Flip chip wafer, flip chip die and manufacturing processes thereof
11-07-2012 дата публикации
Номер:
EP2061072A3
Автор: Chen, Singjang
Принадлежит: Biotronik CRM Patent AG
Контакты:
Номер заявки: 31-71-0816.5
Дата заявки: 21-10-2008
The invention relates to a flip chip wafer comprising an active surface having a plurality of bumps (40, 41, 42) formed thereon and having at least one layer of a cured underfill material (30, 35, 36) accommodated between said plurality of bumps (40, 41, 42). The invention further comprises a flip chip die as well as processes for manufacturing a flip chip wafer and a flip chip die.
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