Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof
Номер патента: SG47193A1
Опубликовано: 20-03-1998
Автор(ы): Atushi Ogishima, Hideo Miura, Hiromi Abe, Hiromi Todorobaru, Hiroyuki Uchiyama, Masashi Sahara, Masayuki Suzuki, Nee Toda Sonoko Abe, Shinichi Ishida, Shinji Nishihara, Shuji Ikeda
Принадлежит: HITACHI LTD
Опубликовано: 20-03-1998
Автор(ы): Atushi Ogishima, Hideo Miura, Hiromi Abe, Hiromi Todorobaru, Hiroyuki Uchiyama, Masashi Sahara, Masayuki Suzuki, Nee Toda Sonoko Abe, Shinichi Ishida, Shinji Nishihara, Shuji Ikeda
Принадлежит: HITACHI LTD
Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof
Номер патента: MY115056A. Автор: Masayuki Suzuki,Hideo Miura,Shuji Ikeda,Shinichi Ishida,Hiromi Abe,Hiroyuki Uchiyama,Shinji Nishihara,Atushi Ogishima,Hiromi Todorobaru,Masashi Sahara,Sonoko Abe. Владелец: HITACHI LTD. Дата публикации: 2003-03-31.