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Semiconductor device, static random access memory cell and manufacturing method of semiconductor device

Номер патента: US10170483B2
Опубликовано: 01-01-2019
Автор(ы): Kun-Mu Li, Ming-Hua Yu, Tsz-Mei Kwok, Yi-Jing Lee
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Method of fabricating a semiconductor device including ion implantation at a tilt angle in exposed regions

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Method of fabricating a semiconductor device including ion implantation at a tilt angle in exposed regions

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Method of fabricating a semiconductor device

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Structure and method of forming a semiconductor device with resistive elements

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Structure and method of forming a semiconductor device with resistive elements

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Method of manufacturing a semiconductor device and semiconductor device obtained with such a method

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Method of manufacturing a semiconductor device

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Method of Manufacturing a Semiconductor Device Having Electrode Trenches, Isolated Source Zones and Separation Structures

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Nitride semiconductor device and method of manufacturing nitride semiconductor device

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A semiconductor device and a method of manufacturing such semiconductor device

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Method of fabricating a semiconductor device including ion implantation at a tilt angle in exposed regions

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Method of manufacturing a semiconductor device using the same

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Semiconductor device and method of manufacturing a semiconductor device

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Manufacturing method of MIS-type semiconductor device, including heating a zirconium oxynitride (ZrON) layer

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Methods of cleaning a semiconductor device and methods of manufacturing a semiconductor device using the same

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Method of fabricating a semiconductor device

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Method of manufacturing a semiconductor device

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Method of manufacturing a semiconductor device

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Information acquiring method, information acquiring apparatus, semiconductor device comprising array of plurality of unit components for detecting physical quantity distribution, and semiconductor manufacturing method

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Methods of manufacturing a semiconductor device and a semiconductor memory device thereby

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Method of manufacturing a semiconductor device having a heat spreader

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Method of manufacturing a semiconductor device

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Methods of forming a semiconductor cell array region, method of forming a semiconductor device including the semiconductor cell array region, and method of forming a semiconductor module including the semiconductor device

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Method of manufacturing a semiconductor device and semiconductor device obtained by means of such a method

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Method of manufacturing a semiconductor device and such a semiconductor device

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Method of manufacturing a semiconductor device and semiconductor device

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Method of manufacturing a semiconductor device

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Method of fabricating a semiconductor device,method of cleaning a crystalline surface of a semiconductor,and semiconductor device

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Method of manufacturing a semiconductor device

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Method of manufacturing a semiconductor device and semiconductor device obtained by using such a method

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Semiconductor chip, semiconductor wafer, semiconductor device and method of manufacturing the semiconductor device

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Semiconductor device, method of manufacturing a semiconductor device, and positioning jig

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Method of manufacturing a semiconductor device having reduced on-state resistance and structure

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Method of manufacturing a semiconductor device and semiconductor device

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Method of manufacturing a semiconductor device having a pre-metal dielectric liner

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Method of forming a semiconductor device with a multi-layer WSix film with small grain size structure, and a semiconductor device having a polysilicon layer with a multi-layer WSix film formed thereon

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Method of manufacturing a semiconductor device having a pre-metal dielectric liner

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Semiconductor device and a method of manufacturing a semiconductor device

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Method of manufacturing a semiconductor device and a semiconductor device

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Method of manufacturing a semiconductor device and semiconductor device

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Method of making a semiconductor device

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Method of severing a semiconductor device composite

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Method of bonding a semiconductor device using a compliant bonding structure

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Method of bonding a semiconductor device using a compliant bonding structure

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Methods of forming a metal telluride material, related methods of forming a semiconductor device structure, and related semiconductor device structures

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Lead frame, semiconductor device, and method of manufacturing the semiconductor device

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Method of manufacturing a semiconductor device

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Method of making a semiconductor device

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Holder for a semiconductor substrate, and method of manufacturing a semiconductor device using such a holder

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Method of making flexible semiconductor device with graphene tape

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Method of forming a semiconductor device

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Multi-layered structure including an epitaxial layer having a low dislocation defect density, semiconductor device comprising the same, and method of fabricating the semiconductor device

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System and method of testing a semiconductor device and method of fabricating the semiconductor device

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System and method of testing a semiconductor device and method of fabricating the semiconductor device

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Method of mounting a semiconductor device to a substrate and a mounted structure

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Method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer

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A method of fabricating a semiconductor device

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Method of manufacturing a semiconductor device and semiconductor device

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