Circuit element

In a circuit element 300 having a heat-conducting body 301 having top and bottom surfaces, and a die having an electronic circuit thereon, the die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace 308 bonded to the top surface of the heat-conducting body. An encapsulating cap 326 covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device 314.