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  • SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER-CLAD LAMINATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD

SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER-CLAD LAMINATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD

Номер патента: US20170188457A1
Опубликовано: 29-06-2017
Автор(ы): KURIHARA Hiroaki, Matsuura Yoshinori, Nishikawa Joe
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Номер патента: US20170241604A1. Автор: Seung Woo Choi,Cheol Ho Kim,Young Do Kim,Ho Sub Kim. Владелец: Kia Motors Corp. Дата публикации: 2017-08-24.

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Номер патента: US20190085131A1. Автор: Shou-Jui Hsiang,Szu-Hsiang SU,Nan-Kun Huang,Yu-Wen Kao. Владелец: Zhen Ding Technology Co Ltd. Дата публикации: 2019-03-21.

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Номер патента: LU101147A1. Автор: Makoto Hosokawa,Akitoshi Takanashi,Takuma Nishida. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2019-10-02.

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Номер патента: TW201831735A. Автор: 森山晃正. Владелец: 日商Ｊｘ金屬股份有限公司. Дата публикации: 2018-09-01.

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Номер патента: EP3882378B1. Автор: Thomas DEVAHIF,Zainhia KAIDI,Michel Streel,Roman Michez. Владелец: Circuit Foil Luxemburg SARL. Дата публикации: 2024-07-17.

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Номер патента: EP3882378C0. Автор: Thomas DEVAHIF,Zainhia KAIDI,Michel Streel,Roman Michez. Владелец: Circuit Foil Luxemburg SARL. Дата публикации: 2024-07-17.

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Номер патента: LU101698B1. Автор: Thomas DEVAHIF,Zainhia KAIDI,Michel Streel,Roman Michez. Владелец: Circuit Foil Luxembourg. Дата публикации: 2021-09-20.

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Номер патента: KR102482422B1. Автор: 야오-성 라이,루이-장 저우,젠-밍 라이. Владелец: 장 춘 페트로케미컬 컴퍼니 리미티드. Дата публикации: 2022-12-27.

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Номер патента: US20230014153A1. Автор: Yao-Sheng LAI,Jui-Chang Chou,Chien-Ming Lai. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2023-01-19.

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Номер патента: JP2023069987A. Автор: Yao-Sheng LAI,Jui-Chang Chou,耀生 ▲頼▼,瑞昌 周,建銘 ▲黄▼,jian ming Huang. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2023-05-18.

Two-layered copper-clad laminate material, and method for producing same

Номер патента: CN103354843A. Автор: 坂口和彦,稻住肇,佐佐木伸一. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-10-16.

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Номер патента: KR910001549B1. Автор: 아끼시 나까소,도시로 오까무라,도모꼬 와따나베. Владелец: 요꼬야마 류지. Дата публикации: 1991-03-15.

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Номер патента: US20170208686A1. Автор: Ryo Fukuchi. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2017-07-20.

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Номер патента: US20140093743A1. Автор: Atsushi Miki,Ryo Fukuchi,Hideta Arai,Kengo Kaminaga. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2014-04-03.

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Номер патента: SG189489A1. Автор: Atsushi Miki,Ryo Fukuchi,Hideta Arai,Kengo Kaminaga. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2013-05-31.

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Номер патента: US09949371B2. Автор: Masashi Yano,Mitsuru Nozaki,Akihiro Nomoto,Eiji Nagata,Norikatsu Akiyama. Владелец: PI R&D Co Ltd. Дата публикации: 2018-04-17.

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Номер патента: MY190559A. Автор: Yasuo Sato,Hiroyuki Watanabe,Ayumu Tateoka. Владелец: Mitsui Mining & Smelting Co Ltd. Дата публикации: 2022-04-27.

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Номер патента: PH12016000167A1. Автор: TAKANASHI Akitoshi. Владелец: Mitsui Mining And Slemting Co Ltd. Дата публикации: 2017-10-30.

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Номер патента: US20240175162A1. Автор: Ayumu Tateoka,Po Chun Yang,Shota Kawaguchi,Tsubasa KATO. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2024-05-30.

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Номер патента: US20180279482A1. Автор: Miyamoto Nobuaki,Ishii Masafumi,Honda Misato. Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2018-09-27.

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Номер патента: US20180288884A1. Автор: Atsushi Miki,Ryo Fukuchi,Hideta Arai,Yuki Ori. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2018-10-04.

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Номер патента: CN102482795A. Автор: 星野和弘,小黑了一. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2012-05-30.

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Номер патента: CN102482795B. Автор: 星野和弘,小黑了一. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2014-12-24.

Curable composition for printed wiring board, cured film and printed wiring board using the same

Номер патента: KR101684212B1. Автор: 쇼지 미네기시,마사유키 시무라,요시유키 후루타,마사오 유모토. Владелец: 다이요 잉키 세이조 가부시키가이샤. Дата публикации: 2016-12-07.

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Номер патента: JP4948579B2. Автор: 和弘 星野,了一 小黒. Владелец: THE FURUKAW ELECTRIC CO., LTD.. Дата публикации: 2012-06-06.

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Номер патента: TW201250015A. Автор: Shinichi Sasaki,Hajime Inazumi. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2012-12-16.

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Номер патента: US12060647B2. Автор: Yao-Sheng LAI,Jui-Chang Chou,Chien-Ming Lai. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2024-08-13.

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Номер патента: MY198482A. Автор: Arai Hideta,Miki Atsushi,Fukuchi Ryo,Ori Yuki. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2023-09-01.

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Номер патента: US11952675B2. Автор: Yasuhiro Endo,Toshio Kawasaki. Владелец: Nippon Denkai Co Ltd. Дата публикации: 2024-04-09.

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Номер патента: MY162358A. Автор: Shinichi Obata,Koichi Miyake,Tomoyuki Maeda,Sakiko Tomonaga,Ayumu Tateoka,Fumiaki Hosokoshi,Shinya Hiraoka,Hideaki Matsushima. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2017-06-15.

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Номер патента: MY178050A. Автор: Kazuhiro Yoshikawa,Takao Fujimoto,Mitsuyoshi Matsuda,Yasuji Hara. Владелец: Mitsui Mining & Smelting Co Ltd. Дата публикации: 2020-09-30.

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Номер патента: MY141911A. Автор: Shigehiro Hoshida,Kazunori Kondo,Tadashi Amano,Toru Nakanishi. Владелец: Shinetsu Chemical Co. Дата публикации: 2010-07-30.

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Номер патента: MY177387A. Автор: Kazuhiro Yoshikawa. Владелец: Mitsui Mining & Smelting Ltd. Дата публикации: 2020-09-14.

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Номер патента: US11895770B2. Автор: Yuki Inoue,Shun YAMAGUCHI,Tatsuya Arisawa. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2024-02-06.

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Номер патента: US20170245364A1. Автор: Seung Woo Choi,Cheol Ho Kim,Young Do Kim,Ho Sub Kim,Sung Cheul Jeong. Владелец: Kia Motors Corp. Дата публикации: 2017-08-24.

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Номер патента: US9872385B2. Автор: Seung Woo Choi,Cheol Ho Kim,Young Do Kim,Ho Sub Kim,Sung Cheul Jeong. Владелец: Kia Motors Corp. Дата публикации: 2018-01-16.

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Номер патента: US09872385B2. Автор: Seung Woo Choi,Cheol Ho Kim,Young Do Kim,Ho Sub Kim,Sung Cheul Jeong. Владелец: Kia Motors Corp. Дата публикации: 2018-01-16.

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Номер патента: US09475970B2. Автор: Zhongqiang Yang,Cuiming Du,Songgang Chai. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2016-10-25.

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Номер патента: US09650512B2. Автор: Yu-Te Lin,Yi-Jen Chen,Wenfeng Lu,Li-Chih Yu,rong-tao Wang,Wenjun Tian,Ziqian Ma. Владелец: Elite Electronic Material Kunshan Co Ltd. Дата публикации: 2017-05-16.

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Номер патента: US20090139753A1. Автор: Soon-Yong Park,Heon-Sik Song,Jung-Jin Shim,Byung-Nam Kim. Владелец: LG Chem Ltd. Дата публикации: 2009-06-04.

Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same

Номер патента: US11945924B2. Автор: Wei Liang,Qianfa Liu,Liangpeng HAO,Songgang Chai. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2024-04-02.

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Номер патента: US20140102773A1. Автор: Junichi Nagata. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2014-04-17.

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Номер патента: US20180273744A1. Автор: Cheng-Chung Lee,Chien-Hsing Lee,Jung-Hai HUANG,Chun-Hsiung YANG. Владелец: Nan Ya Plastics Corp. Дата публикации: 2018-09-27.

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Номер патента: US09422412B2. Автор: Tse-An Lee,Li-Chih Yu. Владелец: Elite Material Co Ltd. Дата публикации: 2016-08-23.

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Номер патента: US20210017336A1. Автор: Shou-Jui Hsiang,Pei-Jung Wu,Kuan-Wei Lee,Szu-Hsiang SU. Владелец: Zhen Ding Technology Co Ltd. Дата публикации: 2021-01-21.

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Номер патента: US20220267608A1. Автор: Yongjun Guo,Wenyan WEN,Xiaolong Qi,Yangjie ZHU. Владелец: Guangdong Hinno-Tech Co Ltd. Дата публикации: 2022-08-25.

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Номер патента: US20040229070A1. Автор: Masato Takami. Владелец: Fukuda Metal Foil and Powder Co Ltd. Дата публикации: 2004-11-18.

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Номер патента: US9955583B2. Автор: Nobuaki Miyamoto,Masafumi Ishii,Misato Honda. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2018-04-24.

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Номер патента: US20160303829A1. Автор: Arai Hideta,Miki Atsushi,Arai Kohsuke,Nakamuro Kaichiro. Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2016-10-20.

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Номер патента: JP4726855B2. Автор: 渡辺　　弘,誠治 永谷,一史 泉田. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2011-07-20.

Surface-treated copper foil for forming high frequency signal transmission circuit, copper clad laminate board and printed wiring board

Номер патента: KR101931895B1. Автор: 히로아키 츠요시,도시히로 호소이. Владелец: 미쓰이금속광업주식회사. Дата публикации: 2018-12-21.

Electrolytic copper foil, surface treated copper foil using the electrolytic copper foil, copper-clad laminated plate using the surface treated copper foil, and method for manufacturing the electrolytic copper foil

Номер патента: KR101154203B1. Автор: 마코토 도바시,히사오 사카이,미쓰요시 마쓰다,마사루 타카하시. Владелец: 미쓰이 긴조꾸 고교 가부시키가이샤. Дата публикации: 2012-06-18.

Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil

Номер патента: TW511407B. Автор: Takashi Kataoka,Masakazu Mihashi,Naotomi Takahashi. Владелец: Mitsui Mining & Amp Smelting C. Дата публикации: 2002-11-21.

Electrolytic copper foil, surface treated copper foil using the electrolytic copper foil, copper-clad laminated plate using the surface treated copper foil, and method for manufacturing the electrolytic copper foil

Номер патента: WO2007125994A1. Автор: MAKOTO Dobashi,Masaru Takahashi,Mitsuyoshi Matsuda,Hisao Sakai. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2007-11-08.

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Номер патента: TW202246581A. Автор: 李先珩,宋基德,梁暢烈,徐正雨. Владелец: 南韓商日進材料股份有限公司. Дата публикации: 2022-12-01.

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Номер патента: US20090291319A1. Автор: Hiroshi Watanabe,Seiji Nagatani,Kazufumi Izumida. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2009-11-26.

Electrolytic copper foil, surface treated copper foil using the electrolytic copper foil, copper-clad laminated plate using the surface treated copper foil, and method for manufacturing the electrolyt

Номер патента: CN101426959B. Автор: 土桥诚,松田光由,酒井久雄,高桥胜. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2010-11-17.

Surface-treated copper foil, copper-cladded laminate plate, and printed wiring board

Номер патента: WO2023281776A1. Автор: 敦史 三木,佑樹 松岡,翔平 岩沢,郁浩 五刀,誓哉 中島. Владелец: Ｊｘ金属株式会社. Дата публикации: 2023-01-12.

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Номер патента: WO2005083157A1. Автор: Tsutomu Higuchi. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2005-09-09.

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Номер патента: EP1876266A1. Автор: Mitsuyoshi MITSUI MINING&SMELT.CO. LTD MATSUDA,Hisao MITSUI MINING & SMELTING CO. LTD SAKAI,Sakiko MITSUI MINING & SMELTING CO. LTD TOMONAGA,Makoto MITSUI MINING & SMELTING CO. LTD DOBASHI. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2008-01-09.

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Номер патента: US20120285734A1. Автор: Satoshi Fujisawa,Takeo Uno. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2012-11-15.

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Номер патента: EP1185151B1. Автор: Masakazu c/o Mitsui Mining&Smelting Co. Ltd. MITSUHASHI,Takashi c/o Mitsui Mining&Smelting Co. Ltd. KATAOKA,Naotomi c/o Mitsui Mining&Smelting Co. Ltd. TAKAHASHI. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2008-07-16.

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Номер патента: CN1358410A. Автор: 片冈卓,三桥正和,高桥直臣. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2002-07-10.

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Номер патента: JPWO2020017524A1. Автор: 啓太 城野,正幸 中野. Владелец: Showa Denko Materials Co Ltd. Дата публикации: 2021-08-12.

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Номер патента: TW202018124A. Автор: 城野啓太,中野正幸. Владелец: 日商日立化成股份有限公司. Дата публикации: 2020-05-16.

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Номер патента: JP5247929B1. Автор: 友太 永浦,美里 本多. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-07-24.

Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method

Номер патента: KR101887791B1. Автор: 히데타 아라이,아츠시 미키,고스케 아라이,가이치로 나카무로. Владелец: 제이엑스금속주식회사. Дата публикации: 2018-08-10.

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Номер патента: US09967976B2. Автор: Hiroshi Ueda,Yasuhiro Okuda,Kazuhiro Miyata,Yoshio Oka,Takashi Kasuga,Kousuke Miura,Jinjoo Park,Issei Okada. Владелец: Sumitomo Electric Printed Circuits Inc. Дата публикации: 2018-05-08.

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Номер патента: TWI297044B. Автор: Masashi Kumagai,Katsuyuki Tsuchida,Fumiaki Akase. Владелец: Nippon Mining Co. Дата публикации: 2008-05-21.

Processed copper foil for low dielectric resin substrate, copper-clad laminate and printed wiring board using the treated copper foil

Номер патента: JP6083619B2. Автор: 健 岡本,岡本　健,真鍋　久徳,久徳 真鍋. Владелец: Fukuda Metal Foil and Powder Co Ltd. Дата публикации: 2017-02-22.

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Номер патента: CN1213645C. Автор: 片冈卓,三桥正和,高桥直臣. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2005-08-03.

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Номер патента: US20160360615A1. Автор: Nozaki Mitsuru,Nomoto Akihiro,Akiyama Norikatsu,Nagata Eiji,Yano Masashi. Владелец: . Дата публикации: 2016-12-08.

Roughened copper foil, copper-clad laminate and printed wiring board

Номер патента: JP6985745B2. Автор: 眞 細川. Владелец: Namics Corp. Дата публикации: 2021-12-22.

Roughened copper foil, copper-clad laminate, and printed wiring board

Номер патента: CN112204171A. Автор: 细川真. Владелец: Namis Co ltd. Дата публикации: 2021-01-08.

Method for preparing surface treated copper foil

Номер патента: KR100743512B1. Автор: 미츠하시마사카즈,카타오카타카시,타카하시나오토미. Владелец: 미쓰이 긴조꾸 고교 가부시키가이샤. Дата публикации: 2007-07-27.

Surface-Treated Copper Foil

Номер патента: US20170196083A1. Автор: Arai Hideta,Miki Atsushi,Fukuchi Ryo. Владелец: . Дата публикации: 2017-07-06.

Surface-treated copper foil

Номер патента: JP6854114B2. Автор: 亮 福地,新井　英太,英太 新井,敦史 三木. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2021-04-07.

Surface-treated copper foil

Номер патента: US20040209109A1. Автор: Masashi Kumagai,Katsuyuki Tsuchida,Fumiaki Akase. Владелец: Individual. Дата публикации: 2004-10-21.

Surface-treated copper foil

Номер патента: HK1067156A1. Автор: Kumagai Masashi,TSUCHIDA Katsuyuki,Akase Fumiaki. Владелец: Nippon Mining Co. Дата публикации: 2005-04-01.

Surface treated copper foil

Номер патента: JP6632739B2. Автор: 裕子 奥野,岳夫 宇野,隆宏 鶴田. Владелец: THE FURUKAW ELECTRIC CO., LTD.. Дата публикации: 2020-01-22.

Surface treated copper foil

Номер патента: KR102054044B1. Автор: 히데타 아라이,아츠시 미키,료 후쿠치. Владелец: 제이엑스금속주식회사. Дата публикации: 2019-12-09.

Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same

Номер патента: MY152533A. Автор: Kaminaga Kengo,Fukuchi Ryo,Yamanishi Keisuke. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2014-10-15.

Copper surface treatment method and thereby surface treated copper

Номер патента: EP1878812B1. Автор: Tomoaki c/o Hitachi Chemical Co.Ltd. YAMASHITA,Yasuo c/o Hitachi Chemical Co.Ltd. INOUE,Masaharu c/o Hitachi Chemical Co.Ltd. MATSUURA,Toyoki c/o Hitachi Chemical Co.Ltd. ITO,Akira c/o Hitachi Chemical Co.Ltd. SHIMIZU,Fumio c/o Hitachi Chemical Co.Ltd. INOUE,Akishi c/o Hitachi Chemical Co.Ltd. NAKASO. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2012-08-29.

Copper foil for printed circuit and copper-clad laminate

Номер патента: US8642893B2. Автор: Naoki Higuchi. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2014-02-04.

Copper foil for printed circuit and copper clad laminate

Номер патента: CN101809206B. Автор: 樋口直树. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-10-02.

Copper foil for printed circuit and copper clad laminate

Номер патента: EP2216427A4. Автор: Naoki Higuchi. Владелец: Nippon Mining and Metals Co Ltd. Дата публикации: 2011-04-06.

Copper foil for printed circuit boards, manufacturing method thereof, laminate and printed circuit board using the copper foil

Номер патента: KR980007876A. Автор: 토시코 요코타,마코토 도바시,히로시 하타,히로아키 쿠리하라,나오토미 타카하시,타쯔야 수도. Владелец: 미쯔이킨조쿠코교 가부시기가이샤. Дата публикации: 1998-03-30.

High strength, high heat resistance electrodeposited copper foil and manufacturing method for same

Номер патента: US09428840B2. Автор: Akitoshi Suzuki,Satoshi Yamazaki,Hirokazu Sasaki,Kensaku Shinozaki,Takeshi Ezura. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2016-08-30.

Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method

Номер патента: KR101851882B1. Автор: 마사후미 이시이,노부아키 미야모토,미사토 혼다. Владелец: 제이엑스금속주식회사. Дата публикации: 2018-04-24.

Printed wiring board manufacturing method and printed wiring board obtained by the manufacturing method

Номер патента: JPWO2009034764A1. Автор: 吉幸 浅川,晴美 永尾,研二 池内,浅川　吉幸. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2010-12-24.

Roughening treatment copper foil, copper-clad laminated board and printed circuit board (PCB)

Номер патента: CN107002249B. Автор: 津吉裕昭,茂木晓. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2018-05-22.

Copper foil for printed circuit board, its production and laminate and printed circuit board using the same

Номер патента: JPH1068087A. Автор: MAKOTO Dobashi,誠 土橋,直臣 高橋,Hiroshi Hata,Toshiko Yokota,俊子 横田,Hiroaki Kurihara,宏明 栗原,洋志 端,Naotomi Takahashi,Tatsuya Sudo,達哉 須戸. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 1998-03-10.

Copper cladding for printed circuit boards and copper clad laminates for printed circuit boards

Номер патента: TWI452953B. Автор: Terumasa Moriyama,Kengo Kaminaga. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2014-09-11.

Two-layer-copper-clad laminate and process for producing same

Номер патента: TW201043736A. Автор: Michiya Kohiki,Naonori Michishita. Владелец: Nippon Mining Co. Дата публикации: 2010-12-16.

Roughened copper foil, copper clad laminate, and printed circuit board

Номер патента: US20180223412A1. Автор: Hiroaki Tsuyoshi,Satoshi Mogi. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2018-08-09.

Treated copper foil for low dielectric resin substrate and copper-clad laminate and printed writing board using the same

Номер патента: CN106413248A. Автор: 冈本健,真锅久德. Владелец: Fukuda Metal Foil and Powder Co Ltd. Дата публикации: 2017-02-15.

Roughening treatment Copper Foil and manufacture method, copper clad laminate and printed circuit board (PCB)

Номер патента: CN102803576B. Автор: 藤泽哲,宇野岳夫. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2015-11-25.

Treated copper foil for low dielectric resin substrate, and copper-clad laminate and printed writing board using the same

Номер патента: KR101998923B1. Автор: 다케시 오카모토,히사노리 마나베. Владелец: 후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤. Дата публикации: 2019-07-10.

Copper foil with carrier, copper-clad laminate, and printed circuit board

Номер патента: CN110293712B. Автор: 细川真,高梨哲聪,西田琢磨. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2021-11-02.

Copper foil and copper-clad laminate obtained using same

Номер патента: TW201242448A. Автор: Kaichiro Nakamuro. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2012-10-16.

Method for producing flexible copper-clad laminate

Номер патента: JP5976588B2. Автор: 正一 井伊,祐之 松下. Владелец: Nippon Steel and Sumikin Chemical Co Ltd. Дата публикации: 2016-08-23.

Process for producing a copper-clad laminate

Номер патента: DE69118043T2. Автор: Yasuo Tanaka,Norio Sayama,Takamasa Kawakami,Kazuhiro Ando,Yasuhiro Shouji,Takeo Kanaoka. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 1996-09-12.

High strength, high heat-resistance electrolytic copper foil, and manufacturing method for same

Номер патента: KR101779653B1. Автор: 사토시 야마자키,다케시 에주라,아키토시 스즈키,겐사쿠 시노자키,히로카즈 사사키. Владелец: 후루카와 덴키 고교 가부시키가이샤. Дата публикации: 2017-09-18.

ADHESIVE LAYER-EQUIPPED LAMINATE, AND FLEXIBLE COPPER-CLAD LAMINATE SHEET AND FLEXIBLE FLAT CABLE USING SAME

Номер патента: US20170259544A1. Автор: Yamada Masashi,OKIMURA Yuya. Владелец: . Дата публикации: 2017-09-14.

MODIFIED BISMALEIMIDE RESIN, METHOD FOR PREPARING THE SAME, PREPREG, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD

Номер патента: US20220081514A1. Автор: HSU Sen-Huang,LIAO Te-Chao,Liu Pei-Han. Владелец: . Дата публикации: 2022-03-17.

PRODUCTION METHOD FOR COPPER-CLAD LAMINATE PLATE

Номер патента: US20180139848A1. Автор: Tateoka Ayumu,HOSOKAWA Makoto,KAWAGUCHI Shota. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2018-05-17.

Electronic circuit, method for forming the same, and copper-clad laminate for forming electronic circuit

Номер патента: JPWO2011086972A1. Автор: 敬亮 山西,亮 福地,賢吾 神永. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-05-20.

Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation

Номер патента: KR101451489B1. Автор: 료 후쿠치,게이스케 야마니시,겐조 가미나가. Владелец: 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤. Дата публикации: 2014-10-17.

Flexible Copper Clad Laminate Capable of Preventing Open/Short Circuit and Method for Manufacturing The Same

Номер патента: KR102502200B1. Автор: 이만형,송병길,염정은,류한권. Владелец: 에스케이넥실리스 주식회사. Дата публикации: 2023-02-20.

Flexible Copper Clad Laminate Capable of Preventing Open/Short Circuit and Method for Manufacturing The Same

Номер патента: KR20180017919A. Автор: 이만형,송병길,염정은,류한권. Владелец: 엘에스엠트론 주식회사. Дата публикации: 2018-02-21.

Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation

Номер патента: WO2011086972A1. Автор: 敬亮 山西,亮 福地,賢吾 神永. Владелец: Jx日鉱日石金属株式会社. Дата публикации: 2011-07-21.

RESIN COMPOSITION, COPPER-CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME

Номер патента: US20170260364A1. Автор: HSIEH CHEN-YU. Владелец: . Дата публикации: 2017-09-14.

Surface-treated copper foil for high-frequency circuit and method for producing the same

Номер патента: WO2023148384A1. Автор: Michel Streel,Roman Michez. Владелец: Circuit Foil Luxembourg. Дата публикации: 2023-08-10.

Method for producing copper-clad laminate

Номер патента: MY119775A. Автор: Fujio Kuwako,Tomohiro Ishino. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2005-07-29.

Production method for copper-clad laminated sheet

Номер патента: EP1227710A1. Автор: Fujio MITSUI MINING & SMELTING CO. LTD. KUWAKO,Tomohiro MITSUI MINING & SMELTING CO.LTD ISHINO. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2002-07-31.

Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board

Номер патента: MY183238A. Автор: Daisuke Nakajima,Yoshinori Shimizu,Kazuhiro Yoshikawa,Toru Hanada. Владелец: Mitsui Mining & Smelting Co Ltd. Дата публикации: 2021-02-18.

Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board

Номер патента: US09924597B2. Автор: Fujio Kuwako,Toshihiro Hosoi,Toshifumi Matsushima. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2018-03-20.

Production method for copper-clad laminated sheet

Номер патента: EP1227710A4. Автор: Fujio Kuwako,Tomohiro Ishino. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2004-04-14.

Copper clad laminate, printed circuit board, and method of manufacturing the same

Номер патента: US09578740B2. Автор: Chang Jae Lee,Tae Ho Ko,Jun Ho Kang,Seok Jun Ahn. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2017-02-21.

Copper-clad laminate. method for manufacturing the same, and printed circuit board including the same

Номер патента: US20140127483A1. Автор: Seong Hyun Yoo,Jin Seok Moon,Sa Yong Lee. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2014-05-08.

Micro-roughened electrodeposited copper foil and copper clad laminate

Номер патента: US20210321514A1. Автор: Hung-Wei Hsu,Yun-Hsing SUNG,Chun-Yu Kao,Shih-Shen Lee. Владелец: Co Tech Development Corp. Дата публикации: 2021-10-14.

Micro-roughened electrodeposited copper foil and copper clad laminate

Номер патента: US20240357740A1. Автор: Hung-Wei Hsu,Yun-Hsing SUNG,Chun-Yu Kao,Shih-Shen Lee. Владелец: Co Tech Development Corp. Дата публикации: 2024-10-24.

Micro-roughened electrodeposited copper foil and copper clad laminate

Номер патента: US12120816B2. Автор: Hung-Wei Hsu,Yun-Hsing SUNG,Chun-Yu Kao,Shih-Shen Lee. Владелец: Co Tech Development Corp. Дата публикации: 2024-10-15.

Method of producing copper-clad laminated board

Номер патента: US5286330A. Автор: Keiji Azuma,Kimikazu Katoh,Ryoichi Oguro. Владелец: Circuit Foil Japan Co Ltd. Дата публикации: 1994-02-15.

Double-Sided Copper-Clad Laminate

Номер патента: MY195622A. Автор: Yoshihiro Yoneda,Yuji Kageyama,Toshihiro Hosoi,Ryuji ISHIZUKA. Владелец: Mitsui Mining & Smelting Co Ltd. Дата публикации: 2023-02-02.

Process for producing copper-clad laminate

Номер патента: US4909886A. Автор: Kazuo Noguchi. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 1990-03-20.

Double-sided copper-clad laminate

Номер патента: US20230238181A1. Автор: Yoshihiro Yoneda,Yuji Kageyama,Toshihiro Hosoi,Ryuji ISHIZUKA. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2023-07-27.

Preparation method for copper clad laminate having low dielectric constant and high peel strength, copper clad laminate and application thereof

Номер патента: US20220402255A1. Автор: Hongzhuan Zheng,Yonghua LIANG,Liangwen JIN. Владелец: Jiangmen Dezhongtai Engineering Plastics Technology Co Ltd. Дата публикации: 2022-12-22.

Reel mechanism and winding device for flexible copper clad laminate

Номер патента: US20230217597A1. Автор: Rui Pan,Hongyuan Wang,Yilan Zhang,Hezhi Wang. Владелец: AAC Technologies Holdings Nanjing Co Ltd. Дата публикации: 2023-07-06.

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

Номер патента: KR19990078038A. Автор: 다나까야스오,가꾸모리오,이께구찌노부유끼,가또요시히로. Владелец: 오히라 아끼라. Дата публикации: 1999-10-25.

Method of producing two-layered copper-clad laminate, and two-layered copper-clad laminate

Номер патента: US8470450B2. Автор: Mikio Hanafusa. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-06-25.

Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad Laminate and Printed Circuit Board

Номер патента: US20240244755A1. Автор: Zhi Su,Ke Zhang,Weiping Jiang,Qiang Gao,Meijuan ZHANG,Yuhua Zhu,Kaihui ZHU. Владелец: Guangzhou Fangbang Electronics Co Ltd. Дата публикации: 2024-07-18.

Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same

Номер патента: US9402310B2. Автор: Chen Yu Hsieh,Wenjun Tian,Ziqian Ma,Rongtao WANG,Wenfeng LV. Владелец: Elite Electronic Material Kunshan Co Ltd. Дата публикации: 2016-07-26.

Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulating layer using the resin compound, and copper-clad laminate using them

Номер патента: US20020106516A1. Автор: Tetsuro Sato,Tsutomu Asai. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2002-08-08.

Surface-treated copper foil, copper foil with carrier, copper-clad laminate using them, and method for producing printed wiring board

Номер патента: JPWO2017179416A1. Автор: 浩人 飯田,光由 松田,吉川　和広,和広 吉川,翼 加藤. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2019-02-21.

Surface-treated copper foil, copper foil with carrier, and methods for manufacturing copper-clad laminates and printed wiring boards using them.

Номер патента: JP6945523B2. Автор: 浩人 飯田,光由 松田,吉川　和広,和広 吉川,翼 加藤. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2021-10-06.

Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus

Номер патента: US20180228029A1. Автор: Moriyama Terumasa. Владелец: . Дата публикации: 2018-08-09.

Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board

Номер патента: KR101704892B1. Автор: 히데타 아라이,아츠시 미키. Владелец: 제이엑스금속주식회사. Дата публикации: 2017-02-08.

Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board

Номер патента: KR101822325B1. Автор: 히데타 아라이,아츠시 미키. Владелец: 제이엑스금속주식회사. Дата публикации: 2018-01-25.

Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board

Номер патента: WO2020105289A1. Автор: 光由 松田,翼 加藤. Владелец: 三井金属鉱業株式会社. Дата публикации: 2020-05-28.

Electrodeposited copper foil with carrier, method for producing the electrodeposited copper foil, and copper-clad laminate formed by use of the electrodeposited copper foil

Номер патента: MY122680A. Автор: MAKOTO Dobashi,Shin-Ichi Obata. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2006-04-29.

Surface-treated copper foil, copper-clad laminate board, and printed wiring board

Номер патента: WO2023281778A1. Автор: 敦史 三木,佑樹 松岡,翔平 岩沢,郁浩 五刀,誓哉 中島. Владелец: Ｊｘ金属株式会社. Дата публикации: 2023-01-12.

Surface-treated copper foil and laminated sheet, printed wiring board, and electronic device using same, as well as method for producing printed wiring board

Номер патента: KR101751622B1. Автор: 히데타 아라이,아츠시 미키. Владелец: 제이엑스금속주식회사. Дата публикации: 2017-06-27.

Production method of electro-deposited copper foil, electro-deposited copper foil obtained by the production method, surface-treated copper foil obtained by using the electro-deposited copper foil and copper-clad laminate obtained by using the electro-deposited copper foil or the surface-treated copper foil

Номер патента: US20090166213A1. Автор: MAKOTO Dobashi,Hiroshi Hata,Takeo Taguchi,Sakiko Tomonaga,Junshi Yoshioka,Ayumu Tateoka,Mitsuyoshi Matsuda,Hisao Sakai,Tomohiro Sakata,Satoshi Mogi. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2009-07-02.

Surface-treated copper foil and laminated sheet, printed wiring board, and electronic device using same, as well as method for producing printed wiring board

Номер патента: TW201406228A. Автор: Atsushi Miki,Hideta Arai. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2014-02-01.

Surface-treated copper foil and laminate using the same, copper foil, printed wiring board, electronic device, and method for manufacturing printed wiring board

Номер патента: JP5475897B1. Автор: 英太 新井,敦史 三木. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2014-04-16.

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Номер патента: CN103361509B. Автор: 中室嘉一郎. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2015-10-28.

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Номер патента: TWI620662B. Автор: 松田光由,加藤翼,飯田浩人,吉川和広,河合信之. Владелец: 三井金屬鑛業股份有限公司. Дата публикации: 2018-04-11.

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Номер патента: KR101174698B1. Автор: 가츠히코 이토,아키노리 히비노,히데츠구 모토베. Владелец: 파나소닉 주식회사. Дата публикации: 2012-08-17.

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Номер патента: CN1751544A. Автор: 元部英次,日比野明宪,伊藤克彦. Владелец: Matsushita Electric Works Ltd. Дата публикации: 2006-03-22.

Surface treatment of copper foil and the use of its laminate, copper foil, printed wiring board, electronic equipment, and printed wiring board manufacturing methods

Номер патента: TWI479036B. Автор: Atsushi Miki,Hideta Arai. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2015-04-01.

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Номер патента: CN104427757B. Автор: 新井英太,三木敦史,新井康修,中室嘉郎,中室嘉一郎,福地亮,永浦友太. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2018-08-28.

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Номер патента: US20210267052A1. Автор: Kamoshida Shinichi,Kurokawa Hiroshi,SHIRAOKAWA Yoshikatsu. Владелец: . Дата публикации: 2021-08-26.

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Номер патента: JP2022132145A. Автор: Takashi Yamaguchi,淳 塩谷,貴史 山口,啓輔 ▲杉▼本,太陽 中村,Keisuke Sugimoto,崇司 田▲崎▼,Takashi Tasaki,Atsushi Shiotani,Taiyou Nakamura,眞花 山下,Madoka Yamashita. Владелец: Arakawa Chemical Industries Ltd. Дата публикации: 2022-09-07.

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Номер патента: KR20220087525A. Автор: 이쿠히로 고토. Владелец: 제이엑스금속주식회사. Дата публикации: 2022-06-24.

Method for manufacturing surface treated copper foil for microfabrication circuit substrate

Номер патента: JP2006028635A. Автор: Sang-Bum Kim,Shoko Ryu,鍾 虎 柳,Shoryo Tei,承 亮 鄭,相 範 金. Владелец: Iljin Copper Foil Co Ltd. Дата публикации: 2006-02-02.

Copper foil with adhesive layer, copper-clad laminate and printed wiring board

Номер патента: WO2013105650A1. Автор: 佐藤　哲朗,敏文 松島,眞 細川,和弘 大澤. Владелец: 三井金属鉱業株式会社. Дата публикации: 2013-07-18.

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Номер патента: WO2022202539A1. Автор: 光由 松田,哲也 金子,大輔 中島,眞 細川,慎哉 平岡,美智 溝口. Владелец: 三井金属鉱業株式会社. Дата публикации: 2022-09-29.

Resin composite electrolyzed copper foil, copper clad laminate and print wiring board

Номер патента: TWI501865B. Автор: Masashi Yano,Mitsuru Nozaki,Akihiro Nomoto,Eiji Nagata,Norikatsu Akiyama. Владелец: PI R&D Co Ltd. Дата публикации: 2015-10-01.

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Номер патента: KR20200131868A. Автор: 아츠시 미키,노부아키 미야모토. Владелец: 제이엑스금속주식회사. Дата публикации: 2020-11-24.

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Номер патента: US20200248330A1. Автор: Chou Jui-Chang,Lai Chien-Ming,LAI Yao-Sheng. Владелец: . Дата публикации: 2020-08-06.

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Номер патента: KR101456419B1. Автор: 히데타 아라이,아츠시 미키,고스케 아라이,가이치로 나카무로. Владелец: 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤. Дата публикации: 2014-10-31.

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Номер патента: KR101631423B1. Автор: 히데타 아라이,아츠시 미키,고스케 아라이,가이치로 나카무로. Владелец: 제이엑스금속주식회사. Дата публикации: 2016-06-16.

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Номер патента: CN103946425A. Автор: 新井英太,三木敦史,新井康修,中室嘉一郎. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2014-07-23.

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Номер патента: KR101658721B1. Автор: 료 후쿠치. Владелец: 제이엑스금속주식회사. Дата публикации: 2016-09-21.

Surface-treated copper foil and laminate using same

Номер патента: WO2014073695A1. Автор: 新井　英太,敦史 三木,嘉一郎 中室,康修 新井. Владелец: Jx日鉱日石金属株式会社. Дата публикации: 2014-05-15.

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Номер патента: PH12014502195A1. Автор: Fukuchi Ryo. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2014-12-10.

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Номер патента: PH12014502195B1. Автор: Ryo Fukuchi. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2014-12-10.

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Номер патента: KR101974687B1. Автор: 다케미 무로가,지즈루 고토. Владелец: 장 춘 페트로케미컬 컴퍼니 리미티드. Дата публикации: 2019-05-02.

Surface-treated copper foil

Номер патента: JPWO2013147115A1. Автор: 亮 福地. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2015-12-14.

Manufacturing method of copper foil with carrier, laminated body, printed wiring board, electronic equipment, and printed wiring board

Номер патента: TWI623248B. Автор: Michiya Kohiki,Tomota Nagaura. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2018-05-01.

Surface-treated copper foil and laminate using the same

Номер патента: KR101498436B1. Автор: 히데타 아라이,아츠시 미키,고스케 아라이,가이치로 나카무로. Владелец: 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤. Дата публикации: 2015-03-03.

Surface-treated copper foil and laminated board using same

Номер патента: WO2014038717A1. Автор: 新井　英太,敦史 三木,友太 永浦,嘉一郎 中室,康修 新井. Владелец: Jx日鉱日石金属株式会社. Дата публикации: 2014-03-13.

Surface-treated copper foil

Номер патента: US10070521B2. Автор: Ryo Fukuchi. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2018-09-04.

Copper-clad laminate for flexible printed wiring board, and flexible printed wiring board

Номер патента: CN107793991B. Автор: 田崎崇司,盐谷淳,山口贵史,杦本启辅. Владелец: Arakawa Chemical Industries Ltd. Дата публикации: 2022-03-08.

Method for manufacturing very low roughness electrodeposited copper foil and electrodeposited copper foil manufactured thereby

Номер патента: US20040104118A1. Автор: Chang Choi,Jeong Kim,Kyung Woo,Hong Moon,Sangyum Kim,Cha Jo,Joon Ki. Владелец: LG Cable Ltd. Дата публикации: 2004-06-03.

Surface-processed copper foil, copper foil with carrier, laminated body, printed circuit board, electronic equipment, manufacturing method for surface-processed copper foil and manufacturing method for printed circuit board

Номер патента: CN105323958A. Автор: 福地亮,神永贤吾. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2016-02-10.

Process for producing electrodeposited copper foil, electrodeposited copper foil, copper-clad laminate and printed circuit board

Номер патента: DE60031479D1. Автор: Yutaka Hirasawa,Nobuyuki Imada,Yasuji Hara,Naoya Matsushita. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2006-12-07.

Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same

Номер патента: TW201742212A. Автор: 松田光由,加藤翼,飯田浩人,吉川和広. Владелец: 三井金屬鑛業股份有限公司. Дата публикации: 2017-12-01.

Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate

Номер патента: KR101886824B1. Автор: 케이이치 키무라,코이치 핫토리. Владелец: 신닛테츠 수미킨 가가쿠 가부시키가이샤. Дата публикации: 2018-08-08.

Copper foil for laser hole drilling, copper-clad laminate and preparation method of the foil

Номер патента: KR101400778B1. Автор: 김철웅,김상범,김동우,범원진. Владелец: 일진머티리얼즈 주식회사. Дата публикации: 2014-06-02.

Copper foil and a method for producing same

Номер патента: KR101343667B1. Автор: 겐고 가미나가. Владелец: 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤. Дата публикации: 2013-12-20.

Copper foil and a method for producing same

Номер патента: WO2010147013A1. Автор: 賢吾 神永. Владелец: Jx日鉱日石金属株式会社. Дата публикации: 2010-12-23.

Flexible printed wiring board and laminate for manufacturing flexible printed wiring board

Номер патента: JP5559674B2. Автор: 高好 小関,浩之 福住,義昭 江崎,陽介 石川. Владелец: Panasonic Corp. Дата публикации: 2014-07-23.

Copper foil with attached carrier, copper-clad laminate using same, printed circuit board, electronic device, and method for manufacturing printed circuit board

Номер патента: CN105209252A. Автор: 坂口和彦,佐佐木伸一. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2015-12-30.

Thermoplastic liquid-crystal polymer film, method for producing same, and flexible copper-clad laminate

Номер патента: WO2020013106A1. Автор: 駿 内山,育佳 猪田. Владелец: デンカ株式会社. Дата публикации: 2020-01-16.

Method for producing phenolic resin flexible agent for laminate, vegetable oil-modified phenolic resin for laminate, prepreg, and copper-clad laminate

Номер патента: JP3158695B2. Автор: 憲 七海,猛 堀内,雅弘 野本,光弘 井上. Владелец: Showa Denko Materials Co Ltd. Дата публикации: 2001-04-23.

Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices

Номер патента: JP6856688B2. Автор: 裕士 石野. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2021-04-07.

Thermoplastic liquid-crystal polymer film, method for producing same, and flexible copper-clad laminate

Номер патента: US20210268695A1. Автор: Shun UCHIYAMA,Ikuka INODA. Владелец: Denka Co Ltd. Дата публикации: 2021-09-02.

Liquid crystal polymer film, method for producing same, flexible copper-clad laminate and flexible printed circuit board

Номер патента: WO2021059586A1. Автор: 田口　貴雄. Владелец: 富士フイルム株式会社. Дата публикации: 2021-04-01.

Surface treatment copper foil and its manufacture method, use in printed circuit board copper-clad laminated board and printed circuit board (PCB)

Номер патента: CN107532281A. Автор: 松浦宜范. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2018-01-02.

Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate

Номер патента: US20230269879A1. Автор: Wei Zhou,Qiang Xu,Caicai XIE. Владелец: BYD Co Ltd. Дата публикации: 2023-08-24.

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Номер патента: US20200399775A1. Автор: SUNG Yun-Hsing,HSU HUNG-WEI,KAO CHUN-YU,LEE SHIH-SHEN. Владелец: . Дата публикации: 2020-12-24.

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Номер патента: US20200399776A1. Автор: SUNG Yun-Hsing,HSU HUNG-WEI,KAO CHUN-YU,LEE SHIH-SHEN. Владелец: . Дата публикации: 2020-12-24.

Copper foil, copper clad laminated plate, and substrate

Номер патента: KR101912765B1. Автор: 타케오 우노,유코 오쿠노,다이스케 이노우에,사토루 도리미츠. Владелец: 후루카와 덴키 고교 가부시키가이샤. Дата публикации: 2018-10-29.

Polyimides, adhesive, adhesive material, adhesive layer, sheet adhesive, copper foil, copper-clad laminated board, wiring plate and manufacturing method

Номер патента: CN108690194A. Автор: 田崎崇司,盐谷淳,山口贵史,杦本启辅. Владелец: Arakawa Chemical Industries Ltd. Дата публикации: 2018-10-23.

Electrodeposited copper foil and copper clad laminate

Номер патента: US20110171491A1. Автор: Yuji Suzuki,Takahiro Saito. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2011-07-14.

Phosphonate based halogen-free compositions for printed circuit board applications

Номер патента: WO2019084532A1. Автор: Jan-Pleun Lens,Lawino Kagumba. Владелец: FRX POLYMERS, INC.. Дата публикации: 2019-05-02.

Copper foil and copper-clad laminate comprising same

Номер патента: TW201825717A. Автор: 佐藤章,宇野岳夫. Владелец: 日商古河電氣工業股份有限公司. Дата публикации: 2018-07-16.

Surface treatment of copper foil and copper clad laminate

Номер патента: TWI468559B. Автор: Yuji Suzuki,Satoshi Fujisawa,Takeo Uno. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2015-01-11.

Electrolytic copper foil and copper-clad laminate

Номер патента: KR101295138B1. Автор: 유지 스즈키,타카히로 사이토. Владелец: 후루카와 덴끼고교 가부시키가이샤. Дата публикации: 2013-08-09.

Electrodeposited copper foil and copper clad laminate

Номер патента: KR102415661B1. Автор: 야오-성 라이,루이-장 저우. Владелец: 장 춘 페트로케미컬 컴퍼니 리미티드. Дата публикации: 2022-06-30.

Aqueous carbon composition and method for coating a non conductive substrate

Номер патента: EP1200968B1. Автор: Frank Polakovic,Michael V. Carano. Владелец: OMG Electronic Chemicals LLC. Дата публикации: 2011-08-10.

Polybenzoxazine precursor and method for preparing same

Номер патента: US20170137391A1. Автор: Sang Hun Park,Ki Hyun Park,Do Kyung SUNG,Hee Jin Cho,Hyun Soo KAGN. Владелец: KOLON INDUSTRIES INC. Дата публикации: 2017-05-18.

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Номер патента: US20190203045A1. Автор: ARISAWA TATSUYA,Abe Tomoyuki,GOTO Hirohisa. Владелец: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LT D.. Дата публикации: 2019-07-04.

Copper-clad laminate and manufacturing method for copper-clad laminate

Номер патента: JP2022100710A. Автор: Takumi Shimoji,匠 下地,Yoshihide Nishiyama,芳英 西山. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2022-07-06.

Organic Silicone Resin Composition and Pre-preg, Laminate, Copper-clad Laminate, and Aluminum Substrate that Use the Composition

Номер патента: US20170349750A1. Автор: TANG Guofang,YE Suwen. Владелец: . Дата публикации: 2017-12-07.

Polyimide Film for Preparing Flexible Copper Clad Laminate And Flexible Copper Clad Laminate Comprising the Same

Номер патента: KR102141891B1. Автор: 임현재,이길남,백승열. Владелец: 피아이첨단소재 주식회사. Дата публикации: 2020-08-07.

Resin composition for copper clad laminate and copper clad laminate

Номер патента: KR101014759B1. Автор: 마사카즈 요시자와,도모유키 이마다. Владелец: 디아이씨 가부시끼가이샤. Дата публикации: 2011-02-15.

Phenol resin composition, cured article thereof, resin composition for copper-clad-laminate, copper-clad laminate, and novel phenol resin

Номер патента: US20100221555A1. Автор: Masakazu Yoshizawa,Tomoyuki Imada. Владелец: DIC Corp. Дата публикации: 2010-09-02.

Copper-clad laminate and printed circuit board including the copper-clad laminate

Номер патента: CN109601025A. Автор: 托马斯·德瓦希夫,米歇尔·斯特里尔,扎伊尼亚·凯季. Владелец: Circuit Foil Luxemburg SARL. Дата публикации: 2019-04-09.

Polyimide Film for Preparing Flexible Copper Clad Laminate And Flexible Copper Clad Laminate Comprising the Same

Номер патента: KR102055630B1. Автор: 임현재,이길남,백승열. Владелец: 에스케이씨코오롱피아이 주식회사. Дата публикации: 2019-12-16.

Resin composition for semiconductor package, copper clad laminate and circuit board having the same

Номер патента: US20230182443A1. Автор: Min Young Hwang,Han Sang KIM,Koh Eun LEE. Владелец: LG Innotek Co Ltd. Дата публикации: 2023-06-15.

Low dielectric composite film for copper clad laminate (ccl), and low dielectric copper clad laminte (ccl) comprising same

Номер патента: EP4212336A4. Автор: Woo Hyun CHO,Won Soo Kim,Ji Hong Jeong,Du Yeong Kim. Владелец: Sang A Frontec Co Ltd. Дата публикации: 2024-09-04.

Copper clad laminate, printed circuit board and manufacturing method of ccl

Номер патента: KR100823998B1. Автор: 박세훈,이우성,박성대,유명재. Владелец: 전자부품연구원. Дата публикации: 2008-04-23.

Copper clad laminate for flexible printed circuit board and flexible printed circuit board

Номер патента: KR102418502B1. Автор: 케이스케 스기모토,타카시 야마구치,아츠시 시오타니,타카시 타사키. Владелец: 아라까와 가가꾸 고교 가부시끼가이샤. Дата публикации: 2022-07-06.

Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device

Номер патента: US9883588B2. Автор: Kazuaki Kaneko,Tomohiro Uno,Keiichi Kimura. Владелец: Nippon Steel and Sumitomo Metal Corp. Дата публикации: 2018-01-30.

Oriented copper plate, copper- clad laminate, flexible circuit board, and electronic device

Номер патента: EP3231880B1. Автор: Kazuaki Kaneko,Tomohiro Uno,Keiichi Kimura. Владелец: Nippon Steel Corp. Дата публикации: 2020-10-21.

Polyimide component, polyimide film, and polyimide copper clad laminate

Номер патента: US20220002490A1. Автор: Shou-Jui Hsiang,Pei-Jung Wu,Kuan-Wei Lee,Szu-Hsiang SU,Wei-Hsin Huang. Владелец: Zhen Ding Technology Co Ltd. Дата публикации: 2022-01-06.

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Номер патента: US20220056213A1. Автор: Lin Ching-Hsuan,Chen Wen-Chang,HSIAO Wan-Ling,KAMANI Sudhir Kumar Reddy. Владелец: . Дата публикации: 2022-02-24.

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Номер патента: US20210054158A1. Автор: Zhang Yilan,Wang Hezhi,WANG Hongyuan. Владелец: . Дата публикации: 2021-02-25.

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Номер патента: US20180201761A1. Автор: XU Ying,Fang Kehong. Владелец: . Дата публикации: 2018-07-19.

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Номер патента: US20180201776A1. Автор: XU Ying,Fang Kehong. Владелец: Shengyi Technology Co.,Ltd.. Дата публикации: 2018-07-19.

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Номер патента: US20160222204A1. Автор: LIN Yu-Te,WANG Rongtao,TIAN Wenjun,MA Ziqian,LV Wenfeng,JIA Ningning. Владелец: . Дата публикации: 2016-08-04.

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Номер патента: US20170241604A1. Автор: Seung Woo Choi,Cheol Ho Kim,Young Do Kim,Ho Sub Kim. Владелец: Kia Motors Corp. Дата публикации: 2017-08-24.

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Номер патента: US20160255718A1. Автор: Chen Yong,Zeng Xianping,XU Yongjing,XIN Yujun. Владелец: . Дата публикации: 2016-09-01.

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Номер патента: US20170368800A1. Автор: Li Xin,Liang Bo,Qin Bing. Владелец: . Дата публикации: 2017-12-28.

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Номер патента: US20170369653A1. Автор: HSU MAO-FENG,SU SZU-HSIANG,HSIANG SHOU-JUI,KAO YU-WEN,TENG CHIA-YIN. Владелец: . Дата публикации: 2017-12-28.

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Номер патента: US20180370189A1. Автор: TANG Guofang,YE Suwen. Владелец: SHENGYI TECHNOLOGY CO., LTD.. Дата публикации: 2018-12-27.

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Номер патента: US20180371232A1. Автор: LI Jiang,XU Yongjing,XI Long. Владелец: . Дата публикации: 2018-12-27.

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Номер патента: KR101556658B1. Автор: 김무현,권정돈,정동희,한덕상,홍도웅. Владелец: 주식회사 두산. Дата публикации: 2015-10-01.

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Номер патента: CN112724640B. Автор: 曾宪平,关迟记,陈宇航. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2022-09-16.

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Номер патента: US6558797B1. Автор: Michitoshi Arata,Nozomu Takano,Kazuhito Kobayashi. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2003-05-06.

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Номер патента: EP3806589A1. Автор: Youngsun LEE,Eunseok HONG,Byeongkeol KIM,Jongmin JEON. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2021-04-14.

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Номер патента: US20210168934A1. Автор: Youngsun LEE,Eunseok HONG,Byeongkeol KIM,Jongmin JEON. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2021-06-03.

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Номер патента: US20160198570A1. Автор: Sugawara Jun,Yonezawa Takayuki,Kaimori Shingo,UCHITA Yoshifumi,Kakimoto Masaya,ASAI Shogo. Владелец: SUMITOMO ELECTROC INDUSTRIES, LTD.. Дата публикации: 2016-07-07.

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Номер патента: US20190211466A1. Автор: Chou Jui-Chang,Cheng Kuei-Sen,LAI Yao-Sheng. Владелец: CHANG CHUN PETROCHEMICAL CO., LTD.. Дата публикации: 2019-07-11.

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Номер патента: KR102485693B1. Автор: 케이스케 스기모토,타카시 야마구치,아츠시 시오타니,타카시 타사키. Владелец: 아라까와 가가꾸 고교 가부시끼가이샤. Дата публикации: 2023-01-06.

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Номер патента: KR102388938B1. Автор: 케이스케 스기모토,타카시 야마구치,아츠시 시오타니,타카시 타사키. Владелец: 아라까와 가가꾸 고교 가부시끼가이샤. Дата публикации: 2022-04-20.

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Номер патента: JP6686619B2. Автор: 雅之 辻,辻　雅之,崇司 田崎,淳 塩谷,太陽 中村. Владелец: Arakawa Chemical Industries Ltd. Дата публикации: 2020-04-22.

Method for manufacturing black surface-treated copper foil for emi shield

Номер патента: WO2006004299A1. Автор: Jong-Ho Ryu,Seung-Ryang Jeong,Sang-Beom Kim. Владелец: Iljin Copper Foil Co., Ltd.. Дата публикации: 2006-01-12.

Method for manufacturing black surface-treated copper foil for EMI Shield

Номер патента: KR100603428B1. Автор: 김상범,류종호,정승량. Владелец: 일진소재산업주식회사. Дата публикации: 2006-07-20.

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Номер патента: KR100604964B1. Автор: 김상범,류종호,정승량. Владелец: 일진소재산업주식회사. Дата публикации: 2006-07-26.

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Номер патента: KR101588537B1. Автор: 마사유키 시무라,요시유키 후루타,마사오 유모토. Владелец: 다이요 잉키 세이조 가부시키가이샤. Дата публикации: 2016-01-25.

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Номер патента: US20210002780A1. Автор: CHEN KUO-CHAO,LIN SHIH-CHING. Владелец: . Дата публикации: 2021-01-07.

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Номер патента: TWI695898B. Автор: 宋雲興. Владелец: 金居開發股份有限公司. Дата публикации: 2020-06-11.

Polyimide-based adhesive, film adhesive, adhesive layer, adhesive sheet, copper-clad laminate, wiring board and its manufacturing method

Номер патента: CN106010420A. Автор: 田崎崇司,辻雅之,盐谷淳,中村太阳. Владелец: Arakawa Chemical Industries Ltd. Дата публикации: 2016-10-12.

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Номер патента: US09957389B2. Автор: Moo Hyun Kim,Duk Sang Han,Dong Hee JUNG,Jeong Don Kwon,Do Woong HONG. Владелец: Doosan Corp. Дата публикации: 2018-05-01.

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Номер патента: US20130266812A1. Автор: ZENG Xian-Ping,Tang Jun-Qi. Владелец: GUANGDONG SHENGYI SCI.TECH CO., LTD. Дата публикации: 2013-10-10.

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Номер патента: US20160222192A1. Автор: OKIMURA Yuya,TAKASHIMA Masaru,YAMADA Mesashi. Владелец: TOAGOSEI CO., LTD.. Дата публикации: 2016-08-04.

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Номер патента: US20140322541A1. Автор: LIN Yu-Te,Chen Yi-Jen,YU Li-Chih,TIAN Wenjun,MA Ziqian,WANG RONG-TAO,LU WENFENG. Владелец: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. Дата публикации: 2014-10-30.

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Номер патента: US20140342161A1. Автор: Zeng Xianping. Владелец: Shengyi Technology Co. Ltd.. Дата публикации: 2014-11-20.

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Номер патента: US20170273188A1. Автор: Zhi Su. Владелец: Guangzhou Fangbang Electronics Co Ltd. Дата публикации: 2017-09-21.

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Номер патента: US20160297967A1. Автор: Moo Hyun Kim,Duk Sang Han,Dong Hee JUNG,Jeong Don Kwon,Do Woong HONG. Владелец: Doosan Corp. Дата публикации: 2016-10-13.

Organic silicone resin-based copper-clad laminate and manufacturing method thereof

Номер патента: KR20180030113A. Автор: 구오팡 탕,쑤원 예. Владелец: 셍기 테크놀로지 코. 엘티디.. Дата публикации: 2018-03-21.

Low dielectric resin constituent and apply its copper clad laminate and printed circuit board (PCB)

Номер патента: CN103509329B. Автор: 谢镇宇,李长元. Владелец: ZHONGSHAN ELITE MATERIAL CO Ltd. Дата публикации: 2016-01-20.

Thermoplastic resin composition having excellent heat resistance and low permittivity, prepreg and copper clad laminate using the same

Номер патента: KR20150060452A. Автор: 김무현,권정돈,정동희,한덕상,홍도웅. Владелец: 주식회사 두산. Дата публикации: 2015-06-03.

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Номер патента: US9693450B2. Автор: Hiroyuki Miyake,Kiyoshi Sekiguchi,Yusuke Murai. Владелец: Canon Inc. Дата публикации: 2017-06-27.

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Номер патента: US20160143133A1. Автор: Hiroyuki Miyake,Kiyoshi Sekiguchi,Yusuke Murai. Владелец: Canon Inc. Дата публикации: 2016-05-19.

Printed wiring board, semiconductor device and printed circuit board

Номер патента: US09693450B2. Автор: Hiroyuki Miyake,Kiyoshi Sekiguchi,Yusuke Murai. Владелец: Canon Inc. Дата публикации: 2017-06-27.

Process for manufacturing copper-clad laminate

Номер патента: US4434022A. Автор: Hiroyoshi Harada,Atsushi Kanezaki,Yoshiaki Matsuga,Masami Watase,Osao Kamada,Tadato Kudo. Владелец: Hitachi Cable Ltd. Дата публикации: 1984-02-28.

Method for manufacturing a copper-clad laminate

Номер патента: US20030102074A1. Автор: Chien-Hsin Ko. Владелец: Pioneer Technology Engineering Co Ltd. Дата публикации: 2003-06-05.

Semi-automatic corrosion box of copper clad laminate

Номер патента: US20200359505A1. Автор: Huihui WANG,Sen Qiu,Shengming LI,Fangyuan Hu. Владелец: Dalian University of Technology. Дата публикации: 2020-11-12.

Semi-automatic corrosion box of copper clad laminate

Номер патента: US12101892B2. Автор: Huihui WANG,Sen Qiu,Shengming LI,Fangyuan Hu. Владелец: Dalian University of Technology. Дата публикации: 2024-09-24.

Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device

Номер патента: US20180160546A1. Автор: Arai Hideta,Miki Atsushi,Fukuchi Ryo,Ori Yuki. Владелец: . Дата публикации: 2018-06-07.

Surface treated copper foil and circuit board

Номер патента: CN1770953B. Автор: 铃木裕二. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2010-05-05.

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Номер патента: US20200214126A1. Автор: Nakashima Hajime,KOMATSU lzuru. Владелец: KABUSHIKI KAISHA TOSHIBA. Дата публикации: 2020-07-02.

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD

Номер патента: US20170347459A1. Автор: Ueda Hiroshi,MIURA Kousuke,MIYATA Kazuhiro,OKADA Issei,OKA Yoshio,KASUGA Takashi,PARK Jinjoo,OKUDA Yasuhiro. Владелец: . Дата публикации: 2017-11-30.

COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Номер патента: US20150060115A1. Автор: Moon Jin Seok,Lee Keun Yong,Lee Sa Yong. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2015-03-05.

Bendable flexible metal copper clad laminate printed circuit board and method for manufacturing the same

Номер патента: KR101713171B1. Автор: 김성민,안재화,소태윤. Владелец: 세일전자 주식회사. Дата публикации: 2017-03-07.

Carrier-foiled composite copper foil, method for manufacturing printed circuit board with resistance circuit, and printed circuit board having resistance circuit

Номер патента: EP1229768A1. Автор: Takuya Mitsui Mining & Smelting Co. Ltd YAMAMOTO,Takashi MITSUI MINING & SMELTING CO.LTD KATAOKA,Naotomi MITSUI MINING & SMELTING CO.LTD TAKAHASHI. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2002-08-07.

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device

Номер патента: US20180288881A1. Автор: Atsushi Miki,Ryo Fukuchi,Hideta Arai,Yuki Ori. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2018-10-04.

Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

Номер патента: US10925170B2. Автор: Atsushi Miki,Ryo Fukuchi,Hideta Arai,Yuki Ori. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2021-02-16.

SURFACE TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WIRING BOARD, AND COPPER CLAD LAMINATE

Номер патента: US20150237737A1. Автор: Arai Hideta,Miki Atsushi,Arai Kohsuke,Nakamuro Kaichiro. Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2015-08-20.

Method for manufacturing printed wiring board

Номер патента: US12058818B2. Автор: Satoru Kawai. Владелец: Ibiden Co Ltd. Дата публикации: 2024-08-06.

Surface-treated copper foil, copper-clad laminate and printed wiring board

Номер патента: JP7014884B1. Автор: 宣明 宮本,裕士 石野,慎介 坂東. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2022-02-01.

Surface treated copper foil, copper clad laminate and printed wiring board

Номер патента: TWI806296B. Автор: 石野裕士,坂東慎介,宮本宣明. Владелец: 日商Ｊｘ金屬股份有限公司. Дата публикации: 2023-06-21.

Surface-treated copper foil, method for producing same, and copper clad laminated board

Номер патента: CN102713020B. Автор: 藤泽哲,宇野岳夫,服部公一. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2015-05-13.

Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated copper foil with very thin primer resin layer

Номер патента: EP2100987B1. Автор: Tetsuro Sato,Toshifumi Matsushima,Tetsuhiro Matsunaga. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2015-01-28.

Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated copper foil with very thin primer resin layer

Номер патента: TW200831283A. Автор: Akihiro Matsunaga,Tetsuro Sato,Toshifumi Matsushima. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2008-08-01.

Bronzing-surface-treated copper foil, process for producing the same, and electromagnetic wave shielding conductive mesh for front panel of plasma display utilizing the bronzing-surface-treated copper foil

Номер патента: KR100738164B1. Автор: 츠토무 히구치. Владелец: 미쓰이 긴조꾸 고교 가부시키가이샤. Дата публикации: 2007-07-10.

Bronzing-surface-treated copper foil, process for producing the same, and electromagnetic wave shielding conductive mesh for front panel of plasma display utilizing the bronzing-surface-treated copper foil

Номер патента: WO2005064044A1. Автор: Tsutomu Higuchi. Владелец: Mitsui Mining & Smelting Co.,Ltd.. Дата публикации: 2005-07-14.

Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna

Номер патента: US20170208680A1. Автор: Fukuchi Ryo. Владелец: . Дата публикации: 2017-07-20.

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Номер патента: CN107848260B. Автор: 米田祥浩,松岛敏文,细井俊宏,桑子富士夫. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2020-10-30.

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Номер патента: TW201710454A. Автор: Masayuki Tsuji,Takashi Tasaki,Atsushi Shiotani,Taiyo Nakamura. Владелец: Arakawa Chemical Industries Ltd. Дата публикации: 2017-03-16.

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Номер патента: US20040191560A1. Автор: Takashi Kataoka,Mitsuyoshi Matsuda. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2004-09-30.

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Номер патента: CN111771015B. Автор: 佐藤章,佐佐木贵大,筱崎淳,菊池伸. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2022-03-29.

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Номер патента: JP4148501B2. Автор: 哲朗 佐藤,敏文 松島,一浩 山崎,英章 三輪,彰 一柳,富士夫 桑子. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2008-09-10.

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Номер патента: KR100602896B1. Автор: 마츠다미츠요시,가타오카타카시. Владелец: 미쓰이 긴조꾸 고교 가부시키가이샤. Дата публикации: 2006-07-19.

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Номер патента: TW201943771A. Автор: 小寺省吾,八百板隆俊,笠井涉,中村順悅. Владелец: 日商Ａｇｃ股份有限公司. Дата публикации: 2019-11-16.

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Номер патента: US20150079415A1. Автор: Fukuchi Ryo. Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2015-03-19.

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Номер патента: US20140355229A1. Автор: Arai Hideta,Miki Atsushi,Arai Kohsuke,Nakamuro Kaichiro. Владелец: . Дата публикации: 2014-12-04.

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Номер патента: KR101315364B1. Автор: 박준우,김승민,김수열. Владелец: 엘에스엠트론 주식회사. Дата публикации: 2013-10-07.

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Номер патента: KR101716988B1. Автор: 히데타 아라이,아츠시 미키,고스케 아라이,가이치로 나카무로. Владелец: 제이엑스금속주식회사. Дата публикации: 2017-03-15.

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Номер патента: WO2012070589A1. Автор: 慎哉 平岡,咲子 朝長,歩 立岡,文彰 細越,松嶋　英明,知志 前田,小畠　真一,三宅　行一. Владелец: 三井金属鉱業株式会社. Дата публикации: 2012-05-31.

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Номер патента: JPWO2012070589A1. Автор: 英明 松嶋,行一 三宅,真一 小畠,慎哉 平岡,咲子 朝長,歩 立岡,文彰 細越,松嶋　英明,知志 前田,小畠　真一,三宅　行一. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2014-05-19.

Surface-treated copper foil, laminate having the same, and apparatus

Номер патента: CN111519216B. Автор: 黄建铭,赖耀生,周瑞昌. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2021-05-18.

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Номер патента: US7566501B2. Автор: Hidetsugu Motobe,Akinori Hibino,Katsuhiko Ito. Владелец: Matsushita Electric Works Ltd. Дата публикации: 2009-07-28.

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Номер патента: EP1650248B1. Автор: Hidetsugu. Matsushita Electric Works Ltd Motobe,Akinori Matsushita Electric Works Ltd Hibino,Katsuhiko Matsushita Electric Works Ltd. Ito. Владелец: Panasonic Electric Works Co Ltd. Дата публикации: 2009-08-12.

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Номер патента: TW201240803A. Автор: Kazuhiko Sakaguchi,Hajime Inazumi,Hisakazu Yachi. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2012-10-16.

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Номер патента: JP2018074153A. Автор: 宣明 宮本,Nobuaki Miyamoto. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2018-05-10.

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Номер патента: CN1322259A. Автор: 土桥诚,小畠真一. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2001-11-14.

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Номер патента: TW201922067A. Автор: 小松出,中島元. Владелец: 日商東芝股份有限公司. Дата публикации: 2019-06-01.

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Номер патента: KR101362288B1. Автор: 김상범,맹일상,박유주. Владелец: 일진머티리얼즈 주식회사. Дата публикации: 2014-02-13.

Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil

Номер патента: KR100461660B1. Автор: 도바시마코토,타카하시나오토미,타에나카사키코,스기모토아키코. Владелец: 미쓰이 긴조꾸 고교 가부시키가이샤. Дата публикации: 2004-12-16.

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Номер патента: WO2001049903A1. Автор: Yutaka Hirasawa,Naotomi Takahashi. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2001-07-12.

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Номер патента: CN1179070C. Автор: ,平泽裕,高桥直臣. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2004-12-08.

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Номер патента: US20180242448A1. Автор: Yoshikawa Kazuo,Tai Makoto,Iwano Nobuyuki,MAYAMA Takayuki. Владелец: . Дата публикации: 2018-08-23.

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Номер патента: CN108467652B. Автор: 田井诚,吉川和男,岩野畅行,间山孝之. Владелец: Arisawa Mfg Co Ltd. Дата публикации: 2020-06-30.

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Номер патента: KR100851799B1. Автор: 다까하시히데유끼,다니구찌고지,요네자와고지,시바야마고이찌,후시미마사오,야기모토히로. Владелец: 세키스이가가쿠 고교가부시키가이샤. Дата публикации: 2008-08-13.

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Номер патента: TW201605611A. Автор: Hiroaki Tsuyoshi,Makoto Hosokawa. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2016-02-16.

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Номер патента: WO2011013922A2. Автор: 박진영,김용석,원종찬,정현민,류종호. Владелец: 일진소재산업(주). Дата публикации: 2011-02-03.

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Номер патента: US20190203045A1. Автор: Tomoyuki Abe,Hirohisa Goto,Tatsuya Arisawa. Владелец: Panasonic Intellectual Property Management Co Ltd. Дата публикации: 2019-07-04.

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Номер патента: CN111093985A. Автор: 小松出,中岛元. Владелец: Toshiba Corp. Дата публикации: 2020-05-01.

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Номер патента: JP6643287B2. Автор: 慎介 坂東. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2020-02-12.

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Номер патента: JP6647253B2. Автор: 慎介 坂東. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2020-02-14.

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Номер патента: CN106010421A. Автор: 田崎崇司,辻雅之,盐谷淳,中村太阳. Владелец: Arakawa Chemical Industries Ltd. Дата публикации: 2016-10-12.

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Номер патента: US10912193B2. Автор: Izuru Komatsu,Hajime Nakashima. Владелец: Toshiba Corp. Дата публикации: 2021-02-02.

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Номер патента: JPWO2019021599A1. Автор: 宏介 三浦,新田　耕司,耕司 新田,将一郎 酒井,隼一 本村,雅広 伊藤,高橋　賢治,賢治 高橋,茉紀 池邉. Владелец: Sumitomo Electric Printed Circuits Inc. Дата публикации: 2020-05-28.

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Номер патента: US20200407524A1. Автор: KOTERA Seigo,KASAI Wataru,YAOITA Takatoshi,NAKAMURA Junetsu. Владелец: AGC Inc.. Дата публикации: 2020-12-31.

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Номер патента: JP2020056081A. Автор: Shinsuke Bando,慎介 坂東. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2020-04-09.

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Номер патента: US20200141017A1. Автор: SUNG Yun-Hsing. Владелец: . Дата публикации: 2020-05-07.

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Номер патента: PH12020000027A1. Автор: Yao-Sheng LAI,Jui-Chang Chou,Ting-Chun Lai. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2021-03-01.

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Номер патента: TWI760249B. Автор: 周瑞昌,賴耀生. Владелец: 長春石油化學股份有限公司. Дата публикации: 2022-04-01.

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Номер патента: CN113026060A. Автор: 赖耀生,周瑞昌,黄慧芳. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2021-06-25.

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Номер патента: KR102098479B1. Автор: 신스케 반도. Владелец: 제이엑스금속주식회사. Дата публикации: 2020-04-07.

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Номер патента: JP2023001854A. Автор: Yao-Sheng LAI,Jui-Chang Chou,耀生 ▲頼▼,瑞昌 周. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2023-01-06.

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Номер патента: US20150118474A1. Автор: Jung Hwan Park,Dong Hoon Kim,Sung Taek Lim. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2015-04-30.

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Номер патента: US11778723B2. Автор: Sheng Zhang,Zai Le,Lihong Tong. Владелец: Ningbo Self Electronics Co Ltd. Дата публикации: 2023-10-03.

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Номер патента: US20100015871A1. Автор: Junji Kodemura,Tomoo Sugawara,Hirotoshi Tanimoto. Владелец: Zeon Corp. Дата публикации: 2010-01-21.

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Номер патента: WO2022158831A1. Автор: 이용호,정승모,박종용,이하수,강형대,정우득. Владелец: 도레이첨단소재 주식회사. Дата публикации: 2022-07-28.

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Номер патента: KR20220107207A. Автор: 마사시 야마다,유야 오키무라,마사히로 토리이,마코토 히라카와,히로노리 쿠츠나. Владелец: 도아고세이가부시키가이샤. Дата публикации: 2022-08-02.

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Номер патента: US5837155A. Автор: Shoji Inagaki,Eiji Takehara. Владелец: Taiyo Ink Mfg Co Ltd. Дата публикации: 1998-11-17.

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Номер патента: JP6514335B2. Автор: 素文 叶,国坊 唐. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2019-05-15.

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Номер патента: JP6525085B2. Автор: 祐弥 沖村,成志 山田. Владелец: TOAGOSEI CO LTD. Дата публикации: 2019-06-05.

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Номер патента: KR101927650B1. Автор: 구오팡 탕,쑤원 예,샤오셩 쑤. Владелец: 셍기 테크놀로지 코. 엘티디.. Дата публикации: 2018-12-10.

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Номер патента: KR20170100624A. Автор: 구오팡 탕,쑤원 예. Владелец: 셍기 테크놀로지 코. 엘티디.. Дата публикации: 2017-09-04.

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Номер патента: KR20170040184A. Автор: 마사시 야마다,유야 오키무라. Владелец: 도아고세이가부시키가이샤. Дата публикации: 2017-04-12.

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Номер патента: TW201623450A. Автор: Su-Wen Ye,guo-fang Tang. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2016-07-01.

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Номер патента: KR101887841B1. Автор: 구오팡 탕,쑤원 예. Владелец: 셍기 테크놀로지 코. 엘티디.. Дата публикации: 2018-08-10.

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Номер патента: TWI531617B. Автор: Su-Wen Ye,guo-fang Tang. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2016-05-01.

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Номер патента: US20230192972A1. Автор: Wei Liang,Qianfa Liu,Liangpeng HAO,Songgang Chai. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2023-06-22.

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Номер патента: US20170088669A1. Автор: Chen-Yu Hsieh,Tse-An Lee,Hui-Ting SHIH. Владелец: Elite Material Co Ltd. Дата публикации: 2017-03-30.

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Номер патента: US20190194408A1. Автор: Kuo-Chan Chiou,Feng-Po Tseng,Wen-Pin Ting. Владелец: ITEQ Corp. Дата публикации: 2019-06-27.

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Номер патента: US09850375B2. Автор: Yu-Te Lin,Ningning JIA,Wenjun Tian,Ziqian Ma,Rongtao WANG,Wenfeng LV. Владелец: Elite Electronic Material Kunshan Co Ltd. Дата публикации: 2017-12-26.

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Номер патента: US20140367149A1. Автор: Jun Young Kim. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2014-12-18.

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Номер патента: US20160338194A1. Автор: Lee Sang-Jae,HAN Youn-Gyu. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2016-11-17.

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Insulating adhesive composition for metal copper clad laminate, coating metal plate using the composition, and method for manufacturing the plate

Номер патента: KR101332507B1. Автор: 김동현,박경호,박찬섭,이배근,박종수,신태규,배대철,김중봉,한재만,조래홍,한상권. Владелец: 포스코강판 주식회사. Дата публикации: 2013-11-26.

Halogen-free resin composition and method for preparatioin of copper clad laminate with same

Номер патента: KR20140041861A. Автор: 위에샨 허. Владелец: 광둥 셍기 에스씨아이. 테크. 코. 엘티디.. Дата публикации: 2014-04-04.

Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the same

Номер патента: EP2657296A4. Автор: Yueshan He,Shiguo Su. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2014-08-27.

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Номер патента: US20220039256A1. Автор: ADAMCHUK Jennifer,Buss Gerard T.,Besozzi Theresa M.. Владелец: . Дата публикации: 2022-02-03.

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Номер патента: US20220267608A1. Автор: Yongjun Guo,Wenyan WEN,Xiaolong Qi,Yangjie ZHU. Владелец: Guangdong Hinno-Tech Co Ltd. Дата публикации: 2022-08-25.

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Номер патента: US20190194383A1. Автор: Chen-Hsi Cheng,Ming-Hung Huang. Владелец: ITEQ Corp. Дата публикации: 2019-06-27.

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Номер патента: US20190194408A1. Автор: CHIOU Kuo-Chan,TSENG Feng-Po,TING Wen-Pin. Владелец: . Дата публикации: 2019-06-27.

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Номер патента: US20180223093A1. Автор: Ying Xu,KeHong FANG. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2018-08-09.

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Номер патента: US20160243798A1. Автор: Chai Songgang. Владелец: . Дата публикации: 2016-08-25.

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Номер патента: US20170245364A1. Автор: Seung Woo Choi,Cheol Ho Kim,Young Do Kim,Ho Sub Kim,Sung Cheul Jeong. Владелец: Kia Motors Corp. Дата публикации: 2017-08-24.

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Номер патента: US20200263031A1. Автор: CHEN CHENG-CHUNG,LIAO Shih-Hao,YANG Min-Yuan,CHOU Ya-Yen,CIOU Jheng-Hong. Владелец: . Дата публикации: 2020-08-20.

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Номер патента: US20180273744A1. Автор: Lee Chien-Hsing,LEE Cheng-Chung,HUANG Jung-Hai,YANG Chun-Hsiung. Владелец: . Дата публикации: 2018-09-27.

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Номер патента: US20080241452A1. Автор: Shigehiro Hoshida,Kazunori Kondo,Tadashi Amano. Владелец: Shin Etsu Chemical Co Ltd. Дата публикации: 2008-10-02.

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Номер патента: KR100601091B1. Автор: 김성우,민현성,이용석,안현우,구은회. Владелец: 주식회사 엘지화학. Дата публикации: 2006-07-14.

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Номер патента: KR101849833B1. Автор: 시안핑 젱,나나 렌. Владелец: 셍기 테크놀로지 코. 엘티디.. Дата публикации: 2018-04-17.

Epoxy resin composition and copper clad laminate manufactured by using same

Номер патента: CN101942180A. Автор: 杨中强,柴颂刚,杜翠鸣. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2011-01-12.

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Номер патента: KR100705269B1. Автор: 구은회,정목용. Владелец: 주식회사 엘지화학. Дата публикации: 2007-04-12.

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Номер патента: KR20140086517A. Автор: 정현철,신상현,강준석,손장배,이광직,신혜숙. Владелец: 삼성전기주식회사. Дата публикации: 2014-07-08.

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Номер патента: WO2005108488A1. Автор: Sung-Woo Kim,Hyeon-Woo Ahn,Hyun-Sung Min,Yong-Seok Lee,Eun-Hae Koo. Владелец: LG CHEM, LTD.. Дата публикации: 2005-11-17.

Copper clad laminate, surface treated copper foil used for manufacturing the same, and printed wiring board manufactured using the same

Номер патента: TW201010539A. Автор: Shinichi Obata. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2010-03-01.

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Номер патента: US20180160529A1. Автор: Arai Hideta,Miki Atsushi,Fukuchi Ryo. Владелец: . Дата публикации: 2018-06-07.

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Номер патента: US20220087032A1. Автор: Okamoto Takeshi,KITAI YUKI. Владелец: . Дата публикации: 2022-03-17.

A copper foil with a carrier, a copper-clad laminate, with use of the copper foil, a printed wiring board with use of the copper foil, a printed circuit board with use of the copper foil, and manufacturing method of a printed wiring board

Номер патента: TWI564144B. Автор: 永浦友太,坂口和彦,森山晃正,古曳倫也. Владелец: Ｊｘ日鑛日石金屬股份有限公司. Дата публикации: 2017-01-01.

Copper foil for manufacturing printed wiring boards, copper foil with carriers and copper-clad laminates, and methods for manufacturing printed wiring boards using them.

Номер патента: JP6836580B2. Автор: 浩人 飯田,光由 松田,智一 金子,吉川　和広,和広 吉川,翼 加藤,哲聡 ▲高▼梨,金子　智一. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2021-03-03.

Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for maunfacturing printed wiring board

Номер патента: KR20140053797A. Автор: 미치야 고히키,도모타 나가우라,가즈히코 사카구치,데루마사 모리야마. Владелец: 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤. Дата публикации: 2014-05-08.

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Номер патента: US20210337664A1. Автор: Miki Atsushi,Miyamoto Nobuaki. Владелец: . Дата публикации: 2021-10-28.

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Номер патента: US20210360785A1. Автор: Miki Atsushi,Miyamoto Nobuaki. Владелец: . Дата публикации: 2021-11-18.

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Номер патента: CN103796422B. Автор: 古曳伦也,永浦友太,坂口和彦,森山晃正. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2017-04-12.

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Номер патента: JP5393903B1. Автор: 和彦 坂口. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2014-01-22.

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Номер патента: JP3184485B2. Автор: 哲朗 佐藤,務 浅井. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2001-07-09.

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Номер патента: US20020182398A1. Автор: Yoshinari Matsuda,Tomohide Koguchi. Владелец: Sony Corp. Дата публикации: 2002-12-05.

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Номер патента: KR102021175B1. Автор: 가즈키 감무리,가즈타카 아오시마,다츠야 야마지. Владелец: 제이엑스금속주식회사. Дата публикации: 2019-09-11.

Copper-clad laminate with copper-plated circuit layer and method for producing printed wiring board using copper-clad laminate with copper-plated circuit layer

Номер патента: JP4683769B2. Автор: 拓也 山本,隆 障子口. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2011-05-18.

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Номер патента: KR102531073B1. Автор: 요시노리 시미즈,다이스케 나카지마,가즈히로 요시카와,도루 하나다. Владелец: 미쓰이금속광업주식회사. Дата публикации: 2023-05-09.

Copper foil for high-frequency circuit, copper-clad laminate sheet, and printed-wiring board

Номер патента: WO2017026490A1. Автор: 裕子 奥野,健作 篠崎,岳夫 宇野. Владелец: 古河電気工業株式会社. Дата публикации: 2017-02-16.

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Номер патента: KR20170131832A. Автор: 요시노리 시미즈,다이스케 나카지마,가즈히로 요시카와,도루 하나다. Владелец: 미쓰이금속광업주식회사. Дата публикации: 2017-11-30.

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Номер патента: TWI598474B. Автор: Yuko Okuno,Takeo Uno,Kensaku Shinozaki. Владелец: Furukawa Electric Co Ltd. Дата публикации: 2017-09-11.

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Номер патента: US09615445B2. Автор: Ming-Jaan Ho,Fu-Yun Shen,Xian-qin HU,yi-qiang Zhuang. Владелец: Garuda Technology Co Ltd. Дата публикации: 2017-04-04.

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Номер патента: US20150245477A1. Автор: Arai Hideta,Miki Atsushi,Arai Kohsuke,Nakamuro Kaichiro. Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2015-08-27.

Copper-clad laminate, printed-wiring boards, multilayer printed-wiring boards, and method for manufacturing the same

Номер патента: KR100963180B1. Автор: 고이치 시마우치,히로후미 이토,이정창. Владелец: 듀폰-미쯔이 플루오로케미칼 가부시끼가이샤. Дата публикации: 2010-06-14.

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Номер патента: CN110561857A. Автор: 王宏远,王和志. Владелец: Ruisheng Technology Nanjing Co Ltd. Дата публикации: 2019-12-13.

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Номер патента: US20180160536A1. Автор: HOSOI Toshihiro,MATSUSHIMA Toshifumi,KUWAKO Fujio. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2018-06-07.

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Номер патента: US20160330839A1. Автор: HOSOI Toshihiro,MATSUSHIMA Toshifumi,KUWAKO Fujio. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2016-11-10.

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Номер патента: JP5254491B2. Автор: 雅史 石井,晃正 森山. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-08-07.

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Номер патента: US11979982B2. Автор: Keiichiro Yamamoto,Kazuo Tani,Masaharu Yano. Владелец: Tanazawa Hakkosha Co Ltd. Дата публикации: 2024-05-07.

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Номер патента: US20150044492A1. Автор: Yoshikawa Kazuhiro. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2015-02-12.

Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer

Номер патента: EP2398304A2. Автор: Takuya Yamamoto,T. Syoujiguchi. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2011-12-21.

Copper plated circuit layer-carring copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer-carring copper clad laminated sheet

Номер патента: KR100866440B1. Автор: 야마모토타쿠야,쇼우지구치타카시. Владелец: 미쓰이 긴조꾸 고교 가부시키가이샤. Дата публикации: 2008-10-31.

Embedded circuit board and manufacturing method thereof

Номер патента: US8552302B2. Автор: Kyung-Wan Park,Shi-yun Cho,Ho-Seong Seo,Byung-Jik Kim,Ji-Hyun Jung,Yu-Su Kim,Youn-Ho Choi,Seok-Myong Kang. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2013-10-08.

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Номер патента: CN108702847A. Автор: 松田光由,吉川和广,饭田浩人,高梨哲聪,金子智,加藤翼,金子智一. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2018-10-23.

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Номер патента: TW200401850A. Автор: MAKOTO Dobashi,Osamu Nakano,Akiko Sugimoto,Junshi Yoshioka,Kenjirou Izutani,Youzo Itagaki. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2004-02-01.

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Номер патента: US20160360624A1. Автор: HOSOI Toshihiro,Tateoka Ayumu,MATSUSHIMA Toshifumi,KUWAKO Fujio. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2016-12-08.

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Номер патента: JP6825368B2. Автор: 崇司 田崎,淳 塩谷,山口　貴史,貴史 山口,啓輔 ▲杉▼本,太陽 中村. Владелец: Arakawa Chemical Industries Ltd. Дата публикации: 2021-02-03.

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Номер патента: KR20170082130A. Автор: 아츠시 시오타니,다카시 야마구치,게이스케 스기모토,다이요 나카무라,다카시 다사키. Владелец: 아라까와 가가꾸 고교 가부시끼가이샤. Дата публикации: 2017-07-13.

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Номер патента: TW201733797A. Автор: Tatsuya Yamaji,Kazuki Kammuri,Kazutaka AOSHIMA. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2017-10-01.

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Номер патента: KR20140023744A. Автор: 김상범,김동우,양창열,류종호. Владелец: 일진머티리얼즈 주식회사. Дата публикации: 2014-02-27.

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Номер патента: CN113099605B. Автор: 张可,高强,蒋卫平,苏陟,张美娟,朱开辉,朱宇华. Владелец: Guangzhou Fangbang Electronics Co Ltd. Дата публикации: 2022-07-12.

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Номер патента: US20180103540A1. Автор: Watanabe Masahiro,TAJIMA Hiroshi,HARUNA Yuusuke,KOBAYASHI YUKARI,SEKIGUCHI Kiyoharu,HOSOYA Yoshihiro. Владелец: . Дата публикации: 2018-04-12.

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Номер патента: KR101391811B1. Автор: 김상범,김동우,양창열,류종호. Владелец: 일진머티리얼즈 주식회사. Дата публикации: 2014-05-07.

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Номер патента: US20180124925A1. Автор: Ueda Hiroshi,HASHIZUME Kayo,OKA Yoshio,KASUGA Takashi,PARK Jinjoo. Владелец: . Дата публикации: 2018-05-03.

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Номер патента: US20170127516A1. Автор: Ueda Hiroshi,MIURA Kousuke,OKA Yoshio,KASUGA Takashi,PARK Jinjoo,UEHARA Sumito,NAKAYAMA Shigeyoshi. Владелец: . Дата публикации: 2017-05-04.

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Номер патента: US20180242450A1. Автор: Nakabayashi Makoto,OKA Yoshio,UCHITA Yoshifumi,KIYA Satoshi,YAMANAKA Yuichiro. Владелец: . Дата публикации: 2018-08-23.

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Номер патента: KR102432584B1. Автор: 김대영,김승민,이정길. Владелец: 에스케이넥실리스 주식회사. Дата публикации: 2022-08-12.

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Номер патента: CN107278015B. Автор: 冠和树,山路达也,青岛一贵. Владелец: Zhi Zhuan Corp. Дата публикации: 2019-10-18.

Laminate board containing uniformly distributed filler particles and method for producing the same

Номер патента: US4798762A. Автор: Reisuke Okada,Hisami Fujino. Владелец: TORAY INDUSTRIES INC. Дата публикации: 1989-01-17.

MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE

Номер патента: US20200404784A1. Автор: SUNG Yun-Hsing,HSU HUNG-WEI,KAO CHUN-YU,LEE SHIH-SHEN. Владелец: . Дата публикации: 2020-12-24.

Method of winding up copper foil or copper-clad laminate

Номер патента: EP2366469A1. Автор: Mikio Hanafusa. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2011-09-21.

Method for producing flexible copper-clad laminated substrate and multi-layer laminate

Номер патента: KR101245791B1. Автор: 유지 마츠시타,마코토 우에노,타에코 타카라베. Владелец: 신닛테츠 수미킨 가가쿠 가부시키가이샤. Дата публикации: 2013-03-20.

Method for producing copper-clad laminated board

Номер патента: KR0172456B1. Автор: 기미가쥬 가토,게이지 마주마,료이치 오구로. Владелец: 후루카와 서키트 호일 가부시끼가이샤. Дата публикации: 1999-03-20.

Metal foil, copper-clad laminate, wiring board, semiconductor, negative electrode material, and battery

Номер патента: CN114603945B. Автор: 苏陟,姚向荣,曾雪淇. Владелец: Guangzhou Fangbang Electronics Co Ltd. Дата публикации: 2023-03-21.

Laminate for Copper Clad Laminate, Manufacturing Method Thereof and Method for Preparing Fine Pitch Circuit Pattern

Номер патента: KR20230039556A. Автор: 김태수,이수연,최영민,정성묵,황정희. Владелец: 한국화학연구원. Дата публикации: 2023-03-21.

Copper-Clad Laminate, Printed Circuit Board and Method for Manufacturing Printed Circuit Board

Номер патента: US20210059048A1. Автор: Wang Hezhi,WANG Hongyuan. Владелец: . Дата публикации: 2021-02-25.

POLYIMIDE, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEXIBLE PRINTED CIRCUIT BOARD

Номер патента: US20140158410A1. Автор: HO MING-JAAN. Владелец: ZHEN DING TECHNOLOGY CO., LTD.. Дата публикации: 2014-06-12.

CIRCUIT BOARD HAVING COPPER CLAD LAMINATE LAMINATED ON CORE LAYER, AND ELECTRONIC DEVICE COMPRISING SAME

Номер патента: US20210168934A1. Автор: HONG Eunseok,LEE Youngsun,Kim Byeongkeol,Jeon Jongmin. Владелец: . Дата публикации: 2021-06-03.

Copper clad laminate, printed circuit board and method for manufacturing of the same

Номер патента: KR101494090B1. Автор: 고태호,이창재,안석준,강준호. Владелец: 삼성전기주식회사. Дата публикации: 2015-02-16.

Glass fabric material/thermosetting resin copper-clad laminate having a high-elasticity

Номер патента: EP1073320B1. Автор: Morio Mitsubishi Gas Chemical Co. Inc Gaku,Hidenori Mitsubishi Gas Chemical Co. Inc Kimbara,Nobuyuki Mitsubishi Gas Chemic. Co. Inc Ikeguchi,Masakazu Mitsubishi Gas Chemical. Co. Inc Motegi. Владелец: Mitsubishi Gas Chemical Co Inc. Дата публикации: 2016-12-14.

Manufacturing of copper/clad laminates

Номер патента: JPS52133391A. Автор: Yasuo Azumabayashi,Yoshiharu Kasai. Владелец: Matsushita Electric Works Ltd. Дата публикации: 1977-11-08.

Copper clad laminate, printed circuit board, and method of manufacturing the same

Номер патента: US20150021084A1. Автор: Chang Jae Lee,Tae Ho Ko,Jun Ho Kang,Seok Jun Ahn. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2015-01-22.

COPPER-CLAD LAMINATE. METHOD FOR MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD INCLUDING THE SAME

Номер патента: US20140127483A1. Автор: Yoo Seong Hyun,Moon Jin Seok,Lee Sa Yong. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2014-05-08.

PREPREG, METHOD FOR MANUFACTURING THE SAME, AND COPPER CLAD LAMINATE USING THE SAME

Номер патента: US20140187112A1. Автор: Kang Joon Seok,Jung Hyun Chul,Lee Kwang Jik,SHIN Sang Hyun,Son Jang Bae,Shin Hye Sook. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2014-07-03.

COPPER CLAD LAMINATE AND METHOD FOR MANUFACTURING THE SAME

Номер патента: US20150230335A1. Автор: Lee Kwang Jik,Shin Hye Suk,Ogura Ichiro,KIM Jin Gu,Yoo Myung Jae. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2015-08-13.

Multiple copper clad laminate, method for manufacturing the same and method for manufacturing printed circuit board using the same

Номер патента: KR101218356B1. Автор: 이민우. Владелец: 삼성테크윈 주식회사. Дата публикации: 2013-01-03.

Apparatus and method for manufacturing copper clad laminate with improved peel strength

Номер патента: TW200621468A. Автор: Joon-Sik Shin,Sang-Youp Lee,Hyung-Wook Park,Geum-Hee Yun. Владелец: Samsung Electro Mech. Дата публикации: 2006-07-01.

Copper clad laminates and method for manufacturing a printed circuit board using the same

Номер патента: US10952329B2. Автор: Sang-Jae Lee,Youn-Gyu HAN. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2021-03-16.

Apparatus and method for manufacturing copper clad laminate with improved peel strength

Номер патента: US20060124228A1. Автор: Sang Lee,Hyung Park,Joon Shin,Geum Yun. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2006-06-15.

Copper-clad laminated board and its manufacturing method

Номер патента: CN108698375A. Автор: 祝迫恭,折田昴优,大神裕之,上野祐贡,古川幸太郎. Владелец: Nippon Tungsten Co Ltd. Дата публикации: 2018-10-23.

Method for manufacturing double-sided copper-clad laminated plate, and one set of copper or copper alloy foil used for the same

Номер патента: TW201132494A. Автор: Toshiyuki Ono. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2011-10-01.

HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME

Номер патента: US20140023839A1. Автор: LIN Yu-Te,YU Li-Chih,WANG RONG-TAO,CHOU LI-MING. Владелец: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. Дата публикации: 2014-01-23.

PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

Номер патента: US20140060899A1. Автор: Sohn Keung Jin,Park Jung Hwan,Chang Tae Eun. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2014-03-06.

EPOXY RESIN COMPOSITION, AND PREPREG AND COPPER CLAD LAMINATE MADE THEREFROM

Номер патента: US20140072818A1. Автор: ZENG Xian-Ping,REN Na-Na,ZHOU Biao. Владелец: GUANGDONG SHENGYI SCI.TECH CO., LTD. Дата публикации: 2014-03-13.

LOW-DIELECTRIC RESIN COMPOSITION AND COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING THE SAME

Номер патента: US20150044485A1. Автор: WANG Rongtao,HSIEH Chen Yu,TIAN Wenjun,MA Ziqian,LV Wenfeng. Владелец: Elite Electronic Material (kunShan) Co., Ltd.. Дата публикации: 2015-02-12.

LOWDIELECTRIC RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME

Номер патента: US20140174802A1. Автор: Chen Yi-Jen,LEE Tse-An,TIAN Wenjun,MA Ziqian,WANG RONG-TAO,LU WENFENG. Владелец: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. Дата публикации: 2014-06-26.

HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME

Номер патента: US20140178697A1. Автор: YU Li-Chih,LI CHANG-YUAN,PENG HONG-XIA. Владелец: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD. Дата публикации: 2014-06-26.

COPPER-CLAD LAMINATE

Номер патента: US20210101366A1. Автор: Nagata Junichi,TANBA Hironori. Владелец: SUMITOMO METAL MINING CO., LTD.. Дата публикации: 2021-04-08.

Core material manufacturing method and copper-clad laminate manufacturing method

Номер патента: US20200146153A1. Автор: Katsuhiko Suzuki. Владелец: Disco Corp. Дата публикации: 2020-05-07.

EPOXY RESIN COMPOSITION, AND, PREPREG AND COPPER CLAD LAMINATE MANUFACTURED USING THE COMPOSITION

Номер патента: US20150189745A1. Автор: Zeng Xianping,REN Nana. Владелец: . Дата публикации: 2015-07-02.

COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Номер патента: US20150206852A1. Автор: Lin Tzu-Chih,Liao Chien-Ko. Владелец: LINGSEN PRECISION INDUSTRIES, LTD.. Дата публикации: 2015-07-23.

FLUORINE-CONTAINING SUBSTRATE, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

Номер патента: US20200389974A1. Автор: Chang Hung-Yi,CHANG Chih-Kai,LIAO Te-Chao,CHEN HAO-SHENG. Владелец: . Дата публикации: 2020-12-10.

Copper clad laminate and printed circuit board

Номер патента: TWI716524B. Автор: 田崎崇司,塩谷淳,山口貴史,杦本啓輔,中村太陽. Владелец: 日商荒川化學工業股份有限公司. Дата публикации: 2021-01-21.

Manufacturing apparatus of copper clad laminates improved peel strength and method thereof

Номер патента: KR100688824B1. Автор: 이상엽,윤금희,신준식,박형욱. Владелец: 삼성전기주식회사. Дата публикации: 2007-03-02.

Copper clad laminate

Номер патента: KR100965441B1. Автор: 고지 나루이,마사후미 하시모토,다쿠로 고치야마. Владелец: 우베 고산 가부시키가이샤. Дата публикации: 2010-06-24.

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

Номер патента: KR100630487B1. Автор: 요시히로 가또,야스오 다나까,모리오 가꾸,노부유끼 이께구찌. Владелец: 미쯔비시 가스 케미칼 컴파니, 인코포레이티드. Дата публикации: 2006-10-04.

Surface-treated copper foil, method for producing same, and negative electrode for secondary battery including same

Номер патента: US20220399547A1. Автор: Ki Deok Song,Young Ho Ryu,Hyung Cheol Kim,Jung Woo Seo,Eun Sil Choi,Won Jin Beom,Chang Yol Yang,Sang Hwa Yoon. Владелец: Iljin Materials Co Ltd. Дата публикации: 2022-12-15.

Surface-treated copper foil

Номер патента: US09647272B1. Автор: Yao-Sheng LAI,Kuei-Sen Cheng,Huei-Fang Huang,Hsi-Hsing LO. Владелец: Chang Chun Petrochemical Co Ltd. Дата публикации: 2017-05-09.

Novel aryl ester compound, its production process , epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition

Номер патента: US20020010288A1. Автор: Yasuhiro Endo,Mitsuhiro Shibata,Kaori Yamasaki,Youichi Ueda. Владелец: Individual. Дата публикации: 2002-01-24.

Method for measuring surface parameter of copper foil, method for sorting copper foil, and method for producing surfacetreated copper foil

Номер патента: US20240328779A1. Автор: Takeshi Iwase,Hiroaki Kurihara. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2024-10-03.

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Номер патента: US20180288867A1. Автор: Fukuchi Ryo. Владелец: . Дата публикации: 2018-10-04.

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD USING SAME

Номер патента: US20200029444A1. Автор: Uno Takeo,TSURUTA Takahiro,OKUNO Yuko,FUKUTAKE Sunao,NISHI Yoshimasa. Владелец: . Дата публикации: 2020-01-23.

Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same

Номер патента: CN1346309A. Автор: 苅谷隆. Владелец: Ibiden Co Ltd. Дата публикации: 2002-04-24.

Multi layer circuit board and manufacturing method of the same

Номер патента: WO2010030059A1. Автор: Seung Min Hong,Jeong Don Kwon,Ju Ho Shin. Владелец: Doosan Corporation. Дата публикации: 2010-03-18.

Printed wiring board manufacturing method and printed wiring board obtained by using the printed wiring board manufacturing method

Номер патента: JPWO2012046841A1. Автор: 吉川　和広,和広 吉川. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2014-02-24.

Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used For Said Laminate

Номер патента: US20140093743A1. Автор: Arai Hideta,Miki Atsushi,Kaminaga Kengo,Fukuchi Ryo. Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2014-04-03.

Printed wiring board manufacturing method and printed wiring board

Номер патента: JP5580135B2. Автор: 浩人 飯田. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2014-08-27.

Printed wiring board manufacturing method and printed wiring board

Номер патента: JPWO2010038559A1. Автор: 俊樹 古谷,剛士 古澤. Владелец: Ibiden Co Ltd. Дата публикации: 2012-03-01.

Printed wiring board, electronic device, and printed wiring board manufacturing method

Номер патента: EP2395821B1. Автор: Yasuji Hiramatsu,Tetsuya Muraki,Yuki Terada. Владелец: Ibiden Co Ltd. Дата публикации: 2015-08-05.

Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same

Номер патента: KR100635897B1. Автор: 아라따미찌또시,다까노노조무,고바야시가즈히또. Владелец: 히다찌 가세이 고오교 가부시끼가이샤. Дата публикации: 2006-10-18.

Flexible circuit board and foldable electronic device comprising same

Номер патента: US20240073307A1. Автор: Younghun SEONG,Kiman Kim,Bumhee BAE,Jeongnam CHEON,Junggil KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-02-29.

PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD

Номер патента: US20160143133A1. Автор: Miyake Hiroyuki,SEKIGUCHI Kiyoshi,Murai Yusuke. Владелец: . Дата публикации: 2016-05-19.

System and method for electrical circuit monitoring

Номер патента: US20200264226A1. Автор: Michael L. Bixenman,David T. LOBER,Mark Taylor MCMEEN,Jason Edward TYNES. Владелец: Kyzen Corp. Дата публикации: 2020-08-20.

Printed Circuit Board, Method For Manufacturing The Same And Electronic Device

Номер патента: US20190254156A1. Автор: Xudong Chen,Hua Miao,Zhanhao Xie,Chuanzhi Li. Владелец: Shennan Circuit Co Ltd. Дата публикации: 2019-08-15.

ADHESIVELESS COPPER CLAD LAMINATES AND PRINTED CIRCUIT BOARD HAVING ADHESIVELESS COPPER CLAD LAMINATES AS BASE MATERIAL

Номер патента: US20140102773A1. Автор: Nagata Junichi. Владелец: SUMITOMO METAL MINING CO., LTD.. Дата публикации: 2014-04-17.

Metal foil, copper-clad laminated board, circuit board and manufacturing method for circuit board

Номер патента: WO2023016060A1. Автор: 苏陟. Владелец: 广州方邦电子股份有限公司. Дата публикации: 2023-02-16.

Copper-clad laminate manufacture method and printed circuit board using copper-clad laminate

Номер патента: KR20130056928A. Автор: 이남철. Владелец: 주식회사 써피스텍. Дата публикации: 2013-05-31.

Flexible circuit board and foldable electronic device comprising same

Номер патента: EP4319505A1. Автор: Younghun SEONG,Kiman Kim,Bumhee BAE,Jeongnam CHEON,Junggil KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-02-07.

Method of manufacturing printed circuit board, and printed circuit board obtained using method of manufacturing printed circuit board

Номер патента: KR101553635B1. Автор: 카즈히로 요시카와. Владелец: 미쓰이금속광업주식회사. Дата публикации: 2015-09-16.

Metal foil, copper-clad laminated board, circuit board and preparation method of circuit board

Номер патента: CN113811093A. Автор: 苏陟. Владелец: Guangzhou Fangbang Electronics Co Ltd. Дата публикации: 2021-12-17.

Device and method for labeling copper-clad laminates

Номер патента: DE10026499A1. Автор: Cristoph Kenn,Theo Schumacher. Владелец: Isola AG. Дата публикации: 2001-12-06.

Device and method for making copper-clad laminates

Номер патента: US20010047985A1. Автор: Theo Schumacher,Dipl.-Ing. Christoph Kenn. Владелец: Isola AG. Дата публикации: 2001-12-06.

Method for continuously producing flexible copper clad laminates

Номер патента: US09587318B2. Автор: Xinlin Xie,Nianqun Yang. Владелец: Richview Electronics Co Ltd. Дата публикации: 2017-03-07.

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Номер патента: US20160157356A1. Автор: Kohiki Michiya. Владелец: . Дата публикации: 2016-06-02.

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Номер патента: US20160183380A1. Автор: Miyamoto Nobuaki,Ishii Masafumi,Honda Misato. Владелец: . Дата публикации: 2016-06-23.

Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus

Номер патента: US20180255646A1. Автор: Moriyama Terumasa. Владелец: . Дата публикации: 2018-09-06.

METHOD AND REAGENT FOR TREATING BARE COPPER WIRE AND SURFACE-TREATED COPPER WIRE

Номер патента: US20180142358A1. Автор: Zhang Peng. Владелец: SAMSUNG ELECTRONICS CO., LTD.. Дата публикации: 2018-05-24.

Copper-Clad Laminate and Method for Manufacturing Same

Номер патента: US20130252019A1. Автор: Sakaguchi Kazuhiko,Inazumi Hajime,Yachi Hisakazu. Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2013-09-26.

Copper-clad laminate and method for manufacturing same

Номер патента: CN103221213A. Автор: 坂口和彦,稻住肇,谷地久和. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-07-24.

Antibacterial surface treated copper material and a method for preparing the same

Номер патента: US11672253B2. Автор: Chang Yeol Yoo,Jaesun Lim. Владелец: Kia Corp. Дата публикации: 2023-06-13.

Antibacterial surface treated copper material and a method for preparing the same

Номер патента: US20220167624A1. Автор: Chang Yeol Yoo,Jaesun Lim. Владелец: Kia Corp. Дата публикации: 2022-06-02.

Manufacturing method of printed wiring board and a laminate jointing apparatus

Номер патента: US20120199291A1. Автор: Hideya Kawada. Владелец: Ibiden Co Ltd. Дата публикации: 2012-08-09.

Electrodeposited copper foil with carrier foil on which a resin layer for forming insulating layer is formed, copper-clad laminate, printed wiring board, method for manufacturing multilayer copper-clad laminate, and method for manufacturing printed wiring board

Номер патента: US7883783B2. Автор: Seiji Nagatani. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2011-02-08.

Electrodeposited Copper Foil with Carrier Foil on which a Resin Layer for Forming Insulating Layer is Formed, Copper-Clad Laminate, Printed Wiring Board, Method for Manufacturing Multilayer Copper-Clad Laminate, and Method for Manufacturing Printed Wiring Board

Номер патента: US20070207337A1. Автор: Seiji Nagatani. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2007-09-06.

Manufacturing method of printed wiring board and a laminate Jointing apparatus

Номер патента: US20080223502A1. Автор: Hideya Kawada. Владелец: Ibiden Co Ltd. Дата публикации: 2008-09-18.

METHOD FOR SURFACE-TREATING COPPER FOIL AND COPPER FOIL SURFACE-TREATED THEREBY

Номер патента: US20150245502A1. Автор: Moon Hong Gi. Владелец: Doosan Corporation. Дата публикации: 2015-08-27.

High density package substrate and method for fabricating the same

Номер патента: US20090283315A1. Автор: Meng-Han Lee,Wei-Wen Lan,Shi-Shyan James SHANG,Ching-Ming Chuang. Владелец: Nan Ya Printed Circuit Board Corp. Дата публикации: 2009-11-19.

Method of manufacturing a printed wiring board

Номер патента: GB2263818A. Автор: Yasuaki Otani,Fusao Birukawa,Tatero Takai. Владелец: Nippon CMK Corp. Дата публикации: 1993-08-04.

Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board, and method for manufacturing multilayer printed wiring board

Номер патента: JP4075673B2. Автор: 大介 金谷,修二 前田,太郎 福井. Владелец: Matsushita Electric Works Ltd. Дата публикации: 2008-04-16.

System and method for manufacturing copper clad glass epoxy laminates

Номер патента: US5160567A. Автор: Jiri D. Konicek,Robert P. Smith,Jerry C. Zeroth. Владелец: AlliedSignal Inc. Дата публикации: 1992-11-03.

Method of manufacturing printed wiring board

Номер патента: US5277787A. Автор: Yasuaki Otani,Fusao Birukawa,Tatero Takai. Владелец: Nippon CMK Corp. Дата публикации: 1994-01-11.

Roughening copper foil, copper clad laminate and printed wiring board

Номер патента: JP5901848B2. Автор: 裕昭 津吉,眞 細川. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2016-04-13.

Roughening treatment copper foil, copper clad laminate and printed wiring board

Номер патента: CN105934307B. Автор: 津吉裕昭,细川真. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2018-04-27.

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Номер патента: JPWO2015111756A1. Автор: 裕昭 津吉,眞 細川. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2017-03-23.

Roughened copper foil, copper-clad laminate, and printed wiring board

Номер патента: KR101734795B1. Автор: 히로아키 츠요시,마코토 호소카와. Владелец: 미쓰이금속광업주식회사. Дата публикации: 2017-05-11.

Composite foil with resin, method for producing the same, multilayer copper-clad laminate using the composite foil, and method for producing multilayer printed wiring board

Номер патента: JP3612594B2. Автор: 藤 哲 朗 佐,井 務 浅,切 健一郎 岩. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2005-01-19.

Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer

Номер патента: US6986937B2. Автор: Kazuhiro Yamazaki,Takashi Syoujiguchi. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2006-01-17.

Method for manufacturing capacitor embedded in PCB

Номер патента: US7736397B2. Автор: Yul Kyo Chung,Hyun Ju Jin,Hyung Dong Kang,Seung Eun Lee. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2010-06-15.

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Номер патента: KR950007618A. Автор: 무네오 사이다,유타카 히라자와,카쯔히로 요시무라. Владелец: 카와키타 토오루. Дата публикации: 1995-03-21.

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Номер патента: TW200708222A. Автор: Haruo Akahoshi,Kunio Arai,Toshinori Kawamura. Владелец: Hitachi Via Mechanics Ltd. Дата публикации: 2007-02-16.

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Номер патента: JP4133560B2. Автор: 健司 寺田,孝一 大隅,貢市 山崎. Владелец: International Business Machines Corp. Дата публикации: 2008-08-13.

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Номер патента: WO2009084533A1. Автор: Tetsuro Sato,Toshifumi Matsushima. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2009-07-09.

Power/ground core for printed circuit boards, printed circuit board and method for producing these boards

Номер патента: HU225075B1. Автор: Robert Japp. Владелец: Ibm. Дата публикации: 2006-06-28.

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Номер патента: US20200029442A1. Автор: UCHIDA Kazumichi. Владелец: KYOCERA CORPORATION. Дата публикации: 2020-01-23.

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Номер патента: JPH10158614A. Автор: Yoshiyuki Narabe,Masabumi Yano,正文 矢野,嘉行 奈良部. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 1998-06-16.

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Номер патента: JP2718844B2. Автор: 嘉行 奈良部,光雄 横田,成史 白石. Владелец: Hitachi Kasei Polymer Co Ltd. Дата публикации: 1998-02-25.

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Номер патента: JPWO2007010758A1. Автор: 秀樹 東谷,東谷　秀樹. Владелец: Panasonic Corp. Дата публикации: 2009-01-29.

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Номер патента: KR900005082B1. Автор: 다쓰오 와다,게이조오 야마시다,다스구 도오야마,데루아끼 야마모도. Владелец: 나야 유이찌로오. Дата публикации: 1990-07-19.

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Номер патента: EP0996318A3. Автор: Takuya Yamamoto,Yutaka Hirasawa,Takashi Kataoka,Tsutomu Higuchi,Kenichiro Iwakiri. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2002-02-20.

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Номер патента: KR101994716B1. Автор: 조혜진,윤효진,함석진,전지은. Владелец: 삼성전기주식회사. Дата публикации: 2019-07-01.

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Номер патента: TWI366513B. Автор: Koichi Hattori,Ryuzo Shinta,Yasufumi Matsumura. Владелец: Nippon Steel Chemical Co. Дата публикации: 2012-06-21.

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Номер патента: FR2636491A1. Автор: Serge Bourdonnais. Владелец: Alcatel Radiotelephone SA. Дата публикации: 1990-03-16.

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Номер патента: FR2636491B1. Автор: Serge Bourdonnais. Владелец: Alcatel Radiotelephone SA. Дата публикации: 1995-07-21.

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Номер патента: JPH10275834A. Автор: Hiroshi Hatano,拓 波多野,Shoji Kigoshi,将次 木越,Yukitsuna Konishi,幸綱 小西. Владелец: TORAY INDUSTRIES INC. Дата публикации: 1998-10-13.

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Номер патента: KR101312029B1. Автор: 최봉윤. Владелец: 주식회사 디에이피. Дата публикации: 2013-09-27.

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Номер патента: TW577096B. Автор: Kazuhiro Yamazaki,Fujio Kuwako,Toshifumi Matsushima. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2004-02-21.

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Номер патента: US20030102077A1. Автор: Chien-Hsin Ko. Владелец: Pioneer Technology Engineering Co Ltd. Дата публикации: 2003-06-05.

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Номер патента: JPH0639155B2. Автор: 辰男 和田,輝昭 山本,慶蔵 山下,輔 遠山. Владелец: 名幸電子工業株式会社. Дата публикации: 1994-05-25.

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Номер патента: US20160167342A1. Автор: Yun Ho Cho,Seok Won Kang,Jung Cheol Kim,Moon Soo Cho. Владелец: Individual. Дата публикации: 2016-06-16.

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Номер патента: KR100578989B1. Автор: 쿠와코후지오,야마자끼카즈히로,마쯔시마토시후미. Владелец: 미쓰이 긴조꾸 고교 가부시키가이샤. Дата публикации: 2006-05-12.

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Номер патента: KR101188025B1. Автор: 조문수,김정철,조연호,강석원. Владелец: 조연호. Дата публикации: 2012-10-08.

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Номер патента: KR20200025801A. Автор: 이용호,이병국,이정덕,정경철,정우득. Владелец: 도레이첨단소재 주식회사. Дата публикации: 2020-03-10.

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Номер патента: US20180226655A1. Автор: Atsushi Miki,Hideta Arai. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2018-08-09.

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Номер патента: US20240052513A1. Автор: Shih-Ching Lin. Владелец: DuPont Electronics Inc. Дата публикации: 2024-02-15.

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Номер патента: JP7193915B2. Автор: 英太 新井,敦史 三木. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2022-12-21.

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Номер патента: TWI751024B. Автор: 周瑞昌,賴耀生,鄭桂森. Владелец: 長春石油化學股份有限公司. Дата публикации: 2021-12-21.

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Номер патента: US20220055344A1. Автор: Kitahara Daisuke. Владелец: SUMITOMO BAKELITE CO., LTD.. Дата публикации: 2022-02-24.

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Номер патента: US20150240055A1. Автор: Zeng Xianping,REN Nana. Владелец: SHENGYI TECHNOLOGY CO., LTD.. Дата публикации: 2015-08-27.

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Номер патента: US12012660B2. Автор: Zhiqiang Zhang,Zhigang Yang,Honglin SONG,Nianqun Yang. Владелец: Richview Electronics Co Ltd. Дата публикации: 2024-06-18.

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Номер патента: MY174169A. Автор: Yasuhiro Shibata,Koichi Miyake,Hiroaki Nakahara,Sakiko Tomonaga,Kazutaka Hozumi. Владелец: Mitsui Mining & Smelting Co Ltd. Дата публикации: 2020-03-12.

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Номер патента: RU2256671C2. Автор: Жиль ЕЙЗЕЛЬ,Дени ЕЖЕН,Жиль КАТРЕН. Владелец: Сикпа Холдинг С.А.. Дата публикации: 2005-07-20.

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Номер патента: KR101465674B1. Автор: 씬린 씨에,니안쿤 양. Владелец: 주하이 리치뷰 일렉트로닉스 컴퍼니 리미티드. Дата публикации: 2014-11-27.

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Номер патента: WO2012040993A1. Автор: 谢新林,杨念群. Владелец: 富景资本有限公司. Дата публикации: 2012-04-05.

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Номер патента: JPWO2011078077A1. Автор: 敦史 三木. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-05-09.

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Номер патента: WO2012128098A1. Автор: 嘉一郎 中室,達也 山路. Владелец: Jx日鉱日石金属株式会社. Дата публикации: 2012-09-27.

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Номер патента: US20140017513A1. Автор: Inazumi Hajime,Sasaki Shinichi. Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2014-01-16.

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Номер патента: TWI545231B. Автор: 陳智,呂佳凌. Владелец: 國立交通大學. Дата публикации: 2016-08-11.

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Номер патента: JP5385625B2. Автор: 晃宜 大野,誠 高徳,実香 濱田. Владелец: JCU Corp. Дата публикации: 2014-01-08.

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Номер патента: US20130228468A1. Автор: Xie Xinlin,Yang Nianqun. Владелец: ZHUHAI RICHVIEW ELECTRONICS CO., LTD.. Дата публикации: 2013-09-05.

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Номер патента: JP3856414B2. Автор: 慎司 菅,一美 田中. Владелец: Victor Company of Japan Ltd. Дата публикации: 2006-12-13.

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Номер патента: US09905529B2. Автор: Yoshihiro Ono,Kenji Sakata,Tsuyoshi Kida. Владелец: Renesas Electronics Corp. Дата публикации: 2018-02-27.

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Номер патента: WO2014163427A1. Автор: 김성문,이항석,한덕상,박일근,문성준. Владелец: 주식회사 두산. Дата публикации: 2014-10-09.

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Номер патента: CN108203497B. Автор: 吴建,福田晋一朗,山本修一,许红金. Владелец: Taiyo Ink Suzhou Co Ltd. Дата публикации: 2021-04-13.

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Номер патента: CN116515107A. Автор: 廖德超,张宏毅,刘家霖,黄威儒,魏千凯. Владелец: Nan Ya Plastics Corp. Дата публикации: 2023-08-01.

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Номер патента: TW201124269A. Автор: Kaichiro Nakamuro. Владелец: Jx Nippon Mining & Metals Corp. Дата публикации: 2011-07-16.

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Номер патента: US20170327476A1. Автор: Sang Hun Park,Ki Hyun Park,Do Kyung SUNG,Hee Jin Cho. Владелец: KOLON INDUSTRIES INC. Дата публикации: 2017-11-16.

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Номер патента: RU2764890C1. Автор: Норберт КАЛЬВА. Владелец: Флоринг Текнолоджиз Лтд.. Дата публикации: 2022-01-24.

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Номер патента: US20160168746A1. Автор: CHEN Chih,LU CHIA-LING. Владелец: . Дата публикации: 2016-06-16.

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Номер патента: US20140291156A1. Автор: Suzuki Akitoshi,Yamazaki Satoshi,Shinozaki Kensaku,Sasaki Hirokazu,Ezura Takeshi. Владелец: . Дата публикации: 2014-10-02.

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Номер патента: US20170321001A1. Автор: PENG Wang,Qianfa Liu,Zhongqiang Yang,Zengbiao HUANG,Huayang DENG. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2017-11-09.

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Decomposable resin composition, prepreg, laminate, copper-clad laminate using the same, and decomposition method thereof

Номер патента: JP2018505921A. Автор: 華陽 ▲でん▼,増彪 黄,潜発 劉,中強 楊,鵬 王. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2018-03-01.

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Номер патента: JPWO2019078300A1. Автор: 政隆 中西,健一 窪木,一貴 松浦. Владелец: Nippon Kayaku Co Ltd. Дата публикации: 2019-11-14.

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Номер патента: TW201922917A. Автор: 中西政隆,松浦一貴,窪木健一. Владелец: 日商日本化藥股份有限公司. Дата публикации: 2019-06-16.

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Номер патента: WO2019078300A1. Автор: 政隆 中西,一貴 松浦,窪木　健一. Владелец: 日本化薬株式会社. Дата публикации: 2019-04-25.

Epoxy resin composition, preparation method thereof, laminated material and copper-clad laminated board manufactured by adopting epoxy resin composition

Номер патента: CN101735562B. Автор: 方克洪,魏东. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2012-09-26.

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Номер патента: EP3231829A4. Автор: PENG Wang,Qianfa Liu,Zhongqiang Yang,Zengbiao HUANG,Huayang DENG. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2018-07-04.

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Номер патента: EP3231829B1. Автор: PENG Wang,Qianfa Liu,Zhongqiang Yang,Zengbiao HUANG,Huayang DENG. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2019-10-30.

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Номер патента: WO2016090857A1. Автор: 王鹏,杨中强,黄增彪,刘潜发,邓华阳. Владелец: 广东生益科技股份有限公司. Дата публикации: 2016-06-16.

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Номер патента: TW200710159A. Автор: Shigehiro Hoshida,Kazunori Kondo,Tadashi Amano,Toru Nakanishi. Владелец: Shinetsu Chemical Co. Дата публикации: 2007-03-16.

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Номер патента: TW200708583A. Автор: Shigehiro Hoshida,Kazunori Kondo,Tadashi Amano,Toru Nakanishi. Владелец: Shinetsu Chemical Co. Дата публикации: 2007-03-01.

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Номер патента: US20140150963A1. Автор: He Yueshan. Владелец: . Дата публикации: 2014-06-05.

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Номер патента: US20210122879A1. Автор: Chang Hung-Yi,CHEN Chi-Lin,LIAO Te-Chao,CHEN HAO-SHENG. Владелец: . Дата публикации: 2021-04-29.

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Номер патента: US20180237582A1. Автор: Chen Meng-Hsin,LIN Chih-Hsiang,CHIU Jen-Chun. Владелец: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE. Дата публикации: 2018-08-23.

The resin composition for copper clad laminate, copper clad comprising the same and method for manufacturing the same

Номер патента: KR100942547B1. Автор: 김상범,양계용,최윤기. Владелец: 일진소재산업주식회사. Дата публикации: 2010-02-16.

Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board

Номер патента: TW202116821A. Автор: 廖德超,張宏毅,陳豪昇,陳其霖. Владелец: 南亞塑膠工業股份有限公司. Дата публикации: 2021-05-01.

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Номер патента: US8981014B2. Автор: Masato Takenouchi,Erina Kimura,Tadatoshi Fujinaga,Yu-Chin Lee,Jen-Hai Liao,Sung-Chen Lo. Владелец: UFC Corp. Дата публикации: 2015-03-17.

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Номер патента: US20140378622A1. Автор: Masato Takenouchi,Erina Kimura,Tadatoshi Fujinaga,Yu-Chin Lee,Jen-Hai Liao,Sung-Chen Lo. Владелец: UFC Corp. Дата публикации: 2014-12-25.

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Номер патента: US20130115472A1. Автор: YU Li-Chih,LEE Tse-An. Владелец: ELITE MATERIAL CO., LTD.. Дата публикации: 2013-05-09.

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Номер патента: US20130295388A1. Автор: YANG Zhongqiang,Du Cuiming,Chai Songgang. Владелец: GUANGDONG SHENGYI SCI. TECH CO., LTD.. Дата публикации: 2013-11-07.

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Номер патента: US20140004324A1. Автор: HSIEH CHEN-YU,LI CHANG-YUAN. Владелец: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD.. Дата публикации: 2014-01-02.

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Номер патента: US20140044918A1. Автор: ZENG Xian-Ping. Владелец: GUANGDONG SHENGYI SCI.TECH CO., LTD. Дата публикации: 2014-02-13.

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Номер патента: US20210017336A1. Автор: LEE Kuan-Wei,SU SZU-HSIANG,WU PEI-JUNG,HSIANG SHOU-JUI. Владелец: . Дата публикации: 2021-01-21.

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Номер патента: US20200079980A1. Автор: Yamada Masashi,Hirakawa Makoto. Владелец: TOAGOSEI CO., LTD.. Дата публикации: 2020-03-12.

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Номер патента: US20180086025A1. Автор: Umeda Hiroaki,Yoshigahara Haruyuki,Miyamoto Masanori. Владелец: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.. Дата публикации: 2018-03-29.

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Номер патента: US20140178696A1. Автор: YU Li-Chih,LEE Tse-An. Владелец: ELITE MATERIAL CO., LTD.. Дата публикации: 2014-06-26.

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Номер патента: US20190144619A1. Автор: SUZUKI Katsuhiko. Владелец: . Дата публикации: 2019-05-16.

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Номер патента: US20170174957A1. Автор: Chen Po-Ju,KUO Cheng-Po. Владелец: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE. Дата публикации: 2017-06-22.

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Номер патента: US20190240957A1. Автор: LEE Hung-Jung. Владелец: . Дата публикации: 2019-08-08.

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Номер патента: US20190256750A1. Автор: Yamada Masashi,Hirakawa Makoto,SEKIOKA Anna. Владелец: . Дата публикации: 2019-08-22.

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Номер патента: US20200332109A1. Автор: HUANG Zengbiao,SHE Naidong. Владелец: . Дата публикации: 2020-10-22.

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Номер патента: KR101254035B1. Автор: 현재혁,박동완,김인주,안진만,송영찬. Владелец: 한화엘앤씨 주식회사. Дата публикации: 2013-04-12.

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Номер патента: KR100561072B1. Автор: 민현성,이용석,김상국,구은회,구상모. Владелец: 주식회사 엘지화학. Дата публикации: 2006-03-16.

Adhesive composition for flexible copper clad laminated film

Номер патента: KR100730984B1. Автор: 서창호,김상필,최규하. Владелец: 도레이새한 주식회사. Дата публикации: 2007-06-22.

Polyphenyl ether resin composite and prepreg and copper clad laminate made of polyphenyl ether resin composite

Номер патента: CN102807658B. Автор: 曾宪平. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2014-06-11.

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Номер патента: KR102016983B1. Автор: 사토시 마츠이,신이치 하세가와,요시에 콘도우,시게키 요시다. Владелец: 가부시키가이샤 아리사와 세이사쿠쇼. Дата публикации: 2019-09-02.

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Номер патента: KR100845329B1. Автор: 강충석,송상민,이길남,임채현. Владелец: 주식회사 코오롱. Дата публикации: 2008-07-10.

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Номер патента: KR960001013A. Автор: 김정식,고종호,석재한. Владелец: 하기주. Дата публикации: 1996-01-25.

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Номер патента: CN113831533A. Автор: 周慧,翁建东,章陈萍. Владелец: Hangzhou Foster Electronic Materials Co ltd. Дата публикации: 2021-12-24.

Engineered wood board production installation and method for producing an engineered wood board

Номер патента: US09796194B2. Автор: Timo Skorzik,Thomas Habetha. Владелец: Flooring Technologies Ltd. Дата публикации: 2017-10-24.

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Номер патента: US20130302635A1. Автор: MAEDA Tomoyuki,MATSUSHIMA Hideaki,Tomonaga Sakiko,Miyake Koichi,Tateoka Ayumu,Obata Shinichi,Hiraoka Shinya,Hosokoshi Fumiaki. Владелец: Mitsui Mining & Smelting Co., Ltd.. Дата публикации: 2013-11-14.

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Номер патента: JP6553558B2. Автор: 歩 立岡,美智 田代. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2019-07-31.

White curable composition for printed wiring board, cured film and printed wiring board using the same

Номер патента: KR102263331B1. Автор: 마사유키 시무라,요시유키 후루타,마사오 유모토. Владелец: 다이요 잉키 세이조 가부시키가이샤. Дата публикации: 2021-06-14.

Link analysis compliance and calibration verification for automated printed wiring board test systems

Номер патента: WO2009036331A1. Автор: Erik S. Daniel,Robert W. Techentin,Bart O. Mccoy,Daniel Schraufnagel. Владелец: Mayo Foundation for Medical Education and Research. Дата публикации: 2009-03-19.

Digital Document processing system and a method for a pre-processing environment and a printing and finishing environment

Номер патента: NL2025993B1. Автор: P J De Smet Luc,H D Geraats Leonardus,P Brünner Marvin. Владелец: Canon Production Printing Holding BV. Дата публикации: 2022-03-08.

Control method for information processing apparatus, information processing apparatus, and non-transitory computer-readable medium

Номер патента: US20200012910A1. Автор: Ryota Onoguchi. Владелец: Canon Inc. Дата публикации: 2020-01-09.

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Номер патента: US20130084463A1. Автор: Fujisawa Satoshi. Владелец: FURUKAWA ELECTRIC CO., LTD.. Дата публикации: 2013-04-04.

Printing method for printing roll paper product by hot stamping and printing

Номер патента: CN107745587B. Автор: 徐军,欧立国. Владелец: Changde Jinpeng Printing Co Ltd. Дата публикации: 2020-02-11.

Device for hole processing for copper clad laminates and method for hole processing using the same

Номер патента: KR100710830B1. Автор: 강승한. Владелец: (주)인터플렉스. Дата публикации: 2007-04-23.

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Номер патента: US20150266267A1. Автор: Syng-Peng Rwei,Yung-Tan Lin. Владелец: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY. Дата публикации: 2015-09-24.

Method for manafacturing metal-copper clad laminated substrate

Номер патента: KR101338320B1. Автор: 최유식,천병욱. Владелец: (주)아이스써킷. Дата публикации: 2013-12-06.

Method for manafacturing metal-copper clad laminated substrate

Номер патента: KR101332802B1. Автор: 천병욱,안강모. Владелец: (주)아이스써킷. Дата публикации: 2013-11-26.

The method for manufacturing copper clad laminate

Номер патента: CN104859225B. Автор: 李东根,韩渊奎,李尚宰. Владелец: Samsung Electro Mechanics Co Ltd. Дата публикации: 2018-05-01.

Flexible copper clad laminate including inorganic layer and method for producting the same

Номер патента: KR20100097495A. Автор: 김경록. Владелец: 엘에스엠트론 주식회사. Дата публикации: 2010-09-03.

Flexible copper-clad laminate and method for making the same

Номер патента: KR101009128B1. Автор: 타에코 타카라베,코이치 하토리. Владелец: 신닛테츠가가쿠 가부시키가이샤. Дата публикации: 2011-01-18.

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Номер патента: US20130126082A1. Автор: KIM Young Kyung,KIM Young Taek. Владелец: SAMSUNG ELECTRONICS CO., LTD.. Дата публикации: 2013-05-23.

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Номер патента: US20130217287A1. Автор: CHO Yun Ho,CHO Moon Soo,KIM Jung Cheol,KANG Seok Won. Владелец: . Дата публикации: 2013-08-22.

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Номер патента: US20130244000A1. Автор: Huang Sheng-Yu,Chen Yu-Jean,Auman Brian C.,Mutoh Tsutomu,We Ming-Te,Yeh Yu-Chih. Владелец: E I DU PONT DE NEMOURS AND COMPANY. Дата публикации: 2013-09-19.

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Номер патента: US20140106147A1. Автор: Lee Jeong Kyu,Yoo Seong Hyun,Lee Hyun Jun,Moon Jin Seok,Lee Keun Yong. Владелец: SAMSUNG ELECTRO-MECHANICS CO., LTD.. Дата публикации: 2014-04-17.

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Номер патента: US20160082703A1. Автор: Kochiyama Takuro,HASHIMOTO Masafumi,Narui Kohji. Владелец: . Дата публикации: 2016-03-24.

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Номер патента: KR101599841B1. Автор: 박진택,임동혁,정명재,천기윤. Владелец: (주)테크피아. Дата публикации: 2016-03-04.

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Номер патента: KR101576252B1. Автор: 정병직. Владелец: 정병직. Дата публикации: 2015-12-14.

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Номер патента: JP6178360B2. Автор: 宣明 宮本,伸一 佐々木,佐々木　伸一,雅史 石井. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2017-08-09.

Flame-resistant adhessive coated copper foil and copper clad laminate manufactured using the same.

Номер патента: MY113701A. Автор: SATO Tetsuro,Kanao Yoshinori. Владелец: Mitsui Mining & Smelting Co Ltd. Дата публикации: 2002-05-31.

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Номер патента: CN102555348B. Автор: 伍宏奎. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2014-08-13.

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Номер патента: US20130040162A1. Автор: HATTORI Koichi,Uno Takeo,Fujisawa Satoshi. Владелец: Furukawa Electric Co. Ltd. Дата публикации: 2013-02-14.

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Номер патента: JP3392066B2. Автор: 岡 卓 片,沢 裕 平,本 拓 也 山,切 健一郎 岩,岡 晶 子 杉,岡 淳 志 吉. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2003-03-31.

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Номер патента: CA1198524A. Автор: Yoshiaki Suzuki,Haruo Nishihara. Владелец: Kanto Kasei Co Ltd. Дата публикации: 1985-12-24.

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Номер патента: JP4912171B2. Автор: 恭司 佐野. Владелец: Fukuda Metal Foil and Powder Co Ltd. Дата публикации: 2012-04-11.

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Номер патента: JP4572423B2. Автор: 健一 富岡,希 高野,道俊 荒田,富男 福田. Владелец: Showa Denko Materials Co Ltd. Дата публикации: 2010-11-04.

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Номер патента: JP2005068473A. Автор: Kazuhiko Arimatsu,信義 南部,一比古 有松,Nobuyoshi Nanbu. Владелец: Chubu Chelest Co Ltd. Дата публикации: 2005-03-17.

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Номер патента: US20120189859A1. Автор: Nozaki Mitsuru,Nomoto Akihiro,Akiyama Norikatsu,Nagata Eiji,Yano Masashi. Владелец: . Дата публикации: 2012-07-26.

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Номер патента: JP6592029B2. Автор: 倫也 古曳. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2019-10-16.

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Номер патента: JP2017124533A. Автор: 倫也 古曳,Michiya Kohiki,Yoshiyuki Miyoshi,良幸 三好. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2017-07-20.

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Номер патента: US20120003793A1. Автор: HWANG Sun-Uk,Cho Young-Woong,Yoon Kyoung-Ro. Владелец: . Дата публикации: 2012-01-05.

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Номер патента: US20120276412A1. Автор: Miki Atsushi. Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2012-11-01.

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Номер патента: JP4628701B2. Автор: 昭朗 前田,貴彦 本田. Владелец: Chiyoda Chemical Co Ltd. Дата публикации: 2011-02-09.

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Номер патента: JP2903893B2. Автор: 正浩 島田,正則 海藤. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 1999-06-14.

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Номер патента: JPH11262975A. Автор: Kenichi Tomioka,健一 富岡,Michitoshi Arata,Tomio Fukuda,Mare Takano,希 高野,道俊 荒田,富男 福田. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 1999-09-28.

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Номер патента: JP5362922B1. Автор: 英太 新井,敦史 三木,嘉一郎 中室,康修 新井. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-12-11.

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Номер патента: US20120148862A1. Автор: . Владелец: JX NIPPON MINING AND METALS CORPORATION. Дата публикации: 2012-06-14.

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Номер патента: JPS6437078A. Автор: Shinichi Inoue,Kuniaki Asai,Kazuo Hinobeta. Владелец: Sumitomo Chemical Co Ltd. Дата публикации: 1989-02-07.

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Номер патента: JP3635811B2. Автор: 将次 木越,昭弘 田畑. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2005-04-06.

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Номер патента: JP2003147171A. Автор: Hiroaki Fujita,広明 藤田,Takahiro Tanabe,貴弘 田邉. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2003-05-21.

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Номер патента: JP6910186B2. Автор: 隆行 萬. Владелец: Nihon Parkerizing Co Ltd. Дата публикации: 2021-07-28.

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Номер патента: MY120195A. Автор: Tetsuro Sato,Yuji Kageyama. Владелец: Mitsui Mining & Smelting Co. Дата публикации: 2005-09-30.

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Номер патента: JP4255759B2. Автор: 智 前川,和彦 大堀. Владелец: Kyocera Chemical Corp. Дата публикации: 2009-04-15.

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Номер патента: JP4547817B2. Автор: 和浩 伊藤,守 永田,正男 榧場,良彦 三宅,秀幸 荒金. Владелец: Sony Corp. Дата публикации: 2010-09-22.

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Номер патента: JP5503789B2. Автор: 裕昭 津吉,真一 小畠,歩 立岡. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2014-05-28.

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Номер патента: CN102363891B. Автор: 胡旭日,王维河,杨鹏海,徐策,考松波,腾笑朋. Владелец: SHANDONG JINBAO ELECTRONICS CO Ltd. Дата публикации: 2013-09-25.

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Номер патента: JP2004256678A. Автор: Toshiro Komiyakoku,小宮谷壽郎. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 2004-09-16.

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Номер патента: CN1874655A. Автор: 荒井邦夫,赤星晴夫,川村利则. Владелец: Hitachi Via Mechanics Ltd. Дата публикации: 2006-12-06.

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Номер патента: JP2734912B2. Автор: 一紀 光橋,達 坂口,満利 鎌田. Владелец: Shin Kobe Electric Machinery Co Ltd. Дата публикации: 1998-04-02.

Thermosetting resin composition, prepreg, copper-clad laminate and printed wiring board

Номер патента: JP6662098B2. Автор: 芳克 白男川,真 柳田,圭祐 串田,辰徳 金子. Владелец: Showa Denko Materials Co Ltd. Дата публикации: 2020-03-11.

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Номер патента: US20120205146A1. Автор: Oguro Ryoichi,Hoshino Kazuhiro. Владелец: FURUKAWA ELECTRIC CO., LTD.. Дата публикации: 2012-08-16.

Electroless plating solution, electroless plating method, printed wiring board manufacturing method, and printed wiring board

Номер патента: JP4236327B2. Автор: 本鎮 袁. Владелец: Ibiden Co Ltd. Дата публикации: 2009-03-11.

Printed wiring board printing method and printed wiring board printing apparatus

Номер патента: JP3196662B2. Автор: 啓文 新井. Владелец: Matsushita Electric Works Ltd. Дата публикации: 2001-08-06.

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Номер патента: JP4709813B2. Автор: 龍男 片岡,裕 井口,芳一 明石. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2011-06-29.

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Номер патента: JP4478844B2. Автор: 健次 高井,豊樹 伊藤,昭士 中祖,茂晴 有家,直之 浦崎. Владелец: Showa Denko Materials Co Ltd. Дата публикации: 2010-06-09.

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Номер патента: JP5573556B2. Автор: 麻理衣 山田,彩 岡田. Владелец: DAI NIPPON PRINTING CO LTD. Дата публикации: 2014-08-20.

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Номер патента: JP5777220B2. Автор: 東馬由和. Владелец: 株式会社伸光製作所. Дата публикации: 2015-09-09.

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Номер патента: JP6191212B2. Автор: 三浦　徹,徹 三浦,伊裕 横沢. Владелец: UBE Industries Ltd. Дата публикации: 2017-09-06.

Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices

Номер патента: JP6781562B2. Автор: 慎介 坂東. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2020-11-04.

High gloss rolled copper foil for copper-clad laminates

Номер патента: JP4522972B2. Автор: 善雄 黒澤,康雄 平能. Владелец: Nippon Mining and Metals Co Ltd. Дата публикации: 2010-08-11.

Copper foil for copper clad laminates

Номер патента: JP3319650B2. Автор: 哲朗 佐藤,祐司 蔭山. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2002-09-03.

Copper foil excellent in flexibility, manufacturing method thereof, and flexible copper-clad laminate

Номер патента: JP5185066B2. Автор: 俊之 小野,嘉一郎 中室. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2013-04-17.

Method for producing two-layer copper-clad laminate and two-layer copper-clad laminate

Номер патента: JP5461888B2. Автор: 幹夫 花房. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2014-04-02.

Adhesive-coated copper foil and copper-clad laminate

Номер патента: JPH10279893A. Автор: Yoshiyuki Narabe,Masabumi Yano,正文 矢野,嘉行 奈良部. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 1998-10-20.

Multilayer copper clad laminate with built-in capacitor and method for producing copper clad laminate

Номер патента: JP3710835B2. Автор: 弘 福川. Владелец: Kyocera Chemical Corp. Дата публикации: 2005-10-26.

Copper-clad laminate and method for producing copper-clad laminate

Номер патента: JP2023005364A. Автор: Yoshihide Nishiyama,芳英 西山. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2023-01-18.

Two-layer flexible copper-clad laminate and method for producing the two-layer flexible copper-clad laminate

Номер патента: JP4540100B2. Автор: 誠 土橋,進 高橋,俊子 横田,英明 松嶋. Владелец: Mitsui Mining and Smelting Co Ltd. Дата публикации: 2010-09-08.

Electrolytic copper foil for copper-clad laminate, and manufacturing method thereof

Номер патента: TW574441B. Автор: Mikio Hanabusa. Владелец: Nikko Materials Co Ltd. Дата публикации: 2004-02-01.

Copper-clad laminate, multilayer copper-clad laminate and process for producing the same

Номер патента: CN1160633A. Автор: 小林和仁,中祖昭士,冈野德男. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 1997-10-01.

Copper foil laminate and method for producing laminate

Номер патента: JP5697892B2. Автор: 雅之 高森. Владелец: JX Nippon Mining and Metals Corp. Дата публикации: 2015-04-08.

Pretreatment method for electroplating and method for producing copper clad laminated resin film by electroplating method including the pretreatment method

Номер патента: JP5673582B2. Автор: 晋平 西原. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2015-02-18.

Method for producing copper-clad laminate

Номер патента: JP2020012156A. Автор: 下地　匠,Takumi Shimoji,匠 下地,智治 渡邊,Tomoharu Watanabe. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2020-01-23.

Method for producing double-sided copper-clad laminate

Номер патента: JP5021985B2. Автор: 善彦 中村,英次 元部,龍史 高橋,健 小泉. Владелец: Panasonic Corp. Дата публикации: 2012-09-12.

Method for producing multilayer copper-clad laminate

Номер патента: JP2602423B2. Автор: 公治 福島. Владелец: 富山日本電気株式会社. Дата публикации: 1997-04-23.

Copper clad laminate for multilayer printed wiring

Номер патента: JP2531799Y2. Автор: 健治 渡辺,統夫 片山,浩司 平田. Владелец: Risho Kogyo Co Ltd. Дата публикации: 1997-04-09.

Method for producing copper-clad laminate

Номер патента: JP5073801B2. Автор: 康史 松村,龍三 新田,公一 服部. Владелец: Nippon Steel and Sumikin Chemical Co Ltd. Дата публикации: 2012-11-14.

Method for producing copper clad laminate

Номер патента: JP6201191B2. Автор: 裕規 丹波. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2017-09-27.

Surface treatment method for resin film and method for producing copper clad laminate including the same

Номер патента: JP6060854B2. Автор: 秀晴 大上,大上　秀晴. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2017-01-18.

Flame-retardant phenolic resin copper-clad laminate and method for producing the same

Номер патента: JP2940816B2. Автор: 裕昭 仲見,鉄秋 鈴木. Владелец: Toshiba Chemical Corp. Дата публикации: 1999-08-25.

A manufacturing method for copper-clad laminated plate

Номер патента: TW200728068A. Автор: Ryuzo Shinta,Yasufumi Matsumura. Владелец: Nippon Steel Chemical Co. Дата публикации: 2007-08-01.

Continuously produced thermosetting resin composition for copper-clad laminate, copper-clad laminate production method, and copper-clad laminate

Номер патента: JP4964722B2. Автор: 圭子 柏原,智之 石川,稔 宇野,博晴 井上. Владелец: Panasonic Corp. Дата публикации: 2012-07-04.

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Номер патента: JP4186029B2. Автор: 薫 田中,哲治 西川. Владелец: Ishihara Chemical Co Ltd. Дата публикации: 2008-11-26.

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Номер патента: JP4699261B2. Автор: 祐之 松下,妙子 財部,誠人 上野. Владелец: Nippon Steel and Sumikin Chemical Co Ltd. Дата публикации: 2011-06-08.

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Номер патента: JP2020132958A. Автор: Yoshihide Nishiyama,芳英 西山. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2020-08-31.

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Номер патента: CN101296562A. Автор: 李建辉,林志铭. Владелец: Asia Electronic Material Co Ltd. Дата публикации: 2008-10-29.

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Номер патента: JPS55127438A. Автор: Yoshio Nakagawa,Susumu Koga,Mitsuo Niwa,Mitsunori Yasukui. Владелец: Sumitomo Bakelite Co Ltd. Дата публикации: 1980-10-02.

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Номер патента: CA944674A. Автор: Hiroshi Ishii,Kazuo Doi,Hiroyoshi Sato,Takeru Murakami. Владелец: Matsushita Electric Works Ltd. Дата публикации: 1974-04-02.

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Номер патента: TWM443362U. Автор: Chih-Ming Lin,Chien-Hui Lee,Jen-Hsiung Hsiao. Владелец: Asia Electronic Material Co. Дата публикации: 2012-12-11.

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Номер патента: JPS53134082A. Автор: Ryuichi Shimizu,Motoyo Wajima,Takeshi Shimazaki,Akio Takahashi. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 1978-11-22.

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Номер патента: US20120318568A1. Автор: . Владелец: JX NIPPON MINING & METALS CORPORATION. Дата публикации: 2012-12-20.

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Номер патента: CN101456276B. Автор: 蒋伟,周长松,沈宗华,游金荣,佟德林. Владелец: New Materials Co Ltd Zhejiang China Is. Дата публикации: 2011-07-20.

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Номер патента: CN101564929A. Автор: 张记明. Владелец: SHAANXI SHENGYI SCI TECH Co Ltd. Дата публикации: 2009-10-28.

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Номер патента: JPH0663111B2. Автор: 眞一 穂坂. Владелец: Nippon Avionics Co Ltd. Дата публикации: 1994-08-17.

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Номер патента: JPH1199590A. Автор: 憲 七海,Takeshi Horiuchi,猛 堀内,Yoshitoshi Kumakura,俊寿 熊倉,Ken Nanaumi. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 1999-04-13.

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Номер патента: CN104975534A. Автор: 江敏. Владелец: Shangxin Paper Co Ltd. Дата публикации: 2015-10-14.

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Номер патента: CN102267265A. Автор: 王勤,陈俊龙,钟健伟. Владелец: Shengyi Technology Co Ltd. Дата публикации: 2011-12-07.

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Номер патента: CN102336879B. Автор: 傅智雄,余青川. Владелец: SINOINFO ECOMMERCE Inc. Дата публикации: 2012-10-03.

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Номер патента: CN101564929B. Автор: 张记明. Владелец: SHAANXI SHENGYI SCI TECH Co Ltd. Дата публикации: 2012-08-29.

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Номер патента: KR970010865A. Автор: 정창범,석재한,김일용,강승구,이해주,정일영. Владелец: 이웅열. Дата публикации: 1997-03-27.

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Номер патента: JP2013131686A. Автор: Toshiaki Aihara,俊明 相原,Takahiro Suda,貴広 須田. Владелец: SUMITOMO METAL MINING CO LTD. Дата публикации: 2013-07-04.

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Номер патента: JPS62252189A. Автор: 千野　貴之,井原　松利,角屋　明由. Владелец: HITACHI LTD. Дата публикации: 1987-11-02.

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