: 2008-04-17.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: KR101431299B1. Автор: 미치아키 안도,도미카즈 우에노,다이치 마츠모토. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2014-08-20.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: JP5403262B2. Автор: 富和 植野,民智明 安藤,太一 松本. Владелец: JSR Corp. Дата публикации: 2014-01-29.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: WO2008117593A1. Автор: Taichi Matsumoto,Tomikazu Ueno,Michiaki Andou. Владелец: JSR Corporation. Дата публикации: 2008-10-02.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: EP2071615B1. Автор: Hirotaka Shida,Akihiro Takemura,Tomohisa Konno,Masayuki Motonari,Yuuji Namie. Владелец: JSR Corp. Дата публикации: 2012-07-18.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: EP2071615A1. Автор: Hirotaka Shida,Akihiro Takemura,Tomohisa Konno,Masayuki Motonari,Yuuji Namie. Владелец: JSR Corp. Дата публикации: 2009-06-17.

Aqueous dispersion for chemical mechanical polishing, method for producing the same, and chemical mechanical polishing method

Номер патента: WO2008010499A1. Автор: Norihiko Ikeda,Tomikazu Ueno,Mitsuru Memo. Владелец: JSR Corporation. Дата публикации: 2008-01-24.

Aqueous dispersion for chemical mechanical polishing, method for producing the same, and chemical mechanical polishing method

Номер патента: TW200813205A. Автор: Norihiko Ikeda,Tomikazu Ueno,Mitsuru Meno. Владелец: JSR Corp. Дата публикации: 2008-03-16.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: KR101406487B1. Автор: 마사유끼 모또나리,도모히사 곤노,히로따까 시다,아끼히로 다께무라,유우지 나미에. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2014-06-12.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: JPWO2008117592A1. Автор: 富和 植野,民智明 安藤,太一 松本. Владелец: JSR Corp. Дата публикации: 2010-07-15.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device

Номер патента: WO2008117592A1. Автор: Taichi Matsumoto,Tomikazu Ueno,Michiaki Andou. Владелец: JSR Corporation. Дата публикации: 2008-10-02.

Polishing agent, method for manufacturing polishing agent, undiluted solution of polishing agent, container filled with undiluted solution of polishing agent, method for chemical mechanical polishing

Номер патента: TW201835287A. Автор: 上村哲也. Владелец: 日商富士軟片股份有限公司. Дата публикации: 2018-10-01.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: WO2009098924A1. Автор: Hirotaka Shida,Akihiro Takemura,Kazuhito Uchikura,Takafumi Shimizu,Masatoshi Ikeda,Shou Kubouchi,Yousuke Shibata. Владелец: JSR Corporation. Дата публикации: 2009-08-13.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: KR101563023B1. Автор: 히로타카 시다,다카후미 시미즈,마사토시 이케다,쇼 구보우치,요스케 시바타,미치아키 안도,가즈히토 우치쿠라,아키히로 다케무라. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2015-10-23.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing

Номер патента: DE602005002409T2. Автор: Masayuki Hattori,Nobuo Kawahashi,Norihiko Ikeda,Kazuo Nishimoto. Владелец: JSR Corp. Дата публикации: 2008-06-12.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: US20110081780A1. Автор: Hirotaka Shida,Akihiro Takemura,Kazuhito Uchikura,Michiaki Andou,Takafumi Shimizu,Masatoshi Ikeda,Shou Kubouchi,Yousuke Shibata. Владелец: JSR Corp. Дата публикации: 2011-04-07.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: US8506359B2. Автор: Hirotaka Shida,Akihiro Takemura,Kazuhito Uchikura,Takafumi Shimizu,Masatoshi Ikeda,Shou Kubouchi,Yousuke Shibata. Владелец: JSR Corp. Дата публикации: 2013-08-13.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: WO2009104517A1. Автор: 和一 内倉,裕貴 仕田,民智明 安藤,彰浩 竹村,正俊 池田,翔 窪内,崇文 清水,陽介 柴田. Владелец: Jsr株式会社. Дата публикации: 2009-08-27.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: TW200944583A. Автор: Hirotaka Shida,Akihiro Takemura,Kazuhito Uchikura,Michiaki Andou,Takafumi Shimizu,Masatoshi Ikeda,Shou Kubouchi,Yousuke Shibata. Владелец: JSR Corp. Дата публикации: 2009-11-01.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: US20110059680A1. Автор: Masayuki Motonari,Takashi Matsuda,Tomikazu Ueno,Eiichirou KUNITANI,Takahiro Iijima. Владелец: JSR Corp. Дата публикации: 2011-03-10.

Aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method using same

Номер патента: EP2533274A1. Автор: Akihiro Takemura,Tomohisa Konno,Tatsuya Yamanaka,Kouhei Yoshio. Владелец: JSR Corp. Дата публикации: 2012-12-12.

Aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method using same

Номер патента: WO2011093153A1. Автор: 達也 山中,彰浩 竹村,金野　智久,浩平 吉尾. Владелец: Jsr株式会社. Дата публикации: 2011-08-04.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method using same

Номер патента: WO2011016323A1. Автор: 康孝 亀井,達慶 河本,馬場　淳,祐吾 田井. Владелец: Jsr株式会社. Дата публикации: 2011-02-10.

Aqueous dispersion for chemical mechanical polishing, production method thereof, and chemical mechanical polishing method

Номер патента: US20090325323A1. Автор: Norihiko Ikeda,Tomikazu Ueno,Mitsuru Meno. Владелец: JSR Corp. Дата публикации: 2009-12-31.

Composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: WO2021111863A1. Автор: 山田　裕也,浩平 吉尾,岡本　匡史,紀彦 杉江. Владелец: Jsr株式会社. Дата публикации: 2021-06-10.

Composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: JP6892034B1. Автор: 山田　裕也,康孝 亀井,裕也 山田,鵬宇 王,紀彦 杉江. Владелец: JSR Corp. Дата публикации: 2021-06-18.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: US20110053462A1. Автор: Hirotaka Shida,Akihiro Takemura,Kazuhito Uchikura,Takafumi Shimizu,Masatoshi Ikeda,Shou Kubouchi,Yousuke Shibata. Владелец: JSR Corp. Дата публикации: 2011-03-03.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: US8741008B2. Автор: Masayuki Motonari,Takashi Matsuda,Tomikazu Ueno,Eiichirou KUNITANI,Takahiro Iijima. Владелец: JSR Corp. Дата публикации: 2014-06-03.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing

Номер патента: DE602005002409D1. Автор: Masayuki Hattori,Nobuo Kawahashi,Norihiko Ikeda,Kazuo Nishimoto. Владелец: JSR Corp. Дата публикации: 2007-10-25.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: WO2009104465A1. Автор: 和一 内倉,裕貴 仕田,民智明 安藤,彰浩 竹村,正俊 池田,翔 窪内,崇文 清水,陽介 柴田. Владелец: Jsr株式会社. Дата публикации: 2009-08-27.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: WO2009104334A1. Автор: 英一郎 國谷,正之 元成,富和 植野,孝浩 飯島,隆志 松田. Владелец: Jsr株式会社. Дата публикации: 2009-08-27.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: TW200936738A. Автор: Masayuki Motonari,Takashi Matsuda,Tomikazu Ueno,Eiichirou KUNITANI,Takahiro Iijima. Владелец: JSR Corp. Дата публикации: 2009-09-01.

Alumina abrasive grains for chemical mechanical polishing, production method therefor, and chemical mechanical polishing method

Номер патента: WO2020045087A1. Автор: 達也 山中,鵬宇 王,康二 中西. Владелец: Jsr株式会社. Дата публикации: 2020-03-05.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method using same

Номер патента: TW201109426A. Автор: Yasutaka Kamei,Tatsuyoshi Kawamoto,Atsushi Baba,Yuugo Tai. Владелец: JSR Corp. Дата публикации: 2011-03-16.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: WO2020045088A1. Автор: 達也 山中,鵬宇 王,康二 中西. Владелец: Jsr株式会社. Дата публикации: 2020-03-05.

Slurry composition for chemical mechanical polishing and process of chemical mechanical polishing

Номер патента: KR101481573B1. Автор: 이종원,한상엽,홍창기. Владелец: 삼성전자주식회사. Дата публикации: 2015-01-14.

Composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: JPWO2021095413A1. Автор: 康孝 亀井,裕也 山田,鵬宇 王,紀彦 杉江. Владелец: JSR Corp. Дата публикации: 2021-11-25.

Aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method using same

Номер патента: TW201139634A. Автор: Akihiro Takemura,Tomohisa Konno,Tatsuya Yamanaka,Kouhei Yoshio. Владелец: JSR Corp. Дата публикации: 2011-11-16.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: KR101562416B1. Автор: 히로타카 시다,다카후미 시미즈,마사토시 이케다,쇼 구보우치,요스케 시바타,가즈히토 우치쿠라,아키히로 다케무라. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2015-10-21.

A slurry composition for chemical mechanical polishing for polishing polycrystalline silicon film and method of making the same

Номер патента: DE112005003745B4. Автор: In Kyung Lee,Tae Young Lee,Jae Hoon Choung,Won Young Choi,Ji Chul Yang. Владелец: Cheil Industries Inc. Дата публикации: 2017-09-21.

Aqueous dispersion for chemical mechanical polishng and chemical mechanical polishing method for semiconductor device

Номер патента: US20100099260A1. Автор: Taichi Matsumoto,Tomikazu Ueno,Michiaki Andou. Владелец: JSR Corp. Дата публикации: 2010-04-22.

Polishing slurry for chemical mechanical polishing and method for polishing substrate

Номер патента: US20060124591A1. Автор: Yasushi Kurata,Kazuhiro Enomoto,Yuto Ootsuki,Kouji Haga. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2006-06-15.

Polishing slurry for chemical mechanical polishing and method for polishing substrate

Номер патента: US8231735B2. Автор: Yasushi Kurata,Kazuhiro Enomoto,Yuto Ootsuki,Kouji Haga. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2012-07-31.

Polishing slurry for chemical mechanical polishing and method for polishing substrate

Номер патента: US7311855B2. Автор: Yasushi Kurata,Kazuhiro Enomoto,Yuto Ootsuki,Kouji Haga. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2007-12-25.

Aqueous polishing composition and method for chemical mechanical polishing of substrates for electrical equipment, mechanical equipment and optical equipment

Номер патента: JP5965907B2. Автор: リー，ユツホウ,チュー，チョア‐チュイ,スンダール ヴェンカタラマン，シアム,ウエイン ピンダー，ハーヴェイ,イブラヒム，シェイク アンサル ウスマン,イブラヒム，シェイク アンサル ウスマン. Владелец: BASF SE. Дата публикации: 2016-08-10.

Slurry for chemical mechanical polishing, method of manufacturing the same, and polishing method using the same

Номер патента: KR960042922A. Автор: 마사가즈 무로야마. Владелец: 이데이 노부유키. Дата публикации: 1996-12-21.

Polishing slurry for chemical mechanical polishing and method for polishing substrate

Номер патента: US20080176982A1. Автор: Yasushi Kurata,Kazuhiro Enomoto,Yuto Ootsuki,Kouji Haga. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2008-07-24.

A slurry composition for chemical mechanical polishing for polishing polycrystalline silicon film and method of making the same

Номер патента: DE112005003745T5. Автор: Won Young Choi,Ji Chul Yang,Jae Hoon Ahnyang Choung,In Kyung Euiwang Lee,Tae Young Gunpo Lee. Владелец: Cheil Industries Inc. Дата публикации: 2008-11-20.

Polishing composition and method of polishing a substrate having enhanced defect reduction

Номер патента: US12024652B2. Автор: Yi Guo. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2024-07-02.

Polishing slurries and methods for chemical mechanical polishing

Номер патента: US7186653B2. Автор: Udaya B. Patri,Youngki Hong,Sharath Hegde,Sunil Chandra Jha,Sreehari Nimmala,Suryadevera V. Babu. Владелец: Climax Engineered Materials LLC. Дата публикации: 2007-03-06.

Polishing slurries and methods for chemical mechanical polishing

Номер патента: US20050211953A1. Автор: Sunil Jha,Youngki Hong,Sharath Hegde,Udaya Patri,Sreehari Nimmala,S.V. Babu. Владелец: Climax Engineered Materials LLC. Дата публикации: 2005-09-29.

Polishing slurries and methods for chemical mechanical polishing

Номер патента: US7553430B2. Автор: Sharath Hedge,Udaya B. Patri,Youngki Hong,Sreehari Nimmala,Sunil Chandra,Suryadevara Vijayakumar Babu. Владелец: Climax Engineered Materials LLC. Дата публикации: 2009-06-30.

Polishing slurries and methods for chemical mechanical polishing

Номер патента: US20070043230A1. Автор: Sunil Jha,Youngki Hong,Sharath Hegde,Udaya Patri,Sreehari Nimmala,S.V. Babu. Владелец: Patri Udaya B. Дата публикации: 2007-02-22.

Polishing slurries and methods for chemical mechanical polishing

Номер патента: KR100946421B1. Автор: 찬드라 자 선일,스리하리 니마라,샤라스 헤지,에스. 브이. 바부,비. 패트리 유데이아,영기 홍. Владелец: 클라이막스 엔지니어레드 메테리얼스, 엘엘씨. Дата публикации: 2010-03-10.

Polishing slurries and methods for chemical mechanical polishing

Номер патента: EP1856229A4. Автор: Youngki Hong,Sharath Hegde,Sunil Chandra Jha,Sreehari Nimmala,S V Babu,Udaya B Patri. Владелец: Climax Engineered Materials LLC. Дата публикации: 2009-11-18.

Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Номер патента: WO2012032469A1. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Sheik Ansar Usman Ibrahim. Владелец: Basf (China) Company Limited. Дата публикации: 2012-03-15.

Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Номер патента: SG188460A1. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Ibrahim Sheik Ansar Usman. Владелец: BASF SE. Дата публикации: 2013-04-30.

Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Номер патента: EP2614123B1. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Sheik Ansar Usman Ibrahim. Владелец: BASF SE. Дата публикации: 2017-06-28.

Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices

Номер патента: EP2614121B1. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Sheik Ansar Usman Ibrahim. Владелец: BASF SE. Дата публикации: 2019-03-06.

Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Номер патента: KR101907863B1. Автор: 유주오 리,제-주 추,시얌 순다르 벤카타라만,하비 웨인 핀더,이브라힘 쉐익 안사르 우스만. Владелец: 바스프 에스이. Дата публикации: 2018-10-15.

Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Номер патента: IL225085A. Автор: . Владелец: BASF SE. Дата публикации: 2017-09-28.

Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Номер патента: MY164859A. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Ibrahim Sheik Ansar Usman. Владелец: BASF SE. Дата публикации: 2018-01-30.

Aqueous polishing composition and process for chemically mechanically polishing substrate matetials for electrical, mechanical and optical devices

Номер патента: TW201211223A. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Ibrahim Sheik Ansar Usman. Владелец: BASF SE. Дата публикации: 2012-03-16.

Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Номер патента: EP2614123A4. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Ibrahim Sheik Ansar Usman. Владелец: BASF SE. Дата публикации: 2014-07-30.

Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices

Номер патента: EP2614123A1. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Sheik Ansar Usman Ibrahim. Владелец: BASF SE. Дата публикации: 2013-07-17.

Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices

Номер патента: WO2012032461A1. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Sheik Ansar Usman Ibrahim. Владелец: Basf (China) Company Limited. Дата публикации: 2012-03-15.

Polishing slurry for chemical-mechanical polishing of metal and metal/dielectric structures, method for produce thereof and use thereof

Номер патента: HU0105244A3. Автор: . Владелец: Bayer AG. Дата публикации: 2003-07-28.

Polishing slurry for chemical-mechanical polishing of metal and metal/dielectric structures, method for produce thereof and use thereof

Номер патента: HU0105244D0. Автор: Passing Gerd Dr,Tsai Ming-Shih Dr,Vogt Kristina Dr. Владелец: Bayer AG. Дата публикации: 2002-02-28.

Polishing slurry for chemical-mechanical polishing of metal and metal/dielectric structures, method for produce thereof and use thereof

Номер патента: HU0105244A2. Автор: Gerd Passing,Kristina Vogt,Ming-Shih Tsai. Владелец: Bayer Ag.. Дата публикации: 2003-02-28.

Slurry for chemical mechanical polishing, method for producing the same, and polishing method using the same

Номер патента: JP3438410B2. Автор: 雅和 室山. Владелец: Sony Corp. Дата публикации: 2003-08-18.

Stabilized composition for chemical mechanical polishing and method for polishing a substrate

Номер патента: DE102011104161A1. Автор: Yi Guo,Zhendong Liu,Kancharla-Arun Kumar Reddy,Guangyun Zhang. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2012-01-26.

Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices

Номер патента: SG188206A1. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Ibrahim Sheik Ansar Usman. Владелец: BASF SE. Дата публикации: 2013-04-30.

Polishing slurries and methods for chemical mechanical polishing

Номер патента: US20070023731A1. Автор: Sharath Hedge,Sunil Jha,Youngki Hong,Udaya Patri,Sreehari Nimmala,S.V. Babu. Владелец: Climax Engineered Materials LLC. Дата публикации: 2007-02-01.

Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices

Номер патента: TW201213469A. Автор: Yuzhuo Li,Jea-Ju Chu,Shyam Sundar Venkataraman,Harvey Wayne Pinder,Ibrahim Sheik Ansar Usman. Владелец: BASF SE. Дата публикации: 2012-04-01.

Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices

Номер патента: KR101908280B1. Автор: 위주오 리,제-주 추,시얌 순다르 벤카타라만,하비 웨인 핀더,이브라힘 쉐익 안사르 우스만. Владелец: 바스프 에스이. Дата публикации: 2018-10-16.

Composition for chemical mechanical polishing and method for polishing

Номер патента: WO2021251108A1. Автор: 浩平 吉尾,裕也 山田. Владелец: Jsr株式会社. Дата публикации: 2021-12-16.

Composition for chemical mechanical polishing and method for polishing

Номер патента: US20230002640A1. Автор: Pengyu Wang,Yuuya YAMADA,Kouhei Nishimura,Shuuhei Nakamura. Владелец: JSR Corp. Дата публикации: 2023-01-05.

Composition for chemical mechanical polishing and method for polishing

Номер патента: TW202132527A. Автор: 山田裕也,王鵬宇,西村康平,中村柊平. Владелец: 日商Ｊｓｒ股份有限公司. Дата публикации: 2021-09-01.

Formulations for chemical mechanical polishing pads and cmp pads made therewith

Номер патента: US20180148537A1. Автор: Michael E. Mills,Bryan E. Barton. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2018-05-31.

Chemical mechanical polishing pad and method of making same

Номер патента: US09586305B2. Автор: Yuhua Tong,Bainian Qian,Julia KOZHUKH,Tony Quan Tran,Marty W. Degroot,George C. Jacob,Teresa Brugarolas Brufau,Fengji Yeh,David Michael Veneziale,Diego Lugo,Andrew Wank,Jeffrey B. Miller,Marc R. Stack. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-03-07.

Chemical mechanical polishing pad and preparation thereof

Номер патента: US20230112228A1. Автор: Bainian Qian,Michael E. Mills,Lyla M. El-Sayed,Bradley K. Taylor,Robert M. Blomquist,Kancharla-Arun REDDY,Shijing Xia. Владелец: DuPont Electronics Inc. Дата публикации: 2023-04-13.

Polishing slurry and method for chemical-mechanical polishing

Номер патента: US20020098700A1. Автор: James Alwan,Craig Carpenter. Владелец: Individual. Дата публикации: 2002-07-25.

Self-stopping polishing composition and method for high topological selectivity

Номер патента: US12116502B2. Автор: Michael WILLHOFF,Sudeep Pallikkara Kuttiatoor,Juyeon Chang,Jinfeng Wang,Sajo Naik,Elliot KNAPTON. Владелец: CMC Materials LLC. Дата публикации: 2024-10-15.

Ceramic composite for light conversion and method for manufacture thereof

Номер патента: US09543480B2. Автор: Toshiro Doi,Takafumi Kawano,Dai Inamori,Syuhei Kurokawa. Владелец: UBE Industries Ltd. Дата публикации: 2017-01-10.

Polishing compositions for reduced defectivity and methods of using the same

Номер патента: US12065587B2. Автор: James Mcdonough,Saul Alvarado. Владелец: Fujifilm Electronic Materials USA Inc. Дата публикации: 2024-08-20.

Self-stopping polishing composition and method for high topological selectivity

Номер патента: EP4263735A1. Автор: Michael WILLHOFF,Sudeep Pallikkara Kuttiatoor,Juyeon Chang,Jinfeng Wang,Sajo Naik,Elliot KNAPTON. Владелец: CMC Materials LLC. Дата публикации: 2023-10-25.

Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device

Номер патента: EP2128893A4. Автор: Tomohisa Konno,Michiaki Andou. Владелец: JSR Corp. Дата публикации: 2011-05-18.

Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device

Номер патента: WO2008114563A1. Автор: Tomohisa Konno,Michiaki Andou. Владелец: JSR Corporation. Дата публикации: 2008-09-25.

Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device

Номер патента: TW200839864A. Автор: Tomohisa Konno,Michiaki Andou. Владелец: JSR Corp. Дата публикации: 2008-10-01.

Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device

Номер патента: EP2128893A1. Автор: Tomohisa Konno,Michiaki Andou. Владелец: JSR Corp. Дата публикации: 2009-12-02.

The system, method and abrasive slurry for chemical mechanical polishing

Номер патента: WO2006042466A1. Автор: Andy Chunxiao Yang,Chris Chang Yu. Владелец: Anji Microelectronics (Shanghai) Co., Ltd.. Дата публикации: 2006-04-27.

Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing

Номер патента: EP1333476A2. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Masayuki Motonari. Владелец: JSR Corp. Дата публикации: 2003-08-06.

Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing

Номер патента: EP1333476A3. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Masayuki Motonari. Владелец: JSR Corp. Дата публикации: 2005-10-19.

Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing

Номер патента: US7183211B2. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Masayuki Motonari. Владелец: JSR Corp. Дата публикации: 2007-02-27.

Aqueous dispersion for chemical mechanical polishing, kit for their preparation and chemical-mechanical polishing process

Номер патента: DE602006002900D1. Автор: Masayuki Hattori,Nobuo Kawahashi,Kazuhito Uchikura. Владелец: JSR Corp. Дата публикации: 2008-11-13.

Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing

Номер патента: US20030153183A1. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Masayuki Motonari. Владелец: JSR Corp. Дата публикации: 2003-08-14.

Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing

Номер патента: TWI257420B. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Masayuki Motonari. Владелец: JSR Corp. Дата публикации: 2006-07-01.

Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing

Номер патента: TW200302267A. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Masayuki Motonari. Владелец: JSR Corp. Дата публикации: 2003-08-01.

Composition and method for polishing boron doped polysilicon

Номер патента: EP4284885A1. Автор: Brian Reiss,Alexander W. HAINS,Roman A. Ivanov,Brittany Johnson. Владелец: CMC Materials LLC. Дата публикации: 2023-12-06.

Slurry composition for chemical mechanical polishing, method of preparing the same, and polishing method using the same

Номер патента: US10047248B2. Автор: Un-Gyu Paik,Ye-Hwan Kim,Ji-hoon SEO. Владелец: Industry University Cooperation Foundation IUCF HYU. Дата публикации: 2018-08-14.

Method for controlling polysilicon removal

Номер патента: WO2007041203A1. Автор: Jeffrey Dysard,Timothy Johns,Paul Feeney. Владелец: Cabot Microelectronics Corporation. Дата публикации: 2007-04-12.

Fine polishing solution and fine polishing method for chemical mechanical polishing of germanium wafer

Номер патента: CN114479674A. Автор: 王元立,陈美琳,贺友华. Владелец: Beijing Tongmei Xtal Technology Co Ltd. Дата публикации: 2022-05-13.

Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor

Номер патента: US20070000872A1. Автор: Gaku Minamihaba,Hiroyuki Yano,Yukiteru Matsui,Atsushi Shigeta. Владелец: Toshiba Corp. Дата публикации: 2007-01-04.

Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor

Номер патента: US7402521B2. Автор: Gaku Minamihaba,Hiroyuki Yano,Yukiteru Matsui,Atsushi Shigeta. Владелец: Toshiba Corp. Дата публикации: 2008-07-22.

Slurry composition for chemical mechanical polishing, method of planarizing surface of semiconductor device using the same and method of controlling selectivity of slurry composition

Номер патента: KR100578596B1. Автор: 백운규,박재근,박진형,카토타케오. Владелец: 주식회사 사무코. Дата публикации: 2006-05-12.

Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations

Номер патента: EP1419853A1. Автор: Manoocher Birang,Allan Gleason,Grigory Pyatigorsky,Nils Johansson. Владелец: Applied Materials Inc. Дата публикации: 2004-05-19.

Chemical mechanical polishing system for a workpiece, arithmetic system, and method of producing simulation model for chemical mechanical polishing

Номер патента: US20230043639A1. Автор: Norikazu Suzuki,Yoshihiro Mochizuki,Hozumi Yasuda,Yohei Hashimoto. Владелец: Kanazawa University NUC. Дата публикации: 2023-02-09.

Retainer ring for chemical-mechanical polishing device

Номер патента: US20160158910A1. Автор: Jae-Bok Lee,Jun-Je LEE. Владелец: Will Be S and T Co Ltd. Дата публикации: 2016-06-09.

Substrate holder to reduce substrate edge stress during chemical mechanical polishing

Номер патента: WO2012012056A2. Автор: HUNG Chih Chen,Samuel Chu-Chiang Hsu,Denis M. Koosau,Gautam Shashank. Владелец: Applied Materials, Inc.. Дата публикации: 2012-01-26.

Substrate holder to reduce substrate edge stress during chemical mechanical polishing

Номер патента: WO2012012056A3. Автор: HUNG Chih Chen,Samuel Chu-Chiang Hsu,Denis M. Koosau,Gautam Shashank. Владелец: Applied Materials, Inc.. Дата публикации: 2012-04-12.

Retainer ring for chemical-mechanical polishing device

Номер патента: US09827647B2. Автор: Jae-Bok Lee,Jun-Je LEE. Владелец: Will Be S and T Co Ltd. Дата публикации: 2017-11-28.

Temperature modification for chemical mechanical polishing

Номер патента: US09550270B2. Автор: Yeh-Chieh Wang,Chi-Hao Huang,Jung-Lung Hung,Rong-June Hsiao,Hong-Hsing Chou. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-01-24.

Polishing pad for chemical mechanical polishing, chemical mechanical polishing apparatus inluding the same, and method of fabricating semiconductor device using the chemical mechanical polishing apparatus

Номер патента: US20230211456A1. Автор: Sang Kyun Kim,Bo Un Yoon,Byung Keun Hwang,Bo yun KIM,Hyo San LEE,Yea Rin Byun,In Kwon Kim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-07-06.

Steam treatment stations for chemical mechanical polishing system

Номер патента: US20240307928A1. Автор: Hui Chen,Jianshe Tang,Paul D. Butterfield,Shou-sung Chang,Chih Chung Chou,Hari Soundararajan,Haosheng Wu,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2024-09-19.

Vacuum assembly for chemical mechanical polishing

Номер патента: US20200101580A1. Автор: Shih-Ho Lin,Yu-chen Wei,Chun-Jui Chu,Chih-Yuan Yang,Jen Chieh Lai,Szu-Cheng Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2020-04-02.

Slurry distribution device for chemical mechanical polishing

Номер патента: US11806835B2. Автор: Jianshe Tang,Paul D. Butterfield,Stephen Jew,Shou-sung Chang,Bum Jick KIM,Haosheng Wu,Yen-Chu Yang,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2023-11-07.

Slurry distribution device for chemical mechanical polishing

Номер патента: US11986926B2. Автор: Jianshe Tang,Paul D. Butterfield,Stephen Jew,Shou-sung Chang,Bum Jick KIM,Haosheng Wu,Yen-Chu Yang,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2024-05-21.

Chemical mechanical polishing apparatus and method of replacing polishing pad using the same

Номер патента: US20240217057A1. Автор: Chungki MIN,Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-04.

Chemical mechanical polishing apparatus and method of controlling the same

Номер патента: US20240217059A1. Автор: Wonkeun Cho. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-04.

System and method for monitoring chemical mechanical polishing

Номер патента: US20230182257A1. Автор: Chih-Yu Wang,Tien-Wen Wang,In-Tsang Lin,Hsin-Hui Chou. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-06-15.

Chemical mechanical polishing apparatus and method of manufacturing semiconductor device

Номер патента: US20200070300A1. Автор: Ji Min Lee,Eun Kyung Hong,Sung Hyup Kim,Nam Il Koo,Ji Min CHOI,Ik Seon JEON,Sang Yeon OH. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-03-05.

Chemical mechanical polishing apparatus and method using the same

Номер патента: US20230191555A1. Автор: Hoyoung Kim,Jinyoung Park,Jaehyug LEE,Chaelyoung KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-06-22.

Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing

Номер патента: TWI634956B. Автор: 陳輝. Владелец: 應用材料股份有限公司. Дата публикации: 2018-09-11.

Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing

Номер патента: TW201501820A. Автор: Hui Chen. Владелец: Applied Materials Inc. Дата публикации: 2015-01-16.

Apparatus and method for chemical mechanical polishing

Номер патента: US20200198088A1. Автор: Ilcheol Shin,Sung-Chang Park,Kyoungwoo Kim,Young-Kyun Woo,Hak-Jae Im. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-06-25.

Equipment, apparatus and method of chemical mechanical polishing (cmp)

Номер патента: US20240227112A1. Автор: Ilyoung Yoon,Seungjun LEE,Jinoh Im. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-11.

Chemical mechanical polishing pad with clear endpoint detection window

Номер патента: US20150306730A1. Автор: Bainian Qian,Marty W. Degroot. Владелец: Dow Global Technologies LLC. Дата публикации: 2015-10-29.

Chemical mechanical polishing pad with clear endpoint detection window

Номер патента: US09333620B2. Автор: Bainian Qian,Marty W. Degroot. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2016-05-10.

Chemical-mechanical polishing (CMP) apparatus

Номер патента: US5705435A. Автор: Lai-Tuh Chen. Владелец: Industrial Technology Research Institute ITRI. Дата публикации: 1998-01-06.

Steam treatment stations for chemical mechanical polishing system

Номер патента: US20220388041A1. Автор: Hui Chen,Jianshe Tang,Paul D. Butterfield,Shou-sung Chang,Chih Chung Chou,Hari Soundararajan,Haosheng Wu,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2022-12-08.

Steam treatment stations for chemical mechanical polishing system

Номер патента: US20200376523A1. Автор: Hui Chen,Jianshe Tang,Paul D. Butterfield,Shou-sung Chang,Chih Chung Chou,Hari Soundararajan,Haosheng Wu,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2020-12-03.

Steam treatment stations for chemical mechanical polishing system

Номер патента: US12030093B2. Автор: Hui Chen,Jianshe Tang,Paul D. Butterfield,Shou-sung Chang,Chih Chung Chou,Hari Soundararajan,Haosheng Wu,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2024-07-09.

Chemical mechanical polishing apparatus for controlling polishing uniformity

Номер патента: US20200185231A1. Автор: Seung-Ho Park,Hyo-san Lee,In-Kwon Kim,Sang-Won Bae,Woo-in Lee,Sun-jae Jang. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-06-11.

Chemical mechanical polishing (cmp) apparatus and method of controlling thereof

Номер патента: US20240238936A1. Автор: Wonkeun Cho,Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-18.

Chemical mechanical polishing method for first interlayer dielectric layer

Номер патента: US09490175B2. Автор: Ji Cheng,Jian Zhao. Владелец: Semiconductor Manufacturing International Shanghai Corp. Дата публикации: 2016-11-08.

Chemical mechanical polishing apparatus

Номер патента: US12020946B2. Автор: Yu-Ping TSENG,Ren-Hao JHENG. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-06-25.

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Номер патента: US12023853B2. Автор: Rajeev Bajaj,Fred C. Redeker,Kasiraman Krishnan,Mahendra C. Orilall,Daniel REDFIELD,Nag B. Patibandla,Gregory E. Menk,Jason G. Fung,Russell Edward Perry. Владелец: Applied Materials Inc. Дата публикации: 2024-07-02.

Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control

Номер патента: WO2003082522A8. Автор: Yehiel Gotkis,Bruno Morel,Rodney Kistler,Aleksander Owczarz,David J Hemker,Damon V Williams. Владелец: Lam Res Corp. Дата публикации: 2004-12-09.

Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control

Номер патента: EP1487611A1. Автор: Yehiel Gotkis,Bruno Morel,Rodney Kistler,Aleksander Owczarz,David J. Hemker,Damon V. Williams. Владелец: Lam Research Corp. Дата публикации: 2004-12-22.

Adapative endpoint method for pad life effect on chemical mechanical polishing

Номер патента: US20130146224A1. Автор: Hui-Chi Huang,Chu-An Lee,Peng-Chung Jangjian. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2013-06-13.

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Номер патента: US09776361B2. Автор: Rajeev Bajaj,Fred C. Redeker,Kasiraman Krishnan,Mahendra C. Orilall,Daniel REDFIELD,Nag B. Patibandla,Gregory E. Menk,Jason G. Fung,Russell Edward Perry. Владелец: Applied Materials Inc. Дата публикации: 2017-10-03.

Chemical mechanical polishing apparatus

Номер патента: US20240304455A1. Автор: Yu-Ping TSENG,Ren-Hao JHENG. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-09-12.

Polishing pad, chemical mechanical polishing apparatus including the same, and method for manufacturing semiconductor device using the same

Номер патента: US20230219191A1. Автор: Byoung Ho Kwon,Ji Su Kim,Sanha Kim,Sukkyung Kang,Ji-hun Jeong,Myung-Ki Hong,Dong Geun Kim,Hyun Jun Ryu,Yeong Bong PARK. Владелец: Korea Advanced Institute of Science and Technology KAIST. Дата публикации: 2023-07-13.

Chemical mechanical polishing method

Номер патента: US20240308021A1. Автор: Chi-Hung Liao,Wei-Chang Cheng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-09-19.

Method of chemical mechanical polishing

Номер патента: US20050070091A1. Автор: Hyo-Jong Lee,Sung-Bae Lee,Sang-Rok Ha. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2005-03-31.

Method of manufacturing semiconductor device using single slurry chemical mechanical polishing (cmp) process

Номер патента: US20230215926A1. Автор: SEUNGJAE LEE,Ilyoung Yoon,JaEung Koo,Boun Yoon,Joongsuk Oh,Kangchun LEE,Junhwan Yim,Huiteak Hong. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-07-06.

Chemical mechanical polishing method and chemical mechanical polishing device

Номер патента: EP2079106A3. Автор: Masanori Miyata,Kenji Nishihara,Tetsuya Okada,Akinori Suzuki,Tadao Uehara,Koichi Sogawa,Tohru Haruki,Taro Usami,Shisyo Chin,Hiroaki Teratani,Yuuichi Kohno. Владелец: Ricoh Co Ltd. Дата публикации: 2012-03-07.

Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical mechanical polishing

Номер патента: EP1372907A2. Автор: Miguel A. Saldana,Damon Vincent Williams. Владелец: Lam Research Corp. Дата публикации: 2004-01-02.

Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical-mechanical polishing

Номер патента: EP1372907B1. Автор: Miguel A. Saldana,Damon Vincent Williams. Владелец: Lam Research Corp. Дата публикации: 2006-11-29.

Chemical mechanical polishing using time share control

Номер патента: US11931854B2. Автор: Wei Lu,Jianshe Tang,Jimin Zhang,Brian J. Brown,Priscilla Diep LaRosa. Владелец: Applied Materials Inc. Дата публикации: 2024-03-19.

Chemical mechanical polishing apparatus and method

Номер патента: US12076831B2. Автор: Shih-Ho Lin,Jen-Chieh LAI,Jheng-Si SU,Yu-chen Wei,Chun-Chieh Chan. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-09-03.

Spherical drive assembly for chemical mechanical planarization

Номер патента: WO2002060643A9. Автор: David G Halley. Владелец: STRASBAUGH. Дата публикации: 2003-09-12.

Endpoint control during chemical mechanical polishing by detecting interface between different layers through selectivity change

Номер патента: WO2012012052A3. Автор: Wen-Chiang Tu,Zhihong Wang,Xiaoyuan Hu (Sandra). Владелец: Applied Materials, Inc.. Дата публикации: 2012-04-12.

Endpoint control during chemical mechanical polishing by detecting interface between different layers through selectivity change

Номер патента: WO2012012052A2. Автор: Wen-Chiang Tu,Zhihong Wang,Xiaoyuan Hu (Sandra). Владелец: Applied Materials, Inc.. Дата публикации: 2012-01-26.

Chemical mechanical polishing device and polishing method

Номер патента: US20240227122A9. Автор: Kai-Yao Shih,Ming-Hsiang Chen,Shih-Ci Yen. Владелец: Powerchip Semiconductor Manufacturing Corp. Дата публикации: 2024-07-11.

Methods for planarizing a substrate using a combined wet etch and chemical mechanical polishing (cmp) process

Номер патента: US20240087907A1. Автор: Shan Hu,Eric Chih-Fang Liu,Henan ZHANG,Sangita Kumari,Peter Delia. Владелец: Tokyo Electron Ltd. Дата публикации: 2024-03-14.

Chemical mechanical polishing (cmp) apparatus

Номер патента: US20240157502A1. Автор: Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-16.

Chemical mechanical polishing pad having holes and/or grooves

Номер патента: EP1417703B1. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2011-04-06.

Chemical mechanical polishing pad having holes and/or grooves

Номер патента: EP1417703A1. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2004-05-12.

Chemical mechanical polishing apparatus and chemical mechanical polishing method

Номер патента: US20240278383A1. Автор: Dongchan Kim,Byoungho Kwon,Hwiyoung JEONG. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-08-22.

Chemical mechanical polishing pad having holes and/or grooves

Номер патента: EP1417703A4. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2008-04-09.

Methods for planarizing a substrate using a combined wet etch and chemical mechanical polishing (CMP) process

Номер патента: US12100598B2. Автор: Shan Hu,Eric Chih-Fang Liu,Henan ZHANG,Sangita Kumari,Peter Delia. Владелец: Tokyo Electron Ltd. Дата публикации: 2024-09-24.

Chemical mechanical polishing pad composite polishing layer formulation

Номер патента: US09630293B2. Автор: Bainian Qian,Julia KOZHUKH,Tony Quan Tran,George C. Jacob,Teresa Brugarolas Brufau,Jeffrey James Hendron,Diego Lugo,Jeffrey B. Miller,Marc R. Stack. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-04-25.

Composite polishing layer chemical mechanical polishing pad

Номер патента: US09539694B1. Автор: Bainian Qian,Julia KOZHUKH,Teresa Brugarolas Brufau. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-01-10.

Chemical mechanical polishing pad with composite polishing layer

Номер патента: US09457449B1. Автор: Bainian Qian,Julia KOZHUKH,Teresa Brugarolas Brufau. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2016-10-04.

Improved chemical mechanical polishing pad and methods of making and using same

Номер патента: EP2025454A2. Автор: Richard D. Hreha,Ravichandra V. Palaparthi,Benjamin John Vining. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2009-02-18.

Alignment method for used in chemical mechanical polishing process

Номер патента: US5933744A. Автор: Tsu Shih,Chung-Long Chang,Jeng-Horng Chen,Jui-Yu Chang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 1999-08-03.

Chemical mechanical polishing pad with micro-holes

Номер патента: EP1430520A1. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2004-06-23.

Chemical mechanical polishing pad with micro-holes

Номер патента: EP1430520A4. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2008-04-09.

Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same

Номер патента: US20240308020A1. Автор: Chun-Hsi Huang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-09-19.

Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same

Номер патента: US12059769B2. Автор: Chun-Hsi Huang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-08-13.

Chemical-mechanical polishing apparatus, polishing pad and method for manufacturing semiconductor device

Номер патента: US20030168169A1. Автор: Kiyoshi Tanaka,Akira Ishikawa,Satoru Ide,Eiichi Yamamoto,Takahiko Mitsui. Владелец: Nikon Corp. Дата публикации: 2003-09-11.

Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process

Номер патента: US6159075A. Автор: Liming Zhang. Владелец: VLSI Technology Inc. Дата публикации: 2000-12-12.

Sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing systems

Номер патента: US11850700B2. Автор: Jamie Stuart Leighton,Van H. Nguyen,Jeonghoon Oh,Roger M. Johnson. Владелец: Applied Materials Inc. Дата публикации: 2023-12-26.

Chemical mechanical polishing of carbon hard mask

Номер патента: US20240194732A1. Автор: Sharath Hegde,Gary Ding,Matthew J. Prince,Walid M. Hafez,Inki Kim,Amitesh Shrivastava,Anurag A. Jain,Caitlin M. Kilroy. Владелец: Intel Corp. Дата публикации: 2024-06-13.

Conditioner and chemical mechanical polishing apparatus including the same

Номер патента: US20240173820A1. Автор: Donghoon Kwon,Yeonsu Go. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-30.

Chemical mechanical polishing apparatus

Номер патента: US20240238935A1. Автор: Gihwan KIM,Kihoon JANG,Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-18.

In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection

Номер патента: CA2036102C. Автор: Gabriel Lorimer Miller,Eric Richard Wagner. Владелец: American Telephone and Telegraph Co Inc. Дата публикации: 1995-04-04.

Chemical mechanical polishing tool, apparatus and method

Номер патента: WO2003022518A2. Автор: In-kwon Jeong. Владелец: Oriol, Inc.. Дата публикации: 2003-03-20.

Wafer support for chemical mechanical planarization

Номер патента: WO2002053320A9. Автор: David G Halley. Владелец: STRASBAUGH. Дата публикации: 2004-03-04.

Apparatus for holding wafer cassettes in a cassette in a cassette tub during a chemical mechanical polishing process

Номер патента: US20030119434A1. Автор: Yao-Hsiang Liang,Kevin Lai. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2003-06-26.

Device and method for preventing settlement of particles on a chemical-mechanical polishing pad

Номер патента: US5968841A. Автор: Michael Francis Lofaro,William Francis Landers,Adam Dan Ticknor. Владелец: International Business Machines Corp. Дата публикации: 1999-10-19.

Chemical mechanical polishing method

Номер патента: US11673223B2. Автор: Shih-Ho Lin,Jen-Chieh LAI,Jheng-Si SU,Yu-chen Wei,Chun-Chieh Chan. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-06-13.

Chemical mechanical polishing temperature scanning apparatus for temperature control

Номер патента: US11752589B2. Автор: Jianshe Tang,Shou-sung Chang,Hari Soundararajan,Haosheng Wu. Владелец: Applied Materials Inc. Дата публикации: 2023-09-12.

Chemical mechanical polishing temperature scanning apparatus for temperature control

Номер патента: US20230356351A1. Автор: Jianshe Tang,Shou-sung Chang,Hari Soundararajan,Haosheng Wu. Владелец: Applied Materials Inc. Дата публикации: 2023-11-09.

Chemical-mechanical polishing pad and chemical-mechanical polishing method

Номер патента: US20130189907A1. Автор: Yukio Hosaka,Takahiro Okamoto,Kotaro Kubo. Владелец: JSR Corp. Дата публикации: 2013-07-25.

Chemical mechanical polishing temperature scanning apparatus for temperature control

Номер патента: WO2020214706A1. Автор: Jianshe Tang,Shou-sung Chang,Hari Soundararajan,Haosheng Wu. Владелец: Applied Materials, Inc.. Дата публикации: 2020-10-22.

Loading device of chemical mechanical polishing equipment for semiconductor wafers

Номер патента: WO2007061170A1. Автор: Young Su Heo,Chang Il Kim,Young Min Na. Владелец: Doosan Mecatec Co., Ltd.. Дата публикации: 2007-05-31.

Chemical mechanical polishing method

Номер патента: US12017322B2. Автор: Chi-Hung Liao,Wei-Chang Cheng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-06-25.

Chemical mechanical polishing with multiple polishing pads

Номер патента: US20030190865A1. Автор: Sasson Somekh. Владелец: Applied Materials Inc. Дата публикации: 2003-10-09.

Chemical-mechanical polishing method and apparatus using ultrasound applied to the carrier and platen

Номер патента: US5688364A. Автор: Junichi Sato. Владелец: Sony Corp. Дата публикации: 1997-11-18.

Chemical mechanical polishing apparatus

Номер патента: US20180009078A1. Автор: Kyutae Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2018-01-11.

Spray system for slurry reduction during chemical mechanical polishing (cmp)

Номер патента: US11819976B2. Автор: Christopher Heung-Gyun Lee,Shou-sung Chang,Chih Chung Chou,Ekaterina MIKHAYLICHENKO,Erik Rondum,Anand Nilakantan IYER,Tiffany Yu-nung Cheung. Владелец: Applied Materials Inc. Дата публикации: 2023-11-21.

Chemical mechanical polishing method with in-line thickness detection

Номер патента: US6117780A. Автор: Kuei-Chang Tsai,Chin-Hsiang Chang,Li-Chun Hsien,Yun-Liang Ouyang. Владелец: Mosel Vitelic Inc. Дата публикации: 2000-09-12.

Apparatus for the chemical-mechanical polishing of wafers

Номер патента: US5964652A. Автор: Hermann Wendt,Hanno Melzner. Владелец: SIEMENS AG. Дата публикации: 1999-10-12.

Chemical mechanical polishing pads with a disulfide bridge

Номер патента: US20240100648A1. Автор: Jaeseok Lee,Jessica Lindsay,Satish Rai,Sangcheol Kim. Владелец: CMC Materials LLC. Дата публикации: 2024-03-28.

Chemical mechanical polishing pads with a disulfide bridge

Номер патента: WO2024064259A1. Автор: Jaeseok Lee,Satish Rai,Sangcheol Kim,Jessica TABERT. Владелец: CMC Materials LLC. Дата публикации: 2024-03-28.

Chemical mechanical polishing apparatus and chemical mechanical polishing system using the same

Номер патента: US20240051079A1. Автор: Hoyoung Kim,Boun Yoon,Eunkyoung Kim,Kiho BAE,Boumyoung Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-02-15.

Chemical mechanical polishing tool with robot access to cassettes

Номер патента: SG11201901582QA. Автор: Yongqi Hu,Thomas Lawrence Terry. Владелец: Applied Materials Inc. Дата публикации: 2019-03-28.

Rotary body module and chemical mechanical polishing apparatus having the same

Номер патента: US11590628B2. Автор: Kuntack Lee,Yonghee Lee,Byoungho Kwon,Taemin EARMME,Seungchul Han,Yungjun Kim,Hyunjoon Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-02-28.

Rotary body module and chemical mechanical polishing apparatus having the same

Номер патента: US20210008686A1. Автор: Kuntack Lee,Yonghee Lee,Byoungho Kwon,Taemin EARMME,Seungchul Han,Yungjun Kim,Hyunjoon Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2021-01-14.

Planarization of a polysilicon layer surface by chemical mechanical polish to improve lithography and silicide formation

Номер патента: US6548336B2. Автор: Steven C. Avanzino,Steven K. Park. Владелец: Advanced Micro Devices Inc. Дата публикации: 2003-04-15.

Planarization of a polysilicon layer surface by chemical mechanical polish to improve lithography and silicide formation

Номер патента: US20020072219A1. Автор: Steven Avanzino,Stephen Park. Владелец: Advanced Micro Devices Inc. Дата публикации: 2002-06-13.

Dummy metal gate structures to reduce dishing during chemical-mechanical polishing

Номер патента: US09601489B2. Автор: Chan-Hong Chern,Chih-Chang Lin,Jacklyn CHANG,Julie Tran. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-03-21.

Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof

Номер патента: US20040121704A1. Автор: Jun Liu,Huey-Ming Wang,Kunihiko Sakurai,Gerard Moloney,Peter Lao. Владелец: Ebara Technologies Inc. Дата публикации: 2004-06-24.

Spray system for slurry reduction during chemical mechanical polishing (cmp)

Номер патента: US20240042571A1. Автор: Christopher Heung-Gyun Lee,Shou-sung Chang,Chih Chung Chou,Erik Rondum,Ekaterina A. MIKHAYLICHENKO,Anand Nilakantan IYER,Tiffany Yu-nung Cheung. Владелец: Applied Materials Inc. Дата публикации: 2024-02-08.

Method and apparatus for controlling backside pressure during chemical mechanical polishing

Номер патента: US5925576A. Автор: Cheng-An Peng. Владелец: Promos Technologies Inc. Дата публикации: 1999-07-20.

Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection

Номер патента: AU3761799A. Автор: Trung T. Doan. Владелец: Micron Technology Inc. Дата публикации: 1999-11-16.

Chemical mechanical polishing tool with robot access to cassettes

Номер патента: US20180056479A1. Автор: Yongqi Hu,Thomas Lawrence Terry. Владелец: Applied Materials Inc. Дата публикации: 2018-03-01.

Chemical mechanical polishing pad and chemical mechanical polishing apparatus including the same

Номер патента: US11813714B2. Автор: Donghyuk Jang,Taesung Kim,Youngjin Hong,Seokjun HONG,Hojoong Kim,Junyong KIM. Владелец: Sungkyunkwan University Research and Business Foundation. Дата публикации: 2023-11-14.

Chemical mechanical polishing tool with robot access to cassettes

Номер патента: EP3504731A1. Автор: Yongqi Hu,Thomas Lawrence Terry. Владелец: Applied Materials Inc. Дата публикации: 2019-07-03.

Retainer ring used in chemical mechanical polishing apparatus

Номер патента: KR102510720B1. Автор: 송성훈,송종석. Владелец: 피코맥스(주). Дата публикации: 2023-03-16.

Real-time control of chemical-mechanical polishing processes using a shaft distortion measurement.

Номер патента: MY124028A. Автор: Li Leping,Wang Xinhui. Владелец: Ibm. Дата публикации: 2006-06-30.

Chemical mechanical polishing fixture having lateral perforation structures

Номер патента: US20140342643A1. Автор: Hui-Chen Yen. Владелец: KAI FUNG TECHNOLOGY Co Ltd. Дата публикации: 2014-11-20.

Gas delivery pallet assembly, cleaning unit and chemical mechanical polishing system having the same

Номер патента: WO2024085975A1. Автор: Edwin Velazquez. Владелец: Applied Materials, Inc.. Дата публикации: 2024-04-25.

Gas delivery pallet assembly, cleaning unit and chemical mechanical polishing system having the same

Номер патента: US20240131562A1. Автор: Edwin Velazquez. Владелец: Applied Materials Inc. Дата публикации: 2024-04-25.

Gas delivery pallet assembly, cleaning unit and chemical mechanical polishing system having the same

Номер патента: US20240226970A9. Автор: Edwin Velazquez. Владелец: Applied Materials Inc. Дата публикации: 2024-07-11.

Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces

Номер патента: US7131891B2. Автор: Jason B. Elledge. Владелец: Micron Technology Inc. Дата публикации: 2006-11-07.

Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces

Номер патента: US7357695B2. Автор: Jason B. Elledge. Владелец: Micron Technology Inc. Дата публикации: 2008-04-15.

Method for reducing dishing in chemical mechanical polishing

Номер патента: US20030054649A1. Автор: Shaoyu Wu,Joon Kang,Pang Foo. Владелец: INSTITUTE OF MICROELECTRONICS. Дата публикации: 2003-03-20.

Method for reducing dishing in chemical mechanical polishing

Номер патента: SG115405A1. Автор: Shaoyu Wu,Joon Mo Kang,Pang Dow Foo. Владелец: Inst Of Microelectronics. Дата публикации: 2005-10-28.

Manufacturing method for retainer ring of chemical mechanical polishing apparatus and manufacturing mold thereof

Номер патента: KR101365726B1. Автор: 유승열. Владелец: 유승열. Дата публикации: 2014-02-20.

Method for pre-texturing a chemical-mechanical polishing layer

Номер патента: DE102013012549A1. Автор: John Henry Nunley jun.,Andrew M. Geiger,Jeffrey H. Benedict. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2014-01-30.

Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces

Номер патента: TW200513345A. Автор: Jason B Elledge. Владелец: Micron Technology Inc. Дата публикации: 2005-04-16.

Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces

Номер патента: KR100870630B1. Автор: 제이슨 비. 엘레지. Владелец: 마이크론 테크놀로지 인코포레이티드. Дата публикации: 2008-11-26.

Method for reducing dishing in chemical mechanical polishing

Номер патента: US6670272B2. Автор: Shaoyu Wu,Joon Mo Kang,Pang Dow Foo. Владелец: Institute of Microelectronics ASTAR. Дата публикации: 2003-12-30.

Redistribution layer and methods of fabrication thereof

Номер патента: US20240355672A1. Автор: Dian-Hau Chen,Liang-Wei WANG,Chih-Pin CHIU,Lee-Wen Hsu,Zhen De Ma. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-10-24.

Structure and Method for Interconnection with Self-Alignment

Номер патента: US20210265208A1. Автор: Shau-Lin Shue,Tai-I Yang,Chia-Tien Wu,Hai-Ching Chen,Hsin-Ping Chen,Yu-Chieh Liao. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2021-08-26.

Structure and Method for Interconnection with Self-Alignment

Номер патента: US20200105598A1. Автор: Shau-Lin Shue,Tai-I Yang,Chia-Tien Wu,Hai-Ching Chen,Hsin-Ping Chen,Yu-Chieh Liao. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2020-04-02.

Method of forming interconnect structures

Номер патента: WO2024040200A1. Автор: Jian Zhou,Vinod Purayath,Kenta Ohama. Владелец: Avient Corporation. Дата публикации: 2024-02-22.

Method of fabricating a damascene structure

Номер патента: US20020137319A1. Автор: Chia-Lin Hsu,Teng-Chun Tsai,Hsueh-Chung Chen,Yung-Tsung Wei. Владелец: United Microelectronics Corp. Дата публикации: 2002-09-26.

Method of forming buried wiring in semiconductor device

Номер патента: US20050186795A1. Автор: Kazuhide Abe. Владелец: Individual. Дата публикации: 2005-08-25.

Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation

Номер патента: US09768066B2. Автор: XING Zhao,Duk Ju Na,Lai Yee Chia. Владелец: Stats Chippac Pte Ltd. Дата публикации: 2017-09-19.

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Номер патента: US09997451B2. Автор: Lawrence A. Clevenger,Michael RIZZOLO,Huai HUANG,Christopher J. Penny,Bartlet H. DeProspo,Benjamin David Briggs. Владелец: International Business Machines Corp. Дата публикации: 2018-06-12.

Method of forming a metal line of a semiconductor memory device

Номер патента: US20080026570A1. Автор: Young Mo Kim,Sung Min Hwang. Владелец: Hynix Semiconductor Inc. Дата публикации: 2008-01-31.

Methods for planarizing a metal layer

Номер патента: US20050142829A1. Автор: Joo-hyun Lee. Владелец: DongbuAnam Semiconductor Inc. Дата публикации: 2005-06-30.

Methods for planarizing a metal layer

Номер патента: US7192869B2. Автор: Joo-hyun Lee. Владелец: Dongbu Electronics Co Ltd. Дата публикации: 2007-03-20.

Methods of forming metal wiring of semiconductor devices

Номер патента: US20040132283A1. Автор: Dong-Ki Jeon,Jae-Won Han. Владелец: Anam Semiconductor Inc. Дата публикации: 2004-07-08.

Method of manufacturing semiconductor device having island structure

Номер патента: US20230420264A1. Автор: Chen-Cheng Chang. Владелец: Nanya Technology Corp. Дата публикации: 2023-12-28.

Manufacturing method of semiconductor chip, and kit

Номер патента: US11914300B2. Автор: Tetsuya Kamimura. Владелец: Fujifilm Corp. Дата публикации: 2024-02-27.

Arrays of memory cells individually comprising a capacitor and an elevationally-extending transistor, methods of forming a tier of an array of memory cells, and methods of forming an array of memory cells individually comprising a capacitor and an elevationally-extending transistor

Номер патента: US09837420B1. Автор: Durai Vishak Nirmal Ramaswamy. Владелец: Micron Technology Inc. Дата публикации: 2017-12-05.

Ceramic-metal joined body and method of manufacturing the same, and multi-piece ceramic-metal joined body and method of manufacturing the same

Номер патента: US20210107837A1. Автор: Koya Arai,Masahito Komasaki. Владелец: Mitsubishi Materials Corp. Дата публикации: 2021-04-15.

Method of forming field effect transistors with replacement metal gates and contacts and resulting structure

Номер патента: US09911736B1. Автор: Hui Zang,Haigou Huang,Xiaofeng Qiu. Владелец: Globalfoundries Inc. Дата публикации: 2018-03-06.

Method of forming a vertical device

Номер патента: US09614054B2. Автор: Teng-Chun Tsai,MING-CHING Chang,De-Fang Chen,Li-Ting Wang,Cheng-Tung Lin,Chun-Hung Lee,Huan-Just Lin. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-04-04.

Method of wafer reclaim

Номер патента: US20020173115A1. Автор: Ching-Yu Chang. Владелец: Macronix International Co Ltd. Дата публикации: 2002-11-21.

Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing

Номер патента: US09508575B2. Автор: Hui Chen,Sen-Hou Ko. Владелец: Applied Materials Inc. Дата публикации: 2016-11-29.

Method of forming isolation layer of semiconductor device

Номер патента: US7682928B2. Автор: Myung IL Kang. Владелец: Dongbu Electronics Co Ltd. Дата публикации: 2010-03-23.

Method of Forming a Vertical Device

Номер патента: US20240186400A1. Автор: Teng-Chun Tsai,MING-CHING Chang,De-Fang Chen,Li-Ting Wang,Cheng-Tung Lin,Chun-Hung Lee,Huan-Just Lin. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-06-06.

Method of forming a vertical device

Номер патента: US20160111523A1. Автор: Teng-Chun Tsai,MING-CHING Chang,De-Fang Chen,Li-Ting Wang,Cheng-Tung Lin,Chun-Hung Lee,Huan-Just Lin. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2016-04-21.

Method of forming a vertical device

Номер патента: US20210050430A1. Автор: Teng-Chun Tsai,MING-CHING Chang,De-Fang Chen,Li-Ting Wang,Cheng-Tung Lin,Chun-Hung Lee,Huan-Just Lin. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2021-02-18.

Method of forming a vertical device

Номер патента: US20200111887A1. Автор: Teng-Chun Tsai,MING-CHING Chang,De-Fang Chen,Li-Ting Wang,Cheng-Tung Lin,Chun-Hung Lee,Huan-Just Lin. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2020-04-09.

Method of forming an STI feature while avoiding or reducing divot formation

Номер патента: US6689665B1. Автор: Syun-Ming Jang,Mo-Chiun Yu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2004-02-10.

Vinylidene fluoride polymer composition and method of producing same, resin composition, electrode mixture, and electrode containing these, and method of producing same

Номер патента: US20240010826A1. Автор: Takuya Ikeda,Yoshiyuki Nagasawa,Tamito Igarashi,Kayoko Okada,Masataka KATONO. Владелец: Kureha Corp. Дата публикации: 2024-01-11.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method using the same, and method for regenerating aqueous dispersion for chemical mechanical polishing

Номер патента: TW200938604A. Автор: Kazuo Nishimoto,Tomotaka Shinoda. Владелец: JSR Corp. Дата публикации: 2009-09-16.

Method of production of composited particle, composited particle produced by this method and aqueous dispersion for chemical mechanical polishing containing this composited particle, and method of production of aqueous dispersion for chemical mechanical polishing

Номер патента: US6582761B1. Автор: Masayuki Hattori,Nobuo Kawahashi,Kazuo Nishimoto. Владелец: JSR Corp. Дата публикации: 2003-06-24.

Method of Production of Composited Particle, Composited Particle Produced by This Method and Aqueous Dispersion for Chemical Mechanical Polishing Containing This Composited Particle, and Method of Production of Aqueous Dispersion for Chemical Mechanical Polishing

Номер патента: KR100444239B1. Автор: 마사유끼 하또리,노부오 가와하시,가즈오 니시모또. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2004-08-11.

Tungsten chemical mechanical polishing method using fixed polishing pad and tungsten layer chemical mechanical polishing solution for chemical mechanical polishing using fixed polishing pad

Номер патента: JP4010112B2. Автор: ダイネッシュ チョップラ，,スコット， ジー． メイクル，. Владелец: マイクロン テクノロジー， インク．. Дата публикации: 2007-11-21.

Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: US6206756B1. Автор: Dinesh Chopra,Scott G. Meikle. Владелец: Micron Technology Inc. Дата публикации: 2001-03-27.

Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: US6273786B1. Автор: Dinesh Chopra,Scott G. Meikle. Владелец: Micron Technology Inc. Дата публикации: 2001-08-14.

Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: WO2000028585A1. Автор: Dinesh Chopra,Scott G. Meikle. Владелец: MICRON TECHNOLOGY, INC.. Дата публикации: 2000-05-18.

Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: KR100443458B1. Автор: 디네쉬 코프라,스코트지. 메이클. Владелец: 미크론 테크놀로지,인코포레이티드. Дата публикации: 2004-08-09.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method using same, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: WO2011093195A1. Автор: 和男 西元,太一 阿部,達慶 河本,志保　浩司. Владелец: Jsr株式会社. Дата публикации: 2011-08-04.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method using same, and kit for preparing aqueous dispersion for chemical mechanical polishing

Номер патента: TW201139633A. Автор: Kazuo Nishimoto,Hiroshi Shiho,Taichi Abe,Tatsuyoshi Kawamoto. Владелец: JSR Corp. Дата публикации: 2011-11-16.

Composition and method for polishing memory hard disks exhibiting reduced edge roll-off

Номер патента: MY177709A. Автор: WHITE Michael,Li Tong,Lau Hon-Wu. Владелец: Cmc Mat Inc. Дата публикации: 2020-09-23.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process

Номер патента: TW572980B. Автор: Masayuki Hattori,Nobuo Kawahashi,Masayuki Motonari,Kazuhito Uchikura. Владелец: Tokyo Shibaura Electric Co. Дата публикации: 2004-01-21.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process

Номер патента: EP1116762A1. Автор: Masayuki Hattori,Nobuo Kawahashi,Masayuki Motonari,Kazuhito Uchikura. Владелец: JSR Corp. Дата публикации: 2001-07-18.

Aqueous Dispersion for Chemical Mechanical Polishing and Chemical Mechanical Polishing Process

Номер патента: KR100719982B1. Автор: 마사유끼 핫또리,마사유끼 모또나리,노부오 가와하시,가즈히또 우찌꾸라. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2007-05-18.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process

Номер патента: US6579153B2. Автор: Masayuki Hattori,Nobuo Kawahashi,Masayuki Motonari,Kazuhito Uchikura. Владелец: Toshiba Corp. Дата публикации: 2003-06-17.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process

Номер патента: US20010008828A1. Автор: Masayuki Hattori,Nobuo Kawahashi,Masayuki Motonari,Kazuhito Uchikura. Владелец: JSR Corp. Дата публикации: 2001-07-19.

Aqueous Dispersion for Chemical Mechanical Polishing and Chemical Mechanical Polishing Process

Номер патента: KR100746785B1. Автор: 마사유끼 핫또리,마사유끼 모또나리,노부오 가와하시,가즈히또 우찌꾸라. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2007-08-06.

Composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: JP6892033B1. Автор: 山田　裕也,康孝 亀井,裕也 山田,鵬宇 王,紀彦 杉江. Владелец: JSR Corp. Дата публикации: 2021-06-18.

Aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method

Номер патента: TW201435070A. Автор: Tomohisa Konno,Yasutaka Kamei,Tatsuya Yamanaka,Yoshitaka Miyazaki. Владелец: JSR Corp. Дата публикации: 2014-09-16.

Polishing slurry and method for chemical-mechanical polishing of copper

Номер патента: US20050022456A1. Автор: Sunil Jha,Sharath Hegde,S. Babu. Владелец: Climax Engineered Materials LLC. Дата публикации: 2005-02-03.

Method of production of composited particle, composited particle produced by this method and aqueous dispersion for chemical mechanical polishing containing this composited particle, and its method of production

Номер патента: TW534917B. Автор: Masayuki Hattori,Nobuo Kawahashi,Kazuo Nishimoto. Владелец: JSR Corp. Дата публикации: 2003-06-01.

Composition and method for conducting a material removing operation

Номер патента: US20230116858A1. Автор: Lin Fu,Douglas E. Ward,Jason A. Sherlock,Long Huy Bui. Владелец: Saint Gobain Ceramics and Plastics Inc. Дата публикации: 2023-04-13.

Peak-based endpointing for chemical mechanical polishing

Номер патента: US09799578B2. Автор: Dominic J. Benvegnu,Boguslaw A. Swedek,David J. Lischka. Владелец: Applied Materials Inc. Дата публикации: 2017-10-24.

Polishing Pad for Chemical Mechanical Polishing and Method

Номер патента: US20230398659A1. Автор: Liang-Guang Chen,Shich-Chang Suen,Chih Hung Chen,Te-Chien Hou,Liang-Che Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-12-14.

Coated compressive subpad for chemical mechanical polishing

Номер патента: EP3221085A1. Автор: Diane Scott,Paul Andre Lefevre. Владелец: Nexplanar Corp. Дата публикации: 2017-09-27.

Method and system for performing chemical mechanical polishing

Номер патента: US20230278160A1. Автор: Shih-Ho Lin,Jen-Chieh LAI,Yu-chen Wei,Huai-Tei Yang,Chih-Yuan Yang,Li-Hsiang Chao,Szu-Cheng Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-09-07.

Printing a chemical mechanical polishing pad

Номер патента: US20230278159A1. Автор: Rajeev Bajaj,Terrance Y. Lee,Barry Lee Chin. Владелец: Applied Materials Inc. Дата публикации: 2023-09-07.

Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices

Номер патента: US20040092112A1. Автор: Chia-Lin Hsu,Teng-Chun Tsai,Shao-Chung Hu. Владелец: United Microelectronics Corp. Дата публикации: 2004-05-13.

Apparatus for printing a chemical mechanical polishing pad

Номер патента: US09457520B2. Автор: Rajeev Bajaj,Terrance Y. Lee,Barry Lee Chin. Владелец: Applied Materials Inc. Дата публикации: 2016-10-04.

Method for an improved chemical mechanical polishing system

Номер патента: WO2010019339A2. Автор: Yulin Wang,Alpay Yilmaz,Roy Nangoy. Владелец: Applied Materials, Inc.. Дата публикации: 2010-02-18.

Pad constructions for chemical mechanical planarization applications

Номер патента: MY136868A. Автор: Jeffrey Scott Kollodge,Christopher Nicholas Loesch. Владелец: 3M Innovative Properties Co. Дата публикации: 2008-11-28.

Apparatus and methods for chemical mechanical polishing

Номер патента: US20230405756A1. Автор: Kei-Wei Chen,Shich-Chang Suen,Chih Hung Chen,Kang Huang,Te-Chien Hou,Wen-Pin Liao. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-12-21.

Method of removing a photoresist pattern, method of forming a dual polysilicon layer using the removing method and method of manufacturing a semiconductor device using the removing

Номер патента: US20070298596A1. Автор: Keum-Joo Lee,Kyoung-Chul Kim,Byoung-Yong Gwak. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2007-12-27.

Method and/or system for chemical mechanical planarization (CMP)

Номер патента: US09997420B2. Автор: Cheng Yen-Wei,Jong-I Mou,Yen-Di Tsen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-06-12.

Printed chemical mechanical polishing pad having particles therein

Номер патента: US11794308B2. Автор: Kasiraman Krishnan,Nag B. Patibandla,Periya Gopalan. Владелец: Applied Materials Inc. Дата публикации: 2023-10-24.

Chemical mechanical polishing method

Номер патента: US20230078573A1. Автор: Kei-Wei Chen,Chih-Chieh Chang,Chun-Hao Kung,Tung-Kai Chen,Kao-Feng Liao,Hui-Chi Huang,Chia-Jung Hsu,Ching-hsiang Tsai,Fang-I Chih,Hsin-ying Ho. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-03-16.

Printing a chemical mechanical polishing pad

Номер патента: US12011801B2. Автор: Rajeev Bajaj,Terrance Y. Lee,Barry Lee Chin. Владелец: Applied Materials Inc. Дата публикации: 2024-06-18.

Chemical mechanical polishing slurry buildup monitoring

Номер патента: US11890722B2. Автор: Thomas Ho Fai LI. Владелец: Applied Materials Inc. Дата публикации: 2024-02-06.

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

Номер патента: US20050170751A1. Автор: Manoocher Birang,Allan Gleason,Nils Johansson. Владелец: Applied Materials Inc. Дата публикации: 2005-08-04.

End point detection system for chemical mechanical polishing applications

Номер патента: EP1399294A1. Автор: Yehiel Gotkis,Mike Ravkin,Katrina A. Mikhaylich. Владелец: Lam Research Corp. Дата публикации: 2004-03-24.

METHOD OF FINISHING CHEMICAL-MECHANICAL POLISHING OF InAs PLATES

Номер патента: RU2582904C1. Автор: Екатерина Алексеевна Ковалишина. Владелец: Открытое акционерное общество "Центральный научно-исследовательский институт "Электрон". Дата публикации: 2016-04-27.

Method for forming aluminum bumps by sputtering and chemical mechanical polishing

Номер патента: US20020142604A1. Автор: Cheng-Wei Lee. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2002-10-03.

In-situ defect count detection in post chemical mechanical polishing

Номер патента: US20230298949A1. Автор: Chi-Jen Liu,Liang-Guang Chen,Chun-Hung LIAO,Huang-Lin Chao,Jeng-Chi Lin. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-09-21.

Polyurethane, composition for formation of polishing layers that contains same, pad for chemical mechanical polishing, and chemical mechanical polishing method using same

Номер патента: WO2010146982A1. Автор: 岡本　隆浩,力丸 桑原. Владелец: Jsr株式会社. Дата публикации: 2010-12-23.

Polyurethane, composition for formation of polishing layers that contains same, pad for chemical mechanical polishing, and chemical mechanical polishing method using same

Номер патента: KR20120039523A. Автор: 다카히로 오카모토,리키마루 구와바라. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2012-04-25.

Polyurethane, composition for formation of polishing layers that contains same, pad for chemical mechanical polishing, and chemical mechanical polishing method using same

Номер патента: EP2444433A1. Автор: Takahiro Okamoto,Rikimaru Kuwabara. Владелец: JSR Corp. Дата публикации: 2012-04-25.

Aqueous dispersion useful for chemical-mechanical polishing of conductive metal films contains an abrasive in the form of fumed alumina

Номер патента: DE102007005291A1. Автор: Wolfgang Dr. Lortz. Владелец: EVONIK DEGUSSA GmbH. Дата публикации: 2008-08-07.

TREATMENT COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND CLEANING METHOD

Номер патента: US20180086943A1. Автор: NISHIGUCHI Naoki,MITSUBOSHI Ran,MITSUMOTO Kiyotaka,IIDA Masashi,HAYAMA Takahiro,Kamo Satoshi,KAMEI Yasutaka. Владелец: JSR Corporation. Дата публикации: 2018-03-29.

Method of manufacturing solid electrolyte sheet, method of manufacturing negative electrode sheet for all-solid state secondary battery, and method of manufacturing all-solid state secondary battery

Номер патента: US12034114B2. Автор: Hideyuki Suzuki,Shinji Imai,Shin Ozawa. Владелец: Fujifilm Corp. Дата публикации: 2024-07-09.

Method of processing steel for electric steel sheet with aligned grain structure and method of making electric steel sheet with aligned grain structure

Номер патента: RU2471877C1. Автор: Суити НАКАМУРА,Йосиюки УСИГАМИ,Норихиро ЯМАМОТО,Томодзи КУМАНО. Владелец: Ниппон Стил Корпорейшн. Дата публикации: 2013-01-10.

Catalyst complex for fuel cell, method of manufacturing the catalyst complex, electrolyte membrane including the catalyst complex and method of manufacturing the electrolyte membrane

Номер патента: US20210028467A1. Автор: Yong Min Kim,Min Kyung Kim,Woong Pyo Hong,Soon Hong Park,Seung Jeong OH,Byoung Su Kim. Владелец: Kia Motors Corp. Дата публикации: 2021-01-28.

Catalyst complex for fuel cell, method of manufacturing the catalyst complex, electrolyte membrane including the catalyst complex and method of manufacturing the electrolyte membrane

Номер патента: US20230084103A1. Автор: Yong Min Kim,Min Kyung Kim,Woong Pyo Hong,Soon Hong Park,Seung Jeong OH,Byoung Su Kim. Владелец: Kia Corp. Дата публикации: 2023-03-16.

Catalyst complex for fuel cell, method of manufacturing the catalyst complex, electrolyte membrane including the catalyst complex and method of manufacturing the electrolyte membrane

Номер патента: US11545673B2. Автор: Yong Min Kim,Min Kyung Kim,Woong Pyo Hong,Soon Hong Park,Seung Jeong OH,Byoung Su Kim. Владелец: Kia Motors Corp. Дата публикации: 2023-01-03.

Catalyst complex for fuel cell, method of manufacturing the catalyst complex, electrolyte membrane including the catalyst complex and method of manufacturing the electrolyte membrane

Номер патента: US12009528B2. Автор: Yong Min Kim,Min Kyung Kim,Woong Pyo Hong,Soon Hong Park,Seung Jeong OH,Byoung Su Kim. Владелец: Kia Corp. Дата публикации: 2024-06-11.

Method of manufacturing hexagonal ferrite powder, hexagonal ferrite powder, magnetic recording medium and method of manufacturing magnetic recording medium

Номер патента: US20170004912A1. Автор: Masashi Shirata. Владелец: Fujifilm Corp. Дата публикации: 2017-01-05.

Method of manufacturing hexagonal ferrite powder, hexagonal ferrite powder, magnetic recording medium and method of manufacturing magnetic recording medium

Номер патента: US9957167B2. Автор: Masashi Shirata. Владелец: Fujifilm Corp. Дата публикации: 2018-05-01.

Apparatus and methods for chemical mechanical polishing

Номер патента: US20240363447A1. Автор: Chi-hsiang Shen,Chen-Hao WU,Shich-Chang Suen,Te-Chien Hou,Jeng-Chi Lin,Chen-Chi Tang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-10-31.

Method of forming a diode for integration with a semiconductor device and method of forming a transistor device having an integrated diode

Номер патента: EP1102318B1. Автор: Evgueniy Stefanov,Jean-Michel Reynes,Ivana Deram. Владелец: Semiconductor Components Industries LLC. Дата публикации: 2005-06-29.

Protective insulating layer and chemical mechanical polishing for polycrystalline thin film solar cells

Номер патента: US09741890B2. Автор: Mahadevaiyer Krishnan,Talia S. Gershon,Supratik Guha,Jeehwan Kim,Byungha Shin. Владелец: International Business Machines Corp. Дата публикации: 2017-08-22.

Methods of forming a magnetic electrode of a magnetic tunnel junction and methods of forming a magnetic tunnel junction

Номер патента: US9520553B2. Автор: Gurtej S. Sandhu,Witold Kula,Manzar Siddik. Владелец: Micron Technology Inc. Дата публикации: 2016-12-13.

Run-to-run control for chemical mechanical planarization

Номер патента: US20130267148A1. Автор: Patrick David Noll,Madhu Sudan RAMAVAJJALA,Prakash Lakshmikanthan. Владелец: Texas Instruments Inc. Дата публикации: 2013-10-10.

Method of making a capacitor via chemical mechanical polish

Номер патента: US5821151A. Автор: Horng-Huei Tseng. Владелец: Vanguard International Semiconductor Corp. Дата публикации: 1998-10-13.

Method of designing electroluminescent device, electroluminescent device manufactured with the design method, and method of manufacturing electroluminescent device with the design method

Номер патента: US09893324B2. Автор: Koujirou Sekine,Mitsuru Yokoyama,Kou Osawa. Владелец: KONICA MINOLTA INC. Дата публикации: 2018-02-13.

Wet chemical heating system and a method of chemical mechanical polishing

Номер патента: US20230095741A1. Автор: Liang-Guang Chen,Chih Hung Chen,Keith Kuang-Kuo Koai,Chyi Shyuan Chern,Ji James Cui,Chia-Hsun Chang,Tzu kai Lin. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-03-30.

Method of forming a diode for integration with a semiconductor device and method of forming a transistor device having an integrated diode

Номер патента: US6773977B1. Автор: Evgueniy Stefanov,Jean-Michel Reynes,Ivana Deram. Владелец: Semiconductor Components Industries LLC. Дата публикации: 2004-08-10.

Method of fabricating nonpolar gallium nitride-based semiconductor layer, nonpolar semiconductor device, and method of fabricating the same

Номер патента: US09966497B2. Автор: Seung Kyu Choi,Chae Hon KIM,Jung Whan JUNG. Владелец: Seoul Viosys Co Ltd. Дата публикации: 2018-05-08.

Method of fabricating an apparatus of fabricating an flat panel display device and method for fabricating flat panel display device

Номер патента: US20090139960A1. Автор: Jin Wuk Kim,Mi Kyung Park. Владелец: LG Display Co Ltd. Дата публикации: 2009-06-04.

Methods of reducing a registration error of a photomask, and related photomasks and methods of manufacturing an integrated circuit

Номер патента: US20140363633A1. Автор: CHALYKH Roman,Sang-Hyun Kim,Seong-Sue Kim,Dong-gun Lee,Mun-Ja KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2014-12-11.

Fabrication of volcano-shaped field emitters by chemical-mechanical polishing (CMP)

Номер патента: US6008064A. Автор: Heinz H. Busta. Владелец: American Energy Services Inc. Дата публикации: 1999-12-28.

Formulations for chemical mechanical polishing pads with high planarization efficiency and CMP pads made therewith

Номер патента: US12064845B2. Автор: Teresa Brugarolas Brufau,Bryan E. Barton. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2024-08-20.

Polishing slurry and method for chemical-mechanical polishing

Номер патента: US6271139B1. Автор: James J. Alwan,Craig M. Carpenter. Владелец: Micron Technology Inc. Дата публикации: 2001-08-07.

Polishing slurry and method for chemical-mechanical polishing

Номер патента: US6558570B2. Автор: James J. Alwan,Craig M. Carpenter. Владелец: Micron Technology Inc. Дата публикации: 2003-05-06.

Methods for real-time error detection in CMP processing

Номер патента: US09403254B2. Автор: Chi-Ming Yang,Chin-Hsiang Lin,Bo-I Lee,James Jeng-Jyi Hwang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2016-08-02.

Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith

Номер патента: US09687956B2. Автор: Ching-Ming Tsai,Sheng-huan LIU,Jia-Cheng Hsu,Shi-Wei CHENG,Kun-Shu YANG,Feng-Chih Hsu,Craig Kokjohn. Владелец: Cabot Microelectronics Corp. Дата публикации: 2017-06-27.

Cleaner for chemical mechanical polishing apparatus

Номер патента: US20240208005A1. Автор: Jongsu Kim,Sungyong PARK,Hoseop Choi,Jubong LEE,Hyunjoon Park,Bongki PARK,Eunsun PARK. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-06-27.

Semiconductor device and method for fabricating the same and apparatus for chemical mechanical polishing and method of chemical mechanical polishing

Номер патента: KR100419268B1. Автор: 하라다시게루,다까따요시후미,이즈미따니준꼬. Владелец: 미쓰비시덴키 가부시키가이샤. Дата публикации: 2004-02-19.

Method of forming package structure

Номер патента: US20240347506A1. Автор: Wen-Chih Chiou,Ebin Liao,Yi-Hsiu Chen,Hong-Ye Shih,Jia-Ling Ko. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-10-17.

Peak-based endpointing for chemical mechanical polishing

Номер патента: US09564377B2. Автор: Dominic J. Benvegnu,Boguslaw A. Swedek,David J. Lischka. Владелец: Applied Materials Inc. Дата публикации: 2017-02-07.

Method of fabricating semiconductor device

Номер патента: US20160086813A1. Автор: Un-Gyu Paik,Sang-kyun Kim,Dong-jun Lee,Jong-woo Kim,Ye-Hwan Kim,Ji-hoon SEO. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2016-03-24.

Method and apparatus for endpoint detection for chemical mechanical polishing

Номер патента: WO2000054935A9. Автор: John A Adams,Robert A Eaton,Thomas Frederick Allen J Bibby. Владелец: Speedfam IPEC Corp. Дата публикации: 2002-06-20.

Method of forming the gate electrode of field effect transistor

Номер патента: US09812551B2. Автор: Neng-Kuo Chen,Sey-Ping Sun,Clement Hsingjen Wann,Yi-An Lin,Chun-Wei Chang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-11-07.

Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing

Номер патента: US5209816A. Автор: Chris C. Yu,Trung T. Doan,Alan E. Laulusa. Владелец: Micron Technology Inc. Дата публикации: 1993-05-11.

Method of manufacturing semiconductor device

Номер патента: US09870950B2. Автор: Bo-Un Yoon,Chang-sun Hwang,Ho-Young Kim,Ja-Eung Koo,Jong-Hyung Park,Leian Bartolome,Hyoung-Bin Moon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2018-01-16.

Method of planarizing substrate surface

Номер патента: US09773682B1. Автор: Li-Chieh Hsu,Yu-Ting Li,Fu-Shou Tsai,Kun-Ju Li,Yi-Liang Liu. Владелец: United Microelectronics Corp. Дата публикации: 2017-09-26.

Method of planarizing substrate surface

Номер патента: US20180012771A1. Автор: Li-Chieh Hsu,Yu-Ting Li,Fu-Shou Tsai,Kun-Ju Li,Yi-Liang Liu. Владелец: United Microelectronics Corp. Дата публикации: 2018-01-11.

Polishing devices for chemical mechanical polishing devices and their chemical mechanical polishing devices

Номер патента: KR100308138B1. Автор: 사토시 무라카미,노부히로 가토,도모하루 와타나베. Владелец: 니시무로 타이죠. Дата публикации: 2002-04-24.

CMP pad maintenance apparatus and method

Номер патента: US5916010A. Автор: Kathryn H. Varian,James T. Varian. Владелец: International Business Machines Corp. Дата публикации: 1999-06-29.

System and method of broad band optical end point detection for film change indication

Номер патента: EP1490898A2. Автор: Vladimir Katz,Bella Mitchell. Владелец: Lam Research Corp. Дата публикации: 2004-12-29.

System and method of broad band optical end point detection for film change indication

Номер патента: EP1490898A4. Автор: Vladimir Katz,Bella Mitchell. Владелец: Lam Research Corp. Дата публикации: 2005-06-15.

Layered-filament lattice for chemical mechanical polishing

Номер патента: US7517277B2. Автор: Gregory P. Muldowney. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2009-04-14.

Method and apparatus for endpoint detection for chemical mechanical polishing

Номер патента: US6106662A. Автор: John A. Adams,Christopher E. Barns,Thomas Frederick Allen Bibby, Jr.,Robert A. Eaton,Charles Hannes. Владелец: Speedfam IPEC Corp. Дата публикации: 2000-08-22.

Method of CMP pad conditioning

Номер патента: US09908213B2. Автор: Feng-Inn Wu,Hsiu-Ming Yeh. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-03-06.

Method of making composite polishing layer for chemical mechanical polishing pad

Номер патента: KR20170001627A. Автор: 바이니안 퀴안,유화 통,앤드류 완크,디에고 루고,마크 알. 스택,데이비드 미카엘 베네지알레,조지 씨. 제이콥,제프리 비. 밀러,줄리아 코주크,테레사 브루갈로라스 브루파우,토니 쿠안 트랜,제프리 제임스 헨드론. Владелец: 다우 글로벌 테크놀로지스 엘엘씨. Дата публикации: 2017-01-04.

Method of making composite polishing layer for chemical mechanical polishing pad

Номер патента: KR102499031B1. Автор: 바이니안 퀴안,유화 통,앤드류 완크,디에고 루고,마크 알. 스택,데이비드 미카엘 베네지알레,조지 씨. 제이콥,제프리 비. 밀러,줄리아 코주크,테레사 브루갈로라스 브루파우,토니 쿠안 트랜,제프리 제임스 헨드론. Владелец: 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드. Дата публикации: 2023-02-14.

Method of making polishing layer for chemical mechanical polishing pad

Номер патента: TWI705992B. Автор: 百年 錢,喬治Ｃ 雅各,馬提Ｗ 狄羅特,特里沙 布魯格洛雷斯布魯法,朱利亞 庫扎克,逢薊 葉,安德魯 汪克,迪耶戈 盧戈,大衛 麥克 凡尼札爾,傑弗瑞Ｂ 米勒,童玉華. Владелец: 美商陶氏全球科技責任有限公司. Дата публикации: 2020-10-01.

Method of making polishing layer for chemical mechanical polishing pad

Номер патента: KR102548640B1. Автор: 바이니안 퀴안,유화 통,앤드류 완크,디에고 루고,데이비드 미카엘 베네지알레,마티 더블유. 디그루트,조지 씨. 제이콥,제프리 비. 밀러,줄리아 코주크,테레사 브루갈로라스 브루파우,펭지 예. Владелец: 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드. Дата публикации: 2023-06-28.

Method of making composite polishing layer for chemical mechanical polishing pad

Номер патента: US20160375554A1. Автор: Yuhua Tong,Bainian Qian,Julia KOZHUKH,Tony Quan Tran,George C. Jacob,Teresa Brugarolas Brufau,Jeffrey James Hendron,David Michael Veneziale,Diego Lugo,Andrew Wank,Jeffrey B. Miller,Marc R. Stack. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2016-12-29.

Peak-based endpointing for chemical mechanical polishing

Номер патента: WO2008055174A3. Автор: Dominic J Benvegnu,Boguslaw A Swedek,David J Lischka. Владелец: David J Lischka. Дата публикации: 2008-07-10.

Peak-based endpointing for chemical mechanical polishing

Номер патента: WO2008055174A2. Автор: Dominic J. Benvegnu,Boguslaw A. Swedek,David J. Lischka. Владелец: Applied Materials, Inc.. Дата публикации: 2008-05-08.

Semiconductor device with a dislocation structure and method of forming the same

Номер патента: US20140103444A1. Автор: Chun Hsiung Tsai,Tsan-Chun Want. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2014-04-17.

Method of manufacturing semiconductor device having island structure

Номер патента: US20230422490A1. Автор: Chen-Cheng Chang. Владелец: Nanya Technology Corp. Дата публикации: 2023-12-28.

Semiconductor device with a dislocation structure and method of forming the same

Номер патента: US09595522B2. Автор: Chun Hsiung Tsai,Tsan-Chun Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-03-14.

Method of fabricating semiconductor structure

Номер патента: US09391177B1. Автор: Hung-Chi Huang,Chun-Yi Lin,chu-ming Ma,Hsien-Ta Chung. Владелец: United Microelectronics Corp. Дата публикации: 2016-07-12.

The method for preparing the composite polishing layer for chemical mechanical polishing pads

Номер патента: CN107695869A. Автор: J·考兹休克,B·钱,G·C·雅各布,布鲁福 T·布鲁加罗拉斯,D·M·韦内齐亚莱,Y·童,D·卢戈,J·B·米勒,T·Q·陈,M·R·斯塔克,A·旺克,J·J·亨德伦. Владелец: Rohm and Haas Electronic Materials LLC. Дата публикации: 2018-02-16.

The method for preparing the polishing layer for chemical mechanical polishing pads

Номер патента: CN107695904A. Автор: J·考兹休克,B·钱,G·C·雅各布,D·M·韦内齐亚莱,Y·童,D·卢戈,J·B·米勒,A·旺克,F·叶,T·布鲁加罗拉斯布鲁福,M·W·德格罗特. Владелец: ROHM AND HAAS ELECTRONIC MATER. Дата публикации: 2018-02-16.

Apparatus and method for conditioning polishing pad for chemical mechanical polishing apparatus

Номер патента: TW200800491A. Автор: Jung Hoon Lee,Seung Wook Yoon. Владелец: Doosan DND Co Ltd. Дата публикации: 2008-01-01.

Gas-diffusive electrode, method of its fabrication, membrane and electrode unit containing gas-diffusive electrode and method of fabrication of membrane and electrode unit containing gas-diffusive electrode

Номер патента: RU2559833C2. Автор: Вальтер АДРИАНСЕНС,ГАЙЕГО Иоланда АЛЬВАРЕС,Филиппе ВЕРМЕЙРЕН,Андре-Виктор КЛАЕС. Владелец: Вито Нв. Дата публикации: 2015-08-10.

Gas-diffusive electrode, method of its fabrication, membrane and electrode unit containing gas-diffusive electrode and method of fabrication of membrane and electrode unit containing gas-diffusive electrode

Номер патента: RU2559833C9. Автор: Вальтер АДРИАНСЕНС,ГАЙЕГО Иоланда АЛЬВАРЕС,Филиппе ВЕРМЕЙРЕН,Андре-Виктор КЛАЕС. Владелец: Вито Нв. Дата публикации: 2016-01-20.

Integrated circuit device and method of making the same

Номер патента: WO1998000872A1. Автор: Derryl D. J. Allman,John W. Gregory,James P. Yakura,John J. Seliskar,Dim Lee Kwong. Владелец: Gill, David, Alan. Дата публикации: 1998-01-08.

Fabricating method of back-illuminated image sensor with dishing depression surface

Номер патента: US09443902B1. Автор: Tseng-Fei Wen. Владелец: United Microelectronics Corp. Дата публикации: 2016-09-13.

Method of forming a fixed distribution of induced magnetic field in a magnetic structure formed in an integrated circuit, and an integrated circuit comprising a magnetic structure

Номер патента: RU2723233C1. Автор: Эрван Филипп Мари Гапиан,Евгений Викторович Данилкин. Владелец: Общество С Ограниченной Ответственностью "Крокус Наноэлектроника" (Ооо "Крокус Наноэлектроника"). Дата публикации: 2020-06-09.

Method of forming phase change material layer using ge(ii) source, and method of fabricating phase change memory device

Номер патента: US20130005112A1. Автор: Sung-Lae Cho,Do-Hyung Kim,Byoung-Jae Bae,Jin-Il Lee,Hye-Young Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2013-01-03.

Method of selectively killing cancer cells using low-temperature plasma jet device and method of treating tumors using the same

Номер патента: US20170319256A1. Автор: Tae-Hong Kang,Ji-Ye CHOI. Владелец: Research Foundation for Industry Academy Cooperation of Dong A University. Дата публикации: 2017-11-09.

Electrostatic suction cup device for wafer chemical mechanical polishing

Номер патента: US20240286244A1. Автор: Yao-Sung Wei. Владелец: Shoxproof Technology Co Ltd. Дата публикации: 2024-08-29.

External heating system for use in chemical mechanical polishing system

Номер патента: US11633829B2. Автор: Chun-Wei Hsu,Chi-hsiang Shen,Chi-Jen Liu,Yi-Sheng Lin,Yang-chun Cheng,Kei-Wei Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-04-25.

External heating system for use in chemical mechanical polishing system

Номер патента: US20230294237A1. Автор: Chun-Wei Hsu,Chi-hsiang Shen,Chi-Jen Liu,Yi-Sheng Lin,Yang-chun Cheng,Kei-Wei Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-09-21.

Negatively charged silica particles, method of producing such particles, compositions comprising such particles, and a method of chemical-mechanical polishing using such particles

Номер патента: WO2023180216A1. Автор: Eric Jacquinot,Frédéric GUILLAUD. Владелец: Merck Patent GmBH. Дата публикации: 2023-09-28.

Chemical mechanical polishing pad and polishing method

Номер патента: US11813713B2. Автор: Teresa Brugarolas Brufau,Bryan E. Barton. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-11-14.

Amphiphilic abrasive particles and their use for chemical mechanical planarization

Номер патента: WO2024129435A1. Автор: Gerhard Jonschker. Владелец: Versum Materials US, LLC. Дата публикации: 2024-06-20.

Titanium dioxide chemical-mechanical polishing composition for polishing nickel substrates

Номер патента: US20240174891A1. Автор: Cheng-Yuan Ko,Jin-Hao JHANG. Владелец: CMC Materials LLC. Дата публикации: 2024-05-30.

Titanium dioxide chemical-mechanical polishing composition for polishing nickel substrates

Номер патента: WO2024107316A1. Автор: Cheng-Yuan Ko,Jin-Hao JHANG. Владелец: ENTEGRIS, INC.. Дата публикации: 2024-05-23.

Chemical mechanical polishing slurry

Номер патента: US09718991B2. Автор: Song Yuan Chang,Ming Hui Lu,Ming Che Ho,Wen Cheng Liu,Yi Han Yang. Владелец: Uwiz Technology Co Ltd. Дата публикации: 2017-08-01.

Chemical-mechanical polishing particle and polishing slurry composition comprising same

Номер патента: US11787974B2. Автор: Jae Hyun Kim,Jong Dai Park,Min Gun Lee,Sung Hoon Jin,Jae Hong Yoo,Kyu Soon SHIN,Goo Hwa LEE,Weoun Gyuen MOON,Gyeong Sook CHO. Владелец: Dongjin Semichem Co Ltd. Дата публикации: 2023-10-17.

Chemical-mechanical polishing particle and polishing slurry composition comprising same

Номер патента: US20210340405A1. Автор: Jae Hyun Kim,Jong Dai Park,Min Gun Lee,Sung Hoon Jin,Jae Hong Yoo,Kyu Soon SHIN,Goo Hwa LEE,Weoun Gyuen MOON,Gyeong Sook CHO. Владелец: Dongjin Semichem Co Ltd. Дата публикации: 2021-11-04.

Cerium oxide particles, making process thereof and use thereof in chemical mechanical polishing

Номер патента: US20240158251A1. Автор: Lauriane D'ALENCON,Marie PLISSONNEAU,Valerie Buissette,Réka TOTH,Mickaël BOUDOT. Владелец: Rhodia Operations SAS. Дата публикации: 2024-05-16.

Cerium oxide particles, making process thereof and use thereof in chemical mechanical polishing

Номер патента: EP4305121A1. Автор: Lauriane D'ALENCON,Marie PLISSONNEAU,Valerie Buissette,Réka TOTH,Mickaël BOUDOT. Владелец: Rhodia Operations SAS. Дата публикации: 2024-01-17.

Cerium oxide particles, making process thereof and use thereof in chemical mechanical polishing

Номер патента: EP4304984A1. Автор: Lauriane D'ALENCON,Marie PLISSONNEAU,Valerie Buissette,Réka TOTH,Mickaël BOUDOT. Владелец: Rhodia Operations SAS. Дата публикации: 2024-01-17.

Cerium oxide particles, making process thereof and use thereof in chemical mechanical polishing

Номер патента: US20240158250A1. Автор: Lauriane D'ALENCON,Marie PLISSONNEAU,Valerie Buissette,Réka TOTH,Mickaël BOUDOT. Владелец: Rhodia Operations SAS. Дата публикации: 2024-05-16.

Chemical-mechanical polishing solution

Номер патента: US11898063B2. Автор: Wenting Zhou. Владелец: Anji Microelectronics Shanghai Co Ltd. Дата публикации: 2024-02-13.

Method of contentions mitigation for an operational application, associated computer program product and method for determining a stress application

Номер патента: US11803427B2. Автор: Marc Fumey,Pierrick LAMOUR. Владелец: Thales SA. Дата публикации: 2023-10-31.

Method of processing authorization messages destined for a plurality of mobile receivers and method of transmitting such messages

Номер патента: CA2632049A1. Автор: Yishan Zhao. Владелец: Individual. Дата публикации: 2007-06-07.

Method of setting number of iteration counts of iterative decoding, and apparatus and methods of iterative decoding

Номер патента: US20140250349A1. Автор: Ki-Seok Chung,Joo-Yul Park. Владелец: Industry University Cooperation Foundation IUCF HYU. Дата публикации: 2014-09-04.

Method of setting number of iteration counts of iterative decoding, and apparatus and method of iterative decoding

Номер патента: US20120131415A1. Автор: Ki-Seok Chung,Joo-Yul Park. Владелец: Industry University Cooperation Foundation IUCF HYU. Дата публикации: 2012-05-24.

Method of setting number of iteration counts of iterative decoding, and apparatus and method of iterative decoding

Номер патента: US8719672B2. Автор: Ki-Seok Chung,Joo-Yul Park. Владелец: Industry University Cooperation Foundation IUCF HYU. Дата публикации: 2014-05-06.

Method of setting number of iteration counts of iterative decoding, and apparatus and method of iterative decoding

Номер патента: WO2011004939A1. Автор: Ki-Seok Chung,Joo-Yul Park. Владелец: IUCF-HYU (Industry-University Cooperation Foundation Hanyang University). Дата публикации: 2011-01-13.

Method of controlling image diagnosis apparatus and mobile terminal for the same, and method of operating image diagnosis apparatus and image diagnosis apparatus for the same

Номер патента: US09629593B2. Автор: Seung-Il Yoon. Владелец: Samsung Medison Co Ltd. Дата публикации: 2017-04-25.

Method of constructing information on associate meanings between segments of multimedia stream and method of browing video using the same

Номер патента: US20050240980A1. Автор: Kyoung Yoon,Sung Jun. Владелец: LG ELECTRONICS INC. Дата публикации: 2005-10-27.

Method of identifying a precoding matrix corresponding to a wireless network channel and method of approximating a capacity of a wireless network channel in a wireless network

Номер патента: WO2011037738A3. Автор: Ayelet Doron,Rotem Avivi,Yuval Lomnitz. Владелец: Intel Corporation. Дата публикации: 2011-07-21.

Method of allowing user to participate in video conference using qr code and method of participating, by user, in video conference using qr code

Номер патента: US20240089410A1. Автор: Daekyeong Moon. Владелец: Individual. Дата публикации: 2024-03-14.

Method of processing authorization messages destined for a plurality of mobile receivers and method of transmitting such messages

Номер патента: US8341706B2. Автор: Yishan Zhao. Владелец: Nagra France SAS. Дата публикации: 2012-12-25.

Uv-curable resins for chemical mechanical polishing pads

Номер патента: US20230406984A1. Автор: Ping Huang. Владелец: CMC Materials LLC. Дата публикации: 2023-12-21.

Uv-curable resins for chemical mechanical polishing pads

Номер патента: WO2023244740A1. Автор: Ping Huang. Владелец: CMC Materials LLC. Дата публикации: 2023-12-21.

UV-curable resins used for chemical mechanical polishing pads

Номер патента: US11807710B2. Автор: Ping Huang,Chen-Chih Tsai,Eric S. Moyer. Владелец: CMC Materials LLC. Дата публикации: 2023-11-07.

Uv-curable resins used for chemical mechanical polishing pads

Номер патента: EP4229104A1. Автор: Ping Huang,Chen-Chih Tsai,Eric S. Moyer. Владелец: CMC Materials LLC. Дата публикации: 2023-08-23.

Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad

Номер патента: WO2009051895A1. Автор: Robert G. Swisher,William C. Allison. Владелец: PPG Industries Ohio, Inc.. Дата публикации: 2009-04-23.

Composite pad for chemical mechanical polishing

Номер патента: US20230339067A1. Автор: Zhan Liu,Michael E. Mills,Nan-Rong Chiou. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-10-26.

Method for chemical-mechanical finishing of surface

Номер патента: RU2290291C2. Автор: Марк Д. МИЧОД,Гари СРОКА,Лэйн Уилль м УИНКЕЛМАНН,Лэйн Уилльям УИНКЕЛМАНН. Владелец: Рем Текнолоджиз, Инк.. Дата публикации: 2006-12-27.

Dual-cure resin for preparing chemical mechanical polishing pads

Номер патента: WO2023244739A1. Автор: Chen-Chih Tsai. Владелец: CMC Materials LLC. Дата публикации: 2023-12-21.

Dual-cure resin for preparing chemical mechanical polishing pads

Номер патента: US20230405765A1. Автор: Chen-Chih Tsai. Владелец: CMC Materials LLC. Дата публикации: 2023-12-21.

Brush for cleaning wafers after chemical mechanical polishing (cmp) process

Номер патента: US20240180324A1. Автор: Liqing Wen,Le Lu,Jhih-Fong Lin,Deng-Gao Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-06-06.

Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device

Номер патента: US20050197046A1. Автор: Hirofumi Tsuchiyama,Shinobu Nakamura,Masahiro Aoyagi,Aki Nakajo. Владелец: Trecenti Technologies Inc. Дата публикации: 2005-09-08.

Semiconductor Chemical Mechanical Polishing Sludge Recycling Device

Номер патента: US20240317621A1. Автор: Shao-Hua Hu,Hsin-Hui Chou,Ya-Min Hsieh,Wen-Ming Cheng,Hsing-Wen HSIEH,Chin-An KUAN. Владелец: Individual. Дата публикации: 2024-09-26.

High removal rate chemical mechanical polish for ophthalmic polishing

Номер патента: WO2023211707A1. Автор: David Shepard,Ashwin Sankaran,Peter BUSHONG. Владелец: Pacific Industrial Development Corporation. Дата публикации: 2023-11-02.

High removal rate chemical mechanical polish for ophthalmic polishing

Номер патента: WO2023211707A9. Автор: David Shepard,Ashwin Sankaran,Peter BUSHONG. Владелец: Pacific Industrial Development Corporation. Дата публикации: 2023-12-28.

Method of formation in well of gravel packing in zone of formation and method of well completion

Номер патента: RU2123103C1. Автор: Гарнер Джоунс Ллойд,Дж.Ятс Томми. Владелец: Мобил Ойл Корпорейшн. Дата публикации: 1998-12-10.

Methods of using a degradable component in a wellbore and related systems and methods of forming such components

Номер патента: US9856411B2. Автор: Anil K. Sadana,Jeffrey R. Potts. Владелец: Baker Hughes Inc. Дата публикации: 2018-01-02.

Method of separating gases in fluid for oil production, oil production system and method of oil production

Номер патента: RU2465444C2. Автор: Реймонд Николас ФРЕНЧ,Заида ДИАЗ,Джефри Мэтью УОРЕН. Владелец: Шелл Интернэшнл Рисерч Маатсхаппий Б.В.. Дата публикации: 2012-10-27.

Detecting particle agglomeration in chemical mechanical polishing slurries

Номер патента: US20060266736A1. Автор: Mansour Moinpour,Alexander Tregub. Владелец: Intel Corp. Дата публикации: 2006-11-30.

Film-forming liquid for forming an insulating coating on sheet of anisotropic electrical steel, method for manufacturing sheet of anisotropic electrical steel, and sheet of anisotropic electrical steel

Номер патента: RU2753929C1. Автор: Кадзутоси ТАКЕДА,Суити ЯМАДЗАКИ,Хироясу ФУДЗИИ,Тору НАГАИ. Владелец: Ниппон Стил Корпорейшн. Дата публикации: 2021-08-24.

Magnetorheological-elastomer polishing pad for chemical mechanical polishing of semiconductor wafer, preparation method and application thereof

Номер патента: US12083647B1. Автор: Qiang XIONG,Da Hu,Jiabin LU,Haotian Long,Yuhang Jin. Владелец: GUANGDONG UNIVERSITY OF TECHNOLOGY. Дата публикации: 2024-09-10.

Formulations for chemical mechanical polishing pads and CMP pads made therewith

Номер патента: US11806830B2. Автор: Teresa Brugarolas Brufau,Bryan E. Barton. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-11-07.

Monitoring of polishing pad texture in chemical mechanical polishing

Номер патента: US20230321788A1. Автор: Thomas H. Osterheld,Benjamin Cherian. Владелец: Applied Materials Inc. Дата публикации: 2023-10-12.

Process for chemical mechanical polishing

Номер патента: US20030064594A1. Автор: Alfred Kersch,Johannes Baumgartl,Stephanie Delage. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2003-04-03.

System, control method and apparatus for chemical mechanical polishing

Номер патента: US20230390882A1. Автор: Kei-Wei Chen,Shich-Chang Suen,Te-Chien Hou,Wen-Pin Liao,Chen-Chi Tang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-12-07.

Active acoustic monitoring for chemical mechanical polishing

Номер патента: US20220281058A1. Автор: Thomas H. Osterheld,Dominic J. Benvegnu,Boguslaw A. Swedek,Nicholas A. Wiswell,Sohrab POURMAND. Владелец: Applied Materials Inc. Дата публикации: 2022-09-08.

Steam generation for chemical mechanical polishing

Номер патента: US20240342855A1. Автор: Jianshe Tang,Shou-sung Chang,Jeonghoon Oh,Haosheng Wu,Chad POLLARD,Jonathan P. Domin,Sih-Ling Yeh. Владелец: Applied Materials Inc. Дата публикации: 2024-10-17.

Steam generation for chemical mechanical polishing

Номер патента: WO2024215780A2. Автор: Jianshe Tang,Shou-sung Chang,Jeonghoon Oh,Haosheng Wu,Chad POLLARD,Jonathan P. Domin,Sih-Ling Yeh. Владелец: Applied Materials, Inc.. Дата публикации: 2024-10-17.

Method of producing a microbial preparation for biological modification of mineral fertilizers and a method for use thereof

Номер патента: RU2694570C1. Автор: Алексей Геннадьевич Ариткин. Владелец: Общество с ограниченной ответственностью "Силекс-Агро". Дата публикации: 2019-07-16.

Liver-type fatty acid-binding protein standard, method for evaluating standard, method for regulating variation range of measured value caused by liver-type fatty acid-binding protein in measurement using standard, liver-type fatty acid-binding protein, dna encoding protein, cell transformed by dna, method of producing protein, method of drawing calibration curve for liver-type fatty acid-binding protein, and method of quantifying protein

Номер патента: US20190359663A1. Автор: Takeshi Sugaya,Tsuyoshi Oikawa,Masateru OKAZAKI. Владелец: CMIC Holdings Co Ltd. Дата публикации: 2019-11-28.

Conditioning disks for chemical mechanical polishing

Номер патента: WO2017146678A1. Автор: Alexander Tregub,Kenneth A. DELBRIDGE,Andrew Paul MANSSON,Gunnmeet S. DHILLON,John E. GARLAND. Владелец: Intel Corporation. Дата публикации: 2017-08-31.

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

Номер патента: US6676717B1. Автор: Manoocher Birang,Allan Gleason. Владелец: Individual. Дата публикации: 2004-01-13.

End-point detection system for chemical mechanical polishing applications

Номер патента: US20020061713A1. Автор: Yehiel Gotkis,Mike Ravkin,Katrina Mikhaylich. Владелец: Lam Research Corp. Дата публикации: 2002-05-23.

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

Номер патента: US20040014395A1. Автор: Manoocher Birang,Allan Gleason,Nils Johansson. Владелец: Applied Materials Inc. Дата публикации: 2004-01-22.

Retaining ring with trigger for chemical mechanical polishing apparatus

Номер патента: US20050014452A1. Автор: Peter Khuu. Владелец: Khuus Inc. Дата публикации: 2005-01-20.

Wafer carrier structure for chemical-mechanical polisher

Номер патента: US20020173253A1. Автор: Chi-Feng Cheng. Владелец: Macronix International Co Ltd. Дата публикации: 2002-11-21.

Retainiing ring with trigger for chemical mechanical polishing apparatus

Номер патента: WO2005009679A2. Автор: Peter Khuu. Владелец: Khuu's Inc., Dba Kamet. Дата публикации: 2005-02-03.

Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve

Номер патента: US20030024582A1. Автор: Andreas Fischer,Stefan Geyer. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2003-02-06.

Methods of detecting non-conforming substrate processing events during chemical mechanical polishing

Номер патента: US12036635B2. Автор: Jamie Stuart Leighton,Jeonghoon Oh,Ashish BHUSHAN,John Anthony GARCIA,Stephen Thomas CORMIER,Nick Joseph JACKSON,Manoj BALAKUMAR,Nandkishore PATIDAR. Владелец: Applied Materials Inc. Дата публикации: 2024-07-16.

Method of Obtaining Transgenic Plants with Modified Enzymes for Saccharification of Ligninocellulose, and Method for Production of Modified Enzymes

Номер патента: SE2230450A1. Автор: Stanislaw Karpinski. Владелец: Stanislaw Karpinski. Дата публикации: 2024-07-01.

Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve

Номер патента: US6854484B2. Автор: Andreas Fischer,Stefan Geyer. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2005-02-15.

Slurry recycling for chemical mechanical polishing system

Номер патента: US20220355441A1. Автор: Wen-Kuei Liu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2022-11-10.

Clamping retainer for chemical mechanical polishing and method of operation

Номер патента: WO2023229658A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh. Владелец: Applied Materials, Inc.. Дата публикации: 2023-11-30.

Polishing pad including an acoustic window for chemical mechanical polishing

Номер патента: EP4366911A1. Автор: Thomas H. Osterheld,Benjamin Cherian,Nicholas A. Wiswell,Jason Garcheung Fung. Владелец: Applied Materials Inc. Дата публикации: 2024-05-15.

Indium oxide nanowire having copper-based dopants, method of forming the same and gas sensor having the same, and method of forming nanowires having metal phthalocyanine, nanowire arrangement and gas sensor having the same

Номер патента: US20170307561A1. Автор: Chaoyi Yan,Pooi See Lee,Jiangxin Wang,Nandan Singh,Abhishek Singh Dahiya. Владелец: NANYANG TECHNOLOGICAL UNIVERSITY. Дата публикации: 2017-10-26.

Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method

Номер патента: US8277286B2. Автор: Huang Soon Kang,Zin-Chang Wei,Kun-Ku Hung,Chyi-Shyuan Chern. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2012-10-02.

Retaining ring for chemical mechanical polishing

Номер патента: US8556684B2. Автор: William B. Sather,Adam W. Manzonie. Владелец: SPM Technology Inc. Дата публикации: 2013-10-15.

Apparatus and method for chemical mechanical polishing of substrates

Номер патента: EP1307320A1. Автор: Jason Melvin,Hilario L. Oh,Nam P. Suh. Владелец: ASML US Inc. Дата публикации: 2003-05-07.

Controlled retention of slurry in chemical mechanical polishing

Номер патента: US6019665A. Автор: Solomon I. Beilin,Michael G. Lee. Владелец: Fujitsu Ltd. Дата публикации: 2000-02-01.

Groove cleaning device for chemical-mechanical polishing

Номер патента: US6135868A. Автор: Madhavi Chandrachood,Brian J. Brown,Robert Tolles,Doyle Bennett,James C. Nystrom. Владелец: Applied Materials Inc. Дата публикации: 2000-10-24.

Groove cleaning device for chemical-mechanical polishing

Номер патента: WO1999041038A1. Автор: Brian J. Brown,Robert Tolles,Doyle Bennett,James C. Nystrom,Madhayi Chandrachood. Владелец: Applied Materials, Inc.. Дата публикации: 1999-08-19.

Apparatus and method for chemically mechanically polishing

Номер патента: US20200306929A1. Автор: Bo-I Lee. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2020-10-01.

Chemical mechanical polishing pad with fluorinated polymer and multimodal groove pattern

Номер патента: US20240207998A1. Автор: Joseph So,Matthew R. Gadinski. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2024-06-27.

Method of purifying/concentrating sugar chains with a sugar chain-trapping molecule and method of analyzing sugar chain structure

Номер патента: US20150175652A1. Автор: Hiroaki Nakagawa,Minenobu Okayama,Shinichiro Nishimura,Kenichi Niikura. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2015-06-25.

Method of purifying/concentrating sugar chains with a sugar chain-trapping molecule and method of analyzing sugar chain structure

Номер патента: US09683006B2. Автор: Hiroaki Nakagawa,Minenobu Okayama,Shinichiro Nishimura,Kenichi Niikura. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2017-06-20.

Polisher for chemical mechanical polishing process

Номер патента: KR20020053941A. Автор: 한동원. Владелец: 박종섭. Дата публикации: 2002-07-06.

Slurry recycling for chemical mechanical planarization system

Номер патента: US20230256563A1. Автор: Wen-Kuei Liu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-08-17.

Hot water generation for chemical mechanical polishing

Номер патента: EP4334083A1. Автор: Jianshe Tang,Shou-sung Chang,Hari Soundararajan,Haosheng Wu,Chad POLLARD,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2024-03-13.

Polishing pad and chemical mechanical polishing apparatus for polishing a workpiece, and method of polishing a workpiece using the chemical mechanical polishing apparatus

Номер патента: US09821429B2. Автор: Kenya Ito,Shozo Takahashi,Yu Ishii,Mika Suzuki. Владелец: Ebara Corp. Дата публикации: 2017-11-21.

Method of production of paraffin wax for water-dispersible polymerization of tetrafluoroethylene and method of production of polytetrafluoroethylene with the use of this wax

Номер патента: RU2268895C2. Автор: Дзун ХОСИКАВА,Сигеки КОБАЯСИ,Хироки КАМИЯ,Казуо КАТО,Хироюки ХИРАИ. Владелец: Асахи Гласс Компани, Лимитед. Дата публикации: 2006-01-27.

2,2'-di(3,4-alkylenedioxythiophene)s, their application, method of their obtaining, method of obtaining 5,5'-dihalogen-2,2'-(3,4-alkylenedioxythiophene)s and method of obtaining poly(3,4-alkylenedioxythiophene)s based on them

Номер патента: RU2345081C2. Автор: Кнуд РОЙТЕР. Владелец: Х.К. Штарк Гмбх. Дата публикации: 2009-01-27.

Porous chemical mechanical polishing pads

Номер патента: US20230330805A1. Автор: Rajeev Bajaj,Fred C. Redeker,Sivapackia Ganapathiappan,Mahendra C. Orilall,Daniel REDFIELD,Nag B. Patibandla,Ashwin CHOCKALINGAM,Boyi FU,Mayu YAMAMURA. Владелец: Applied Materials Inc. Дата публикации: 2023-10-19.

Retainer for chemical mechanical polishing carrier head

Номер патента: US11344991B2. Автор: Steven M. Zuniga,Andrew J. Nagengast. Владелец: Applied Materials Inc. Дата публикации: 2022-05-31.

Control of steam generation for chemical mechanical polishing

Номер патента: US11833637B2. Автор: Paul D. Butterfield,Shou-sung Chang,Calvin Lee,Hari Soundararajan,Haosheng Wu,Chad POLLARD,Dmitry Sklyar,Jonathan P. Domin,Shuchivrat DATAR. Владелец: Applied Materials Inc. Дата публикации: 2023-12-05.

Control of steam generation for chemical mechanical polishing

Номер патента: US20230415297A1. Автор: Paul D. Butterfield,Shou-sung Chang,Calvin Lee,Hari Soundararajan,Haosheng Wu,Chad POLLARD,Dmitry Sklyar,Jonathan P. Domin,Shuchivrat DATAR. Владелец: Applied Materials Inc. Дата публикации: 2023-12-28.

System and method for chemical mechanical polishing pad replacement

Номер патента: US20230009839A1. Автор: Shih-Chung Chen,Ching-Wen Cheng,Chun Yan Chen,Wei-Kang TU. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-01-12.

Method of manufacturing chemical mechanical polishing pads

Номер патента: US09770808B2. Автор: William A. Heeschen,Andrew Wank,Francis V. Acholla,Scott Chang,Jeff Tsai,Mark Gazze,James David Tate,Leo H. Chiang,Swee-Teng Chin. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-09-26.

Method of fuel firing using oxygen-contaning gas, burner for independent injection and method of glass load heating and furnace heating

Номер патента: RU2361149C2. Автор: Паскаль ДЮПЕРРЕ,Бенуа ГРАН,Бертран ЛЕРУ,Реми Пьер ТСИАВА,Мохан АМИРА,Патрик Жан-Мари РЕКУР,Лоик СИЛЬВЕСТР. Владелец: Л`Эр Ликид, Сосьете Аноним А Директуар Э Консей Де Сюрвейянс Пур Л`Этюд Э Л`Эксплуатасьон Де Проседе Жорж Клод. Дата публикации: 2009-07-10.

Methods of increasing mesenchymal stromal cell biosynthesis of specialized pro-resolving mediators and methods of use

Номер патента: WO2024044666A2. Автор: Thomas Turner,Edward Botchwey,Nick WILLETT,Elaine DELORIMIER. Владелец: University of Oregon. Дата публикации: 2024-02-29.

Methods of producing bioconjugates of e. coli o-antigen polysaccharides, compositions thereof, and methods of use thereof

Номер патента: EP4253554A2. Автор: Stefan Jochen KEMMLER,Michael Thomas KOWARIK,Eveline Marleen WEERDENBURG,Jeroen GEURTSEN,Kellen Cristhina FAE,Pieter Jan Burghout,Jan Theunis Poolman,Martin Edward Braun,Maria Paula Carranza Sandmeier,Veronica Gambillara FONCK,Darren Robert Abbanat,Manuela Mally,Patricia Ibarra Yon. Владелец: Janssen Pharmaceuticals Inc. Дата публикации: 2023-10-04.

Protected one-vial formulation for nucleic acid molecules, methods of making the same by in-line mixing, and related products and methods

Номер патента: EP1104309A2. Автор: Mark J. Logan,Russ Mumper,Maria Bruno,Jenna Tagliaferri,Luke Lawson. Владелец: Urigen Pharmaceuticals Inc. Дата публикации: 2001-06-06.

Carrier head for chemical mechanical polishing

Номер патента: US6165058A. Автор: Hung Chen,Steven Zuniga. Владелец: Applied Materials Inc. Дата публикации: 2000-12-26.

Clamping retainer for chemical mechanical polishing

Номер патента: US20230381917A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh. Владелец: Applied Materials Inc. Дата публикации: 2023-11-30.

Dual membrane carrier head for chemical mechanical polishing

Номер патента: US20240042574A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jay Gurusamy. Владелец: Applied Materials Inc. Дата публикации: 2024-02-08.

Retainer for chemical mechanical polishing carrier head

Номер патента: WO2024049890A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh,Eric Lau,Kuen-Hsiang Chen. Владелец: Applied Materials, Inc.. Дата публикации: 2024-03-07.

Dual membrane carrier head for chemical mechanical polishing

Номер патента: US11945073B2. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jay Gurusamy. Владелец: Applied Materials Inc. Дата публикации: 2024-04-02.

Retainer for chemical mechanical polishing carrier head

Номер патента: US20240075584A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh,Eric Lau,Kuen-Hsiang Chen. Владелец: Applied Materials Inc. Дата публикации: 2024-03-07.

Cobalt metal foam catalyst, method of making same, thermal-medium-circulating heat-exchange reactor using same, and method of producing a liquid fuel by means of a fischer-tropsch synthesis reaction using thermal-medium-circulating heat-exchange reactor

Номер патента: US20160200985A1. Автор: Heon Jung,Jung-Il Yang,Dong-Hyun Chun,Ji-Chan Park. Владелец: Korea Institute of Energy Research KIER. Дата публикации: 2016-07-14.

Preparation with the viable mycoparasitic microorganism pythium oligandrum for the treatment of dermaphytoses and yeast infections on the skin and mucous membranes, method of determining the cell's viability of the microorganism pythium oligandrum and method of applying the preparation

Номер патента: EP3478302A1. Автор: Martin Suchanek,Radim Klimes. Владелец: Bio Agens Research And Development - Bard Sro. Дата публикации: 2019-05-08.

Preparation with the mycoparasitic microorganism pythium oligandrum for the treatment of dermaphytoses and yeast infections on the skin and mucouses, method of determing the cell's viability of the microorganism pythium oligandrum and method of applying the preparation

Номер патента: US20200085893A1. Автор: Martin Suchanek,Radim Klimes. Владелец: Bio Agens Research And Development - Bard Sro. Дата публикации: 2020-03-19.

Customized polish pads for chemical mechanical planarization

Номер патента: US20100273398A1. Автор: Pradip K. Roy,Sudhanshu Misra. Владелец: Individual. Дата публикации: 2010-10-28.

Chip customized polish pads for chemical mechanical planarization (cmp)

Номер патента: EP1610929A1. Автор: Pradip K. Roy. Владелец: Neopad Technologies Corp. Дата публикации: 2006-01-04.

Method of chemical mechanical polish operation and chemical mechanical polishing system

Номер патента: US20230256561A1. Автор: Yu-Chu Hsu,Chunhung Chen,Ren-Dou Lee. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-08-17.

Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation

Номер патента: US6153116A. Автор: Champion Yi,Ming-Cheng Yang,Cheng-Sung Huang,Feng-Yeu Shau. Владелец: United Microelectronics Corp. Дата публикации: 2000-11-28.

Chemical mechanical polishing

Номер патента: GB2345257A. Автор: Juan-Yuan Wu,Chien-Hsin Lai,Juen-Kuen Lin,Daniel Chiu,Chih-Chiang Yang,Peng-Yih Peng,Kun-Lin Wu,Hao-Kuang Chiu. Владелец: United Microelectronics Corp. Дата публикации: 2000-07-05.

Low magnetic chemical mechanical polishing conditioner

Номер патента: US09475171B2. Автор: Tian-Yeu WU. Владелец: Kinik Co. Дата публикации: 2016-10-25.

Nitrogen-doped catalyst for oxidative coupling reaction of methane, manufacturing method of nitrogen-doped catalyst for oxidative coupling reaction of methane thereby, and method for oxidative coupling reaction of methane using the same

Номер патента: US20220161249A1. Автор: Tae-Woo Kim,Hee-Yeon Kim,Ji-Haeng Yu,Dae Keun Lee. Владелец: Korea Institute of Energy Research KIER. Дата публикации: 2022-05-26.

Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing

Номер патента: WO2003002302A1. Автор: Robert A. Eaton. Владелец: Speedfam-Ipec Corporation. Дата публикации: 2003-01-09.

Temperature control of chemical mechanical polishing

Номер патента: WO2010126902A4. Автор: Thomas H. Osterheld,Stephen Jew,Kun Xu,Jimin Zhang. Владелец: Applied Materials, Inc.. Дата публикации: 2011-03-31.

Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad

Номер патента: US09446497B2. Автор: David B. James,Marty W. Degroot,Mary A. Leugers,Angus Repper. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2016-09-20.

Method of producing crystalline rods having regions of reversed dominant ferroelectric polarity and method for clarifying such a rod

Номер патента: US5171400A. Автор: Robert L. Byer,Martin M. Fejer,Gregory A. Magel. Владелец: Leland Stanford Junior University. Дата публикации: 1992-12-15.

Detection method and detection apparatus for polishing pad of chemical mechanical polishing device

Номер патента: US20210146501A1. Автор: Hsien-Ming Lee,Chun-Chen Chen,Po-Ching Huang,Ching-Tang Hsueh. Владелец: Ta Liang Technology Co Ltd. Дата публикации: 2021-05-20.

Chemical mechanical polishing apparatus and polishing method using the same

Номер патента: US09481069B2. Автор: Sheng-Chen Wang,Feng-Inn Wu,Yuan-Hsuan Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2016-11-01.

Synthetic fibre for three-dimensional reinforcement of cement product and method of preparing said fibre (versions), cement product containing dispersed synthetic fibre and method of preparing said cement product

Номер патента: RU2396379C2. Автор: Евгений Павлович Бабенков. Владелец: Общество С Ограниченной Ответственностью "Си Айрлайд". Дата публикации: 2010-08-10.

Method of production of blended metal composition based on additive, catalytic composition and method of catalytic hydraulic treatment of hydrocarbon material

Номер патента: RU2287367C2. Автор: Франс Лодевейк ПЛАНТЕНГА,Сонь ЭЙСБАУТС,Сонья Эйсбаутс,Маринус Брюс СЕРФОНТАЙН. Владелец: Альбемарл Недерландс Б.В.. Дата публикации: 2006-11-20.

Method of producing paper web for applying pattern on concrete surface (embodiments) and method of applying pattern on concrete surface

Номер патента: RU2698923C2. Автор: Владимир Николаевич Нешта,Анатолий Львович Апекишев. Владелец: Анатолий Львович Апекишев. Дата публикации: 2019-09-02.

Endpoint detection window, chemical mechanical polishing pad with window and preparation method thereof

Номер патента: US20240009797A1. Автор: Kai Chen,Lijun Yao,Jianguo SHI,Hongqi XIANG. Владелец: Inventech Materials Co Ltd. Дата публикации: 2024-01-11.

Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer

Номер патента: WO2020176460A1. Автор: Kevin H. Song,Benedict W. Pang. Владелец: Applied Materials, Inc.. Дата публикации: 2020-09-03.

Chemical-mechanical polishing aid

Номер патента: GB9828786D0. Автор: . Владелец: United Microelectronics Corp. Дата публикации: 1999-02-17.

Chemical mechanical polishing pad with window

Номер патента: US09446498B1. Автор: Joseph So,Bainian Qian,Janet Tesfai. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2016-09-20.

High strength dip galvanized steel plate with excellent characteristic of impact strength, and method of its manufacturing, and high strength alloyed dip galvanized steel plate and method of its manufacturing

Номер патента: RU2566121C1. Автор: Хироюки КАВАТА,Наоки МАРУЯМА,Акинобу МУРАСАТО,Акинобу МИНАМИ,Такеси ЯСУИ,Такуя КУВАЯМА,Хироюки БАН,Каору ХИРАМАЦУ. Владелец: Ниппон Стил Энд Сумитомо Метал Корпорейшн. Дата публикации: 2015-10-20.

Methods of producing bioconjugates of e. coli o-antigen polysaccharides, compositions thereof, and methods of use thereof

Номер патента: EP4253554A3. Автор: Stefan Jochen KEMMLER,Michael Thomas KOWARIK,Eveline Marleen WEERDENBURG,Jeroen GEURTSEN,Kellen Cristhina FAE,Pieter Jan Burghout,Jan Theunis Poolman,Martin Edward Braun,Maria Paula Carranza Sandmeier,Veronica Gambillara FONCK,Darren Robert Abbanat,Manuela Mally,Patricia Ibarra Yon. Владелец: Janssen Pharmaceuticals Inc. Дата публикации: 2024-01-17.

Methods of identifying a tumor that is sensitive to treatment with talazoparib and methods of treatment thereof

Номер патента: US20240052423A1. Автор: Joshua James Gruber,Melinda TELLI. Владелец: PFIZER INC. Дата публикации: 2024-02-15.

METHOD OF HIGHLY EXPRESSING TARGET PROTEIN FROM PLANT USING RbcS FUSION PROTEIN AND METHOD OF PREPARING COMPOSITION FOR ORAL ADMINISTRATION OF MEDICAL PROTEIN USING TARGET PROTEIN EXPRESSION PLANT BODY

Номер патента: US20170335361A1. Автор: Per-Olof Berggren,Inhwan Hwang,Yong Jik Lee,Jae Yoon Kim,Eun Ju Sohn,Hyang Ju KANG,Yun Joo YOO. Владелец: Academy Industry Foundation of POSTECH. Дата публикации: 2017-11-23.

Methods of identifying a tumor that is sensitive to treatment with talazoparib and methods of treatment thereof

Номер патента: EP4256088A1. Автор: Joshua James Gruber,Melinda TELLI. Владелец: PFIZER INC. Дата публикации: 2023-10-11.

Methods of increasing mesenchymal stromal cell biosynthesis of specialized pro-resolving mediators and methods of use

Номер патента: WO2024044666A3. Автор: Thomas Turner,Edward Botchwey,Nick WILLETT,Elaine DELORIMIER. Владелец: University of Oregon. Дата публикации: 2024-05-10.

Method of producing antibodies to a restricted population of t lymphocytes, antibodies and method of use

Номер патента: WO1993005813A1. Автор: Steven M. Friedman,Mary K. Crow,David Posnett. Владелец: New York Society For The Relief Of The Ruptured And Crippled, Maintaining The Hospital For Special Surgery. Дата публикации: 1993-04-01.

Chemical mechanical polishing apparatus and a method for planarizing/polishing a surface

Номер патента: US20070026769A1. Автор: Eugene Davis,Kyle Hunt,Daniel Caldwell. Владелец: Texas Instruments Inc. Дата публикации: 2007-02-01.

Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus

Номер патента: US11964357B2. Автор: Kuntack Lee,Yonghee Lee,Byoungho Kwon,Taemin EARMME,Seungchul Han. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-04-23.

Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus

Номер патента: US20200346317A1. Автор: Kuntack Lee,Yonghee Lee,Byoungho Kwon,Taemin EARMME,Seungchul Han. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-11-05.

Removal rate estimating method of a chemical mechanical polishing process under mixed products or mixed layers

Номер патента: US20070145010A1. Автор: Chih-Wei Lai,Ming-Wei Lee. Владелец: Industrial Technology Research Institute ITRI. Дата публикации: 2007-06-28.

Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk

Номер патента: US11766758B2. Автор: Wen-Pin HO,Ren-Hao JHENG,S. P. Cheng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-09-26.

Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus

Номер патента: US20030139117A1. Автор: Jen-Chieh Tung,Kuan-Fu Chang,Sheng-Jan Chang,Yu-Wei Chih. Владелец: Individual. Дата публикации: 2003-07-24.

Chemical mechanical polishing conditioner with high quality abrasive particles

Номер патента: US09415481B2. Автор: Jui-Lin Chou. Владелец: Kinik Co. Дата публикации: 2016-08-16.

Chemical-mechanical polishing subpad having porogens with polymeric shells

Номер патента: EP4267342A1. Автор: Chen-Chih Tsai,Dustin Miller,Paul Andre Lefevre,Aaron Peterson. Владелец: CMC Materials LLC. Дата публикации: 2023-11-01.

Chemical mechanical polishing pad, polishing layer analyzer and method

Номер патента: US20170197290A1. Автор: William A. Heeschen,Andrew Wank,Francis V. Acholla,Scott Chang,Jeff Tsai,Mark Gazze,James David Tate,Leo H. Chiang,Swee-Teng Chin. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-07-13.

Chemical mechanical polishing apparatus with stable signals

Номер патента: US6568988B1. Автор: Chun-Chieh Lee,Hua-Jen Tseng,Dong-Tay Tsai,Yi-Hua Chin. Владелец: Mosel Vitelic Inc. Дата публикации: 2003-05-27.

Conditioner and chemical mechanical polishing apparatus including the same

Номер патента: US20190358772A1. Автор: Yong-Hee Lee,Jong-hwi SEO,Seung-Chul Han,Hui-Gwan LEE. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2019-11-28.

Chemical mechanical polishing apparatus

Номер патента: US20020142711A1. Автор: Hsin-Chuan Tsai,Shan-Chang Wang. Владелец: Nanya Technology Corp. Дата публикации: 2002-10-03.

Apparatus and system of chemical mechanical polishing

Номер патента: US20020132567A1. Автор: Hai-Ching Chen. Владелец: Individual. Дата публикации: 2002-09-19.

Chemical mechanical polishing apparatus

Номер патента: US6761624B2. Автор: Hsin-Chuan Tsai,Shan-Chang Wang. Владелец: Nanya Technology Corp. Дата публикации: 2004-07-13.

Chemical mechanical polishing pad, polishing layer analyzer and method

Номер патента: US09737971B2. Автор: William A. Heeschen,Andrew Wank,Francis V. Acholla,Scott Chang,Jeff Tsai,Mark Gazze,James David Tate,Leo H. Chiang,Swee-Teng Chin. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-08-22.

Method for producing chemical mechanical polishing pad

Номер патента: US20090104856A1. Автор: Yukio Hosaka,Rikimaru Kuwabara. Владелец: JSR Corp. Дата публикации: 2009-04-23.

Chemical mechanical polishing pad with controlled polish rate

Номер патента: US6054017A. Автор: Bih-Tiao Lin,Fu-Liang Yang. Владелец: Vanguard International Semiconductor Corp. Дата публикации: 2000-04-25.

Modular chemical mechanical polisher with simultaneous polishing and pad treatment

Номер патента: US20240075582A1. Автор: Steven M. Zuniga,Jay Gurusamy. Владелец: Applied Materials Inc. Дата публикации: 2024-03-07.

Modular chemical mechanical polisher with simultaneous polishing and pad treatment

Номер патента: WO2024049642A1. Автор: Steven M. Zuniga,Jay Gurusamy. Владелец: Applied Materials, Inc.. Дата публикации: 2024-03-07.

Chemical-mechanical-polishing system with continuous filtration

Номер патента: US6244929B1. Автор: Daniel Thomas,Richard D. Russ. Владелец: VLSI Technology Inc. Дата публикации: 2001-06-12.

Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step

Номер патента: US7268000B2. Автор: Gerd Marxsen,Dirk Wollstein,Jan Raebiger. Владелец: Advanced Micro Devices Inc. Дата публикации: 2007-09-11.

Chemical mechanical polishing device and polishing method

Номер патента: US20240131655A1. Автор: Kai-Yao Shih,Ming-Hsiang Chen,Shih-Ci Yen. Владелец: Powerchip Semiconductor Manufacturing Corp. Дата публикации: 2024-04-25.

Chemical mechanical polishing apparatus for polishing workpiece

Номер патента: US20190262968A1. Автор: Hitoshi Morinaga,Kenya Ito,Hiroshi Asano,Kazusei Tamai,Yu Ishii,Shingo OHTSUKI. Владелец: Ebara Corp. Дата публикации: 2019-08-29.

Chemical mechanical polishing apparatus with integrated slurry mixer-dispenser and methods for operating the same

Номер патента: US20230373062A1. Автор: Yu-chen Wei,Feng-Inn Wu,You-Shiang Lin,Jiun Ru Huang,Jyun-Jie Wu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-23.

Chemical mechanical polishing apparatus

Номер патента: US20240173815A1. Автор: Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-30.

Single drive system for a bi-directional linear chemical mechanical polishing apparatus

Номер патента: US20030022607A1. Автор: Douglas Young,Bernard Frey,Mark Henderson. Владелец: ASM Nutool Inc. Дата публикации: 2003-01-30.

Chemical mechanical polishing slurry pump monitoring system and method

Номер патента: US20050101223A1. Автор: Daniel Caldwell,Thomas Kiez. Владелец: Texas Instruments Inc. Дата публикации: 2005-05-12.

Chemical-mechanical polishing apparatus

Номер патента: US6010395A. Автор: Hideharu Nakajima. Владелец: Sony Corp. Дата публикации: 2000-01-04.

Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing

Номер патента: US6531397B1. Автор: Ronald J. Nagahara,Dawn M. Lee. Владелец: LSI Logic Corp. Дата публикации: 2003-03-11.

Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing

Номер патента: US20230182259A1. Автор: Hui Chen,Shou-sung Chang,Surajit Kumar,Chih Chung Chou. Владелец: Applied Materials Inc. Дата публикации: 2023-06-15.

Monitor chemical mechanical polishing process using machine learning based processing of heat images

Номер патента: EP4329981A1. Автор: Thomas H. Osterheld,Benjamin Cherian. Владелец: Applied Materials Inc. Дата публикации: 2024-03-06.

Chemical mechanical polishing system

Номер патента: US20050095963A1. Автор: David Stark,Christopher Schutte. Владелец: Texas Instruments Inc. Дата публикации: 2005-05-05.

Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing

Номер патента: WO2022006012A1. Автор: Hui Chen,Shou-sung Chang,Surajit Kumar,Chih Chung Chou. Владелец: Applied Materials, Inc.. Дата публикации: 2022-01-06.

Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing

Номер патента: EP4171872A1. Автор: Hui Chen,Shou-sung Chang,Surajit Kumar,Chih Chung Chou. Владелец: Applied Materials Inc. Дата публикации: 2023-05-03.

Installation for improving chemical-mechanical polishing operation

Номер патента: US6062955A. Автор: Ying-Chih Liu. Владелец: Worldwide Semiconductor Manufacturing Corp. Дата публикации: 2000-05-16.

Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing

Номер патента: US20030104761A1. Автор: Boguslaw Swedek,Andreas Wiswesser,Walter Schoenleber. Владелец: Applied Materials Inc. Дата публикации: 2003-06-05.

Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus

Номер патента: US20040261945A1. Автор: Wilfried Ensinger. Владелец: Ensinger Kunststofftechnologie GbR. Дата публикации: 2004-12-30.

Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method

Номер патента: US20240091902A1. Автор: Younghun Kim,Sangyun Lee. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-03-21.

Control of platen shape in chemical mechanical polishing

Номер патента: WO2024006213A1. Автор: Steven M. Zuniga,Jay Gurusamy,Jeonghoon Oh. Владелец: Applied Materials, Inc.. Дата публикации: 2024-01-04.

Control of platen shape in chemical mechanical polishing

Номер патента: US20230415295A1. Автор: Steven M. Zuniga,Jay Gurusamy,Jeonghoon Oh. Владелец: Applied Materials Inc. Дата публикации: 2023-12-28.

Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk

Номер патента: US20230364731A1. Автор: Wen-Pin HO,Ren-Hao JHENG,S.P. Cheng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-16.

A carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus

Номер патента: EP1045740A1. Автор: Steven M. Zuniga,Hung Chen. Владелец: Applied Materials Inc. Дата публикации: 2000-10-25.

Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same

Номер патента: US20030234078A1. Автор: Chia-Lin Hsu,Hsueh-Chung Chen,Shih-Hsun Hsu,Art Yu. Владелец: United Microelectronics Corp. Дата публикации: 2003-12-25.

Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces

Номер патента: US6935929B2. Автор: Jason B. Elledge. Владелец: Micron Technology Inc. Дата публикации: 2005-08-30.

Chemical mechanical polishing machine and fabrication processes using the same.

Номер патента: GB2342605A. Автор: Juan-Yuan Wu,Chien-Hsin Lai,Juen-Kuen Lin,Daniel Chiu,Chih-Chiang Yang,Peng-Yih Peng,Kun-Lin Wu,Hao-Kuang Chiu. Владелец: United Microelectronics Corp. Дата публикации: 2000-04-19.

Chemical mechanical polishing optical endpoint detection

Номер патента: US20050075055A1. Автор: Brian ZINN,Barry Lanier. Владелец: Texas Instruments Inc. Дата публикации: 2005-04-07.

Retaining ring for use in chemical mechanical polishing

Номер патента: US6821192B1. Автор: Timothy J. Donohue. Владелец: Applied Materials Inc. Дата публикации: 2004-11-23.

A chemical mechanical polishing semiconductor device and mehhod for preventing scratch

Номер патента: KR100568031B1. Автор: 심상철. Владелец: 동부아남반도체 주식회사. Дата публикации: 2006-04-05.

In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization

Номер патента: US7024063B2. Автор: Wallace T. Y. Tang. Владелец: Applied Materials Inc. Дата публикации: 2006-04-04.

Carrier head with layer of conformable material for a chemical mechanical polishing system

Номер патента: US6036587A. Автор: Robert D. Tolles,John Prince,Tsungan Cheng. Владелец: Applied Materials Inc. Дата публикации: 2000-03-14.

A chemical mechanical polishing semiconductor device and mehhod for preventing scratch

Номер патента: KR20050014350A. Автор: 심상철. Владелец: 동부아남반도체 주식회사. Дата публикации: 2005-02-07.

Compliant inner ring for a chemical mechanical polishing system

Номер патента: US20230356354A1. Автор: Steven M. Zuniga,Satish Radhakrishnan,Andrew Nagengast,Jeonghoon Oh,Hari Prasath RAJENDRAN,Ekaterina A. MIKHAYLICHENKO,Eric L. Lau,Kuen-Hsiang Chen. Владелец: Applied Materials Inc. Дата публикации: 2023-11-09.

Compliant inner ring for a chemical mechanical polishing system

Номер патента: WO2023214985A1. Автор: Steven M. Zuniga,Satish Radhakrishnan,Andrew Nagengast,Jeonghoon Oh,Hari Prasath RAJENDRAN,Ekaterina A. MIKHAYLICHENKO,Eric L. Lau,Kuen-Hsiang Chen. Владелец: Applied Materials, Inc.. Дата публикации: 2023-11-09.

Manufacturing method for retainer ring of chemical mechanical polishing apparatus

Номер патента: KR101285308B1. Автор: 유승열. Владелец: 유승열. Дата публикации: 2013-07-11.

Manufacturing method for retainner ring of chemical mechanical polishing apparatus

Номер патента: KR101085856B1. Автор: 김진우,김민규,이재복,이한주,구광희. Владелец: 주식회사 윌비에스엔티. Дата публикации: 2011-11-22.

Manufacturing Method for Retainner Ring of Chemical Mechanical Polishing Apparatus

Номер патента: KR101085855B1. Автор: 김민규,이재복,이한주,구광희. Владелец: 주식회사 윌비에스엔티. Дата публикации: 2011-11-22.

Method for verifying performance of chemical mechanical polishing device

Номер патента: CN111426495A. Автор: 郑凯铭. Владелец: Yangtze Memory Technologies Co Ltd. Дата публикации: 2020-07-17.

Manufacturing method for retainner ring of chemical mechanical polishing apparatus

Номер патента: KR101003525B1. Автор: 김민규,이재복,이한주,구광희. Владелец: 주식회사 윌비에스엔티. Дата публикации: 2010-12-30.

Method for manufacturing single-crystal sensing elements for high-voltage optical measuring voltage transformers

Номер патента: RU2748973C1. Автор: Сергей Александрович Сахаров,Владимир Владимирович Аленков,Светлана Сергеевна Базалевская,Дина Генриховна Евтушенко,Алексей Николаевич Забелин,Анатолий Анатольевич Мололкин. Владелец: Акционерное Общество "ФОМОС-МАТЕРИАЛЫ". Дата публикации: 2021-06-02.

Device and methods for chemical mechanical polishing

Номер патента: US11772227B2. Автор: Chi-Ming Yang,He Hui Peng,James Jeng-Jyi Hwang,Jiann Lih Wu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-10-03.

Ditch type floating ring for chemical mechanical polishing

Номер патента: US20020086536A1. Автор: Wei-Chieh Hsu. Владелец: Vanguard International Semiconductor Corp. Дата публикации: 2002-07-04.

Abrasive slurry delivery apparatus and methods of using same

Номер патента: US5636691A. Автор: James D. Hendrickson,Ronnie D. Finley,Dean S. O'Neal,Sidney J. Guillot. Владелец: Halliburton Energy Services Inc. Дата публикации: 1997-06-10.

Chemical mechanical polishing conditioner

Номер патента: US09821431B2. Автор: Jui-Lin Chou,Chia-Feng Chiu,Wen-Jen Liao,Xue-Shen Su. Владелец: Kinik Co. Дата публикации: 2017-11-21.

Operation of clamping retainer for chemical mechanical polishing

Номер патента: US20230381915A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh. Владелец: Applied Materials Inc. Дата публикации: 2023-11-30.

Apparatus and method for endpoint detection and monitoring for chemical mechanical polishing operations

Номер патента: WO2004002680A1. Автор: Karl E. Mautz. Владелец: Freescale Semiconductor, Inc.. Дата публикации: 2004-01-08.

Method for analyzing effective polishing frequency and effective polishing times for chemical mechanical planarization polishing wafers with different polishing pad profiles

Номер патента: US20060240745A1. Автор: Zone-Ching Lin,Chein-Chung Chen. Владелец: National Taiwan University of Science and Technology NTUST. Дата публикации: 2006-10-26.

Method for analyzing effective polishing frequency and effective polishing times for chemical mechanical planarization polishing wafers with different polishing pad profiles

Номер патента: US7299107B2. Автор: Zone-Ching Lin,Chein-Chung Chen. Владелец: National Taiwan University of Science and Technology NTUST. Дата публикации: 2007-11-20.

Reinforced polishing pad for linear chemical mechanical polishing and method for forming

Номер патента: US20030013398A1. Автор: Tsu Shih,Wen-Chih Chiou,Ying-Ho Chen,Syun-Ming Jang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2003-01-16.

Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures

Номер патента: EP1307909A2. Автор: William J. Campbell. Владелец: Advanced Micro Devices Inc. Дата публикации: 2003-05-07.

Hydrophilic and zeta potential tunable chemical mechanical polishing pads

Номер патента: US11826876B2. Автор: Rajeev Bajaj,Sivapackia Ganapathiappan,Hou T. Ng,Daniel REDFIELD,Nag B. Patibandla,Ashwin CHOCKALINGAM,Boyi FU,Ankit Vora,Sudhakar Madhusoodhanan. Владелец: Applied Materials Inc. Дата публикации: 2023-11-28.

Medical device, kit for treating and method of treating disturbed blood vessels, body cavities and body ducts, as well as method for placing medical fluid in surrounding tissue

Номер патента: RU2712089C2. Автор: Микаэль ОКЕССОН. Владелец: Медваск Аб. Дата публикации: 2020-01-24.

Method of application lacquer on security papers, particularly on security papers printed by intaglio method, for example, banknotes, and machine for application lacquer for performing method

Номер патента: RU2513682C2. Автор: Стефан БОЛОНИНИ. Владелец: КБА-НотаСис СА. Дата публикации: 2014-04-20.

Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring

Номер патента: US20040171331A1. Автор: William Dyson,Tanlin Dickey,Scott Chin,Gerald Maloney,John Geraghty. Владелец: Individual. Дата публикации: 2004-09-02.

Method to shape the surface of chemical mechanical polishing pads

Номер патента: US09802293B1. Автор: Jeffrey James Hendron,Jeffrey Robert Stack. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-10-31.

Simplified method of making part, part produced by means of such manufacturing method, and method of selection between simplified and not simplified manufacturing method

Номер патента: RU2732552C2. Автор: Пьер КОЛЕН,Ив БОННМАЙР. Владелец: Пса Отомобиль Са. Дата публикации: 2020-09-21.

Method of making array of optical elements (versions), article containing said array and method of making said article

Номер патента: RU2422861C2. Автор: Стивен Р. ЧЭПМЭН,Деннис И. КАЗИН,Кэцзянь ХУАН,Деннис И. КАЗИН (US),Кэцзянь ХУАН (US),Стивен Р. ЧЭПМЭН (US). Владелец: Эвери Деннисон Копэрейшн. Дата публикации: 2011-06-27.

System and method of dosing a polymer mixture with a first solvent, device, system and method of extracting solvent from at least one polymeric yarn, system and method of mechanical pre-recovery of at least one liquid in at least one polymeric yarn, and continuous system and method for producing at least one polymeric yarn

Номер патента: US12031234B2. Автор: Marcos Roberto Paulino Bueno,André PENAQUIONI,Alessandro Bernardi,Sérgio Luiz Dias Almeida,Leandro Ohara Oliveira Santa Rosa,Patrícia Freitas Oliveira Fialho,Daniela Zaira Rauber. Владелец: Braskem America Inc. Дата публикации: 2024-07-09.

Method and apparatus for endpoint detection during chemical mechanical polishing

Номер патента: WO2003041909A1. Автор: Prabodh J. Parikh. Владелец: Speedfam-Ipec Corporation. Дата публикации: 2003-05-22.

Chemical mechanical polishing system and method of using

Номер патента: US11724360B2. Автор: Wen Yen Kung. Владелец: TSMC Nanjing Co Ltd. Дата публикации: 2023-08-15.

Digital electronic device capable of memory formatting, a method of memory formatting, digital electronic device having a function of storing and method for storing thereof

Номер патента: US20080189505A1. Автор: Joo-sun Hong. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2008-08-07.

Method of producing long workpiece for production of helical spring, helical spring and method of production thereof

Номер патента: RU2739737C1. Автор: Андрей Николаевич Скворцов. Владелец: Андрей Николаевич Скворцов. Дата публикации: 2020-12-28.

Photopolymerised composition for single-stage obtaining of polymer nanoporous material with hydrophobic pore surface, nanoporous polymer material with selective sorbing properties, method of obtaining thereof, method of single-stage formation based thereon of water-separating filtering elements and method of purifying organic liquids from water

Номер патента: RU2525908C1. Автор: Татьяна Ивановна Куликова,Алексей Николаевич Конев,Сергей Николаевич Менсов,Сергей Артурович Чесноков,Глеб Арсентьевич Абакумов,Роман Сергеевич Ковылин,Максим Александрович Батенькин,Юрий Владимирович Чечет. Владелец: Федеральное государственное бюджетное учреждение науки Институт металлорганической химии им. Г.А. Разуваева Российской академии наук (ИМХ РАН). Дата публикации: 2014-08-20.

Method of creating track of movement for autonomous movement of movable object and method of autonomous movement of movable object along path of movement

Номер патента: RU2691679C1. Автор: Андрей Владимирович ВАВИЛИН,Анатолий Сергеевич Терский. Владелец: Андрей Владимирович ВАВИЛИН. Дата публикации: 2019-06-17.

Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer

Номер патента: US20020192965A1. Автор: Miguel Saldana. Владелец: Individual. Дата публикации: 2002-12-19.

Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer

Номер патента: EP1390820B1. Автор: Miguel A. Saldana. Владелец: Lam Research Corp. Дата публикации: 2007-07-25.

Biopolymeric fibre, composition of forming solution for its obtaining, method of forming solution preparation, linen of biomedical purpose, biological bandage and method of wound treatment

Номер патента: RU2468129C2. Автор: Юрий Александрович Дмитриев,Анна Борисовна Шиповская,Николай Владимирович Островский,Юрий Евгеньевич Сальковский,Екатерина Владимировна Козырева,Ирина Борисовна Белянина,Вадим Владимирович Березяк,Ольга Игоревна Александрова,Ирина Васильевна Кириллова,Дмитрий Валерьевич Перминов. Владелец: Государственное образовательное учреждение высшего профессионального образования "Саратовский государственный университет им. Н.Г. Чернышевского". Дата публикации: 2012-11-27.

Method of making catalyst for production of synthesis gas, catalyst thus made and method of producing synthesis gas with its application

Номер патента: RU2491118C1. Автор: Андрей Леонидович Тарасов,Леонид Модестович Кустов. Владелец: ФЕДЕРАЛЬНОЕ ГОСУДАРСТВЕННОЕ БЮДЖЕТНОЕ УЧРЕЖДЕНИЕ НАУКИ ИНСТИТУТ ОРГАНИЧЕСКОЙ ХИМИИ ИМ. Н.Д. ЗЕЛИНСКОГО РОССИЙСКОЙ АКАДЕМИИ НАУК (ИОХ РАН). Дата публикации: 2013-08-27.

Method of deciding risk of obstructive sleep apnea syndrome, method of deciding sinking of hyoid bone, programs, x-ray diagnostic system, and method of making oral appliance

Номер патента: US20150320379A1. Автор: Daiki HIRABAYASHI. Владелец: Cephmedical Corp. Дата публикации: 2015-11-12.

Method of deciding risk of obstructive sleep apnea syndrome, method of deciding sinking of hyoid bone, programs, X-ray diagnostic system, and method of making oral appliance

Номер патента: US09561012B2. Автор: Daiki HIRABAYASHI. Владелец: Cephmedical Corp. Дата публикации: 2017-02-07.

Chemical mechanical polishing system with platen temperature control

Номер патента: US11911869B2. Автор: Jamie Stuart Leighton,Van H. Nguyen,Jeonghoon Oh,Roger M. Johnson. Владелец: Applied Materials Inc. Дата публикации: 2024-02-27.

Extrudate retarders, extruder configured to carry out high-moisture protein texturization extrusion, improvement to high-moisture protein texturization extrusion method, method of performing extrusion with an extruder having a cooling die, method of manufacturing meat replacement products using high-moisture protein texturization extrusion, and method of increasing manufacturing capacity of meat replacement production where high-moisture protein texturization extrusion is used

Номер патента: FI20235117A1. Автор: Jingwei Liu,Zhongqing JIANG. Владелец: VALIO OY. Дата публикации: 2024-08-08.

Method of injecting liquid agents at acupuncture points to arrive internal organs and method of visualizing arrival of liquid agents

Номер патента: US8057783B2. Автор: Min Soo Kim,Kwang Sup Soh,Cheon Joo Choi,Baeck Kyoung Sung,Vyacheslav Ogay. Владелец: Mobase Co Ltd. Дата публикации: 2011-11-15.

Method of injecting liquid agents at acupuncture points to arrive internal organs and method of visualizing arrival of liquid agents

Номер патента: US20090098058A1. Автор: Min Soo Kim,Kwang Sup Soh,Cheon Joo Choi,Baeck Kyoung Sung,Vyacheslav Ogay. Владелец: Mobase Co Ltd. Дата публикации: 2009-04-16.

V-mn-sb-tio2 catalyst, method of fabricating the catalyst, heat recovery steam generator comprising the catalyst, and method of eliminating yellow plume using the catalyst

Номер патента: EP4410421A1. Автор: Dongho Kim,Heon Phil Ha,Dong-Wook Kwon,Yeonjae PARK. Владелец: Korea Institute of Science and Technology KIST. Дата публикации: 2024-08-07.

Extrudate retarders, extruder configured to carry out high-moisture protein texturization extrusion, flow bender, improvement to high-moisture protein texturization extrusion method, method of performing extrusion with an extruder having a cooling die, method of manufacturing meat replacement products using high-moisture protein texturization extrusion, and method of increasing manufacturing capacity of meat replacement production where high-moisture protein texturization extrusion is used

Номер патента: WO2024165629A2. Автор: JIANG Zhongqing,Jingwei Liu. Владелец: VALIO OY. Дата публикации: 2024-08-15.

Extrudate retarders, extruder configured to carry out high-moisture protein texturization extrusion, flow bender, improvement to high-moisture protein texturization extrusion method, method of performing extrusion with an extruder having a cooling die, method of manufacturing meat replacement products using high-moisture protein texturization extrusion, and method of increasing manufacturing capacity of meat replacement production where high-moisture protein texturization extrusion is used

Номер патента: WO2024165629A3. Автор: JIANG Zhongqing,Jingwei Liu. Владелец: VALIO OY. Дата публикации: 2024-10-10.

Method of learning a parameter to estimate posture of an articulated object and method of estimating posture of an articulated object

Номер патента: US09460368B2. Автор: Jae Joon Han,Seung Ju Han. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2016-10-04.

Method of operating data storage device using size and write speed information and method of operating system including the same

Номер патента: US09778849B2. Автор: Jin Hyuk Kim,Chong Hyun Lee,Ho Suk YUM,Jin Wan Jun,Dong Hyuk IHM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2017-10-03.

Method of reading data from a nonvolatile memory device, nonvolatile memory device, and method of operating a memory system

Номер патента: US09412471B2. Автор: Kyung-Ryun Kim,Sang-Yong Yoon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2016-08-09.

Method of automatically recognizing and classifying design information in imaged PID drawing and method of automatically creating intelligent PID drawing using design information stored in database

Номер патента: US11756323B2. Автор: Sung Oh KANG,Hum Kyung BAEK,Eul Bum LEE. Владелец: Doftech Co Ltd. Дата публикации: 2023-09-12.

Method of forming a layer of silica to be eliminated subsequently and method for mounting an integrated optical component

Номер патента: US5736429A. Автор: Estelle Derouin,Claude Artigue,Denis Tregoat,Frederic Pommereau. Владелец: Alcatel NV. Дата публикации: 1998-04-07.

Methods to clean chemical mechanical polishing systems

Номер патента: US11850704B2. Автор: Kei-Wei Chen,Yen-Ting Chen,Chih-Chieh Chang,Hui-Chi Huang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-12-26.

Method of apparatus for forming an object by means of additive manufacturing

Номер патента: US20210362431A1. Автор: Herman Hendrikus Maalderink,Fabien Bernard Jacques Bruning,Wijnand Christiaan Germs. Владелец: Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO. Дата публикации: 2021-11-25.

Method of apparatus for forming an object by means of additive manufacturing

Номер патента: EP3774285A1. Автор: Herman Hendrikus Maalderink,Fabien Bernard Jacques Bruning,Wijnand Christiaan Germs. Владелец: Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO. Дата публикации: 2021-02-17.

Method for operating chemical mechanical polishing ("CMP") tool for the manufacture of semiconductor devices

Номер патента: US20040171266A1. Автор: Chien Hua Chen,Yuan Hsin Peng,Xiao Hua Li. Владелец: Semiconductor Manufacturing International Shanghai Corp. Дата публикации: 2004-09-02.

System and method of dosing a polymer mixture with a first solvent, device, system and method of extracting solvent from at least one polymeric yarn, system and method of mechanical pre-recovery of at least one liquid in at least one polymeric yarn, and continuous system and method for producing at least one polymeric yarn

Номер патента: US20240026571A1. Автор: Marcos Roberto Paulino Bueno,André PENAQUIONI,Alessandro Bernardi,Sérgio Luiz Dias Almeida,Leandro Ohara Oliveira Santa Rosa,Patrícia Freitas Oliveira Fialho,Daniela Zaira Rauber. Владелец: Braskem America Inc. Дата публикации: 2024-01-25.

System and method of dosing a polymer mixture with a first solvent, device, system and method of extracting solvent from at least one polymeric yarn, system and method of mechanical pre-recovery of at least one liquid in at least one polymeric yarn, and continuous system and method for producing at least one polymeric yarn

Номер патента: US11866849B2. Автор: Marcos Roberto Paulino Bueno,André PENAQUIONI,Alessandro Bernardi,Sérgio Luiz Dias Almeida,Leandro Ohara Oliveira Santa Rosa,Patrícia Freitas Oliveira Fialho,Daniela Zaira Rauber. Владелец: Braskem America Inc. Дата публикации: 2024-01-09.

System and method of dosing a polymer mixture with a first solvent, device, system and method of extracting solvent from at least one polymeric yarn, system and method of mechanical pre-recovery of at least one liquid in at least one polymeric yarn, and continuous system and method for producing at least one polymeric yarn

Номер патента: US11970788B2. Автор: Marcos Roberto Paulino Bueno,André PENAQUIONI,Alessandro Bernardi,Sérgio Luiz Dias Almeida,Leandro Ohara Oliveira Santa Rosa,Patrícia Freitas Oliveira Fialho,Daniela Zaira Rauber. Владелец: Braskem America Inc. Дата публикации: 2024-04-30.

System and method of dosing a polymer mixture with a first solvent, device, system and method of extracting solvent from at least one polymeric yarn, system and method of mechanical pre-recovery of at least one liquid in at least one polymeric yarn, and continuous system and method for producing at least one polymeric yarn

Номер патента: US11976385B2. Автор: Marcos Roberto Paulino Bueno,André PENAQUIONI,Alessandro Bernardi,Sérgio Luiz Dias Almeida,Leandro Ohara Oliveira Santa Rosa,Patrícia Freitas Oliveira Fialho,Daniela Zaira Rauber. Владелец: Braskem America Inc. Дата публикации: 2024-05-07.

Post-chemical mechanical polishing brush cleaning box

Номер патента: WO2023287507A1. Автор: Gary Ka Ho Lam. Владелец: Applied Materials, Inc.. Дата публикации: 2023-01-19.

Post-chemical mechanical polishing brush cleaning box

Номер патента: US12023779B2. Автор: Gary Ka Ho Lam. Владелец: Applied Materials Inc. Дата публикации: 2024-07-02.

Method of preparing biologically active reagents from succinimide-containing polymers, analytical element and methods of use

Номер патента: CA2058515C. Автор: Richard Calvin Sutton,Ignazio Salvatore Ponticello,Susan Jean Danielson,Marsha D.Bale Oenick. Владелец: Ortho Clinical Diagnostics Inc. Дата публикации: 2000-01-18.

Method of determining a parasitic force of an actuator of an optical component, control method for an actuator, optical system, projection system and lithographic apparatus

Номер патента: EP4303659A1. Автор: Hans Butler,Robertus Johannes Marinus De Jongh,Marinus Engelbertus Cornelis MUTSAERS. Владелец: ASML Netherlands BV. Дата публикации: 2024-01-10.

Method of determining a parasitic force of an actuator of an optical component, control method for an actuator, optical system, projection system and lithographic apparatus

Номер патента: WO2024008394A1. Автор: Hans Butler,Robertus Johannes Marinus De Jongh,Marinus Engelbertus Cornelis MUTSAERS. Владелец: ASML Netherlands B.V.. Дата публикации: 2024-01-11.

Method of detecting preceding feature and apparatus for detecting preceding feature jump and method of producing cold pipe using the method of detecting preceding feature

Номер патента: RU2603398C2. Автор: Такуя ХАНАДА. Владелец: Ниппон Стил Энд Сумитомо Метал Корпорейшн. Дата публикации: 2016-11-27.

Method of control over material particle size reduction, machine to this end and method of machine calibration

Номер патента: RU2484636C2. Автор: Ханс-Петер БЕРНАУЕР,Вольфганг ШТАНКМАНН,Юрген ЗИЛЛ,Олаф БАЛЬЦЕР,Оливер МЕКЛЕНБУРГ,Йорг МЕРТЕН,Бруно ДЕРИЙК. Владелец: Крафт Фудз Ар Энд Ди, Инк.. Дата публикации: 2013-06-20.

Space device and aircraft, elongated element of space device or aircraft, method of making model of elongated element of space device or aircraft, and method of producing elongated element of space device or aircraft, and computer

Номер патента: RU2486102C2. Автор: Эрик Стивен ВУД. Владелец: Эйрбас Оперейшнз Лимитед. Дата публикации: 2013-06-27.

Method of searching read voltage of nonvolatile memory device using regression analysis and method of reading data from nonvolatile memory device using the same

Номер патента: US11961553B2. Автор: Wijik LEE,Kwanwoo NOH,Hyeonjong Song. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-04-16.

Method of correcting mask pattern, computer program product, mask pattern correcting apparatus, and method of manufacturing semiconductor device

Номер патента: US20120244707A1. Автор: Toshiya Kotani,Taiga Uno,Hiromitsu Mashita,Yukiyasu Arisawa. Владелец: Individual. Дата публикации: 2012-09-27.

Method of operating nonvolatile memory device, nonvolatile memory device performing the same and method of operating memory system using the same

Номер патента: US20210090657A1. Автор: Seongho Ahn. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2021-03-25.

Mold for forming an expandable balloon for intraluminal use, balloon and method

Номер патента: EP4237216A1. Автор: Mario Salerno. Владелец: I Vasc Srl. Дата публикации: 2023-09-06.

Method of and apparatus for supplying cooling water to laser processing head and method of producing cooling water

Номер патента: US11878370B2. Автор: Jun Iwasaki. Владелец: Amada Holdings Co Ltd. Дата публикации: 2024-01-23.

Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same

Номер патента: TW200718647A. Автор: Jong-pil Kim,Seung-Beom Cho,Jang-yul Kim,Jun-Seok Nho,Myoung-Hwan Oh,Min-Jin Ko. Владелец: Lg Chemical Ltd. Дата публикации: 2007-05-16.

Composition and method for polishing memory hard disks exhibiting reduced edge roll off

Номер патента: MY191308A. Автор: Chinnathambi Selvaraj Palanisamy. Владелец: Cmc Mat Inc. Дата публикации: 2022-06-15.

AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES

Номер патента: US20130200038A1. Автор: Li Yuzhuo,Chu Jea-Ju,Venkataraman Shyam Sundar,Usman Ibrahim Sheik Ansar,Pinder Harvey Wayne. Владелец: BASF SE. Дата публикации: 2013-08-08.

Silicon oxynitride removal enhancers and methods of use thereof

Номер патента: US20240301241A1. Автор: Jimmy Granstrom. Владелец: Fujimi Inc. Дата публикации: 2024-09-12.

EROSION INHIBITOR FOR CHEMICAL MECHANICAL POLISHING, SLURRY FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD

Номер патента: US20140154884A1. Автор: Kato Shinya,KATO Mitsuru,OKAMOTO Chihiro,TAKEGOSHI Minori. Владелец: KURARAY CO., LTD.. Дата публикации: 2014-06-05.

AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD

Номер патента: US20150344739A1. Автор: Konno Tomohisa,Yamanaka Tatsuya,KAMEI Yasutaka,MIYAZAKI Yoshitaka. Владелец: JSR Corporation. Дата публикации: 2015-12-03.

SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD OF PREPARING THE SAME, AND POLISHING METHOD USING THE SAME

Номер патента: US20170107404A1. Автор: PAIK Un-gyu,SEO Ji-hoon,Kim Ye-Hwan. Владелец: . Дата публикации: 2017-04-20.

Polishing solution and polishing method for chemical mechanical polishing of silicon surface of silicon carbide wafer

Номер патента: CN113881349B. Автор: 孙韬,王汉强,步峥峥,王雪含. Владелец: Shanghai University of Engineering Science. Дата публикации: 2022-10-21.

Maintenance methods for polishing systems and articles related thereto

Номер патента: US11986925B2. Автор: Allen L. D'Ambra,Shantanu Rajiv GADGIL,Sumit Subhash PATANKAR,Nathan Arron DAVIS,Michael J. Coughlin. Владелец: Applied Materials Inc. Дата публикации: 2024-05-21.

Maintenance methods for polishing systems and articles related thereto

Номер патента: US20230060141A1. Автор: Allen L. D'Ambra,Shantanu Rajiv GADGIL,Sumit Subhash PATANKAR,Nathan Arron DAVIS,Michael J. Coughlin. Владелец: Applied Materials Inc. Дата публикации: 2023-03-02.

AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES

Номер патента: US20130161285A1. Автор: Li Yuzhuo,Chu Jea-Ju,Venkataraman Shyam Sundar,Usman Ibrahim Sheik Ansar,Pinder Harvey Wayne. Владелец: BASF SE. Дата публикации: 2013-06-27.

Slurry Composition for Chemical Mechanical Polishing of Metal having Enhanced Polishing Ability and Improved Stability and a Method for Preparing the Slurry Composition

Номер патента: KR100442549B1. Автор: 이길성,이재석,노현수,이인경,정재훈,도원중,김원래,박태원. Владелец: 제일모직주식회사. Дата публикации: 2004-07-30.

Polishing pad with porous interface and solid core, and related apparatus and methods

Номер патента: US09463551B2. Автор: Robert Vacassy,George Fotou. Владелец: Cabot Microelectronics Corp. Дата публикации: 2016-10-11.

Method of making low specific gravity polishing pads

Номер патента: US20230390970A1. Автор: Nan-Rong Chiou. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-12-07.

Composite material and related articles and methods

Номер патента: EP3233989A1. Автор: Michael John Percy. Владелец: Victrex Manufacturing Ltd. Дата публикации: 2017-10-25.

Composite material and related articles and methods

Номер патента: WO2016097715A1. Автор: Michael John Percy. Владелец: VICTREX MANUFACTURING LIMITED. Дата публикации: 2016-06-23.

Resin composition, polishing pad, and method for producing polishing pad

Номер патента: US11873399B2. Автор: Nobuyuki Takahashi,Ryujin Ishiuchi. Владелец: Resonac Corp. Дата публикации: 2024-01-16.

Resin composition, polishing pad, and method for producing polishing pad

Номер патента: US20210054192A1. Автор: Nobuyuki Takahashi,Ryujin Ishiuchi. Владелец: Showa Denko KK. Дата публикации: 2021-02-25.

Single crystal diamond component and method for producing

Номер патента: WO2023280842A1. Автор: Matthew Lee Markham,Jonathan Newland. Владелец: ELEMENT SIX TECHNOLOGIES LIMITED. Дата публикации: 2023-01-12.

Single crystal diamond component and method for producing

Номер патента: US20240309554A1. Автор: Matthew Lee Markham,Jonathan Christopher NEWLAND. Владелец: Element Six Technologies Ltd. Дата публикации: 2024-09-19.

Pad for chemical mechanical polishing

Номер патента: US20230347470A1. Автор: Joseph So,Matthew R. Gadinski,Donna M. Alden. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-11-02.

Method for intracellular conversion of single-stranded proteins into their double-stranded form

Номер патента: RU2569185C2. Автор: И Лю,Санджив ГАНШАНИ,Линх К. ЛЕ,Лэнс Э. СТЮАРД. Владелец: Аллерган, Инк.. Дата публикации: 2015-11-20.

Method of manufacturing thin film magnetic head

Номер патента: US20090265917A1. Автор: Masanori Tachibana,Koichi Sugimoto,Yoshiyuki Ikeda,Kazuaki Satoh. Владелец: Fujitsu Ltd. Дата публикации: 2009-10-29.

Composite polishing pad including carbon nanotubes, and method for producing same

Номер патента: US20240253178A1. Автор: Min Woo Kang,Seong Jae Kim,Seung Geun Kim,Sanha Kim,Sukkyung Kang,Jung Hee Choi,Ji Hun Jeong,Hyun Jun Ryu,Byung Ju Min,Seok Ji HONG,Nam Gue OH. Владелец: KPX CHEMICAL CO Ltd. Дата публикации: 2024-08-01.

Apparatus and method of using impedance resonance sensor for thickness measurement

Номер патента: US09528814B2. Автор: Yury Nikolenko,Matthew Fauss. Владелец: NeoVision LLC. Дата публикации: 2016-12-27.

Pad break-in method for chemical mechanical polishing tool which polishes with ceria-based slurry

Номер патента: TWI286958B. Автор: Kuo-Chun Wu,Karen Wong. Владелец: Promos Technologies Inc. Дата публикации: 2007-09-21.

Manufacturing method of a thin-film magnetic head

Номер патента: US7712204B2. Автор: Hiroshi Kamiyama,Hiroshi Yamazaki,Makoto Hasegawa,Kazuhiko Maejima,Atsuhiro Nonaka,Teruhisa Shindo. Владелец: TDK Corp. Дата публикации: 2010-05-11.

Method of determining pressure to apply to wafers during a cmp

Номер патента: US20100167629A1. Автор: John H. Zhang,Walter Kleemeier,Ronald K. Sampson. Владелец: STMicroelectronics lnc USA. Дата публикации: 2010-07-01.

Polishing method of soft magnetic layer in thin-film magnetic head, manufacturing method of thin-film magnetic head and thin-film magnetic head

Номер патента: US20070230064A1. Автор: Hiroshi Kamiyama,Hiroshi Yamazaki,Makoto Hasegawa,Atsuhiro Nonaka,Teruhisa Shindo,Kazukiko Maejima. Владелец: TDK Corp. Дата публикации: 2007-10-04.

Manufacturing methode of membrane for chemical mechanical polishing and membrane for chemical mechanical polishing using the same

Номер патента: KR101221853B1. Автор: 이두현,박기웅,정구찬. Владелец: 주식회사리온. Дата публикации: 2013-01-15.

POLYURETHANE, COMPOSITION FOR FORMATION OF POLISHING LAYERS THAT CONTAINS SAME, PAD FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME

Номер патента: US20140223832A1. Автор: OKAMOTO Takahiro,KUWABARA Rikimaru. Владелец: JSR Corporation. Дата публикации: 2014-08-14.

Dressing device and method for chemical mechanical polishing and chemical mechanical polishing system

Номер патента: CN114536220B. Автор: 路新春,王同庆,王春龙,许振杰,陈映松. Владелец: Huahaiqingke Co Ltd. Дата публикации: 2022-07-15.

Dressing device and method for chemical mechanical polishing and chemical mechanical polishing system

Номер патента: CN114536220A. Автор: 路新春,王同庆,王春龙,许振杰,陈映松. Владелец: Huahaiqingke Co Ltd. Дата публикации: 2022-05-27.

Method for chemical mechanical polishing (CMP) station maintenance and chemical mechanical polishing (CMP) station

Номер патента: TW201426833A. Автор: Teng-Chun Tsai,Kuo-Yin Lin,Chi-Yuan Chen,Wan-Chun Pan,Hsiang-Pi Chang. Владелец: Taiwan Semiconductor Mfg. Дата публикации: 2014-07-01.

Polishing pad for chemical-mechanical polishing of a semiconductor substrate

Номер патента: US5628862A. Автор: Chris C. Yu,Tat-Kwan Yu. Владелец: Motorola Inc. Дата публикации: 1997-05-13.

Three-dimensional network for chemical mechanical polishing

Номер патента: US7604529B2. Автор: Gregory P. Muldowney. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2009-10-20.

ACOUSTIC WINDOW WITH LIQUID-FILLED PORES FOR CHEMICAL MECHANICAL POLISHING AND METHODS OF FORMING PADS

Номер патента: US20230011626A1. Автор: Osterheld Thomas H.,Fung Jason Garcheung,Cherian Benjamin,Wiswell Nicholas A.. Владелец: . Дата публикации: 2023-01-12.

Bearing head for chemical mechanical polishing and chemical mechanical polishing equipment

Номер патента: CN112108996A. Автор: 路新春,赵德文. Владелец: TSINGHUA UNIVERSITY. Дата публикации: 2020-12-22.

Bearing head for chemical mechanical polishing and chemical mechanical polishing equipment

Номер патента: CN112108995A. Автор: 路新春,赵德文. Владелец: TSINGHUA UNIVERSITY. Дата публикации: 2020-12-22.

Method of manufacturing thermal inkjet printhead

Номер патента: US20080283494A1. Автор: Byung-Ha Park,Kyong-il Kim,Jin-Wook Lee,Myong-jong Kwon,Il-woo Kim,Hye-Young Min. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2008-11-20.

Chemical-mechanical polishing system and method of operating the same

Номер патента: EP3946808A1. Автор: Vladimir Gulkov,Nikolay Yeremin. Владелец: BRUKER NANO INC. Дата публикации: 2022-02-09.

METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD

Номер патента: US20160375553A1. Автор: Tong Yuhua,Degroot Marty W.,Jacob George C.,Kozhukh Julia,Qian Bainian,Brugarolas Brufau Teresa,Veneziale David Michael,Lugo Diego,Miller Jeffrey B.,Wank Andrew,Yeh Fengji. Владелец: . Дата публикации: 2016-12-29.

Method of and apparatus for chemical-mechanical polishing

Номер патента: US20020182978A1. Автор: Ralf Lukner,Owen Hehmeyer. Владелец: Momentum Technical Consulting Inc. Дата публикации: 2002-12-05.

Removable polishing pad for chemical mechanical polishing

Номер патента: US20090124176A1. Автор: Leonard J. Borucki. Владелец: Araca Inc. Дата публикации: 2009-05-14.

METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD

Номер патента: US20160375552A1. Автор: Tong Yuhua,Jacob George C.,Kozhukh Julia,Hendron Jeffrey James,Qian Bainian,Brugarolas Brufau Teresa,Veneziale David Michael,Lugo Diego,Miller Jeffrey B.,Tran Tony Quan,Stack Marc R.,Wank Andrew. Владелец: . Дата публикации: 2016-12-29.

METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD

Номер патента: US20160375555A1. Автор: Tong Yuhua,Degroot Marty W.,Jacob George C.,Kozhukh Julia,Qian Bainian,Brugarolas Brufau Teresa,Veneziale David Michael,Lugo Diego,Miller Jeffrey B.,Wank Andrew,Yeh Fengji. Владелец: . Дата публикации: 2016-12-29.

Dresser and apparatus for chemical mechanical polishing and method of dressing polishing pad

Номер патента: US7559827B2. Автор: Toshiya Saito. Владелец: Elpida Memory Inc. Дата публикации: 2009-07-14.

Customized polishing pads for cmp and methods of fabrication and use thereof

Номер патента: IL185099A. Автор: . Владелец: Nexplanar Corp. Дата публикации: 2013-11-28.

Customized polishing pads for cmp and methods of fabrication and use thereof

Номер патента: WO2006089293A1. Автор: Pradip K. Roy,Manish Deopura,Sudhanshu Misra. Владелец: Neopad Technologies Corporation. Дата публикации: 2006-08-24.

ENDPOINT CONTROL DURING CHEMICAL MECHANICAL POLISHING BY DETECTING INTERFACE BETWEEN DIFFERENT LAYERS THROUGH SELECTIVITY CHANGE

Номер патента: US20120003759A1. Автор: . Владелец: Applied Materials, Inc.. Дата публикации: 2012-01-05.

COMPOSITION FOR ADVANCED NODE FRONT-AND BACK-END OF LINE CHEMICAL MECHANICAL POLISHING

Номер патента: US20120003901A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

METAL CONDUCTOR CHEMICAL MECHANICAL POLISH

Номер патента: US20120001262A1. Автор: Yang Chi-Ming,Lin Chin-Hsiang,Jeng Shwang-Ming,Kang Huang Soon,Kuo Han-Hsin. Владелец: Taiwan Semiconductor Manufacturing Company, Ltd.. Дата публикации: 2012-01-05.

Chemical - mechanical polishing method

Номер патента: RU2305621C1. Автор: Владимир Николаевич Хмелёв,Андрей Викторович Шалунов,Роман Владиславович Барсуков,Сергей Николаевич Цыганок,Алексей Николаевич Сливин. Владелец: Государственное образовательное учреждение высшего профессионального образования "Алтайский государственный технический университет им. И.И. Ползунова" (АлтГТУ). Дата публикации: 2007-09-10.

Chemical mechanical polishing pad having holes and/or grooves

Номер патента: MY137114A. Автор: KIM Jaeseok,KWON Tae-Kyoung,Park Inha. Владелец: SKC Co Ltd. Дата публикации: 2008-12-31.

Silica sol, polishing composition, method for polishing silicon wafer, method for producing silicon wafer, chemical-mechanical polishing composition, and method for producing semiconductor device

Номер патента: JP7206695B2. Автор: 直子 住谷,智裕 京谷,栄治 出島,友寛 加藤,毅 沢井,耕史 本田,慎 池本. Владелец: Mitsubishi Chemical Corp. Дата публикации: 2023-01-18.

Chemical mechanical polishing pad having wave-shaped grooves

Номер патента: MY137105A. Автор: KIM Jaeseok,KWON Tae-Kyoung,Park Inha,Hwang In-Ju. Владелец: SKC Co Ltd. Дата публикации: 2008-12-31.

Auto feedback method for using recipes of chemical mechanical polishing (CMP) apparatus and control system thereof

Номер патента: TWI284583B. Автор: Chih-Hao Chuang,Sheng-Huan Tseng,Chien-Ying Chuang. Владелец: Powerchip Semiconductor Corp. Дата публикации: 2007-08-01.

Slurry composition for use in chemical mechanical polishing of metal wiring

Номер патента: MY140033A. Автор: Hyun Soo Roh,Kil Sung Lee,Jae Seok Lee,Chang Ki Hong,Bo Un Yoon,Won Joong Do,Jong Won Lee,Sang Rok Hah,Joon Sang Park. Владелец: Cheil Ind Inc. Дата публикации: 2009-11-30.

Method for controlling planeness during chemically mechanical polishing for ULSI multiple-layered copper wiring

Номер патента: CN1861321A. Автор: 刘玉岭,刘博�. Владелец: HEBEI UNIVERSITY OF TECHNOLOGY. Дата публикации: 2006-11-15.

Method for removing residues after chemical mechanical polishing

Номер патента: CN102157368A. Автор: 邓武锋. Владелец: Semiconductor Manufacturing International Shanghai Corp. Дата публикации: 2011-08-17.

Method for cleaning wafer after chemical mechanical polishing

Номер патента: CN101905221A. Автор: 黄孝鹏. Владелец: Semiconductor Manufacturing International Shanghai Corp. Дата публикации: 2010-12-08.

Method for cleaning surface after chemically mechanical polishing of tungsten-molybdenum alloy

Номер патента: CN102074460B. Автор: 刘玉岭,潘国峰,陈海涛. Владелец: HEBEI UNIVERSITY OF TECHNOLOGY. Дата публикации: 2012-05-23.

Abrasive particles for chemical mechanical polishing

Номер патента: MY153435A. Автор: James Neil Pryor,Jia-Ni Chu. Владелец: Grace W R & Co. Дата публикации: 2015-02-13.

Expression plasmid vector for heterological expression of recombinant proteins, high-frequency integration and amplified amplification of expression cassette in cells of mammals, bicistronic messenger riziform, method of production of stable lines of producents of recombinant proteins using specified vector, method for production of recombinant proteins

Номер патента: RU2488633C1. Автор: Надежда Александровна Орлова,Сергей Владимирович Ковнир,Иван Иванович Воробьев. Владелец: Общество с ограниченной ответственностью "Лаборатория медицинской биотехнологии" (ООО "ЛМБТ"). Дата публикации: 2013-07-27.

Method of treating periodontitis and oral mucosal diseases associated with helicobacter infection, and method for using it

Номер патента: RU2549445C1. Автор: Татьяна Григорьевна Хонина,Елена Владимировна Шадрина,Александр Витальевич Брагин,Марина Олеговна Нагаева,Гюзель Маратовна Акмалова,Екатерина Сергеевна Орлова,Елена Евгеньевна Короткова. Владелец: Екатерина Сергеевна Орлова. Дата публикации: 2015-04-27.

Composition of binder for impregnation of fibrous filler, prepreg on its base, method of production of prepreg, method of production of heat-resistant articles from prepreg-based composite material and method of manufacture of heat-resistant articles from composite material on base of fibrous filler

Номер патента: RU2304591C1. Автор: Николай Васильевич Мухин,Николай Владимирович Выморков,Владимир Васильевич Викулин,Ирина Петровна Никулина,Борис Алексеевич Ковалев,Валентина Петровна Ларичева,Владимир Васильевич Викулин (RU),Николай Васильевич Мухин (RU),Николай Владимирович Выморков (RU),Валентина Петровна Ларичева (RU),Борис Алексеевич Ковалев (RU),Ирина Петровна Никулина (RU). Владелец: Федеральное государственное унитарное предприятие "Научно-исследовательский физико-химический институт им. Л.Я. Карпова". Дата публикации: 2007-08-20.

Method of erection of structure from building blocks and/or building boards and method of manufacture of building block or board

Номер патента: RU2566350C1. Автор: Виктор Павлович Ремез. Владелец: Общество с ограниченной ответственностью "Научно-Производственное предприятие "Эксорб". Дата публикации: 2015-10-27.

Method of controlling state and recording running time of power production equipment and method to this effect

Номер патента: RU2534704C1. Автор: Владимир Григорьевич Бартенев. Владелец: Владимир Григорьевич Бартенев. Дата публикации: 2014-12-10.

Alcohol nitrates containing amide, dinitromethylene and nitroamine groups, method of preparing thereof 3- (acylaminodinitroalkyl)tetrahydo-1,3-oxazoles and oxazines, and method of preparing thereof

Номер патента: RU2146243C1. Автор: Л.Т. Еременко,А.Г. Корепин,П.В. Галкин,Е.К. Перепелкина,Н.М. Глушакова,И.Л. Еременко. Владелец: Институт химической физики в Черноголовке РАН. Дата публикации: 2000-03-10.

Method of maintenance cleaning and passivation of drum boiler pipe inner surface and method of maintenance cleaning and passivation of pipe inner surface of combined-cycle plant waste-heat boiler (versions)

Номер патента: RU2525033C1. Автор: Анастасия Васильевна Кирилина,Сергей Юрьевич Суслов,Игорь Александрович Сергеев,Тамара Викторовна Зезюля,Игорь Сергеевич Суслов,Екатерина Александровна Соколова. Владелец: Фонд поддержки научной, научно-технический и инновационной деятельности "Энергия без границ". Дата публикации: 2014-08-10.

Method of determination of coordinates of radio-frequency radiation source - repeater jammer and method of determination of coordinates of targets irradiated with repeater jammer

Номер патента: RU2531803C2. Автор: Сергей Яковлевич Прудников,Борис Григорьевич Беляев,Валерий Анатольевич Жибинов. Владелец: ОТКРЫТОЕ АКЦИОНЕРНОЕ ОБЩЕСТВО "НИИ измерительных приборов-Новосибирский завод имени Коминтерна" /ОАО "НПО НИИИП-НЗиК"/. Дата публикации: 2014-10-27.

Coagulant-adsorbent for cleaning industrial wastes from heavy metals, method of producing coagulant-adsorbent for cleaning industrial wastes from heavy metals and method of using coagulant-adsorbent for cleaning industrial wastes from heavy metals

Номер патента: RU2411191C1. Автор: Светлана Васильевна Караван,Анатолий Иванович Дробышев,Ольга Афанасьевна Пинчук,Ким Александрович Бурков. Владелец: Федеральное государственное образовательное учреждение высшего профессионального образования Санкт-Петербургский государственный университет (СПбГУ). Дата публикации: 2011-02-10.

CRYSTALLINE CERIUM OXIDE AND PREPARATION METHOD OF THE SAME

Номер патента: US20120000137A1. Автор: CHOI Sang-Soon,CHO Seung-Beom,HA Hyun-Chul,KWAK Ick-Soon,CHO Jun-Yeon. Владелец: LG CHEM, LTD.. Дата публикации: 2012-01-05.

Method Of Polishing Chalcogenide Alloy

Номер патента: US20120003834A1. Автор: Reddy Kancharla-Arun Kumar,Liu Zhendong,Koo Ja-Ho,Sawant Kaveri. Владелец: . Дата публикации: 2012-01-05.

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

Номер патента: US20120003808A1. Автор: Lee Sang-yun. Владелец: BESANG INC.. Дата публикации: 2012-01-05.

ULTRAHIGH DENSITY VERTICAL NAND MEMORY DEVICE AND METHOD OF MAKING THEREOF

Номер патента: US20120001247A1. Автор: Alsmeier Johann. Владелец: SanDisk Corporation. Дата публикации: 2012-01-05.

ULTRAHIGH DENSITY VERTICAL NAND MEMORY DEVICE & METHOD OF MAKING THEREOF

Номер патента: US20120001249A1. Автор: Alsmeier Johann,Samachisa George. Владелец: SanDisk Corporation. Дата публикации: 2012-01-05.

ULTRAHIGH DENSITY VERTICAL NAND MEMORY DEVICE AND METHOD OF MAKING THEREOF

Номер патента: US20120001250A1. Автор: Alsmeier Johann. Владелец: SanDisk Corporation. Дата публикации: 2012-01-05.

ULTRAHIGH DENSITY VERTICAL NAND MEMORY DEVICE AND METHOD OF MAKING THEREOF

Номер патента: US20120001252A1. Автор: Alsmeier Johann,Purayath Vinod Robert,Chien Henry,Matamis George,Lee Yao-Sheng,Kai James,Zhang Yuan. Владелец: SanDisk Corporation. Дата публикации: 2012-01-05.

METHOD OF FABRICATING AN INTEGRATED CIRCUIT DEVICE

Номер патента: US20120003806A1. Автор: . Владелец: Taiwan Semiconductor Manufacturing Company, Ltd.. Дата публикации: 2012-01-05.

Perpendicular Magnetic Write head and method of manufacturing the same

Номер патента: US20120002326A1. Автор: Matono Naoto,SASAKI Kenji,Mino Tetsuya,Onodera Ikuhito,Nishiyama Kazushi,Tsuchiya Michitoshi. Владелец: SAE Magnetics (H.K.) Ltd.. Дата публикации: 2012-01-05.

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Номер патента: US20120001331A1. Автор: . Владелец: KABUSHI KAISHA TOSHIBA. Дата публикации: 2012-01-05.

Alignment Mark and Method of Formation

Номер патента: US20120001337A1. Автор: Yu Chen-Hua,Lin Jing-Cheng,Jeng Shin-Puu,Chiou Wen-Chih,Wu Weng-Jin,Chen Chia-Ho,Tsai Fang Wen,Tsai Chen-Yu,Wang Shih-Hui,Chiu Chien-Ming. Владелец: Taiwan Semiconductor Manufacturing Company, Ltd.. Дата публикации: 2012-01-05.

THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20120001345A1. Автор: Hwang Kihyun,YANG Junkyu,Choi Hanmei,Park ChanJin,Min Gyungjin,Yoo Dongchul,Kong Yoochul. Владелец: . Дата публикации: 2012-01-05.

SYSTEM AND METHOD OF ILLUMINATING INTERFEROMETRIC MODULATORS USING BACKLIGHTING

Номер патента: US20120001962A1. Автор: Tung Ming-Hau,Chui Clarence. Владелец: QUALCOMM MEMS Technologies, Inc.. Дата публикации: 2012-01-05.

METHOD OF FABRICATING A LIGHT EMITTING DIODE CHIP HAVING PHOSPHOR COATING LAYER

Номер патента: US20120003758A1. Автор: HSIEH Chung-Chuan. Владелец: . Дата публикации: 2012-01-05.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WHICH A PLURALITY OF TYPES OF TRANSISTORS ARE MOUNTED

Номер патента: US20120001265A1. Автор: . Владелец: FUJITSU SEMICONDUCTOR LIMITED. Дата публикации: 2012-01-05.

Large Area Nitride Crystal and Method for Making It

Номер патента: US20120000415A1. Автор: Speck James S.,"DEvelyn Mark P.". Владелец: Soraa, Inc.. Дата публикации: 2012-01-05.

ETCHANTS AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES USING THE SAME

Номер патента: US20120001264A1. Автор: YANG Jun-Kyu,Kim Hong-Suk,Hwang Ki-Hyun,Ahn Jae-Young,Lim Hun-Hyeong,KIM Jin-Gyun. Владелец: . Дата публикации: 2012-01-05.

MEMORY CELL THAT EMPLOYS A SELECTIVELY FABRICATED CARBON NANO-TUBE REVERSIBLE RESISTANCE-SWITCHING ELEMENT AND METHODS OF FORMING THE SAME

Номер патента: US20120001150A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

INTEGRATED CIRCUIT DEVICE WITH WELL CONTROLLED SURFACE PROXIMITY AND METHOD OF MANUFACTURING SAME

Номер патента: US20120001238A1. Автор: Ouyang Hui,Fan Wei-Han,Tsai Ming-Huan,Cheng Chun-Fai. Владелец: Taiwan Semiconductor Manufacturing Company, Ltd.. Дата публикации: 2012-01-05.

METHODS OF FORMING NANOSCALE FLOATING GATE

Номер патента: US20120001248A1. Автор: Sandhu Gurtej S.,Ramaswamy D.V. Nirmal. Владелец: MICRON TECHNOLOGY, INC.. Дата публикации: 2012-01-05.

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Номер патента: US20120001333A1. Автор: HWANG Chang Youn. Владелец: HYNIX SEMICONDUCTOR INC.. Дата публикации: 2012-01-05.

METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Номер патента: US20120003841A1. Автор: . Владелец: ULVAC, INC.. Дата публикации: 2012-01-05.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

Номер патента: US20120003823A1. Автор: Sasaki Makoto,NISHIGUCHI Taro,HARADA Shin,Okita Kyoko,Namikawa Yasuo. Владелец: Sumitomo Electric Industries, Ltd.. Дата публикации: 2012-01-05.

METHODS FOR MAKING IN-PLANE AND OUT-OF-PLANE SENSING MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS)

Номер патента: US20120001277A1. Автор: Liu Lianjun,Park Woo Tae,Loreck Heinz,KARLIN LISA H.,Desai Hemant D.. Владелец: . Дата публикации: 2012-01-05.

Non-Volatile Resistive Oxide Memory Cells, Non-Volatile Resistive Oxide Memory Arrays, And Methods Of Forming Non-Volatile Resistive Oxide Memory Cells And Memory Arrays

Номер патента: US20120001147A1. Автор: . Владелец: MICRON TECHNOLOGY, INC.. Дата публикации: 2012-01-05.

Semiconductor Device and Method for Manufacturing the Same

Номер патента: US20120001180A1. Автор: Yoshizumi Kensuke,YOKOI Tomokazu. Владелец: . Дата публикации: 2012-01-05.

METHOD FOR PRODUCING SOLID STATE IMAGING DEVICE AND SOLID-STATE IMAGING DEVICE

Номер патента: US20120001292A1. Автор: . Владелец: KABUSHIKI KAISHA TOSHIBA. Дата публикации: 2012-01-05.

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Номер патента: US20120003801A1. Автор: . Владелец: KABUSHIKI KAISHA TOSHIBA. Дата публикации: 2012-01-05.

Method of forming switching jumper

Номер патента: RU2579166C2. Автор: Сергей Иванович Бабкин,Святослав Игоревич Волков. Владелец: Федеральное государственное учреждение "Федеральный научный центр Научно-исследовательский институт системных исследований Российской академии наук" (ФГУ ФНЦ НИИСИ РАН). Дата публикации: 2016-04-10.

Auto feedback method of Receipes for chemical mechanical polishing(CMP)apparatus and controlling method for the same

Номер патента: TW200740553A. Автор: Chih-Hao Chuang,Sheng-Huan Tseng,Chien-Ying Chuang. Владелец: Powerchip Semiconductor Corp. Дата публикации: 2007-11-01.

Method of polishing semiconductor materials

Номер патента: RU2457574C1. Автор: Вячеслав Михайлович Андреев,Дмитрий Александрович Кудряшов,Михаил Николаевич Мизеров,Борис Васильевич Пушный. Владелец: Учреждение Российской академии наук Научно-технологический центр микроэлектроники и субмикронных гетероструктур РАН. Дата публикации: 2012-07-27.

CANCER BIOMARKERS AND METHODS OF USE THEREOF

Номер патента: US20120003639A1. Автор: KERLIKOWSKE KARLA,TLSTY THEA D.,GAUTHIER MONA L.,BERMAN HAL K.,BREMER TROY,MOLINARO ANNETTE M.. Владелец: . Дата публикации: 2012-01-05.

Estimation method of polishing time for chemical mechanical polishing process

Номер патента: TW450873B. Автор: Ying-Lang Wang,Yu-Gu Lin,Wen-Bin Jang,Huei-Chi Lin. Владелец: Taiwan Semiconductor Mfg. Дата публикации: 2001-08-21.

GATE STRUCTURES AND METHOD OF FABRICATING SAME

Номер патента: US20120001266A1. Автор: . Владелец: Taiwan Semiconductor Manufacturing Company, Ltd.. Дата публикации: 2012-01-05.

METHOD OF REDUCING EROSION OF A METAL CAP LAYER DURING VIA PATTERNING IN SEMICONDUCTOR DEVICES

Номер патента: US20120003832A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

OPTICAL MODULATOR AND METHOD FOR MANUFACTURING SAME

Номер патента: US20120003767A1. Автор: . Владелец: NEC Corporation. Дата публикации: 2012-01-05.

Chemical mechanical polishing aqueous dispersion, polishing method for chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method for polishing a wiring layer made of copper or copper alloy provided on a substrate for an electro-optical display device

Номер патента: JP5263484B2. Автор: 和男 西元,智隆 篠田. Владелец: JSR Corp. Дата публикации: 2013-08-14.

III-NITRIDE LIGHT-EMITTING DEVICES WITH REFLECTIVE ENGINEERED GROWTH TEMPLATES AND METHODS OF MANUFACTURE

Номер патента: US20120001213A1. Автор: Jorgenson Robbie J.. Владелец: LIGHTWAVE PHOTONICS, INC.. Дата публикации: 2012-01-05.

ELECTRODE MATERIAL AND METHOD FOR FORMING ELECTRODE MATERIAL

Номер патента: US20120003529A1. Автор: . Владелец: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.. Дата публикации: 2012-01-05.

Methods for Improving Viability and Productivity in Cell Culture

Номер патента: US20120003735A1. Автор: Dorai Haimanti,Ly Celia,Sauerwald McClain Tina M.. Владелец: . Дата публикации: 2012-01-05.

Composition and method for cmp of metal films

Номер патента: WO2024129467A1. Автор: Hongjun Zhou,Rung-Je Yang,Matthias Stender,Anupama Mallikarjunan,Sana MA,Mingshih TSAI. Владелец: Versum Materials US, LLC. Дата публикации: 2024-06-20.

Method of making photodetector array

Номер патента: RU2522681C2. Автор: Лариса Васильевна Киселева,Алексей Алексеевич Лопухин,Анатолий Михайлович Филачев,Анна Алексеевна Рябова,Елена Анатольевна Кожаринова,Елена Васильевна Умникова. Владелец: Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации. Дата публикации: 2014-07-20.

Semiconductor Device and Method for Forming the Same

Номер патента: US20120001229A1. Автор: Zhu Huilong,Liang Qingqing. Владелец: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES. Дата публикации: 2012-01-05.

PAD FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF CHEMICAL MECHANICAL POLISHING USING SAME

Номер патента: US20120322348A1. Автор: . Владелец: JSR Corporation. Дата публикации: 2012-12-20.

Method for assembling a carrier head for chemical mechanical polishing

Номер патента: TW200602155A. Автор: Ming-Kung Lee,Gilbert Lu,Philip Shih,Jui-Tang Huang. Владелец: Applied Materials Taiwan Ltd. Дата публикации: 2006-01-16.

Composite particle for chemical mechanical polishing used for manufacturing semiconductor device, method for manufacturing the same, and chemical mechanical polishing method using the same

Номер патента: JP4041236B2. Автор: 学 南幅,博之 矢野,正之 元成,章 飯尾,雅幸 服部,之輝 松井,勝弥 奥村. Владелец: JSR Corp. Дата публикации: 2008-01-30.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

Номер патента: US20120003811A1. Автор: . Владелец: Sumitomo Electric Industries, Ltd.. Дата публикации: 2012-01-05.

POLYURETHANE, COMPOSITION FOR FORMATION OF POLISHING LAYERS THAT CONTAINS SAME, PAD FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME

Номер патента: US20120083187A1. Автор: OKAMOTO Takahiro,KUWABARA Rikimaru. Владелец: JSR Corporation. Дата публикации: 2012-04-05.

Device and method for chemical mechanical polishing

Номер патента: TW382760B. Автор: Guan-Jiun Yi. Владелец: Promos Technologies Inc. Дата публикации: 2000-02-21.

Method for chemical mechanical polishing in combination with spin coating

Номер патента: TW466154B. Автор: Chi-Fa Lin. Владелец: Winbond Electronics Corp. Дата публикации: 2001-12-01.

Replaceable polishing pad for chemical mechanical polishing

Номер патента: TW422761B. Автор: Shiou-Mei You,Shiue-Jung Chen. Владелец: Ind Tech Res Inst. Дата публикации: 2001-02-21.

Monitoring and measuring method for chemical mechanical polishing

Номер патента: TW521368B. Автор: Ming-Shiang Chen,Chi-Yuan Chin,Jiun-Lian Su,Shr-Geng Juo,Yi-Shr Lin. Владелец: Macronix Int Co Ltd. Дата публикации: 2003-02-21.

Alignment method for chemical mechanical polishing process

Номер патента: TW368698B. Автор: bi-shan Wang,Yuan-Lung Liou,Jau-Jie Wang. Владелец: Taiwan Semiconductor Mfg Co Ltd. Дата публикации: 1999-09-01.

Alignment method for chemical mechanical polishing

Номер патента: TW376354B. Автор: Wen-Shiang Liao. Владелец: Vanguard Int Semiconduct Corp. Дата публикации: 1999-12-11.

Polishing time controlling method and apparatus for chemical mechanical polishing process

Номер патента: TW200505629A. Автор: Alan Su,Jason C S Chu. Владелец: Promos Technologies Inc. Дата публикации: 2005-02-16.

Device and method for chemical mechanical polishing while avoiding copper corrosion

Номер патента: TW430585B. Автор: Tsu Shih,Wen-Chih Chiou,Ying-Ho Chen,Syun-Ming Jang,Chia-Ming Yang. Владелец: Taiwan Semiconductor Mfg. Дата публикации: 2001-04-21.

SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING PROCESS AND METHOD OF FORMING PHASE CHANGE MEMORY DEVICE USING THE SAME

Номер патента: US20120049107A1. Автор: . Владелец: . Дата публикации: 2012-03-01.

AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME

Номер патента: US20120175550A1. Автор: . Владелец: JSR Corporation. Дата публикации: 2012-07-12.

Composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: JP6819280B2. Автор: 英一郎 國谷,山田　裕也,昌宏 野田,裕也 山田,康平 西村,洋太 石戸,恭兵 渋谷. Владелец: JSR Corp. Дата публикации: 2021-01-27.

Composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: JP6938910B2. Автор: 英一郎 國谷,山田　裕也,昌宏 野田,裕也 山田,康平 西村,恭兵 渋谷. Владелец: JSR Corp. Дата публикации: 2021-09-22.

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method using the same

Номер патента: JP4430098B2. Автор: 学 南幅,博之 矢野,雅幸 服部,信夫 川橋,和男 西元. Владелец: JSR Corp. Дата публикации: 2010-03-10.

Composition for chemical mechanical polishing and chemical mechanical polishing method

Номер патента: TWI786275B. Автор: 野田昌宏,山中達也,國谷英一郎,田中一啓. Владелец: 日商Ｊｓｒ股份有限公司. Дата публикации: 2022-12-11.

A carrier head and chemical mechanical polishing equipment for chemical mechanical polishing

Номер патента: CN218697529U. Автор: 王宇,孟松林,魏兴武. Владелец: Huahaiqingke Co Ltd. Дата публикации: 2023-03-24.

Aqueous dispersing element for chemical mechanical polishing, manufacturing method thereof, and chemical mechanical polishing method

Номер патента: JP2010016341A. Автор: Hirotaka Shida,和一 内倉,裕貴 仕田,Masatoshi Ikeda,正俊 池田,Kazuichi Uchikura. Владелец: JSR Corp. Дата публикации: 2010-01-21.

Process for manufacturing regulating mechanism for chemical mechanical polishing

Номер патента: TW374036B. Автор: Chih-Lung Lin. Владелец: Taiwan Semiconductor Mfg Co Ltd. Дата публикации: 1999-11-11.

METHOD FOR MANUFACTURING GRAIN-ORIENTED SILICON STEEL WITH SINGLE COLD ROLLING

Номер патента: US20120000262A1. Автор: Jin Weizhong,Shen Kanyi,Li Guobao,Zhang Pijun,Yang Yongjie,Hu Zhuochao,Wu Peiwen,Jiang Quanli. Владелец: BAOSHAN IRON & STEEL CO., LTD.. Дата публикации: 2012-01-05.

SYSTEMS AND METHODS FOR COMPRESSING DATA AND CONTROLLING DATA COMPRESSION IN BOREHOLE COMMUNICATION

Номер патента: US20120001776A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

METHODS FOR DETERMINING A BREEDING VALUE BASED ON A PLURALITY OF GENETIC MARKERS

Номер патента: US20120004112A1. Автор: Lund Mogens Sandø,Su Guosheng,Guldbrandtsen Bernt. Владелец: . Дата публикации: 2012-01-05.

METABOLIC BIOMARKERS FOR OVARIAN CANCER AND METHODS OF USE THEREOF

Номер патента: US20120004854A1. Автор: Gray Alexander,Guan Wei,Fernandez Facundo M.,McDonald John,Zhou Manshui. Владелец: . Дата публикации: 2012-01-05.

POLISHED POLYETHYLENE POLISHING PAD FOR CHEMICAL-MECHANICAL POLISHING AND POLISHING DEVICE

Номер патента: DE60118963T2. Автор: S. Yaw Orlando OBENG,M. Edward Penbroke Pines YOKLEY. Владелец: psiloQuest Inc. Дата публикации: 2006-12-21.

POLISHED POLYETHYLENE POLISHING PAD FOR CHEMICAL-MECHANICAL POLISHING AND POLISHING DEVICE

Номер патента: DE60118963D1. Автор: S Obeng,M Yokley. Владелец: psiloQuest Inc. Дата публикации: 2006-05-24.

Polishing liquid and polishing method for chemical mechanical polishing

Номер патента: JP3516157B2. Автор: 英朗 吉田. Владелец: Panasonic Corp. Дата публикации: 2004-04-05.

SLURRY FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD FOR SUBSTRATE USING SAME

Номер патента: US20120270400A1. Автор: . Владелец: KURARAY CO., LTD.. Дата публикации: 2012-10-25.

Method for producing fine particles for chemical mechanical polishing and polishing method using the same

Номер патента: JP3509188B2. Автор: 雅和 室山. Владелец: Sony Corp. Дата публикации: 2004-03-22.

Method for chemical mechanical polishing and forming method of metal interconnection layer

Номер патента: CN102034738A. Автор: 李强,闫大鹏,彭凌剑,张斐尧. Владелец: Semiconductor Manufacturing International Shanghai Corp. Дата публикации: 2011-04-27.

Equipment for chemical-mechanical polishing, method for washing its polishing pad and flattening method

Номер патента: CN1947945A. Автор: 杨志强,刘志勇,朱健夫,彭朋意,林文杉,谢佳原. Владелец: United Microelectronics Corp. Дата публикации: 2007-04-18.

A polish feeding mechanism for chemically mechanical polishing equipment

Номер патента: CN205394286U. Автор: 黄晓伟,章建群,章慧云. Владелец: Individual. Дата публикации: 2016-07-27.

Бесплатный поиск патентной информации. Построение патентных ландшафтов и отчетов.

Главная
Проекты и услуги
Контакты

© 2021-2022 - All Rights Reserved - разработано Ecoruspace.me.