Magnetron sputter ion plating
Номер патента: GB2258343B
Опубликовано: 06-04-1994
Автор(ы): Dennis Gerald Teer
Принадлежит: D G TEER COATING SERVICES LIMI
Опубликовано: 06-04-1994
Автор(ы): Dennis Gerald Teer
Принадлежит: D G TEER COATING SERVICES LIMI
Реферат: A magnetron sputter ion plating system has two or more magnetron assemblies spaced around a substrate centrally located relative to the magnetrons. The magnetrons are arranged so that adjacent magnetrons have outer magnetic assemblies of opposite polarity, so that magnetic field lines link adjacent magnetrons, so as to produce a substantially closed ring of magnetic flux. This substantially traps all electrons generated in the system, and increase the level of ionization surrounding the substrates increasing the ion bombardment of the substrates. Several embodiments are disclosed.
Magnetron sputter ion plating
Номер патента: US5556519A. Автор: Dennis G. Teer. Владелец: Teer; Dennis G.. Дата публикации: 1996-09-17.