Hybrid bonding with through substrate via (TSV)

19-09-2017 дата публикации

Номер:

US9768143B2

Принадлежит: TAIWAN SEMICONDUCTOR MFG CO LTD, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Контакты:

Номер заявки: 48-14-20148017

Дата заявки: 16-09-2014

A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a first semiconductor wafer and a second semiconductor wafer bonded via a hybrid bonding structure, and the hybrid bonding structure includes a first conductive material embedded in a polymer material and a second conductive material embedded in a second polymer material. The first conductive material of the first semiconductor wafer bonded to the second conductive material of the second semiconductor wafer and the first polymer material of the first semiconductor wafer is bonded to the second polymer material of the second semiconductor wafer. The semiconductor device structure further includes at least one through substrate via (TSV) extending from a bottom surface of the second semiconductor wafer to a top surface of the first semiconductor wafer.

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/7 H01L21/76 H01L21/768 H01L21/7689 H01L21/76897 H01L21/76898 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/05 H01L2224/055 H01L2224/0554 H01L2224/05547 H01L2224/0557 H01L2224/05571 H01L2224/056 H01L2224/0562 H01L2224/05624 H01L2224/0564 H01L2224/05647 H01L2224/08 H01L2224/081 H01L2224/0814 H01L2224/08145 H01L2224/08147 H01L2224/8 H01L2224/80 H01L2224/802 H01L2224/8020 H01L2224/80203 H01L2224/803 H01L2224/8035 H01L2224/80357 H01L2224/808 H01L2224/8085 H01L2224/80855 H01L2224/8089 H01L2224/80895 H01L2224/80896 H01L2224/809 H01L2224/8090 H01L2224/80905 H01L2224/8098 H01L2224/80986 H01L2224/9 H01L2224/92 H01L2224/920 H01L2224/9202 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/481 H01L24 H01L24/H01L24/0 H01L24/02 H01L24/8 H01L24/80 H01L24/82 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0657 H01L27 H01L27/H01L27/0 H01L27/06 H01L27/068 H01L27/0688 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00012 H01L2924/00014

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/7 H01L21/76 H01L21/768 H01L23 H01L23/H01L23/0 H01L23/00 H01L23/4 H01L23/48 H01L23/481 H01L25 H01L25/H01L25/1 H01L25/10 H01L25/105 H01L25/5 H01L25/50 H01L27 H01L27/H01L27/0 H01L27/06

Цитирование НПИ

U.S. Notice of Allowance for U.S. Appl. No. 15/076,141, dated Jul. 27, 2017.

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