Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices .

Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices

Номер патента: JP6856688B2
Опубликовано: 07-04-2021
Автор(ы): 裕士石野
Принадлежит: JX Nippon Mining and Metals Corp
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Рисунок 1. Взаимосвязь патентов (ближайшие 20).

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