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Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit

Номер патента: US20080261400A1
Опубликовано: 23-10-2008
Автор(ы): Atsushi Hayashi, Hiroyuki Kamiya, Iori Yoshida, Norihito Nakazawa, Satoshi Takemiya
Принадлежит: Asahi Glass Co Ltd
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Compiling method, running method, and related product

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Image processing device, image providing server, image display method, and image provision method for navigating horizontally or vertically between floor images

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Self-cleaning method and control method for cooking device

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Device, method and system for optical communication with a waveguide structure and an integrated optical coupler of a photonic integrated circuit chip

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Aluminum alloy part cleaning treatment equipment for semiconductor processing for integrated circuit

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Medical diagnosis assistance system and method

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METHOD FOR TESTING MEDIA CARRYING MULTIPLE DIGITALLY OPERATED CIRCUITS, MEDIUM PROVIDED WITH SUCH CIRCUITS, INTEGRATED CIRCUIT SUITABLE FOR MOUNTING ON SUCH MEDIUM AND TEST DEVICE FOR TESTING SUCH MEDIA

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Medical diagnosis assistance system and method

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Depression evaluation method and method for evaluating depression treatment method, and data acquisition method for evaluating depression or result of depression treatment method

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Balanced conforming force mechanism for integrated circuit package workpress testing systems

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Method of wheel manufacture for correcting rotational non-uniformity of a pneumatic tire and wheel assembly, apparatus for performing such method, and the resulting wheel

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Method for Correcting the Critical Dimension Uniformity of a Photomask for Semiconductor Lithography

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