Electronic component and process for producing same

An electronic element as well as a procedure for its production concerns electronic element and procedure for its production description the invention. Erf indungsgemÄße' the element is in particular in the information and communications technology applicable.

A substantial portion of the elements finding in modern electro-technology and electronics use consists of a suitable housing, in whatever an element chip or several element chips is arranged. The housing is thereby both carrier of the chip, serves the handling with the further processing, contacting, the ME chanischen protection of the chip and fulfilled if necessary further functions as for example the element cooling or the electrical and/or electromagnetic screen.

The attachments estigung the element chip at the housing or also at carrier strips with well-known manufacturing processes by an adhesive connection, unfavorable at this solution it is effected that the mechanical stresses resulted from the further treatment processes and the catch of the element in the element chip and/or between element chip and housing not or only incompletely reduced and/or.

to become balanced to be able. Unfavorable consequences of it are insufficient limit values, bad reproductibility of the parameters, higher rejection rate and finally higher manufacturing costs.

The invention is the basis the task to create an element and a procedure for its production whereby the element can be produced simply and effectively, very good and reproducible technical parameters and the procedure problem exhibits loosely into the technological element production process integrable is.

This task solved according to invention by the characteristics in the characteristic part of the requirements 1 and 9 in connection with the characteristics of the generic terms.

Appropriate arrangements of the invention are in the UnteransprÜchen E@nthalten.

The special advantage of the Erf indung results from the use of fusion adhesive with the attachment of the element chips at the housing and/or at the carrier strip, as between the lower surface of the element chip and the inside of the housing bottom a layer from fusion adhesive is arranged and by an additional warming up step, by which the mechanical stresses in the element chip and/or between the element chip and the housing, developed due to the treatment process and the catch of the element, are reduced.

Are suitable according to invention in particular fusion sticking materials, whose softening temperature is higher than 85 11C and whose processing temperature lies between 120 degrees and 240 degrees.

In a particularly favourable execution form the softening temperature with approximately 140 degrees and the processing temperature are appropriate for the invention between 180 11C and 210 IIC, whereby the viscosity of the melt should have a value, which makes a Tropfbarkeit of the adhesive possible.

Fusion adhesives on the basis of ethyl ethyl acrylate copolymers (EEA), ethyl vinyl acetate copolymers (EH), PP (Pa), polyesters (PES), polyisobutilenes (PIB) and Polyvinylbutyraten (PVB) are particularly according to invention favourably applicable.

The production of the electronic elements takes place in simple and economical way, as on the intended junction point between element chip and housing a defined quantity fusion adhesive is applied and the element chip is positioned in the following and pressed in slightly. In such a way prefabricated element is cooled down in the following and submitted of one weiteren' treatment. After conclusion of the treatment and catch of the housing of the element a repeated heating up of the entire electronic element takes place at least up to the softening point, so that the fusion adhesive solidifies again softened and with following cooling again. The process steps are problem-free in the element ago position process integrable.

An additional advantage of the invention results from that application place and application quantity of the liquid adhesive are defined very exactly. This is reached by the use of nozzles, whereby the temperature of the nozzles is substantially higher than the temperature of the liquid adhesive in the Vorratstank.

The invention is to play below on the basis of remark with to be more near described.

The structure in principle one in accordance with the invention herge placed electronic element is in Fig. 1 darge places.

The electronic element consists of a housing and an element chip (1), whereby between the lower surface (la) of the element chip (1) and the inside (2a) of the housing bottom (2) a layer (3) from fusion adhesive is arranged. The adhesive layer (3) is full-laminar trained in the available remark example. For special applications it is likewise possible, the layer to train (3) only punctually. The housing consists in the available remark example of a multi-layer ceramic(s), it is however just as housings made of metal or from plastic usable. The element chip, in the available remark example a SAW filter made of ST-quartz, is with the housing (2) purely mechanically connected by the layer (3) from fusion adhesive. The electrical contact points (5) of the element chip (1) are at the top side (1b) of the element chip (1) arranged. The connection to the bonding sites (6) at the housing bottom (2) becomes by means of bond wires (4) realized.

In the following a variant of the manufacturing process is to be described more near.

The fusion adhesive, which is available in bars or as Granu lat, becomes in. a tank, which is filled to a third, melted. The Vorrich tung is in such a way out-arranged regarding heating temperature and supply pressure that optimal conditions of work exist when laying the liquid adhesive on. The adhesive in the tank is heated in the available remark example on a temperature of 140 degrees, the supply pressure in the tank amounts to 0.1 bar. The housings are made available in a suitable magazine and/or on a carrier strip unit to the Auftropfen of the adhesive. The exhaust nozzle for the fusion adhesive is heated up by means of a nozzle heating on 220 degrees. If the proportioned adhesive quantity is laid on on the housing, the element chip is put on.

Magazine and/or carriers is supplied to a temperature-controlled electrical warmer, so that the splice is brought on the necessary processing temperature. If the temperature is reached, the chip is accurately positioned and pressed in slightly by a device. Afterwards the element is cooled down and supplied for treatment to the further work procedures and finally locked by an appropriate housing cap and/or a cover.

By the treatment and by the catch of the electronic element developed mechanical stresses, which will lead to the impairment of the element, it becomes balanced by the fact that after the working on the element in the locked condition is supplied to a heating up on approx. 150 degrees again, so that the fusion adhesive solidifies itself again softened and with following cooling again.

In a further remark example of the procedure the adhesive is made available not liquid, but is not before the treatment process into a foil processes the invention is limited not to the remark examples described here. Rather it is possible to realize by variations of the shown characteristics and parameters further execution forms without leaving the framework of the invention.