Substrate structure

16-03-2017 дата публикации

Номер:

TW0201711111A

Автор: 潘嘉偉, 高迺澔, 張宏達, 姜亦震, 江東昇, PAN JIA-WEI, KAO NAI-HAO, CHANG HONG-DA, JIANG YIH-JENN, JIANG DON-SON, PAN, JIA-WEI, KAO, NAI-HAO, CHANG, HONG-DA, JIANG, YIH-JENN, JIANG, DON-SON

Принадлежит: 矽品精密工業股份有限公司

Контакты:

Номер заявки: 48-29-10410

Дата заявки: 07-09-2015

Provided is a substrate structure, comprising: a substrate body and an electrical connecting pad disposed on the substrate, wherein the electrical connecting pad has at least a hollow portion for exposing parts of the substrate body therefrom, thereby reducing rigidity of the connecting pad and thus the resistance torque generated by the force of the substrate structure to prevent substrate breakage.

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/05 H01L2224/050 H01L2224/0501 H01L2224/05011 H01L2224/05012 H01L2224/05015 H01L2224/0502 H01L2224/05022 H01L2224/0507 H01L2224/05076 H01L2224/051 H01L2224/0518 H01L2224/05186 H01L2224/055 H01L2224/0557 H01L2224/05572 H01L2224/1 H01L2224/13 H01L2224/130 H01L2224/1302 H01L2224/13022 H01L23 H01L23/H01L23/4 H01L23/49 H01L23/498 H01L23/4981 H01L23/49816 H01L23/4983 H01L23/49838 H01L24 H01L24/H01L24/0 H01L24/05 H01L24/1 H01L24/13

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/60 H01L23 H01L23/H01L23/4 H01L23/48

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