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化学机械抛光垫

Номер патента: CN101642897A
Опубликовано: 10-02-2010
Автор(ы): M·J·库尔普, T·T·克韦纳克
Принадлежит: Rohm and Haas Electronic Materials LLC
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Chemical mechanical plishing pad with window

Номер патента: US20160263721A1. Автор: Joseph So,Bainian Qian,Janet Tesfai. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2016-09-15.

Base pad polishing pad and multi-layer pad comprising the same

Номер патента: EP1715980A1. Автор: Hyun-Woo Lee,Ju-Yeol Lee,Eu-Gene Song,Sung-Min 304-202 Joogong Apt. Gaesin-dong KIM,Jae-Seok 307-1305 Joogong Apt Boonpyung-dong KIM. Владелец: SKC Co Ltd. Дата публикации: 2006-11-02.

Chemical mechanical polishing pad with fluorinated polymer and multimodal groove pattern

Номер патента: US20240207998A1. Автор: Joseph So,Matthew R. Gadinski. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2024-06-27.

Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

Номер патента: CA2305106C. Автор: David S. Gilbride,Oscar K. Hsu,Jean K. Vangsness,Scott C. Billings. Владелец: Innopad Inc. Дата публикации: 2008-07-08.

Chemical mechanical polishing method

Номер патента: US12017322B2. Автор: Chi-Hung Liao,Wei-Chang Cheng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-06-25.

Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

Номер патента: US6656018B1. Автор: David S. Gilbride,Oscar K. Hsu,Jean K. Vangsness,Scott C. Billings. Владелец: Freudenberg Nonwovens LP. Дата публикации: 2003-12-02.

Method of grooving a chemical-mechanical planarization pad

Номер патента: US8758659B2. Автор: Guangwei Wu,Paul Lefevre,David Adam Wells,John Erik Aldeborgh,Anoop Mathew,Oscar K. Hsu,Marc C. Jin. Владелец: FNS Technology Co Ltd. Дата публикации: 2014-06-24.

Hydrophilic and zeta potential tunable chemical mechanical polishing pads

Номер патента: US11826876B2. Автор: Rajeev Bajaj,Sivapackia Ganapathiappan,Hou T. Ng,Daniel REDFIELD,Nag B. Patibandla,Ashwin CHOCKALINGAM,Boyi FU,Ankit Vora,Sudhakar Madhusoodhanan. Владелец: Applied Materials Inc. Дата публикации: 2023-11-28.

Pad for chemical mechanical polishing

Номер патента: US20230347470A1. Автор: Joseph So,Matthew R. Gadinski,Donna M. Alden. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-11-02.

Chemical Mechanical Planarization Tool

Номер патента: US20230271298A1. Автор: Liang-Guang Chen,Kei-Wei Chen,Kao-Feng Liao,Ting-Hsun CHANG,Chun-Chieh Lin,Hsin-ying Ho,Chih Hung Chen,Fu-Ming HUANG,Michael Yen,Chun-Wen Hsiao,Sheng-Chao Chuang,Peng-Chung Jangjian,Ji James Cui. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-08-31.

Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates

Номер патента: US20010006879A1. Автор: Michael Walker,Karl Robinson. Владелец: Individual. Дата публикации: 2001-07-05.

Customized polishing pads for cmp and methods of fabrication and use thereof

Номер патента: IL185099A. Автор: . Владелец: Nexplanar Corp. Дата публикации: 2013-11-28.

Chemical mechanical planarization pads via vat-based production

Номер патента: US11845157B2. Автор: Lin Fu,Ping Huang,Chen-Chih Tsai,Eric S. Moyer,Justin Stewart,Carlos Barros,William Michael SPITZIG. Владелец: CMC Materials LLC. Дата публикации: 2023-12-19.

Polishing pads for chemical mechanical planarization

Номер патента: US20030027500A1. Автор: David James,Peter Burke,Arun Vishwanathan,David Shidner,Lee Cook. Владелец: David Shidner. Дата публикации: 2003-02-06.

Method and apparatus for improved chemical mechanical planarization

Номер патента: EP1799402A1. Автор: Rajeev Bajaj. Владелец: Individual. Дата публикации: 2007-06-27.

Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines

Номер патента: US6361832B1. Автор: Scott G. Meikle,Vishnu K. Agarwal. Владелец: Micron Technology Inc. Дата публикации: 2002-03-26.

Chemical-mechanical planarization pad including patterned structural domains

Номер патента: EP2382651A1. Автор: Guangwei Wu,Paul Lefevre,David Adam Wells,Anoop Mathew,Oscar K. Hsu. Владелец: Innopad Inc. Дата публикации: 2011-11-02.

Polishing pad and polishing method

Номер патента: US20240316721A1. Автор: Masamitsu Kimura,Koshiro Suzuki,Hideji HORITA. Владелец: Disco Corp. Дата публикации: 2024-09-26.

Polishing pad and method for producing same

Номер патента: EP1622193A4. Автор: Mitsuru Saito,Toshihiro Izumi,Takuya Nagamine,Hisatomo Ohno,Ichiro Kodaka,Claughton Miller. Владелец: Nihon Micro Coating Co Ltd. Дата публикации: 2008-08-20.

Method of using polishing pad

Номер патента: US11691243B2. Автор: Sheng-Chen Wang,Jung-Yu Li,Chunhung Chen,Shih-Sian HUANG. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-07-04.

Method of using polishing pad

Номер патента: US12070833B2. Автор: Sheng-Chen Wang,Jung-Yu Li,Chunhung Chen,Shih-Sian HUANG. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-08-27.

Polishing pad and substrate processing apparatus including the same

Номер патента: US20230381913A1. Автор: Boun Yoon,Kihoon JANG,Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-11-30.

Polishing pad

Номер патента: US20240157505A1. Автор: Osamu Kinoshita,Kazuo Shoji. Владелец: Universal Photonics Far East Inc. Дата публикации: 2024-05-16.

Using sacrificial material in additive manufacturing of polishing pads

Номер патента: US20210114172A1. Автор: Daniel REDFIELD,Jason Garcheung Fung,Mayu Felicia Yamamura. Владелец: Applied Materials Inc. Дата публикации: 2021-04-22.

Using sacrificial material in additive manufacturing of polishing pads

Номер патента: US20230256567A1. Автор: Daniel REDFIELD,Jason Garcheung Fung,Mayu Felicia Yamamura. Владелец: Applied Materials Inc. Дата публикации: 2023-08-17.

Surface treatment method of polishing pad and polishing method of wafer using the same

Номер патента: WO2013069938A1. Автор: Sehun CHOI,Kyeongsoon KIM,Younghee MOON. Владелец: LG Siltron Inc.. Дата публикации: 2013-05-16.

Polishing pad and method of monitoring a polishing process using the same

Номер патента: US20240227113A1. Автор: JANGWON SEO,Kyung Hwan Kim,Joonho AN,Chang Gyu Im,Yujin Shin. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-07-11.

Method for polishing using polishing pad provided with adsorption layer

Номер патента: US20200147749A1. Автор: Daisuke Ninomiya,Toshiyasu Yajima. Владелец: Maruishi Sangyo Co Ltd. Дата публикации: 2020-05-14.

Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

Номер патента: US11772229B2. Автор: Rajeev Bajaj,Sivapackia Ganapathiappan,Hou T. Ng,Mahendra C. Orilall,Daniel REDFIELD,Jason G. Fung,Ashwin CHOCKALINGAM,Boyi FU,Mayu YAMAMURA. Владелец: Applied Materials Inc. Дата публикации: 2023-10-03.

Polishing pads with interconnected pores

Номер патента: WO2022265826A1. Автор: Rajeev Bajaj,Jason G. Fung,Ashwin CHOCKALINGAM,Veera Raghava Reddy KAKIREDDY,Puneet Narendra JAWALI,Nandan BARADANAHALLI KENCHAPPA,Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE. Владелец: Applied Materials, Inc.. Дата публикации: 2022-12-22.

Method for manufacturing polishing pad and polishing pad

Номер патента: US09862071B2. Автор: Chung-Chih Feng,I-Peng Yao,Yung-Chang Hung,Lyang-Gung Wang. Владелец: San Fang Chemical Industry Co Ltd. Дата публикации: 2018-01-09.

Polishing pad cluster for polishing a semiconductor wafer

Номер патента: US5575707A. Автор: Homayoun Talieh,David E. Weldon. Владелец: Ontrak Systems Inc. Дата публикации: 1996-11-19.

Polishing method for semiconductor wafer and polishing pad used therein

Номер патента: GB9902373D0. Автор: . Владелец: Shin Etsu Handotai Co Ltd. Дата публикации: 1999-03-24.

Polyurethane polishing pad

Номер патента: US09731398B2. Автор: Benson Lee,Bainian Qian,Raymond L. Lavoie, JR.,Marty W. Degroot. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-08-15.

Polishing pad for wafer polishing apparatus and manufacturing method therefor

Номер патента: EP3708299A1. Автор: Jin Woo Ahn. Владелец: SK Siltron Co Ltd. Дата публикации: 2020-09-16.

Tank and method for producing polishing pad using tank

Номер патента: MY163432A. Автор: Hiroshi Seyanagi. Владелец: Rohm & Haas Elect Materials Cmp Holdings Inc. Дата публикации: 2017-09-15.

Polishing method for semiconductor wafer and polishing pad used therein

Номер патента: MY122396A. Автор: Hisashi Masumura,Kiyoshi Suzuki,Teruaki Fukami. Владелец: Shinetsu Handotai Kk. Дата публикации: 2006-04-29.

Recycled polishing pad

Номер патента: US11541504B2. Автор: Yoon Ho Kim,Seung Taek Oh,Young Jun Yoo,Bong Su Ahn,Pal Kon Kim,Si Hyeong Kim,Jin Ok Moon. Владелец: FNS Technology Co Ltd. Дата публикации: 2023-01-03.

Polishing pad installation tool

Номер патента: US20020081958A1. Автор: Bernard Foster. Владелец: Rodel Holdings Inc. Дата публикации: 2002-06-27.

Recycled polishing pad

Номер патента: US20200238472A1. Автор: Yoon Ho Kim,Seung Taek Oh,Young Jun Yoo,Bong Su Ahn,Pal Kon Kim,Si Hyeong Kim,Jin Ok Moon. Владелец: FNS Technology Co Ltd. Дата публикации: 2020-07-30.

Advanced polishing pads and related polishing pad manufacturing methods

Номер патента: WO2021257136A1. Автор: Rajeev Bajaj,Jason G. Fung,Andrew Scott Lawing,Puneet Narendra JAWALI,Adam Wade MANZONIE,Nandan BARADANAHALLI KENCHAPPA,Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE. Владелец: Applied Materials, Inc.. Дата публикации: 2021-12-23.

Method of using polishing pad

Номер патента: US20230339068A1. Автор: Sheng-Chen Wang,Jung-Yu Li,Chunhung Chen,Shih-Sian HUANG. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-10-26.

Advanced polishing pads and related polishing pad manufacturing methods

Номер патента: US11806829B2. Автор: Rajeev Bajaj,Jason G. Fung,Andrew Scott Lawing,Puneet Narendra JAWALI,Adam Wade MANZONIE,Nandan BARADANAHALLI KENCHAPPA,Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE. Владелец: Applied Materials Inc. Дата публикации: 2023-11-07.

Advanced polishing pads and related polishing pad manufacturing methods

Номер патента: US20240025010A1. Автор: Rajeev Bajaj,Jason G. Fung,Andrew Scott Lawing,Puneet Narendra JAWALI,Adam Wade MANZONIE,Nandan BARADANAHALLI KENCHAPPA,Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE. Владелец: Applied Materials Inc. Дата публикации: 2024-01-25.

Advanced polishing pads and related polishing pad manufacturing methods

Номер патента: EP4168210A1. Автор: Rajeev Bajaj,Jason G. Fung,Andrew Scott Lawing,Puneet Narendra JAWALI,Adam Wade MANZONIE,Nandan BARADANAHALLI KENCHAPPA,Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE. Владелец: Applied Materials Inc. Дата публикации: 2023-04-26.

Polishing pad and apparatus for polishing a semiconductor wafer

Номер патента: US6077153A. Автор: Takashi Fujita,Yuzo Kozai,Motoyuki Ohara. Владелец: Sumitomo Metal Industries Ltd. Дата публикации: 2000-06-20.

Polishing pad with controlled abrasion rate

Номер патента: US5297364A. Автор: Mark E. Tuttle. Владелец: Micron Technology Inc. Дата публикации: 1994-03-29.

Polishing pad

Номер патента: EP1536920B1. Автор: Markus c/o P & M NAUJOK. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2006-07-12.

Polishing pad, and polishing method

Номер патента: EP4282588A1. Автор: Koji Katayama,Shota HISHIDA,Kyosuke Tenko,Daisuke Yasui,Hideharu HASE. Владелец: Fujimi Inc. Дата публикации: 2023-11-29.

Reinforced polishing pad with a shaped or flexible window structure

Номер патента: EP1372908A1. Автор: KANG Jia,Christian David Frederickson,Herbert Elliot Litvak,Eugene Y. Zhao,Michael David Steiman. Владелец: Lam Research Corp. Дата публикации: 2004-01-02.

Polishing pad and polishing method

Номер патента: US20240131654A1. Автор: Koji Katayama,Shota HISHIDA,Kyosuke Tenko,Daisuke Yasui,Hideharu HASE. Владелец: Fujimi Inc. Дата публикации: 2024-04-25.

Polishing pad and polishing method

Номер патента: US20240227119A9. Автор: Koji Katayama,Shota HISHIDA,Kyosuke Tenko,Daisuke Yasui,Hideharu HASE. Владелец: Fujimi Inc. Дата публикации: 2024-07-11.

Polishing pad with alignment feature

Номер патента: US20150152236A1. Автор: William C. Allison,Diane Scott,Robert Kerprich. Владелец: Individual. Дата публикации: 2015-06-04.

Polishing pad with a partial adhesive coating

Номер патента: US20010055939A1. Автор: Robert Tolles. Владелец: Applied Materials Inc. Дата публикации: 2001-12-27.

A polishing pad with a partial adhesive coating

Номер патента: WO2000034008A9. Автор: Robert D Tolles. Владелец: Applied Materials Inc. Дата публикации: 2001-03-29.

Method of manufacturing a polishing pad using a beam

Номер патента: US20020144985A1. Автор: Frank Miceli,Annette Crevasse,William Easter. Владелец: Individual. Дата публикации: 2002-10-10.

Polishing layer of polishing pad and method of forming the same and polishing method

Номер патента: US09969049B2. Автор: Kun-Che Pai,Yu-Hao Pan. Владелец: Iv Technologies Co Ltd. Дата публикации: 2018-05-15.

Homogeneous polishing pad for eddy current end-point detection

Номер патента: US09597777B2. Автор: Ping Huang,Alexander William Simpson,William C. Allison,Diane Scott,Richard Frentzel. Владелец: Nexplanar Corp. Дата публикации: 2017-03-21.

Polishing pad with multi-modal distribution of pore diameters

Номер патента: US09555518B2. Автор: Ping Huang,William C. Allison,Diane Scott,James P. LaCasse. Владелец: Nexplanar Corp. Дата публикации: 2017-01-31.

Polishing pad and polishing method

Номер патента: US20190099860A1. Автор: Yu-Piao Wang. Владелец: Iv Technologies Co Ltd. Дата публикации: 2019-04-04.

Method of forming structured-open-network polishing pads

Номер патента: US9108291B2. Автор: Hamed Lakrout. Владелец: Dow Global Technologies LLC. Дата публикации: 2015-08-18.

Polishing pads with interconnected pores

Номер патента: US11951590B2. Автор: Rajeev Bajaj,Ashwin CHOCKALINGAM,Veera Raghava Reddy KAKIREDDY,Puneet Narendra JAWALI,Nandan BARADANAHALLI KENCHAPPA,Jason Garcheung Fung,Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE. Владелец: Applied Materials Inc. Дата публикации: 2024-04-09.

Polishing pads for high temperature processing

Номер патента: US11911870B2. Автор: Rajeev Bajaj,Sivapackia Ganapathiappan,Daniel REDFIELD,You Wang,Yingdong Luo,Aniruddh Jagdish KHANNA. Владелец: Applied Materials Inc. Дата публикации: 2024-02-27.

Polishing pad, method for producing the same and method of fabricating semiconductor device using the same

Номер патента: US11951591B2. Автор: Hye Young HEO,Jong Wook YUN,Jang Won Seo,Jae In Ahn. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-04-09.

Polishing pad design

Номер патента: US6887131B2. Автор: Paul Fischer,Sadasivan Shankar,Lei Jiang. Владелец: Intel Corp. Дата публикации: 2005-05-03.

Polishing pads with improved planarization efficiency

Номер патента: WO2023219783A1. Автор: Ashwin CHOCKALINGAM,Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE. Владелец: Applied Materials, Inc.. Дата публикации: 2023-11-16.

Polishing pads with improved planarization efficiency

Номер патента: US20230364735A1. Автор: Ashwin CHOCKALINGAM,Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE. Владелец: Applied Materials Inc. Дата публикации: 2023-11-16.

Polishing pad, polishing apparatus and method for manufacturing polishing pad

Номер патента: US20150202732A1. Автор: Chung-Chih Feng,I-Peng Yao,Yung-Chang Hung,Chun-Ta Wang,Wei-Te Liu. Владелец: San Fang Chemical Industry Co Ltd. Дата публикации: 2015-07-23.

Window in thin polishing pad

Номер патента: US11826875B2. Автор: Yongqi Hu,Kadthala Ramaya Narendrnath,Thomas Lawrence Terry. Владелец: Applied Materials Inc. Дата публикации: 2023-11-28.

Polishing pad with multi-modal distribution of pore diameters

Номер патента: WO2012051197A1. Автор: Ping Huang,William C. Allison,Diane Scott,James P. LaCasse. Владелец: NexPlanar Corporation. Дата публикации: 2012-04-19.

Polishing pad with multi-modal distribution of pore diameters

Номер патента: MY167541A. Автор: Ping Huang,Diane Scott,William C Allison,James P Lacasse. Владелец: Cabot Microelectronics Corp. Дата публикации: 2018-09-05.

Polishing pad, polishing apparatus, and method for making the polishing pad

Номер патента: US20170297165A1. Автор: Chung-Chih Feng,I-Peng Yao,Yung-Chang Hung,Kun-Cheng Tsai. Владелец: San Fang Chemical Industry Co Ltd. Дата публикации: 2017-10-19.

Polishing pad conditioning apparatus

Номер патента: US20210060727A1. Автор: Shih-Chung Chen,Hung-Lin Chen,Cheng-Ping Chen,Sheng-Tai Peng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2021-03-04.

Polishing pad conditioning apparatus

Номер патента: US20230234184A1. Автор: Shih-Chung Chen,Hung-Lin Chen,Cheng-Ping Chen,Sheng-Tai Peng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-07-27.

Polishing pads and methods relating thereto

Номер патента: US6843712B2. Автор: Lee Melbourne Cook,David B. James,John H. V. Roberts. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2005-01-18.

Polishing pad

Номер патента: US20230364736A1. Автор: Hiroshi Kurihara,Yoshihide Kawamura,Teppei Tateno,Ryuma Matsuoka,Yamato TAKAMIZAWA,Satsuki Narushima,Keisuke Ochi,Tetsuaki KAWASAKI. Владелец: Fujibo Holdins Inc. Дата публикации: 2023-11-16.

Laminate polishing pad

Номер патента: SG184115A1. Автор: Atsushi Kazuno. Владелец: Toyo Tire & Rubber Co. Дата публикации: 2012-10-30.

Polishing pad and polishing method

Номер патента: US11872671B2. Автор: Yu-Piao Wang. Владелец: Iv Technologies Co Ltd. Дата публикации: 2024-01-16.

Homogeneous polishing pad for eddy current end-point detection

Номер патента: US20120083192A1. Автор: Ping Huang,Alexander William Simpson,William C. Allison,Diane Scott,Richard Frentzel. Владелец: Individual. Дата публикации: 2012-04-05.

Polishing pad and polishing method

Номер патента: US11524389B2. Автор: Yu-Piao Wang. Владелец: Iv Technologies Co Ltd. Дата публикации: 2022-12-13.

Microreplicated polishing pad including fluorinated polymer window

Номер патента: WO2023126854A1. Автор: QIN Lin,Craig R. Hoff,Matthew J. TRIEMERT,Duy K. LEHUU,David J. MURADIAN,Alexander W. SIMPSON. Владелец: 3M INNOVATIVE PROPERTIES COMPANY. Дата публикации: 2023-07-06.

Molded polishing pad having integral window

Номер патента: EP1210209A4. Автор: John V H Roberts,David B James,Barry Scott Pinheiro. Владелец: Rodel Holdings Inc. Дата публикации: 2004-06-30.

Molded polishing pad having integral window

Номер патента: WO2001012387A1. Автор: John V. H. Roberts,David B. James,Barry Scott Pinheiro. Владелец: Rodel Holdings, Inc.. Дата публикации: 2001-02-22.

Polishing pad, polishing unit, polishing device, and method for manufacturing polishing pad

Номер патента: US20230173637A1. Автор: Hiroshi Kurihara,Teppei Tateno,Ryuma Matsuoka,Yamato TAKAMIZAWA,Satsuki Narushima. Владелец: Fujibo Holdins Inc. Дата публикации: 2023-06-08.

Polishing pad

Номер патента: US20240042573A1. Автор: Takeshi Sato,Norihisa Arifuku. Владелец: Disco Corp. Дата публикации: 2024-02-08.

Reinforced polishing pad with a shaped or flexible window structure

Номер патента: WO2002078902A1. Автор: KANG Jia,Christian David Frederickson,Herbert Elliot Litvak,Eugene Y. Zhao,Michael David Steiman. Владелец: LAM RESEARCH CORPORATION. Дата публикации: 2002-10-10.

Polishing pad, polishing apparatus, and polishing method

Номер патента: US20240189959A1. Автор: Keisuke Namiki. Владелец: Ebara Corp. Дата публикации: 2024-06-13.

Molded polishing pad having integral window

Номер патента: EP1210209A1. Автор: John V. H. Roberts,David B. James,Barry Scott Pinheiro. Владелец: Rodel Holdings Inc. Дата публикации: 2002-06-05.

Polishing pad

Номер патента: EP1224060B1. Автор: Stanley E. Eppert, Jr.,Alan H. Saikin,Peter W. Freeman,Marco A. Acevedo. Владелец: Rodel Holdings Inc. Дата публикации: 2004-06-23.

Multi-layer polishing pad for low-pressure polishing

Номер патента: WO2006081286A2. Автор: Wei Lu,Yan Wang,Yongsik Moon,Alain Duboust,Siew Neo,Antoine Manens,Shou-sung Chang. Владелец: Applied Materials, Inc.. Дата публикации: 2006-08-03.

High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives

Номер патента: US20190168356A1. Автор: Bainian Qian,Kancharla-Arun K. Reddy,Marty W. Degroot,George C. Jacob. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2019-06-06.

Manufacturing method of abrasive particle mixture composition, abrasive particle mixture composition, polishing pad using the same, polishing pad manufacturing method, and chemical mechanical polishing method

Номер патента: JP4452015B2. Автор: ▲ひゅん▼淳 朴,容壽 崔. Владелец: Hynix Semiconductor Inc. Дата публикации: 2010-04-21.

Lifetime self-indicate polishing pad for chemical mechanical polisher comprises a pad with body having multicolored indicate layers with a top surface

Номер патента: FR2789005A1. Автор: Hsueh Chung Chen. Владелец: United Microelectronics Corp. Дата публикации: 2000-08-04.

Chemical mechanical polishing pad having holes and/or grooves

Номер патента: EP1417703B1. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2011-04-06.

Chemical mechanical polishing pad having holes and/or grooves

Номер патента: EP1417703A1. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2004-05-12.

Chemical mechanical polishing pad having holes and/or grooves

Номер патента: EP1417703A4. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2008-04-09.

Chemical mechanical polishing pad with micro-holes

Номер патента: EP1430520A1. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2004-06-23.

Chemical mechanical polishing pad with micro-holes

Номер патента: EP1430520A4. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: SKC Co Ltd. Дата публикации: 2008-04-09.

Chemical-mechanical polishing aid

Номер патента: GB9828786D0. Автор: . Владелец: United Microelectronics Corp. Дата публикации: 1999-02-17.

Polishing pad with recessed window

Номер патента: EP1667816A1. Автор: Kyle A. Cabot Microelectronics Corp. TURNER,Jeffrey L. Cabot Microelectronics Corp. BEELER,Kelly J. Cabot Microelectronics Corp. NEWELL. Владелец: Cabot Microelectronics Corp. Дата публикации: 2006-06-14.

Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer

Номер патента: WO2020176460A1. Автор: Kevin H. Song,Benedict W. Pang. Владелец: Applied Materials, Inc.. Дата публикации: 2020-09-03.

Chemical mechanical polishing pad, polishing layer analyzer and method

Номер патента: US20170197290A1. Автор: William A. Heeschen,Andrew Wank,Francis V. Acholla,Scott Chang,Jeff Tsai,Mark Gazze,James David Tate,Leo H. Chiang,Swee-Teng Chin. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-07-13.

Chemical mechanical polishing pad, polishing layer analyzer and method

Номер патента: US09737971B2. Автор: William A. Heeschen,Andrew Wank,Francis V. Acholla,Scott Chang,Jeff Tsai,Mark Gazze,James David Tate,Leo H. Chiang,Swee-Teng Chin. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-08-22.

Polishing pad having a pressure relief channel

Номер патента: US20050281983A1. Автор: Robert Gamble,T. Crkvenac,Jason Lawhorn. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2005-12-22.

Endpoint detection window, chemical mechanical polishing pad with window and preparation method thereof

Номер патента: US20240009797A1. Автор: Kai Chen,Lijun Yao,Jianguo SHI,Hongqi XIANG. Владелец: Inventech Materials Co Ltd. Дата публикации: 2024-01-11.

Chemical-mechanical polishing apparatus, polishing pad and method for manufacturing semiconductor device

Номер патента: US20030168169A1. Автор: Kiyoshi Tanaka,Akira Ishikawa,Satoru Ide,Eiichi Yamamoto,Takahiko Mitsui. Владелец: Nikon Corp. Дата публикации: 2003-09-11.

Chemical mechanical polishing tool, apparatus and method

Номер патента: WO2003022518A2. Автор: In-kwon Jeong. Владелец: Oriol, Inc.. Дата публикации: 2003-03-20.

Modular chemical mechanical polisher with simultaneous polishing and pad treatment

Номер патента: US20240075582A1. Автор: Steven M. Zuniga,Jay Gurusamy. Владелец: Applied Materials Inc. Дата публикации: 2024-03-07.

Modular chemical mechanical polisher with simultaneous polishing and pad treatment

Номер патента: WO2024049642A1. Автор: Steven M. Zuniga,Jay Gurusamy. Владелец: Applied Materials, Inc.. Дата публикации: 2024-03-07.

Chemical mechanical polishing pad and chemical mechanical polishing apparatus including the same

Номер патента: US11813714B2. Автор: Donghyuk Jang,Taesung Kim,Youngjin Hong,Seokjun HONG,Hojoong Kim,Junyong KIM. Владелец: Sungkyunkwan University Research and Business Foundation. Дата публикации: 2023-11-14.

Electrochemical mechanical polishing and planarization equipment for processing conductive wafer substrate

Номер патента: EP4364890A1. Автор: Donghui Wang,Yaomin Deng,Zhengting ZHU. Владелец: Hangzhou Sizone Electronic Technology Inc. Дата публикации: 2024-05-08.

Single drive system for a bi-directional linear chemical mechanical polishing apparatus

Номер патента: US20030022607A1. Автор: Douglas Young,Bernard Frey,Mark Henderson. Владелец: ASM Nutool Inc. Дата публикации: 2003-01-30.

Device and method for preventing settlement of particles on a chemical-mechanical polishing pad

Номер патента: US5968841A. Автор: Michael Francis Lofaro,William Francis Landers,Adam Dan Ticknor. Владелец: International Business Machines Corp. Дата публикации: 1999-10-19.

Groove cleaning device for chemical-mechanical polishing

Номер патента: US6135868A. Автор: Madhavi Chandrachood,Brian J. Brown,Robert Tolles,Doyle Bennett,James C. Nystrom. Владелец: Applied Materials Inc. Дата публикации: 2000-10-24.

An optimized grooving structure for a cmp polishing pad

Номер патента: WO2006026271A1. Автор: Peter Renteln. Владелец: J. H. Rhodes, Inc.. Дата публикации: 2006-03-09.

Groove cleaning device for chemical-mechanical polishing

Номер патента: WO1999041038A1. Автор: Brian J. Brown,Robert Tolles,Doyle Bennett,James C. Nystrom,Madhayi Chandrachood. Владелец: Applied Materials, Inc.. Дата публикации: 1999-08-19.

Method and apparatus for endpoint detection during chemical mechanical polishing

Номер патента: WO2003041909A1. Автор: Prabodh J. Parikh. Владелец: Speedfam-Ipec Corporation. Дата публикации: 2003-05-22.

Polishing pad for chemical-mechanical polishing of a semiconductor substrate

Номер патента: US5628862A. Автор: Chris C. Yu,Tat-Kwan Yu. Владелец: Motorola Inc. Дата публикации: 1997-05-13.

Polishing pad, polishing apparatus and polishing method

Номер патента: US6159088A. Автор: Hideharu Nakajima. Владелец: Sony Corp. Дата публикации: 2000-12-12.

Apparatus for distributing a fluid through a polishing pad

Номер патента: US20030027506A1. Автор: Stephen Schultz,John Herb. Владелец: Speedfam IPEC Corp. Дата публикации: 2003-02-06.

Wafer edge asymmetry correction using groove in polishing pad

Номер патента: US20240075583A1. Автор: Wei Lu,Jianshe Tang,Jimin Zhang,Brian J. Brown,Priscilla Diep. Владелец: Applied Materials Inc. Дата публикации: 2024-03-07.

Wafer edge asymmetry correction using groove in polishing pad

Номер патента: US11951589B2. Автор: Wei Lu,Jianshe Tang,Jimin Zhang,Brian J. Brown,Priscilla Diep. Владелец: Applied Materials Inc. Дата публикации: 2024-04-09.

Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing

Номер патента: US20030104761A1. Автор: Boguslaw Swedek,Andreas Wiswesser,Walter Schoenleber. Владелец: Applied Materials Inc. Дата публикации: 2003-06-05.

Removable polishing pad for chemical mechanical polishing

Номер патента: US20090124176A1. Автор: Leonard J. Borucki. Владелец: Araca Inc. Дата публикации: 2009-05-14.

CMP polishing pad

Номер патента: US6217426B1. Автор: Gopalakrishna B. Prabhu,Steven T. Mear,Robert D. Tolles,Hung Chen,Steven Zuniga. Владелец: Applied Materials Inc. Дата публикации: 2001-04-17.

Chemical mechanical polishing system and method of using

Номер патента: US11724360B2. Автор: Wen Yen Kung. Владелец: TSMC Nanjing Co Ltd. Дата публикации: 2023-08-15.

Polishing pad, conditioner and method for polishing the same

Номер патента: MY135978A. Автор: Lee Hyun Woo,KIM Sung Min,Kim Jae Seok,KIM Geon,LEE Jong Myung,Lee Ju Yeol,Park In Ha,Song Eu Gene. Владелец: SKC Co Ltd. Дата публикации: 2008-07-31.

Electrostatic suction cup device for wafer chemical mechanical polishing

Номер патента: US20240286244A1. Автор: Yao-Sung Wei. Владелец: Shoxproof Technology Co Ltd. Дата публикации: 2024-08-29.

Orbital motion chemical-mechanical polishing apparatus and method of fabrication

Номер патента: US5554064A. Автор: Michael R. Oliver,Joseph R. Breivogel,Christopher E. Barns,Samuel F. Louke,Leopoldo D. Yau. Владелец: Intel Corp. Дата публикации: 1996-09-10.

Polishing pad conditioner equipped polishing pad life time detecting device and polishing pad life time detecting method

Номер патента: KR20070028191A. Автор: 이창섭. Владелец: 동부일렉트로닉스 주식회사. Дата публикации: 2007-03-12.

Customized polish pads for chemical mechanical planarization

Номер патента: US20100273398A1. Автор: Pradip K. Roy,Sudhanshu Misra. Владелец: Individual. Дата публикации: 2010-10-28.

Chip customized polish pads for chemical mechanical planarization (cmp)

Номер патента: EP1610929A1. Автор: Pradip K. Roy. Владелец: Neopad Technologies Corp. Дата публикации: 2006-01-04.

Three-dimensional network for chemical mechanical polishing

Номер патента: US7604529B2. Автор: Gregory P. Muldowney. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2009-10-20.

Cmp polishing pad with protruding structures having engineered open void space

Номер патента: US20230311269A1. Автор: Bryan E. Barton,John R. McCormick. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-10-05.

Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus

Номер патента: US11964357B2. Автор: Kuntack Lee,Yonghee Lee,Byoungho Kwon,Taemin EARMME,Seungchul Han. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-04-23.

Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus

Номер патента: US20200346317A1. Автор: Kuntack Lee,Yonghee Lee,Byoungho Kwon,Taemin EARMME,Seungchul Han. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-11-05.

Methods to clean chemical mechanical polishing systems

Номер патента: US11850704B2. Автор: Kei-Wei Chen,Yen-Ting Chen,Chih-Chieh Chang,Hui-Chi Huang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-12-26.

Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies

Номер патента: US7479206B2. Автор: Jason B. Elledge. Владелец: Micron Technology Inc. Дата публикации: 2009-01-20.

Chemical-mechanical polishing apparatus

Номер патента: US6010395A. Автор: Hideharu Nakajima. Владелец: Sony Corp. Дата публикации: 2000-01-04.

Slurry recycling for chemical mechanical polishing system

Номер патента: US20220355441A1. Автор: Wen-Kuei Liu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2022-11-10.

Retainer ring used in chemical mechanical polishing apparatus

Номер патента: KR102510720B1. Автор: 송성훈,송종석. Владелец: 피코맥스(주). Дата публикации: 2023-03-16.

A chemical mechanical polishing semiconductor device and mehhod for preventing scratch

Номер патента: KR100568031B1. Автор: 심상철. Владелец: 동부아남반도체 주식회사. Дата публикации: 2006-04-05.

Slurry recycling for chemical mechanical planarization system

Номер патента: US20230256563A1. Автор: Wen-Kuei Liu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-08-17.

A chemical mechanical polishing semiconductor device and mehhod for preventing scratch

Номер патента: KR20050014350A. Автор: 심상철. Владелец: 동부아남반도체 주식회사. Дата публикации: 2005-02-07.

CMP polishing pad backside modifications for advantageous polishing results

Номер патента: US5913713A. Автор: Matthew J. Rutten,Terrance M. Wright,John E. Cronin,Roger W. Cheek,Douglas P. Nadeau. Владелец: International Business Machines Corp. Дата публикации: 1999-06-22.

Conditioning wheel for polishing pads

Номер патента: US20190358771A1. Автор: Chun-Hsi Huang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2019-11-28.

Grooved rollers for a linear chemical mechanical planarization system

Номер патента: WO2003057405A8. Автор: Xu Cangshan. Владелец: Lam Res Corp. Дата публикации: 2003-10-30.

Polishing apparatus and polishing pad

Номер патента: EP1395394A1. Автор: Shinro c/o Ebara Corporation OHTA,Kazuo c/o Ebara Corporation SHIMIZU. Владелец: Ebara Corp. Дата публикации: 2004-03-10.

Polishing-pad laminated structure, polishing-pad positioning instrument, and method of attaching a polishing pad to a polishing table

Номер патента: US11642753B2. Автор: Toshikazu Nomura,Nobuyuki Takahashi,Takashi Kishi,Masaki Kinoshita,Suguru Sakugawa. Владелец: Ebara Corp. Дата публикации: 2023-05-09.

Polishing-pad laminated structure, polishing-pad positioning instrument, and method of attaching a polishing pad to a polishing table

Номер патента: US20200023489A1. Автор: Toshikazu Nomura,Nobuyuki Takahashi,Takashi Kishi,Masaki Kinoshita,Suguru Sakugawa. Владелец: Ebara Corp. Дата публикации: 2020-01-23.

Polishing pad, polishing pad tile and method of manufacturing the polishing pad

Номер патента: WO2009025533A2. Автор: Yang-Soo Park,Won-Joon Kim. Владелец: Kolon Industries, Inc. Дата публикации: 2009-02-26.

Polishing pad, polishing pad tile and method of manufacturing the polishing pad

Номер патента: WO2009025533A3. Автор: Yang-Soo Park,Won-Joon Kim. Владелец: Won-Joon Kim. Дата публикации: 2009-04-30.

Grooved rollers for a linear chemical mechanical planarization system

Номер патента: EP1469971A4. Автор: Xu Cangshan. Владелец: Lam Research Corp. Дата публикации: 2005-01-12.

Grooved rollers for a linear chemical mechanical planarization system

Номер патента: US20030139124A1. Автор: Cangshan Xu. Владелец: Lam Research Corp. Дата публикации: 2003-07-24.

Polishing pad for substrate polishing apparatus and substrate polishing apparatus having polishing pad

Номер патента: US20200001424A1. Автор: Toshifumi Kimba. Владелец: Ebara Corp. Дата публикации: 2020-01-02.

Method of fabricating a polishing pad having an optical window

Номер патента: US20030084774A1. Автор: KYLE David. Владелец: Rodel Holdings Inc. Дата публикации: 2003-05-08.

Method of fabricating a polishing pad having an optical window

Номер патента: WO2003039812A1. Автор: Kyle W. David. Владелец: Rodel Holdings, Inc.. Дата публикации: 2003-05-15.

Polishing pad

Номер патента: US09737972B2. Автор: Kenji Nakamura. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-08-22.

Polishing pad and wafer notch polishing method

Номер патента: US20240293911A1. Автор: Takashi Ueno,Takatoshi Hattori,Takamasa Goto,Masatoshi Kishimoto,Sari SHOJI. Владелец: Bbs Kinmei Co Ltd. Дата публикации: 2024-09-05.

Polishing pad and polishing method

Номер патента: EP1447840A1. Автор: Hisatomo NIHON MICRO COATING CO. LTD. OHNO,Satoru NIHON MICRO COATING CO. LTD. SATO,Kazunari NIHON MICRO COATING CO. LTD. OSAWA. Владелец: Nihon Micro Coating Co Ltd. Дата публикации: 2004-08-18.

Method and apparatus for electrochemical mechanical polishing nip substrates

Номер патента: WO2008058200A3. Автор: Yuzhuo Li. Владелец: ST LAWRENCE NANOTECHNOLOGY Inc. Дата публикации: 2008-10-09.

Polishing pad conditioning system and method of using

Номер патента: US20240009801A1. Автор: Wen Yen Kung. Владелец: TSMC Nanjing Co Ltd. Дата публикации: 2024-01-11.

Method of adhering polishing pads and jig for adhering the same

Номер патента: MY138787A. Автор: Yoshio Nakamura,Harumichi Koyama. Владелец: Fujikoshi Machinery Corp. Дата публикации: 2009-07-31.

Method of adhering polishing pads and jig for adhering the same

Номер патента: MY137884A. Автор: Yoshio Nakamura. Владелец: Fujikoshi Machinery Corp. Дата публикации: 2009-03-31.

Fluid dispensing fixed abrasive polishing pad

Номер патента: WO2001024969A2. Автор: Liming Zhang,Andrew Black,Landon Vines. Владелец: Philips Semiconductors, Inc.. Дата публикации: 2001-04-12.

Polishing pad, manufacturing method of polishing pad and polishing method

Номер патента: US11850701B2. Автор: Yu-Piao Wang,Liang-Chi Tu. Владелец: Iv Technologies Co Ltd. Дата публикации: 2023-12-26.

Polishing pad having polishing surface with continuous protrusions

Номер патента: US09649742B2. Автор: Ping Huang,Alexander William Simpson,William C. Allison,Diane Scott,Robert Kerprich,Paul Andre Lefevre,Leslie M. Charns,James Richard Rinehart. Владелец: Nexplanar Corp. Дата публикации: 2017-05-16.

Polishing pad and surface polishing method

Номер патента: MY124043A. Автор: Nakamura Koji,ITO Yasushi,Ichino Mitsuyoshi,Ishizawa Yoshiaki,Shimobayashi Takahiro,Ikemori Gosuke,Fujisawa Yuichiro. Владелец: Fuji Electric Co Ltd. Дата публикации: 2006-06-30.

Apparatus of cleaning a polishing pad and polishing device

Номер патента: US11780050B2. Автор: Ji Hwan CHO. Владелец: SK Siltron Co Ltd. Дата публикации: 2023-10-10.

Laminated polishing pad and method for producing same

Номер патента: US20150079879A1. Автор: Kenji Nakamura. Владелец: Toyo Tire and Rubber Co Ltd. Дата публикации: 2015-03-19.

Laminated polishing pad and method for producing same

Номер патента: US09636796B2. Автор: Kenji Nakamura. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-05-02.

Polishing pad and method for producing same

Номер патента: MY159320A. Автор: Kenji Nakamura,Yoshiyuki Nakai,Kazuyuki Ogawa. Владелец: Rohm & Haas Elect Materials Cmp Holdings Inc. Дата публикации: 2016-12-30.

Method of fabricating polishing pad having detection window thereon

Номер патента: US7875335B2. Автор: Wen-Chang Shih,Yung-Chung Chang,Min-Kuei Chu,Lung-Chen Wei. Владелец: Iv Technologies Co Ltd. Дата публикации: 2011-01-25.

Thin polishing pad with window and molding process

Номер патента: WO2008154185A2. Автор: Thomas H. Osterheld,Dominic J. Benvegnu,Boguslaw A. Swedek,Jimin Zhang. Владелец: Applied Materials, Inc.. Дата публикации: 2008-12-18.

Method for manufacturing glass substrate for information recording medium, method for manufacturing information recording medium, and polishing pad

Номер патента: MY175952A. Автор: Komatsu Takafumi. Владелец: Hoya Corp. Дата публикации: 2020-07-16.

Polishing pad having a groove arrangement for reducing slurry consumption

Номер патента: US7125318B2. Автор: Gregory P. Muldowney. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2006-10-24.

Polishing pad for endpoint detection and related methods

Номер патента: US9333621B2. Автор: Manoocher Birang,Boguslaw A. Swedek. Владелец: Applied Materials Inc. Дата публикации: 2016-05-10.

Polishing pad having a groove arrangement for reducing slurry consumption

Номер патента: EP1533076A1. Автор: Gregory P. Muldowney. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2005-05-25.

Method of producing polishing pad

Номер патента: US20080047205A1. Автор: Chung-Chih Feng,I-Peng Yao,Yung-Chang Hung. Владелец: San Fang Chemical Industry Co Ltd. Дата публикации: 2008-02-28.

Polishing pad

Номер патента: US20140154962A1. Автор: Seiji Fukuda,Shigetaka Kasai,Ryoji Okuda,Nana Takeuchi. Владелец: TORAY INDUSTRIES INC. Дата публикации: 2014-06-05.

Chemical mechanical polishing apparatus and chemical mechanical polishing method

Номер патента: US20240278383A1. Автор: Dongchan Kim,Byoungho Kwon,Hwiyoung JEONG. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-08-22.

Method of manufacturing chemical mechanical polishing pads

Номер патента: US09770808B2. Автор: William A. Heeschen,Andrew Wank,Francis V. Acholla,Scott Chang,Jeff Tsai,Mark Gazze,James David Tate,Leo H. Chiang,Swee-Teng Chin. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-09-26.

Printing a chemical mechanical polishing pad

Номер патента: US20230278159A1. Автор: Rajeev Bajaj,Terrance Y. Lee,Barry Lee Chin. Владелец: Applied Materials Inc. Дата публикации: 2023-09-07.

Method and apparatus for endpoint detection for chemical mechanical polishing

Номер патента: WO2000054935A9. Автор: John A Adams,Robert A Eaton,Thomas Frederick Allen J Bibby. Владелец: Speedfam IPEC Corp. Дата публикации: 2002-06-20.

Uv-curable resins for chemical mechanical polishing pads

Номер патента: US20230406984A1. Автор: Ping Huang. Владелец: CMC Materials LLC. Дата публикации: 2023-12-21.

Uv-curable resins for chemical mechanical polishing pads

Номер патента: WO2023244740A1. Автор: Ping Huang. Владелец: CMC Materials LLC. Дата публикации: 2023-12-21.

Method and apparatus for endpoint detection for chemical mechanical polishing

Номер патента: US6106662A. Автор: John A. Adams,Christopher E. Barns,Thomas Frederick Allen Bibby, Jr.,Robert A. Eaton,Charles Hannes. Владелец: Speedfam IPEC Corp. Дата публикации: 2000-08-22.

Chemical Mechanical Planarization Pad Having Polishing Layer with Multi-lobed Embedded Features

Номер патента: US20240009798A1. Автор: Bainian Qian,Donna M. Alden,Sheng-Huan Tseng. Владелец: Rohm And Haas Electronic Materials Cmp Holidngs Inc. Дата публикации: 2024-01-11.

Layered-filament lattice for chemical mechanical polishing

Номер патента: US7517277B2. Автор: Gregory P. Muldowney. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2009-04-14.

Coated compressive subpad for chemical mechanical polishing

Номер патента: EP3221085A1. Автор: Diane Scott,Paul Andre Lefevre. Владелец: Nexplanar Corp. Дата публикации: 2017-09-27.

Polishing Pad for Chemical Mechanical Polishing and Method

Номер патента: US20230398659A1. Автор: Liang-Guang Chen,Shich-Chang Suen,Chih Hung Chen,Te-Chien Hou,Liang-Che Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-12-14.

Resin composition, polishing pad, and method for producing polishing pad

Номер патента: US11873399B2. Автор: Nobuyuki Takahashi,Ryujin Ishiuchi. Владелец: Resonac Corp. Дата публикации: 2024-01-16.

Resin composition, polishing pad, and method for producing polishing pad

Номер патента: US20210054192A1. Автор: Nobuyuki Takahashi,Ryujin Ishiuchi. Владелец: Showa Denko KK. Дата публикации: 2021-02-25.

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Номер патента: US12023853B2. Автор: Rajeev Bajaj,Fred C. Redeker,Kasiraman Krishnan,Mahendra C. Orilall,Daniel REDFIELD,Nag B. Patibandla,Gregory E. Menk,Jason G. Fung,Russell Edward Perry. Владелец: Applied Materials Inc. Дата публикации: 2024-07-02.

Polishing pad assembly with glass or crystalline window

Номер патента: US7614933B2. Автор: Dominic J. Benvegnu,Jeffrey Drue David,Bogdan Swedek. Владелец: Applied Materials Inc. Дата публикации: 2009-11-10.

Printing a chemical mechanical polishing pad

Номер патента: US12011801B2. Автор: Rajeev Bajaj,Terrance Y. Lee,Barry Lee Chin. Владелец: Applied Materials Inc. Дата публикации: 2024-06-18.

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Номер патента: US09776361B2. Автор: Rajeev Bajaj,Fred C. Redeker,Kasiraman Krishnan,Mahendra C. Orilall,Daniel REDFIELD,Nag B. Patibandla,Gregory E. Menk,Jason G. Fung,Russell Edward Perry. Владелец: Applied Materials Inc. Дата публикации: 2017-10-03.

Tiltable platform for additive manufacturing of a polishing pad

Номер патента: US20180079152A1. Автор: Sivapackia Ganapathiappan,Hou T. Ng,Nag B. Patibandla. Владелец: Applied Materials Inc. Дата публикации: 2018-03-22.

Method of making low specific gravity polishing pads

Номер патента: US20230390970A1. Автор: Nan-Rong Chiou. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-12-07.

Formulations for chemical mechanical polishing pads and CMP pads made therewith

Номер патента: US11806830B2. Автор: Teresa Brugarolas Brufau,Bryan E. Barton. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-11-07.

Apertured conditioning brush for chemical mechanical planarization systems

Номер патента: WO2007047996A3. Автор: Stephen J Benner. Владелец: Tbw Ind Inc. Дата публикации: 2007-10-04.

Ceramic polishing pad dresser and method for fabricating the same

Номер патента: US20070049185A1. Автор: Wei Huang,Yu-Tai Chen,Chou-Chih Tseng,Hsiu-Yi Lin. Владелец: Kinik Co. Дата публикации: 2007-03-01.

Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Номер патента: EP1128932A1. Автор: Andrew J. Nagengast,Anthony Meyer,Michael Labunsky,Glenn W. Travis,Tac Huynh. Владелец: Lam Research Corp. Дата публикации: 2001-09-05.

Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Номер патента: WO2000027585A1. Автор: Andrew J. Nagengast,Anthony Meyer,Michael Labunsky,Glenn W. Travis,Tac Huynh. Владелец: LAM RESEARCH CORPORATION. Дата публикации: 2000-05-18.

Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Номер патента: EP1128932A4. Автор: Anthony Meyer,Michael Labunsky,Andrew J Nagengast,Tac Huynh,Glenn W Travis. Владелец: Lam Research Corp. Дата публикации: 2007-01-10.

Polishing pad, preparation method thereof and method for preparing semiconductor device using same

Номер патента: US12138738B2. Автор: Kyung Hwan Kim,Jang Won Seo,Jae In Ahn,Sung Hoon Yun,Kang Sik MYUNG. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-11-12.

Anionic polishing pads formed by printing processes

Номер патента: US11851570B2. Автор: Rajeev Bajaj,Sivapackia Ganapathiappan,Hou T. Ng,Daniel REDFIELD,Nag B. Patibandla,Ashwin CHOCKALINGAM,Sudhakar Madhusoodhanan,Uma SRIDHAR,Yingdong Luo. Владелец: Applied Materials Inc. Дата публикации: 2023-12-26.

Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same

Номер патента: US11931856B2. Автор: Sunghoon YUN,Hye Young HEO,Jang Won Seo. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-03-19.

Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same

Номер патента: US20210122006A1. Автор: Sunghoon YUN,Hye Young HEO,Jang Won Seo. Владелец: SKC Solmics Co Ltd. Дата публикации: 2021-04-29.

Conditioner for chemical-mechanical-planarization pad and related methods

Номер патента: EP3793772A1. Автор: Rajesh Tiwari,Patrick Doering,Bruce Arrington,Conrad SURIAGA,Andrew Allan GALPIN. Владелец: Entegris Inc. Дата публикации: 2021-03-24.

Conditioner for chemical-mechanical-planarization pad and related methods

Номер патента: WO2019222302A1. Автор: Rajesh Tiwari,Patrick Doering,Bruce Arrington,Conrad SURIAGA,Andrew Allan GALPIN. Владелец: ENTEGRIS, INC.. Дата публикации: 2019-11-21.

Chemical mechanical planarization (cmp) pad conditioner and method of making

Номер патента: EP2652773A2. Автор: Srinivasan Ramanath,Jianhui Wu,Arup K. Khaund,Eric M. Schulz. Владелец: Saint Gobain Abrasifs SA. Дата публикации: 2013-10-23.

Composite polishing pad having layers with different hardness and process for producing the same

Номер патента: US09975214B2. Автор: Chun-Che Tsao,Te-Chao Liao,Wen-Jui Cheng,Tzai-Shing CHEN. Владелец: Nan Ya Plastics Corp. Дата публикации: 2018-05-22.

Polishing pad

Номер патента: US09707663B2. Автор: Satoshi Yanagisawa,Hiroyasu Kato,Masaharu Wada,Yukihiro Matsuzaki,Hajime Nishimura,Kuniyasu Shiro. Владелец: Toray Coatex Co Ltd. Дата публикации: 2017-07-18.

Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Номер патента: US09597769B2. Автор: Ping Huang,Alexander William Simpson,William C. Allison,Diane Scott,Paul Andre Lefevre,James P. LaCasse,Leslie M. Charns. Владелец: Nexplanar Corp. Дата публикации: 2017-03-21.

Polishing system, polishing pad and method of manufacturing semiconductor device

Номер патента: US12042900B2. Автор: Kyung Hwan Kim,Jang Won Seo,Jae In Ahn,Kang Sik F Myung. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-07-23.

Hand-held power tool, axial holding arrangement and polishing pad for such a power tool

Номер патента: EP4450222A1. Автор: Andrea Valentini. Владелец: Individual. Дата публикации: 2024-10-23.

Hand-held power tool, axial holding arrangement and polishing pad for such a power tool

Номер патента: US20240351160A1. Автор: Andrea Valentini. Владелец: Individual. Дата публикации: 2024-10-24.

Polishing pads and systems and methods of making and using the same

Номер патента: EP3359335A1. Автор: David F. Slama,Duy K. LEHUU. Владелец: 3M Innovative Properties Co. Дата публикации: 2018-08-15.

Method of forming a layered polishing pad

Номер патента: US7132033B2. Автор: Mark J. Boldizar,Robert T. Gamble,Vincent Matthew Hedrick,Jason M. Lawhorn,Alan H. Saikin,Katherine L. Tome. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2006-11-07.

Polishing pad

Номер патента: WO2003054097A1. Автор: Alan E. Wang,Robert G. Swisher,William C. Allison. Владелец: PPG Industries Ohio, Inc.. Дата публикации: 2003-07-03.

Polishing pad

Номер патента: EP1458830A1. Автор: Alan E. Wang,Robert G. Swisher,William C. Allison. Владелец: PPG Industries Ohio Inc. Дата публикации: 2004-09-22.

Polishing pad, process for producing the same and method of polishing therewith

Номер патента: US20060199473A1. Автор: Masato Yoshida,Masao Suzuki,Masaya Nishiyama,Hiroshi Nakagawa,Yasuo Shimamura. Владелец: Hitachi Chemical Co Ltd. Дата публикации: 2006-09-07.

Polishing pad and method for manufacturing polishing pad

Номер патента: EP4223452A1. Автор: Hiroshi Kurihara,Keisuke Tanaka,Kenichi Koike,Teppei Tateno,Yoshiki Miyauchi,Yoshie Kiraku. Владелец: Fujibo Holdins Inc. Дата публикации: 2023-08-09.

Polishing pad and method for manufacturing polishing pad

Номер патента: US20230415300A1. Автор: Hiroshi Kurihara,Keisuke Tanaka,Kenichi Koike,Teppei Tateno,Yoshiki Miyauchi,Yoshie Kiraku. Владелец: Fujibo Holdins Inc. Дата публикации: 2023-12-28.

Polishing pad comprising window similar in hardness to polishing layer

Номер патента: US11964360B2. Автор: Sunghoon YUN,Jang Won Seo,Jaein AHN,Joonsung RYOU. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-04-23.

Polishing pad, polishing apparatus and a method for polishing silicon wafer

Номер патента: US11471997B2. Автор: Yue Xie,Youhe Sha. Владелец: Zing Semiconductor Corp. Дата публикации: 2022-10-18.

Polishing pad and polishing method using same

Номер патента: US20190232460A1. Автор: Minori Takegoshi,Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co Ltd. Дата публикации: 2019-08-01.

Polishing pad, polishing apparatus and a method for polishing silicon wafer

Номер патента: US20220009051A1. Автор: Yue Xie,Youhe Sha. Владелец: Zing Semiconductor Corp. Дата публикации: 2022-01-13.

Polishing pad and method for producing same

Номер патента: US11780057B2. Автор: Sunghoon YUN,Jang Won Seo,Joonsung RYOU,Tae Kyoung Kwon. Владелец: SK Enpulse Co Ltd. Дата публикации: 2023-10-10.

Two step curing of polishing pad material in additive manufacturing

Номер патента: US20180079147A1. Автор: Sivapackia Ganapathiappan,Hou T. Ng,Nag B. Patibandla. Владелец: Applied Materials Inc. Дата публикации: 2018-03-22.

Method of manufacturing a polymer or polymer/composite polishing pad

Номер патента: US20020069591A1. Автор: Paul Yancey. Владелец: Rodel Holdings Inc. Дата публикации: 2002-06-13.

Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof

Номер патента: US20020106829A1. Автор: Jose Rodriguez,Arun Nanda,Charles Storey,Laurence Schultz. Владелец: Individual. Дата публикации: 2002-08-08.

Polishing pads and systems for and methods of using same

Номер патента: US20230211455A1. Автор: Eric C. Coad,Joseph D. Rule,Duy K. LEHUU. Владелец: 3M Innovative Properties Co. Дата публикации: 2023-07-06.

Cmp polishing pad

Номер патента: US20240091901A1. Автор: Bainian Qian,Nan-Rong Chiou,Donna M. Alden,Matthew Cimoch,Sheng-Huan Tseng. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2024-03-21.

Polishing pad, method for producing the same and method of fabricating semiconductor device using the same

Номер патента: US20220288743A1. Автор: Hye Young HEO,Jong Wook YUN,Jang Won Seo,Eun Sun JOENG,Sung Hoon Yun. Владелец: SKC Solmics Co Ltd. Дата публикации: 2022-09-15.

Silicate Composite Polishing Pad

Номер патента: US20120122381A1. Автор: Joseph K. So,Donna M. Alden,Andrew R. Wank,Mark E. Gazze,Robert Gargione,David Drop,Mai Tieu Banh,Shawn Riley,Colin E. Cameron, JR.. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2012-05-17.

Method for manufacturing a polishing sheet and a polishing pad

Номер патента: US20240066661A1. Автор: JANGWON SEO,Kyung Hwan Kim,Jong Wook YUN,Joonho AN,Chang Gyu Im. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-02-29.

Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing

Номер патента: US20070037491A1. Автор: Yuzhuo Li,Stuart Hellring,Tianxi Zhang,Jason Keleher. Владелец: PPG Industries Ohio Inc. Дата публикации: 2007-02-15.

Polishing pad for polishing a workpiece, chemical mechanical polishing apparatus, and method for polishing a workpiece using the chemical mechanical polishing apparatus

Номер патента: JP5789634B2. Автор: 遊 石井,賢也 伊藤,伊藤　賢也,正三 高橋,美加 鈴木. Владелец: Ebara Corp. Дата публикации: 2015-10-07.

CHEMICAL-MECHANICAL POLISHING PAD AND CHEMICAL-MECHANICAL POLISHING METHOD

Номер патента: US20130189907A1. Автор: HOSAKA Yukio,OKAMOTO Takahiro,Kubo Kotaro. Владелец: JSR Corporation. Дата публикации: 2013-07-25.

CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME

Номер патента: US20130316621A1. Автор: NISHIGUCHI Naoki,Shida Hirotaka,OKAMOTO Takahiro,Kubo Kotaro,Kamo Satoshi,Maekawa Ayako. Владелец: JSR Corporation. Дата публикации: 2013-11-28.

Chemical Mechanical Polishing Pad and Chemical Mechanical Polishing Method

Номер патента: KR100627202B1. Автор: 노부오 가와하시,고우 하세가와,히로시 시호,유끼오 호사까. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2006-09-25.

Chemical mechanical polishing pad and chemical mechanical polishing method

Номер патента: TW201201962A. Автор: Yukio Hosaka,Takahiro Okamoto,Kotaro Kubo. Владелец: JSR Corp. Дата публикации: 2012-01-16.

Chemical mechanical polishing pads and chemical mechanical grinding methods

Номер патента: TWI537098B. Автор: Yukio Hosaka,Takahiro Okamoto,Kotaro Kubo. Владелец: JSR Corp. Дата публикации: 2016-06-11.

Electrochemical mechanical polishing and planarization equipment for processing conductive wafer substrate

Номер патента: US20240149361A1. Автор: Donghui Wang,Yaomin Deng,Zhengting ZHU. Владелец: Hangzhou Sizone Electronic Technology Inc. Дата публикации: 2024-05-09.

Chemical mechanical polishing apparatus

Номер патента: US12020946B2. Автор: Yu-Ping TSENG,Ren-Hao JHENG. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-06-25.

Methods of detecting non-conforming substrate processing events during chemical mechanical polishing

Номер патента: US12036635B2. Автор: Jamie Stuart Leighton,Jeonghoon Oh,Ashish BHUSHAN,John Anthony GARCIA,Stephen Thomas CORMIER,Nick Joseph JACKSON,Manoj BALAKUMAR,Nandkishore PATIDAR. Владелец: Applied Materials Inc. Дата публикации: 2024-07-16.

Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk

Номер патента: US11766758B2. Автор: Wen-Pin HO,Ren-Hao JHENG,S. P. Cheng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-09-26.

Chemical mechanical polishing apparatus

Номер патента: US20240304455A1. Автор: Yu-Ping TSENG,Ren-Hao JHENG. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-09-12.

Chemical mechanical polishing device and polishing method

Номер патента: US20240227122A9. Автор: Kai-Yao Shih,Ming-Hsiang Chen,Shih-Ci Yen. Владелец: Powerchip Semiconductor Manufacturing Corp. Дата публикации: 2024-07-11.

Chemical mechanical polishing (cmp) apparatus

Номер патента: US20240157502A1. Автор: Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-16.

Chemical mechanical polishing apparatus and method

Номер патента: US12076831B2. Автор: Shih-Ho Lin,Jen-Chieh LAI,Jheng-Si SU,Yu-chen Wei,Chun-Chieh Chan. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-09-03.

Steam generation for chemical mechanical polishing

Номер патента: WO2024215780A2. Автор: Jianshe Tang,Shou-sung Chang,Jeonghoon Oh,Haosheng Wu,Chad POLLARD,Jonathan P. Domin,Sih-Ling Yeh. Владелец: Applied Materials, Inc.. Дата публикации: 2024-10-17.

Chemical mechanical polishing apparatus and method

Номер патента: US11738423B2. Автор: Cheng-Chin Peng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-08-29.

Steam generation for chemical mechanical polishing

Номер патента: US20240342855A1. Автор: Jianshe Tang,Shou-sung Chang,Jeonghoon Oh,Haosheng Wu,Chad POLLARD,Jonathan P. Domin,Sih-Ling Yeh. Владелец: Applied Materials Inc. Дата публикации: 2024-10-17.

System, control method and apparatus for chemical mechanical polishing

Номер патента: US20230390882A1. Автор: Kei-Wei Chen,Shich-Chang Suen,Te-Chien Hou,Wen-Pin Liao,Chen-Chi Tang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-12-07.

Ditch type floating ring for chemical mechanical polishing

Номер патента: US20020086536A1. Автор: Wei-Chieh Hsu. Владелец: Vanguard International Semiconductor Corp. Дата публикации: 2002-07-04.

Apparatus and system of chemical mechanical polishing

Номер патента: US20020132567A1. Автор: Hai-Ching Chen. Владелец: Individual. Дата публикации: 2002-09-19.

Reinforced polishing pad for linear chemical mechanical polishing and method for forming

Номер патента: US20030013398A1. Автор: Tsu Shih,Wen-Chih Chiou,Ying-Ho Chen,Syun-Ming Jang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2003-01-16.

Active acoustic monitoring for chemical mechanical polishing

Номер патента: US20220281058A1. Автор: Thomas H. Osterheld,Dominic J. Benvegnu,Boguslaw A. Swedek,Nicholas A. Wiswell,Sohrab POURMAND. Владелец: Applied Materials Inc. Дата публикации: 2022-09-08.

Retainer ring for chemical-mechanical polishing device

Номер патента: US20160158910A1. Автор: Jae-Bok Lee,Jun-Je LEE. Владелец: Will Be S and T Co Ltd. Дата публикации: 2016-06-09.

Retainer ring for chemical-mechanical polishing device

Номер патента: US09827647B2. Автор: Jae-Bok Lee,Jun-Je LEE. Владелец: Will Be S and T Co Ltd. Дата публикации: 2017-11-28.

Chemical mechanical polishing apparatus

Номер патента: US20020142711A1. Автор: Hsin-Chuan Tsai,Shan-Chang Wang. Владелец: Nanya Technology Corp. Дата публикации: 2002-10-03.

Chemical mechanical polishing apparatus

Номер патента: US6761624B2. Автор: Hsin-Chuan Tsai,Shan-Chang Wang. Владелец: Nanya Technology Corp. Дата публикации: 2004-07-13.

Method and system for monitoring polishing pad before cmp process

Номер патента: US20180169825A1. Автор: Yen-Chih Chen,Yi-Chang Liu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-06-21.

Conditioner and chemical mechanical polishing apparatus including the same

Номер патента: US20190358772A1. Автор: Yong-Hee Lee,Jong-hwi SEO,Seung-Chul Han,Hui-Gwan LEE. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2019-11-28.

Chemical mechanical polishing system

Номер патента: US20050095963A1. Автор: David Stark,Christopher Schutte. Владелец: Texas Instruments Inc. Дата публикации: 2005-05-05.

Substrate holder to reduce substrate edge stress during chemical mechanical polishing

Номер патента: WO2012012056A2. Автор: HUNG Chih Chen,Samuel Chu-Chiang Hsu,Denis M. Koosau,Gautam Shashank. Владелец: Applied Materials, Inc.. Дата публикации: 2012-01-26.

Substrate holder to reduce substrate edge stress during chemical mechanical polishing

Номер патента: WO2012012056A3. Автор: HUNG Chih Chen,Samuel Chu-Chiang Hsu,Denis M. Koosau,Gautam Shashank. Владелец: Applied Materials, Inc.. Дата публикации: 2012-04-12.

Monitoring of polishing pad texture in chemical mechanical polishing

Номер патента: US20230321788A1. Автор: Thomas H. Osterheld,Benjamin Cherian. Владелец: Applied Materials Inc. Дата публикации: 2023-10-12.

Electrochemical mechanical polishing and planarization equipment for processing conductive wafer substrate

Номер патента: US12017293B2. Автор: Donghui Wang,Yaomin Deng,Zhengting ZHU. Владелец: Hangzhou Sizone Electronic Technology Inc. Дата публикации: 2024-06-25.

Chemical mechanical polishing method

Номер патента: US11673223B2. Автор: Shih-Ho Lin,Jen-Chieh LAI,Jheng-Si SU,Yu-chen Wei,Chun-Chieh Chan. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-06-13.

Spray system for slurry reduction during chemical mechanical polishing (cmp)

Номер патента: US11819976B2. Автор: Christopher Heung-Gyun Lee,Shou-sung Chang,Chih Chung Chou,Ekaterina MIKHAYLICHENKO,Erik Rondum,Anand Nilakantan IYER,Tiffany Yu-nung Cheung. Владелец: Applied Materials Inc. Дата публикации: 2023-11-21.

Chemical mechanical polishing slurry pump monitoring system and method

Номер патента: US20050101223A1. Автор: Daniel Caldwell,Thomas Kiez. Владелец: Texas Instruments Inc. Дата публикации: 2005-05-12.

Chemical mechanical polishing apparatus using a magnetically coupled pad conditioning disk

Номер патента: US20230364731A1. Автор: Wen-Pin HO,Ren-Hao JHENG,S.P. Cheng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-16.

Chemical mechanical polishing temperature scanning apparatus for temperature control

Номер патента: US11752589B2. Автор: Jianshe Tang,Shou-sung Chang,Hari Soundararajan,Haosheng Wu. Владелец: Applied Materials Inc. Дата публикации: 2023-09-12.

Chemical mechanical polishing temperature scanning apparatus for temperature control

Номер патента: US20230356351A1. Автор: Jianshe Tang,Shou-sung Chang,Hari Soundararajan,Haosheng Wu. Владелец: Applied Materials Inc. Дата публикации: 2023-11-09.

Chemical mechanical polishing device and polishing method

Номер патента: US20240131655A1. Автор: Kai-Yao Shih,Ming-Hsiang Chen,Shih-Ci Yen. Владелец: Powerchip Semiconductor Manufacturing Corp. Дата публикации: 2024-04-25.

Chemical mechanical polishing temperature scanning apparatus for temperature control

Номер патента: WO2020214706A1. Автор: Jianshe Tang,Shou-sung Chang,Hari Soundararajan,Haosheng Wu. Владелец: Applied Materials, Inc.. Дата публикации: 2020-10-22.

Chemical mechanical polishing with multiple polishing pads

Номер патента: US20030190865A1. Автор: Sasson Somekh. Владелец: Applied Materials Inc. Дата публикации: 2003-10-09.

External heating system for use in chemical mechanical polishing system

Номер патента: US11633829B2. Автор: Chun-Wei Hsu,Chi-hsiang Shen,Chi-Jen Liu,Yi-Sheng Lin,Yang-chun Cheng,Kei-Wei Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-04-25.

Slurry distribution device for chemical mechanical polishing

Номер патента: US11806835B2. Автор: Jianshe Tang,Paul D. Butterfield,Stephen Jew,Shou-sung Chang,Bum Jick KIM,Haosheng Wu,Yen-Chu Yang,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2023-11-07.

External heating system for use in chemical mechanical polishing system

Номер патента: US20230294237A1. Автор: Chun-Wei Hsu,Chi-hsiang Shen,Chi-Jen Liu,Yi-Sheng Lin,Yang-chun Cheng,Kei-Wei Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-09-21.

Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing

Номер патента: US20230182259A1. Автор: Hui Chen,Shou-sung Chang,Surajit Kumar,Chih Chung Chou. Владелец: Applied Materials Inc. Дата публикации: 2023-06-15.

Slurry distribution device for chemical mechanical polishing

Номер патента: US11986926B2. Автор: Jianshe Tang,Paul D. Butterfield,Stephen Jew,Shou-sung Chang,Bum Jick KIM,Haosheng Wu,Yen-Chu Yang,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2024-05-21.

Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing

Номер патента: WO2022006012A1. Автор: Hui Chen,Shou-sung Chang,Surajit Kumar,Chih Chung Chou. Владелец: Applied Materials, Inc.. Дата публикации: 2022-01-06.

Spray system for slurry reduction during chemical mechanical polishing (cmp)

Номер патента: US20240042571A1. Автор: Christopher Heung-Gyun Lee,Shou-sung Chang,Chih Chung Chou,Erik Rondum,Ekaterina A. MIKHAYLICHENKO,Anand Nilakantan IYER,Tiffany Yu-nung Cheung. Владелец: Applied Materials Inc. Дата публикации: 2024-02-08.

Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing

Номер патента: EP4171872A1. Автор: Hui Chen,Shou-sung Chang,Surajit Kumar,Chih Chung Chou. Владелец: Applied Materials Inc. Дата публикации: 2023-05-03.

Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus

Номер патента: US20030139117A1. Автор: Jen-Chieh Tung,Kuan-Fu Chang,Sheng-Jan Chang,Yu-Wei Chih. Владелец: Individual. Дата публикации: 2003-07-24.

Monitor chemical mechanical polishing process using machine learning based processing of heat images

Номер патента: EP4329981A1. Автор: Thomas H. Osterheld,Benjamin Cherian. Владелец: Applied Materials Inc. Дата публикации: 2024-03-06.

Light sensitive chemical-mechanical polishing aggregate

Номер патента: US20010028052A1. Автор: David Carlson. Владелец: Individual. Дата публикации: 2001-10-11.

Method of chemical mechanical polishing

Номер патента: US20050070091A1. Автор: Hyo-Jong Lee,Sung-Bae Lee,Sang-Rok Ha. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2005-03-31.

Chemical mechanical polishing apparatus and method

Номер патента: US20230330810A1. Автор: Cheng-Chin Peng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-10-19.

Chemical mechanical polishing apparatus with integrated slurry mixer-dispenser and methods for operating the same

Номер патента: US20230373062A1. Автор: Yu-chen Wei,Feng-Inn Wu,You-Shiang Lin,Jiun Ru Huang,Jyun-Jie Wu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-23.

Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing

Номер патента: US6531397B1. Автор: Ronald J. Nagahara,Dawn M. Lee. Владелец: LSI Logic Corp. Дата публикации: 2003-03-11.

Chemical mechanical polishing apparatus and method

Номер патента: US20230381918A1. Автор: Chia-Lin Hsueh,Chun-Hsi Huang,Huang-Chu KO. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-30.

Installation for improving chemical-mechanical polishing operation

Номер патента: US6062955A. Автор: Ying-Chih Liu. Владелец: Worldwide Semiconductor Manufacturing Corp. Дата публикации: 2000-05-16.

Arrangement and method for conditioning a polishing pad

Номер патента: EP1270148A1. Автор: Walter Glashauser,Benno Utess,Andreas Purath,Peter Faustmann. Владелец: Infineon Technologies SC300 GmbH and Co KG. Дата публикации: 2003-01-02.

Novel chemical-mechanical polishing apparatus

Номер патента: US20230286106A1. Автор: Chun-Hsi Huang,Huang-Chu KO. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-09-14.

Process for chemical mechanical polishing

Номер патента: US20030064594A1. Автор: Alfred Kersch,Johannes Baumgartl,Stephanie Delage. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2003-04-03.

Chemical mechanical polishing apparatus with stable signals

Номер патента: US6568988B1. Автор: Chun-Chieh Lee,Hua-Jen Tseng,Dong-Tay Tsai,Yi-Hua Chin. Владелец: Mosel Vitelic Inc. Дата публикации: 2003-05-27.

Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces

Номер патента: EP1633526A2. Автор: Jason B. Elledge. Владелец: Micron Technology Inc. Дата публикации: 2006-03-15.

Chemical mechanical polishing apparatus with improved carrier and method of use

Номер патента: US5624299A. Автор: Norman Shendon. Владелец: Applied Materials Inc. Дата публикации: 1997-04-29.

Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical mechanical polishing

Номер патента: EP1372907A2. Автор: Miguel A. Saldana,Damon Vincent Williams. Владелец: Lam Research Corp. Дата публикации: 2004-01-02.

Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical-mechanical polishing

Номер патента: EP1372907B1. Автор: Miguel A. Saldana,Damon Vincent Williams. Владелец: Lam Research Corp. Дата публикации: 2006-11-29.

Apparatus and method for distribution of slurry in a chemical mechanical polishing system

Номер патента: US5709593A. Автор: William L. Guthrie,Norm Shendon,Semyon Spektor,Ivan A. Ocanada. Владелец: Applied Materials Inc. Дата публикации: 1998-01-20.

Controlled retention of slurry in chemical mechanical polishing

Номер патента: US6019665A. Автор: Solomon I. Beilin,Michael G. Lee. Владелец: Fujitsu Ltd. Дата публикации: 2000-02-01.

Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method

Номер патента: US8277286B2. Автор: Huang Soon Kang,Zin-Chang Wei,Kun-Ku Hung,Chyi-Shyuan Chern. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2012-10-02.

Operation of clamping retainer for chemical mechanical polishing

Номер патента: US20230381915A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh. Владелец: Applied Materials Inc. Дата публикации: 2023-11-30.

Chemical mechanical polishing with applied magnetic field

Номер патента: US11787008B2. Автор: Feng Q. Liu,Jianshe Tang,Stephen Jew,Xingfeng Wang,David M. GAGE. Владелец: Applied Materials Inc. Дата публикации: 2023-10-17.

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

Номер патента: US20230364733A1. Автор: Chi-hsiang Shen,Liang-Guang Chen,Kei-Wei Chen,Ji Cui,Ting-Hsun CHANG,Chun-Chieh Lin,Chih Hung Chen,Tsung Hsien Chang,Fu-Ming HUANG,Hung Yen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-16.

Chemical mechanical polishing apparatus including a multi-zone platen

Номер патента: US11772228B2. Автор: Chi-hsiang Shen,Liang-Guang Chen,Kei-Wei Chen,Ji Cui,Ting-Hsun CHANG,Chun-Chieh Lin,Chih Hung Chen,Tsung Hsien Chang,Fu-Ming HUANG,Hung Yen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-10-03.

Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher

Номер патента: US5916012A. Автор: Anil K. Pant,Joseph R. Breivogel,Douglas W. Young,Robert M. Rivera. Владелец: Lam Research Corp. Дата публикации: 1999-06-29.

Chemical mechanical polishing (cmp) apparatus and method of controlling thereof

Номер патента: US20240238936A1. Автор: Wonkeun Cho,Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-18.

Control of steam generation for chemical mechanical polishing

Номер патента: US11833637B2. Автор: Paul D. Butterfield,Shou-sung Chang,Calvin Lee,Hari Soundararajan,Haosheng Wu,Chad POLLARD,Dmitry Sklyar,Jonathan P. Domin,Shuchivrat DATAR. Владелец: Applied Materials Inc. Дата публикации: 2023-12-05.

Control of steam generation for chemical mechanical polishing

Номер патента: US20230415297A1. Автор: Paul D. Butterfield,Shou-sung Chang,Calvin Lee,Hari Soundararajan,Haosheng Wu,Chad POLLARD,Dmitry Sklyar,Jonathan P. Domin,Shuchivrat DATAR. Владелец: Applied Materials Inc. Дата публикации: 2023-12-28.

Retainer for chemical mechanical polishing carrier head

Номер патента: US11344991B2. Автор: Steven M. Zuniga,Andrew J. Nagengast. Владелец: Applied Materials Inc. Дата публикации: 2022-05-31.

Retaining ring for use in chemical mechanical polishing

Номер патента: US6821192B1. Автор: Timothy J. Donohue. Владелец: Applied Materials Inc. Дата публикации: 2004-11-23.

Titanium dioxide chemical-mechanical polishing composition for polishing nickel substrates

Номер патента: US20240174891A1. Автор: Cheng-Yuan Ko,Jin-Hao JHANG. Владелец: CMC Materials LLC. Дата публикации: 2024-05-30.

Titanium dioxide chemical-mechanical polishing composition for polishing nickel substrates

Номер патента: WO2024107316A1. Автор: Cheng-Yuan Ko,Jin-Hao JHANG. Владелец: ENTEGRIS, INC.. Дата публикации: 2024-05-23.

Chemical mechanical polishing apparatus and a method for planarizing/polishing a surface

Номер патента: US20070026769A1. Автор: Eugene Davis,Kyle Hunt,Daniel Caldwell. Владелец: Texas Instruments Inc. Дата публикации: 2007-02-01.

Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer

Номер патента: US6517421B2. Автор: Choul-Gue Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2003-02-11.

A carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus

Номер патента: EP1045740A1. Автор: Steven M. Zuniga,Hung Chen. Владелец: Applied Materials Inc. Дата публикации: 2000-10-25.

Retaining ring with trigger for chemical mechanical polishing apparatus

Номер патента: US20050014452A1. Автор: Peter Khuu. Владелец: Khuus Inc. Дата публикации: 2005-01-20.

Wafer carrier structure for chemical-mechanical polisher

Номер патента: US20020173253A1. Автор: Chi-Feng Cheng. Владелец: Macronix International Co Ltd. Дата публикации: 2002-11-21.

Retainiing ring with trigger for chemical mechanical polishing apparatus

Номер патента: WO2005009679A2. Автор: Peter Khuu. Владелец: Khuu's Inc., Dba Kamet. Дата публикации: 2005-02-03.

Methods and systems for chemical mechanical polish cleaning

Номер патента: US09966281B2. Автор: Hui-Chi Huang,Chien-Ping Lee. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-05-08.

Method of chemical mechanical polish operation and chemical mechanical polishing system

Номер патента: US20230256561A1. Автор: Yu-Chu Hsu,Chunhung Chen,Ren-Dou Lee. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-08-17.

Chemical mechanical planarization tool

Номер патента: US12030159B2. Автор: Kei-Wei Chen,Tung-Kai Chen,Hui-Chi Huang,Wan-Chun Pan,Shang-Yu Wang,Zink Wei. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-07-09.

Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step

Номер патента: US7268000B2. Автор: Gerd Marxsen,Dirk Wollstein,Jan Raebiger. Владелец: Advanced Micro Devices Inc. Дата публикации: 2007-09-11.

Chemical-mechanical polishing method and apparatus using ultrasound applied to the carrier and platen

Номер патента: US5688364A. Автор: Junichi Sato. Владелец: Sony Corp. Дата публикации: 1997-11-18.

Chemical mechanical polishing method and chemical mechanical polishing device

Номер патента: EP2079106A3. Автор: Masanori Miyata,Kenji Nishihara,Tetsuya Okada,Akinori Suzuki,Tadao Uehara,Koichi Sogawa,Tohru Haruki,Taro Usami,Shisyo Chin,Hiroaki Teratani,Yuuichi Kohno. Владелец: Ricoh Co Ltd. Дата публикации: 2012-03-07.

Light sensitive chemical-mechanical polishing method

Номер патента: US20010053606A1. Автор: David Carlson. Владелец: Individual. Дата публикации: 2001-12-20.

Method of and apparatus for chemical-mechanical polishing

Номер патента: US20020182978A1. Автор: Ralf Lukner,Owen Hehmeyer. Владелец: Momentum Technical Consulting Inc. Дата публикации: 2002-12-05.

Endpoint control of multiple substrates with multiple zones on the same platen in chemical mechanical polishing

Номер патента: US20110282477A1. Автор: Jeffrey Drue David,Boguslaw A. Swedek,Jimin Zhang,Harry Q. Lee. Владелец: Applied Materials Inc. Дата публикации: 2011-11-17.

Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies

Номер патента: US20030057185A1. Автор: Gundu Sabde,Jim Hofmann,Scott Moore,Stephen Kramer. Владелец: Individual. Дата публикации: 2003-03-27.

Loading device of chemical mechanical polishing equipment for semiconductor wafers

Номер патента: WO2007061170A1. Автор: Young Su Heo,Chang Il Kim,Young Min Na. Владелец: Doosan Mecatec Co., Ltd.. Дата публикации: 2007-05-31.

Sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing systems

Номер патента: US11850700B2. Автор: Jamie Stuart Leighton,Van H. Nguyen,Jeonghoon Oh,Roger M. Johnson. Владелец: Applied Materials Inc. Дата публикации: 2023-12-26.

Method for analyzing effective polishing frequency and effective polishing times for chemical mechanical planarization polishing wafers with different polishing pad profiles

Номер патента: US20060240745A1. Автор: Zone-Ching Lin,Chein-Chung Chen. Владелец: National Taiwan University of Science and Technology NTUST. Дата публикации: 2006-10-26.

Method for analyzing effective polishing frequency and effective polishing times for chemical mechanical planarization polishing wafers with different polishing pad profiles

Номер патента: US7299107B2. Автор: Zone-Ching Lin,Chein-Chung Chen. Владелец: National Taiwan University of Science and Technology NTUST. Дата публикации: 2007-11-20.

Chemical mechanical polishing machine and fabrication processes using the same.

Номер патента: GB2342605A. Автор: Juan-Yuan Wu,Chien-Hsin Lai,Juen-Kuen Lin,Daniel Chiu,Chih-Chiang Yang,Peng-Yih Peng,Kun-Lin Wu,Hao-Kuang Chiu. Владелец: United Microelectronics Corp. Дата публикации: 2000-04-19.

Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve

Номер патента: US20030024582A1. Автор: Andreas Fischer,Stefan Geyer. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2003-02-06.

Valve for a slurry outlet opening of a chemical mechanical polishing device and chemical mechanical polishing device having a valve

Номер патента: US6854484B2. Автор: Andreas Fischer,Stefan Geyer. Владелец: INFINEON TECHNOLOGIES AG. Дата публикации: 2005-02-15.

Removal rate estimating method of a chemical mechanical polishing process under mixed products or mixed layers

Номер патента: US20070145010A1. Автор: Chih-Wei Lai,Ming-Wei Lee. Владелец: Industrial Technology Research Institute ITRI. Дата публикации: 2007-06-28.

Retaining ring for chemical mechanical polishing

Номер патента: US8556684B2. Автор: William B. Sather,Adam W. Manzonie. Владелец: SPM Technology Inc. Дата публикации: 2013-10-15.

Multi-action chemical mechanical planarization device and method

Номер патента: US6514129B1. Автор: David G. Halley. Владелец: Strasbaugh Inc. Дата публикации: 2003-02-04.

Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing

Номер патента: WO2003002302A1. Автор: Robert A. Eaton. Владелец: Speedfam-Ipec Corporation. Дата публикации: 2003-01-09.

Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus

Номер патента: US20040261945A1. Автор: Wilfried Ensinger. Владелец: Ensinger Kunststofftechnologie GbR. Дата публикации: 2004-12-30.

Chemical-mechanical-polishing system with continuous filtration

Номер патента: US6244929B1. Автор: Daniel Thomas,Richard D. Russ. Владелец: VLSI Technology Inc. Дата публикации: 2001-06-12.

Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method

Номер патента: US20240091902A1. Автор: Younghun Kim,Sangyun Lee. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-03-21.

Chemical mechanical polishing method with in-line thickness detection

Номер патента: US6117780A. Автор: Kuei-Chang Tsai,Chin-Hsiang Chang,Li-Chun Hsien,Yun-Liang Ouyang. Владелец: Mosel Vitelic Inc. Дата публикации: 2000-09-12.

Polisher for chemical mechanical polishing process

Номер патента: KR20020053941A. Автор: 한동원. Владелец: 박종섭. Дата публикации: 2002-07-06.

Apparatus and method for chemical mechanical polishing of substrates

Номер патента: EP1307320A1. Автор: Jason Melvin,Hilario L. Oh,Nam P. Suh. Владелец: ASML US Inc. Дата публикации: 2003-05-07.

Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same

Номер патента: US20030234078A1. Автор: Chia-Lin Hsu,Hsueh-Chung Chen,Shih-Hsun Hsu,Art Yu. Владелец: United Microelectronics Corp. Дата публикации: 2003-12-25.

An apparatus for and method of polishing a semiconductor wafer using chemical mechanical planarization

Номер патента: WO2008023288A2. Автор: Eoin O'dea. Владелец: Eoin O'dea. Дата публикации: 2008-02-28.

Method and apparatus for controlling backside pressure during chemical mechanical polishing

Номер патента: US5925576A. Автор: Cheng-An Peng. Владелец: Promos Technologies Inc. Дата публикации: 1999-07-20.

Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process

Номер патента: US6361414B1. Автор: Mike Ravkin,Katrina Mikhaylich,Don E. Anderson. Владелец: Lam Research Corp. Дата публикации: 2002-03-26.

Chemical mechanical polishing

Номер патента: GB2345257A. Автор: Juan-Yuan Wu,Chien-Hsin Lai,Juen-Kuen Lin,Daniel Chiu,Chih-Chiang Yang,Peng-Yih Peng,Kun-Lin Wu,Hao-Kuang Chiu. Владелец: United Microelectronics Corp. Дата публикации: 2000-07-05.

Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof

Номер патента: US20040121704A1. Автор: Jun Liu,Huey-Ming Wang,Kunihiko Sakurai,Gerard Moloney,Peter Lao. Владелец: Ebara Technologies Inc. Дата публикации: 2004-06-24.

Chemical Mechanical Planarization Tool

Номер патента: US20230321789A1. Автор: Kei-Wei Chen,Tung-Kai Chen,Hui-Chi Huang,Wan-Chun Pan,Shang-Yu Wang,Zink Wei. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-10-12.

In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization

Номер патента: US7024063B2. Автор: Wallace T. Y. Tang. Владелец: Applied Materials Inc. Дата публикации: 2006-04-04.

Chemical-mechanical polishing (CMP) apparatus

Номер патента: US5705435A. Автор: Lai-Tuh Chen. Владелец: Industrial Technology Research Institute ITRI. Дата публикации: 1998-01-06.

Compliant inner ring for a chemical mechanical polishing system

Номер патента: US20230356354A1. Автор: Steven M. Zuniga,Satish Radhakrishnan,Andrew Nagengast,Jeonghoon Oh,Hari Prasath RAJENDRAN,Ekaterina A. MIKHAYLICHENKO,Eric L. Lau,Kuen-Hsiang Chen. Владелец: Applied Materials Inc. Дата публикации: 2023-11-09.

Apparatus and method for chemical mechanical polishing

Номер патента: US20200198088A1. Автор: Ilcheol Shin,Sung-Chang Park,Kyoungwoo Kim,Young-Kyun Woo,Hak-Jae Im. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-06-25.

Retainer for chemical mechanical polishing carrier head

Номер патента: WO2024049890A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh,Eric Lau,Kuen-Hsiang Chen. Владелец: Applied Materials, Inc.. Дата публикации: 2024-03-07.

Chemical mechanical polishing fixture having lateral perforation structures

Номер патента: US20140342643A1. Автор: Hui-Chen Yen. Владелец: KAI FUNG TECHNOLOGY Co Ltd. Дата публикации: 2014-11-20.

Compliant inner ring for a chemical mechanical polishing system

Номер патента: WO2023214985A1. Автор: Steven M. Zuniga,Satish Radhakrishnan,Andrew Nagengast,Jeonghoon Oh,Hari Prasath RAJENDRAN,Ekaterina A. MIKHAYLICHENKO,Eric L. Lau,Kuen-Hsiang Chen. Владелец: Applied Materials, Inc.. Дата публикации: 2023-11-09.

Carrier head with layer of conformable material for a chemical mechanical polishing system

Номер патента: US6036587A. Автор: Robert D. Tolles,John Prince,Tsungan Cheng. Владелец: Applied Materials Inc. Дата публикации: 2000-03-14.

Carrier head for chemical mechanical polishing

Номер патента: US6165058A. Автор: Hung Chen,Steven Zuniga. Владелец: Applied Materials Inc. Дата публикации: 2000-12-26.

Clamping retainer for chemical mechanical polishing

Номер патента: US20230381917A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh. Владелец: Applied Materials Inc. Дата публикации: 2023-11-30.

Dual membrane carrier head for chemical mechanical polishing

Номер патента: US20240042574A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jay Gurusamy. Владелец: Applied Materials Inc. Дата публикации: 2024-02-08.

In-situ defect count detection in post chemical mechanical polishing

Номер патента: US20230298949A1. Автор: Chi-Jen Liu,Liang-Guang Chen,Chun-Hung LIAO,Huang-Lin Chao,Jeng-Chi Lin. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-09-21.

Dual membrane carrier head for chemical mechanical polishing

Номер патента: US11945073B2. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jay Gurusamy. Владелец: Applied Materials Inc. Дата публикации: 2024-04-02.

Retainer for chemical mechanical polishing carrier head

Номер патента: US20240075584A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh,Eric Lau,Kuen-Hsiang Chen. Владелец: Applied Materials Inc. Дата публикации: 2024-03-07.

Clamping retainer for chemical mechanical polishing and method of operation

Номер патента: WO2023229658A1. Автор: Steven M. Zuniga,Andrew J. Nagengast,Jeonghoon Oh. Владелец: Applied Materials, Inc.. Дата публикации: 2023-11-30.

Method for operating chemical mechanical polishing ("CMP") tool for the manufacture of semiconductor devices

Номер патента: US20040171266A1. Автор: Chien Hua Chen,Yuan Hsin Peng,Xiao Hua Li. Владелец: Semiconductor Manufacturing International Shanghai Corp. Дата публикации: 2004-09-02.

Method for shaping features of a semiconductor structure using chemical mechanical planarization (CMP)

Номер патента: US5302233A. Автор: Scott Meikle,Sung C. Kim. Владелец: Micron Semiconductor Inc. Дата публикации: 1994-04-12.

Method for chemical-mechanical finishing of surface

Номер патента: RU2290291C2. Автор: Марк Д. МИЧОД,Гари СРОКА,Лэйн Уилль м УИНКЕЛМАНН,Лэйн Уилльям УИНКЕЛМАНН. Владелец: Рем Текнолоджиз, Инк.. Дата публикации: 2006-12-27.

Apparatus and method for polishing a flat surface using a belted polishing pad

Номер патента: US6059643A. Автор: Burford J. Furman,Albert Hu,Mohamed Abushaban. Владелец: Aplex Inc. Дата публикации: 2000-05-09.

Chemical mechanical planarization process control utilizing in-situ conditioning process

Номер патента: IL177027A. Автор: . Владелец: Tbw Ind Inc. Дата публикации: 2010-06-16.

Spherical drive assembly for chemical mechanical planarization

Номер патента: WO2002060643A9. Автор: David G Halley. Владелец: STRASBAUGH. Дата публикации: 2003-09-12.

Seal for use with a chemical mechanical planarization apparatus

Номер патента: US20020086626A1. Автор: Andrew Yednak,Phillip Rayer. Владелец: Speedfam IPEC Corp. Дата публикации: 2002-07-04.

Configurable pressure design for multizone chemical mechanical planarization polishing head

Номер патента: US09610672B2. Автор: Steven M. Zuniga,Andrew Nagengast,Jeonghoon Oh,Samuel Chu-Chiang Hsu,Gautam Shashank Dandavate. Владелец: Applied Materials Inc. Дата публикации: 2017-04-04.

Chemical mechanical machining and surface finishing

Номер патента: IL157290A. Автор: . Владелец: Rem Technologies. Дата публикации: 2007-06-03.

Method and apparatus for heating polishing pad

Номер патента: EP1497076A4. Автор: Ren Zhou,Linda Jiang,Tuan Nguyen,David Wei,Xuyen Pham,Tony Luong,Sridharan Srivatsan,Anjun Jerry Jin,Katgenhalli Y Ramanujam,Joseph P Simon. Владелец: Lam Research Corp. Дата публикации: 2008-07-16.

Method and apparatus for heating polishing pad

Номер патента: EP1497076A1. Автор: Ren Zhou,Linda Jiang,Tuan Nguyen,David Wei,Xuyen Pham,Tony Luong,Joseph P. Simon,Sridharan Srivatsan,Katgenhalli Y. Ramanujam,Anjun Jerry Jin. Владелец: Lam Research Corp. Дата публикации: 2005-01-19.

Wafer polishing pad centering apparatus

Номер патента: US20020086632A1. Автор: Terrence Stemm. Владелец: Intel Corp. Дата публикации: 2002-07-04.

Polish pad replacing apparatus

Номер патента: US20230158634A1. Автор: Chih-Chieh Su,Chun-Hsien Su,Ko-Chieh Chao. Владелец: Industrial Technology Research Institute ITRI. Дата публикации: 2023-05-25.

Polishing apparatus, polishing pad positioning method, and polishing pad

Номер патента: US09919403B2. Автор: Takeshi Sakurai,Suguru Ogura,Kaoru Hamaura. Владелец: Ebara Corp. Дата публикации: 2018-03-20.

Wafer support for chemical mechanical planarization

Номер патента: WO2002053320A9. Автор: David G Halley. Владелец: STRASBAUGH. Дата публикации: 2004-03-04.

Run-to-run control for chemical mechanical planarization

Номер патента: US20130267148A1. Автор: Patrick David Noll,Madhu Sudan RAMAVAJJALA,Prakash Lakshmikanthan. Владелец: Texas Instruments Inc. Дата публикации: 2013-10-10.

Configurable pressure design for multizone chemical mechanical planarization polishing head

Номер патента: WO2015199815A1. Автор: Steven M. Zuniga,Andrew Nagengast,Jeonghoon Oh,Samuel Chu-Chiang Hsu,Gautam Shashank Dandavate. Владелец: Applied Materials, Inc.. Дата публикации: 2015-12-30.

Chemical-mechanical processing slurry and methods for processing a nickel substrate surface

Номер патента: MY199592A. Автор: TONG Li,Hon Wu Lau. Владелец: Cmc Mat Llc. Дата публикации: 2023-11-08.

Heat exchanger for regulating surface temperature of a polishing pad, polishing apparatus, polishing method, and medium storing computer program

Номер патента: US20180236631A1. Автор: Toru Maruyama,Yohei Eto. Владелец: Ebara Corp. Дата публикации: 2018-08-23.

Pad temperature adjustment apparatus for adjusting temperature of polishing pad, and polishing apparatus

Номер патента: US20190193237A1. Автор: Yasuyuki Motoshima. Владелец: Ebara Corp. Дата публикации: 2019-06-27.

Method and apparatus for conditioning a polishing pad

Номер патента: WO2001049453A1. Автор: Alex Finkelman. Владелец: LAM RESEARCH CORPORATION. Дата публикации: 2001-07-12.

Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus

Номер патента: US09943943B2. Автор: Akira Nakamura,Hiroyuki Shinozaki,Akira Imamura,Takahiro SHIMANO. Владелец: Ebara Corp. Дата публикации: 2018-04-17.

Method and apparatus for dressing polishing pad

Номер патента: US20110312254A1. Автор: Harumichi Koyama. Владелец: Individual. Дата публикации: 2011-12-22.

CMP of a circlet wafer using disc-like brake polish pads

Номер патента: US6099387A. Автор: Mark I. Gardner,Mark C. Gilmer. Владелец: Advanced Micro Devices Inc. Дата публикации: 2000-08-08.

Fabricating structures using chemo-mechanical polishing and chemically-selective endpoint detection

Номер патента: WO2003005421A2. Автор: Charles Hunt,Jeffrey Peterson. Владелец: The Regents of the University of California. Дата публикации: 2003-01-16.

System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads

Номер патента: WO2002053322A3. Автор: Yehiel Gotkis,John M Boyd,Rod Kistler. Владелец: Rod Kistler. Дата публикации: 2003-05-01.

Wafer polishing pad and method of wafer polishing using the same

Номер патента: US20190193238A1. Автор: SANGHOON Lee,SungHyup KIM,Seok Ryul Kim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2019-06-27.

Method of regulating a surface temperature of polishing pad, and polishing apparatus

Номер патента: US20190308293A1. Автор: Mitsunori Komatsu,Keisuke Kamiki,Masashi KABASAWA. Владелец: Ebara Corp. Дата публикации: 2019-10-10.

Method and a system for evaluating the physical consumption of a polishing pad of a cmp apparatus, and cmp apparatus

Номер патента: US20210402559A1. Автор: Renato CORETTI,Simone RIZZARDINI,Valentina ROBBIANO. Владелец: STMICROELECTRONICS SRL. Дата публикации: 2021-12-30.

Polishing pad with adjusted content of chlorine and process for preparing semiconductor device using the same

Номер патента: EP4446057A1. Автор: JANGWON SEO,Eun Gi Min,Jong Wook YUN,Yujin Shin,Suyoung MOON,Min Gyeong JI,Tae Il Hong. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-10-16.

Polishing pad dresser, polishing apparatus and polishing pad dressing method

Номер патента: US09849558B2. Автор: Dai Fukushima,Takayuki Nakayama. Владелец: Toshiba Memory Corp. Дата публикации: 2017-12-26.

Device and method for moistening a polishing pad

Номер патента: WO2023242481A1. Автор: Arto PELTOLA,Tatu PELTOLA. Владелец: TURUN YLIOPISTO. Дата публикации: 2023-12-21.

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Номер патента: US20030180973A1. Автор: Kurt Lehman,Charles Chen,Robert Shinagawa,Anantha Sethuraman,Thanassis Trikas,Haiguang Chen,Ronald Allen,Christopher Bevis,Ching Meng. Владелец: KLA Tencor Technologies Corp. Дата публикации: 2003-09-25.

Optical connector polishing pad

Номер патента: US20220219280A1. Автор: Kenji Aoki,Naoki Sugita,Masaaki Konishi. Владелец: NTT Advanced Technology Corp. Дата публикации: 2022-07-14.

Method and apparatus for conditioning a polish pad and for dispensing slurry

Номер патента: WO2001091974A1. Автор: Albert H. Liu,Nelson W. Ii White. Владелец: Philips Semiconductors, Inc.. Дата публикации: 2001-12-06.

Method of regulating a surface temperature of polishing pad, and polishing apparatus

Номер патента: SG10201902954VA. Автор: KOMATSU Mitsunori,KAMIKI Keisuke,KABASAWA Masashi. Владелец: Ebara Corp. Дата публикации: 2019-11-28.

Method for estimating life of polishing pad and polishing device

Номер патента: US20230381910A1. Автор: Kenichiro Saito,Seiji Murata,Ban ITO. Владелец: Ebara Corp. Дата публикации: 2023-11-30.

Intelligent analysis system for measuring signals of polishing pad surface, method and computer readable medium thereof

Номер патента: US20230211451A1. Автор: Hsien-Ming Lee,Chun-Chen Chen,Ching-Tang Hsueh. Владелец: Ta Liang Technology Co Ltd. Дата публикации: 2023-07-06.

Moisture sensor, polishing device and method for measuring the moisture in a polishing pad

Номер патента: US20220390403A1. Автор: Arto PELTOLA,Tatu PELTOLA. Владелец: University of Turku . Дата публикации: 2022-12-08.

Polishing apparatus having surface-property measuring device of polishing pad and polishing system

Номер патента: US11958161B2. Автор: Toru Maruyama,Yasuyuki Motoshima,Keisuke Kamiki. Владелец: Ebara Corp. Дата публикации: 2024-04-16.

Polishing system with annular platen or polishing pad

Номер патента: US11780046B2. Автор: Fred C. Redeker,Paul D. Butterfield,Thomas H. Osterheld,Shou-sung Chang,Steven M. Zuniga,Jeonghoon Oh. Владелец: Applied Materials Inc. Дата публикации: 2023-10-10.

Moisture sensor, polishing device and method for measuring the moisture in a polishing pad

Номер патента: WO2021099682A1. Автор: Arto PELTOLA,Tatu PELTOLA. Владелец: TURUN YLIOPISTO. Дата публикации: 2021-05-27.

Moisture sensor, polishing device and method for measuring the moisture in a polishing pad

Номер патента: EP4062162A1. Автор: Arto PELTOLA,Tatu PELTOLA. Владелец: University of Turku . Дата публикации: 2022-09-28.

Moisture sensor, polishing device and method for measuring the moisture in a polishing pad

Номер патента: CA3161145A1. Автор: Arto PELTOLA,Tatu PELTOLA. Владелец: University of Turku . Дата публикации: 2021-05-27.

Moisture sensor, polishing device and method for measuring the moisture in a polishing pad

Номер патента: AU2020387657A1. Автор: Arto PELTOLA,Tatu PELTOLA. Владелец: University of Turku . Дата публикации: 2022-05-26.

Fabricating structures using chemo-mechanical polishing and chemically-selective endpoint detection

Номер патента: WO2003005421A3. Автор: Charles Hunt,Jeffrey Peterson. Владелец: Univ California. Дата публикации: 2003-08-28.

Chemical mechanical polishing apparatus and method of replacing polishing pad using the same

Номер патента: US20240217057A1. Автор: Chungki MIN,Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-04.

Chemical mechanical polishing apparatus, chemical mechanical polishing method and method for fabricating semiconductor device

Номер патента: US11986921B2. Автор: Byoung Ho Kwon,Yong Hee Lee,Myung-Ki Hong,Kun Tack LEE. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-21.

Chemical mechanical polishing apparatus, chemical mechanical polishing method and method for fabricating semiconductor device

Номер патента: US20220118582A1. Автор: Byoung Ho Kwon,Myung-Ki Hong,Kun Tack LEE,Youg Hee LEE. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2022-04-21.

Detection method and detection apparatus for polishing pad of chemical mechanical polishing device

Номер патента: US20210146501A1. Автор: Hsien-Ming Lee,Chun-Chen Chen,Po-Ching Huang,Ching-Tang Hsueh. Владелец: Ta Liang Technology Co Ltd. Дата публикации: 2021-05-20.

Equipment, apparatus and method of chemical mechanical polishing (cmp)

Номер патента: US20240227112A1. Автор: Ilyoung Yoon,Seungjun LEE,Jinoh Im. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-11.

Chemical mechanical polishing apparatus for controlling polishing uniformity

Номер патента: US20200185231A1. Автор: Seung-Ho Park,Hyo-san Lee,In-Kwon Kim,Sang-Won Bae,Woo-in Lee,Sun-jae Jang. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-06-11.

Chemical mechanical polishing apparatus and method of controlling the same

Номер патента: US20240217059A1. Автор: Wonkeun Cho. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-04.

Chemical mechanical polishing apparatus and method using the same

Номер патента: US20230191555A1. Автор: Hoyoung Kim,Jinyoung Park,Jaehyug LEE,Chaelyoung KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-06-22.

Conditioner and chemical mechanical polishing apparatus including the same

Номер патента: US20240173820A1. Автор: Donghoon Kwon,Yeonsu Go. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-30.

Polishing pad surface cooling by compressed gas

Номер патента: WO2022256059A1. Автор: Robert Lewis RHOADES,Bryan Francis SENNETT,Peter Sterling Patrick VOWELL. Владелец: Revasum, Inc.. Дата публикации: 2022-12-08.

Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith

Номер патента: US09687956B2. Автор: Ching-Ming Tsai,Sheng-huan LIU,Jia-Cheng Hsu,Shi-Wei CHENG,Kun-Shu YANG,Feng-Chih Hsu,Craig Kokjohn. Владелец: Cabot Microelectronics Corp. Дата публикации: 2017-06-27.

Chemical-mechanical polishing pad conditioning system

Номер патента: US20110244764A1. Автор: Nannaji Saka,Jung-Hoon Chun,Thor Eusner. Владелец: Massachusetts Institute of Technology. Дата публикации: 2011-10-06.

Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same

Номер патента: US20240308020A1. Автор: Chun-Hsi Huang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-09-19.

Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same

Номер патента: US12059769B2. Автор: Chun-Hsi Huang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-08-13.

Temperature Control in Chemical Mechanical Polish

Номер патента: US20240149388A1. Автор: Kei-Wei Chen,Chih Hung Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-05-09.

End-point detection system for chemical mechanical polishing applications

Номер патента: US20020061713A1. Автор: Yehiel Gotkis,Mike Ravkin,Katrina Mikhaylich. Владелец: Lam Research Corp. Дата публикации: 2002-05-23.

End point detection system for chemical mechanical polishing applications

Номер патента: EP1399294A1. Автор: Yehiel Gotkis,Mike Ravkin,Katrina A. Mikhaylich. Владелец: Lam Research Corp. Дата публикации: 2004-03-24.

Chemical mechanical polishing apparatus and method of fabricating semiconductor device using the same

Номер патента: US20240145254A1. Автор: Hyo-Jung Kim,Dong Hoon KWON. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-05-02.

Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control

Номер патента: EP1487611A1. Автор: Yehiel Gotkis,Bruno Morel,Rodney Kistler,Aleksander Owczarz,David J. Hemker,Damon V. Williams. Владелец: Lam Research Corp. Дата публикации: 2004-12-22.

Chemical mechanical polishing apparatus

Номер патента: US20180009078A1. Автор: Kyutae Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2018-01-11.

Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control

Номер патента: WO2003082522A8. Автор: Yehiel Gotkis,Bruno Morel,Rodney Kistler,Aleksander Owczarz,David J Hemker,Damon V Williams. Владелец: Lam Res Corp. Дата публикации: 2004-12-09.

Vacuum assembly for chemical mechanical polishing

Номер патента: US20200101580A1. Автор: Shih-Ho Lin,Yu-chen Wei,Chun-Jui Chu,Chih-Yuan Yang,Jen Chieh Lai,Szu-Cheng Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2020-04-02.

Polishing pad with adjusted content of chlorine and process for preparing semiconductor device using the same

Номер патента: US20240342857A1. Автор: JANGWON SEO,Eun Gi Min,Jong Wook YUN,Yujin Shin,Suyoung MOON,Min Gyeong JI,Tae Il Hong. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-10-17.

Chemical mechanical polishing using time share control

Номер патента: US11931854B2. Автор: Wei Lu,Jianshe Tang,Jimin Zhang,Brian J. Brown,Priscilla Diep LaRosa. Владелец: Applied Materials Inc. Дата публикации: 2024-03-19.

Method and system for performing chemical mechanical polishing

Номер патента: US20230278160A1. Автор: Shih-Ho Lin,Jen-Chieh LAI,Yu-chen Wei,Huai-Tei Yang,Chih-Yuan Yang,Li-Hsiang Chao,Szu-Cheng Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-09-07.

Membrane coating compound for chemical mechanical polishing process, membrane including the same, and polishing apparatus including the same

Номер патента: US20240189960A1. Автор: Sangkyun Kim,Yearin BYUN,Inkwon KIM. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-06-13.

Chemical mechanical polishing slurry

Номер патента: US20020100895A1. Автор: Ting-Chang Chang,Cheng-Jer Yang,Huang-Chung Cheng. Владелец: United Microelectronics Corp. Дата публикации: 2002-08-01.

Chemical mechanical polishing method suitable for highly accurate planarization

Номер патента: US6132292A. Автор: Akira Kubo. Владелец: NEC Corp. Дата публикации: 2000-10-17.

Temperature control of chemical mechanical polishing

Номер патента: WO2010126902A4. Автор: Thomas H. Osterheld,Stephen Jew,Kun Xu,Jimin Zhang. Владелец: Applied Materials, Inc.. Дата публикации: 2011-03-31.

Chemical mechanical polishing apparatus and chemical mechanical polishing system using the same

Номер патента: US20240051079A1. Автор: Hoyoung Kim,Boun Yoon,Eunkyoung Kim,Kiho BAE,Boumyoung Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-02-15.

Uv-curable resins used for chemical mechanical polishing pads

Номер патента: EP4229104A1. Автор: Ping Huang,Chen-Chih Tsai,Eric S. Moyer. Владелец: CMC Materials LLC. Дата публикации: 2023-08-23.

UV-curable resins used for chemical mechanical polishing pads

Номер патента: US11807710B2. Автор: Ping Huang,Chen-Chih Tsai,Eric S. Moyer. Владелец: CMC Materials LLC. Дата публикации: 2023-11-07.

Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations

Номер патента: EP1419853A1. Автор: Manoocher Birang,Allan Gleason,Grigory Pyatigorsky,Nils Johansson. Владелец: Applied Materials Inc. Дата публикации: 2004-05-19.

Chemical mechanical polishing pad and polishing method

Номер патента: US11813713B2. Автор: Teresa Brugarolas Brufau,Bryan E. Barton. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-11-14.

System and method for chemical mechanical polishing pad replacement

Номер патента: US20230009839A1. Автор: Shih-Chung Chen,Ching-Wen Cheng,Chun Yan Chen,Wei-Kang TU. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-01-12.

Control of platen shape in chemical mechanical polishing

Номер патента: US20230415295A1. Автор: Steven M. Zuniga,Jay Gurusamy,Jeonghoon Oh. Владелец: Applied Materials Inc. Дата публикации: 2023-12-28.

Control of platen shape in chemical mechanical polishing

Номер патента: WO2024006213A1. Автор: Steven M. Zuniga,Jay Gurusamy,Jeonghoon Oh. Владелец: Applied Materials, Inc.. Дата публикации: 2024-01-04.

Hot water generation for chemical mechanical polishing

Номер патента: EP4334083A1. Автор: Jianshe Tang,Shou-sung Chang,Hari Soundararajan,Haosheng Wu,Chad POLLARD,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2024-03-13.

Chemical mechanical polishing apparatus and method of manufacturing semiconductor device

Номер патента: US20200070300A1. Автор: Ji Min Lee,Eun Kyung Hong,Sung Hyup Kim,Nam Il Koo,Ji Min CHOI,Ik Seon JEON,Sang Yeon OH. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2020-03-05.

Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer

Номер патента: EP1390820B1. Автор: Miguel A. Saldana. Владелец: Lam Research Corp. Дата публикации: 2007-07-25.

Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer

Номер патента: US20020192965A1. Автор: Miguel Saldana. Владелец: Individual. Дата публикации: 2002-12-19.

Apparatus for holding wafer cassettes in a cassette in a cassette tub during a chemical mechanical polishing process

Номер патента: US20030119434A1. Автор: Yao-Hsiang Liang,Kevin Lai. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2003-06-26.

Temperature control in chemical mechanical polish

Номер патента: US11904430B2. Автор: Kei-Wei Chen,Chih Hung Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-02-20.

Consumable part monitoring in chemical mechanical polisher

Номер патента: US11931860B2. Автор: Thomas H. Osterheld,Dominic J. Benvegnu. Владелец: Applied Materials Inc. Дата публикации: 2024-03-19.

Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device

Номер патента: US20050197046A1. Автор: Hirofumi Tsuchiyama,Shinobu Nakamura,Masahiro Aoyagi,Aki Nakajo. Владелец: Trecenti Technologies Inc. Дата публикации: 2005-09-08.

Chemical mechanical polishing apparatus

Номер патента: US20240238935A1. Автор: Gihwan KIM,Kihoon JANG,Donghoon Kwon. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-07-18.

Chemical mechanical polishing system for a workpiece, arithmetic system, and method of producing simulation model for chemical mechanical polishing

Номер патента: US20230043639A1. Автор: Norikazu Suzuki,Yoshihiro Mochizuki,Hozumi Yasuda,Yohei Hashimoto. Владелец: Kanazawa University NUC. Дата публикации: 2023-02-09.

System and method for monitoring chemical mechanical polishing

Номер патента: US20230182257A1. Автор: Chih-Yu Wang,Tien-Wen Wang,In-Tsang Lin,Hsin-Hui Chou. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-06-15.

Chemical mechanical planarization apparatus and methods

Номер патента: US09950405B2. Автор: Wufeng Deng. Владелец: Semiconductor Manufacturing International Shanghai Corp. Дата публикации: 2018-04-24.

Apparatus and method for monitoring chemical mechanical polishing

Номер патента: US20240051085A1. Автор: Jung-Chih Tsao,Jun-Nan Nian. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-02-15.

Mega-sonic vibration assisted chemical mechanical planarization

Номер патента: US12036636B2. Автор: Kei-Wei Chen,Chun-Hao Kung,Hui-Chi Huang,Ching-hsiang Tsai,Shang-Yu Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-07-16.

Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates

Номер патента: US20010019937A1. Автор: Jason Elledge. Владелец: Individual. Дата публикации: 2001-09-06.

Mega-sonic vibration assisted chemical mechanical planarization

Номер патента: US20230219188A1. Автор: Kei-Wei Chen,Chun-Hao Kung,Hui-Chi Huang,Ching-hsiang Tsai,Shang-Yu Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-07-13.

Polishing pad employing polyamine and cyclohexanedimethanol curatives

Номер патента: US11845156B2. Автор: Lin Fu,Rui Ma,Chen-Chih Tsai,Jaeseok Lee,Sarah BROSNAN. Владелец: CMC Materials LLC. Дата публикации: 2023-12-19.

Conditioner disk, chemical mechanical polishing device, and method

Номер патента: US20210129288A1. Автор: Hsun-Chung KUANG,Hsien Hua Shen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2021-05-06.

Conditioner disk, chemical mechanical polishing device, and method

Номер патента: US11787012B2. Автор: Hsun-Chung KUANG,Hsien Hua Shen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-10-17.

Conditioner disk, chemical mechanical polishing device, and method

Номер патента: US20240025014A1. Автор: Hsun-Chung KUANG,Hsien Hua Shen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-01-25.

Rotary body module and chemical mechanical polishing apparatus having the same

Номер патента: US11590628B2. Автор: Kuntack Lee,Yonghee Lee,Byoungho Kwon,Taemin EARMME,Seungchul Han,Yungjun Kim,Hyunjoon Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-02-28.

Tungsten chemical mechanical polishing slurries

Номер патента: EP4441158A1. Автор: Bradley Brennan,Agnes Derecskei,Matthias Stender. Владелец: Versum Materials US LLC. Дата публикации: 2024-10-09.

Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith

Номер патента: US11772230B2. Автор: Jing Ren,Bryan E. Barton,Kwadwo Tettey. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-10-03.

Rotary body module and chemical mechanical polishing apparatus having the same

Номер патента: US20210008686A1. Автор: Kuntack Lee,Yonghee Lee,Byoungho Kwon,Taemin EARMME,Seungchul Han,Yungjun Kim,Hyunjoon Park. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2021-01-14.

Steam treatment stations for chemical mechanical polishing system

Номер патента: US20240307928A1. Автор: Hui Chen,Jianshe Tang,Paul D. Butterfield,Shou-sung Chang,Chih Chung Chou,Hari Soundararajan,Haosheng Wu,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2024-09-19.

Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies

Номер патента: US6739955B2. Автор: John Skrovan. Владелец: Micron Technology Inc. Дата публикации: 2004-05-25.

Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic device substrate assemblies

Номер патента: US6361413B1. Автор: John Skrovan. Владелец: Micron Technology Inc. Дата публикации: 2002-03-26.

Chemical mechanical polishing apparatus, slurry, and method of using the same

Номер патента: US11351648B2. Автор: Hsun-Chung KUANG,Tung-He Chou. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2022-06-07.

Chemical mechanical polishing apparatus, slurry, and method of using the same

Номер патента: US20180361525A1. Автор: Hsun-Chung KUANG,Tung-He Chou. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-12-20.

Polishing pad for eddy current monitoring

Номер патента: US20080003936A1. Автор: Manoocher Birang,Boguslaw Swedek. Владелец: Applied Materials Inc. Дата публикации: 2008-01-03.

Apparatus with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer

Номер патента: US20040177297A1. Автор: Miguel Saldana. Владелец: Lam Research Corp. Дата публикации: 2004-09-09.

Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process

Номер патента: US6159075A. Автор: Liming Zhang. Владелец: VLSI Technology Inc. Дата публикации: 2000-12-12.

Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation

Номер патента: US6153116A. Автор: Champion Yi,Ming-Cheng Yang,Cheng-Sung Huang,Feng-Yeu Shau. Владелец: United Microelectronics Corp. Дата публикации: 2000-11-28.

Detergent composition and chemical-mechanical polishing composition

Номер патента: US20230174892A1. Автор: Yuichi Sakanishi. Владелец: Daicel Corp. Дата публикации: 2023-06-08.

Endpoint control during chemical mechanical polishing by detecting interface between different layers through selectivity change

Номер патента: WO2012012052A3. Автор: Wen-Chiang Tu,Zhihong Wang,Xiaoyuan Hu (Sandra). Владелец: Applied Materials, Inc.. Дата публикации: 2012-04-12.

Polishing slurry and method for chemical-mechanical polishing

Номер патента: US20020098700A1. Автор: James Alwan,Craig Carpenter. Владелец: Individual. Дата публикации: 2002-07-25.

Carrier head design for a chemical mechanical polishing apparatus

Номер патента: US5762544A. Автор: Steven M. Zuniga,Stephen J. Blumenkranz. Владелец: Applied Materials Inc. Дата публикации: 1998-06-09.

Method and system for chemical mechanical polishing process

Номер патента: US20230274929A1. Автор: Yi-Chang Liu,Chih-I Peng,Hsiu-Ming Yeh. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-08-31.

Endpoint control during chemical mechanical polishing by detecting interface between different layers through selectivity change

Номер патента: WO2012012052A2. Автор: Wen-Chiang Tu,Zhihong Wang,Xiaoyuan Hu (Sandra). Владелец: Applied Materials, Inc.. Дата публикации: 2012-01-26.

Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection

Номер патента: AU3761799A. Автор: Trung T. Doan. Владелец: Micron Technology Inc. Дата публикации: 1999-11-16.

Chemical mechanical polishing optical endpoint detection

Номер патента: US20050075055A1. Автор: Brian ZINN,Barry Lanier. Владелец: Texas Instruments Inc. Дата публикации: 2005-04-07.

Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide.

Номер патента: US20030190866A1. Автор: Stephan Wolf. Владелец: Individual. Дата публикации: 2003-10-09.

Apparatus and method for chemically mechanically polishing

Номер патента: US20200306929A1. Автор: Bo-I Lee. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2020-10-01.

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

Номер патента: US20050170751A1. Автор: Manoocher Birang,Allan Gleason,Nils Johansson. Владелец: Applied Materials Inc. Дата публикации: 2005-08-04.

Conditioning disks for chemical mechanical polishing

Номер патента: WO2017146678A1. Автор: Alexander Tregub,Kenneth A. DELBRIDGE,Andrew Paul MANSSON,Gunnmeet S. DHILLON,John E. GARLAND. Владелец: Intel Corporation. Дата публикации: 2017-08-31.

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

Номер патента: US20040014395A1. Автор: Manoocher Birang,Allan Gleason,Nils Johansson. Владелец: Applied Materials Inc. Дата публикации: 2004-01-22.

Steam treatment stations for chemical mechanical polishing system

Номер патента: US20200376523A1. Автор: Hui Chen,Jianshe Tang,Paul D. Butterfield,Shou-sung Chang,Chih Chung Chou,Hari Soundararajan,Haosheng Wu,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2020-12-03.

Gas delivery pallet assembly, cleaning unit and chemical mechanical polishing system having the same

Номер патента: US20240131562A1. Автор: Edwin Velazquez. Владелец: Applied Materials Inc. Дата публикации: 2024-04-25.

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

Номер патента: US6676717B1. Автор: Manoocher Birang,Allan Gleason. Владелец: Individual. Дата публикации: 2004-01-13.

Real-time control of chemical-mechanical polishing processes using a shaft distortion measurement.

Номер патента: MY124028A. Автор: Li Leping,Wang Xinhui. Владелец: Ibm. Дата публикации: 2006-06-30.

Steam treatment stations for chemical mechanical polishing system

Номер патента: US20220388041A1. Автор: Hui Chen,Jianshe Tang,Paul D. Butterfield,Shou-sung Chang,Chih Chung Chou,Hari Soundararajan,Haosheng Wu,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2022-12-08.

Gas delivery pallet assembly, cleaning unit and chemical mechanical polishing system having the same

Номер патента: WO2024085975A1. Автор: Edwin Velazquez. Владелец: Applied Materials, Inc.. Дата публикации: 2024-04-25.

Steam treatment stations for chemical mechanical polishing system

Номер патента: US12030093B2. Автор: Hui Chen,Jianshe Tang,Paul D. Butterfield,Shou-sung Chang,Chih Chung Chou,Hari Soundararajan,Haosheng Wu,Alexander John Fisher. Владелец: Applied Materials Inc. Дата публикации: 2024-07-09.

Gas delivery pallet assembly, cleaning unit and chemical mechanical polishing system having the same

Номер патента: US20240226970A9. Автор: Edwin Velazquez. Владелец: Applied Materials Inc. Дата публикации: 2024-07-11.

Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers

Номер патента: US5609718A. Автор: Scott G. Meikle. Владелец: Micron Technology Inc. Дата публикации: 1997-03-11.

Method and apparatus for in-situ monitoring of chemical mechanical planarization (cmp) processes

Номер патента: EP4355528A2. Автор: Daniel Ray TROJAN,Jessica BRINDLEY. Владелец: AXUS Tech LLC. Дата публикации: 2024-04-24.

A chemical mechanical planarization system with an adjustable force applying air platen

Номер патента: EP1381492A1. Автор: Miguel A. Saldana,Aleksander A. Owczarz. Владелец: Lam Research Corp. Дата публикации: 2004-01-21.

Aliphatic polyurethane optical endpoint detection windows and cmp polishing pads containing them

Номер патента: US20180304438A1. Автор: George C. Jacob,Mohammad T. Islam,Nan-Rong Chiou. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2018-10-25.

System and method for removing debris during chemical mechanical planarization

Номер патента: US12017325B2. Автор: Chun-Wei Hsu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-06-25.

System and method for removing debris during chemical mechanical planarization

Номер патента: US20230381923A1. Автор: Chun-Wei Hsu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-30.

Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same

Номер патента: WO2022177767A9. Автор: Jason Keleher,Ara Philipossian,Yasa Sampurno,Katherine WORTMON-OTTO,Abigail LINHART,Kiana A. CAHUE. Владелец: Araca, Inc.. Дата публикации: 2023-05-19.

System and Method for Online End Point Detection for use in Chemical Mechanical Planarization

Номер патента: US20060100821A1. Автор: ASHOK KUMAR,Arun SIKDER,Tapas Das,Rajesh Ganesan. Владелец: UNIVERSITY OF SOUTH FLORIDA. Дата публикации: 2006-05-11.

Compensating chemical mechanical wafer polishing apparatus and method

Номер патента: US20030100196A1. Автор: Wen-Chueh Pan,Yang-Jiann Fann,Yih-Hsing Wang,Chaug-Liang Hsu,Jer-Shyong Lai,Chien-Cheng He. Владелец: National Chung Shan Institute of Science and Technology NCSIST. Дата публикации: 2003-05-29.

Method and/or system for chemical mechanical planarization (CMP)

Номер патента: US09997420B2. Автор: Cheng Yen-Wei,Jong-I Mou,Yen-Di Tsen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-06-12.

Systems, methods and apparatus for post-chemical mechanical planarization substrate cleaning

Номер патента: US09844800B2. Автор: Brian J. Brown,Steven M. Zuniga. Владелец: Applied Materials Inc. Дата публикации: 2017-12-19.

Systems and methods for chemical mechanical planarization with photo-current detection

Номер патента: US09754845B2. Автор: I-Shuo Liu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-09-05.

Wafer conveying device, chemical mechanical planarization apparatus and wafer conveying method

Номер патента: US20230201995A1. Автор: Zhipeng ZHOU,Yuansi YANG. Владелец: Hangzhou Sizone Electronic Technology Inc. Дата публикации: 2023-06-29.

Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same

Номер патента: EP4272241A1. Автор: Jason Keleher,Ara Philipossian,Yasa Sampurno,Abigail LINHART,Kiana A. CAHUE,Katherine WORTMAN-OTTO. Владелец: Araca Inc. Дата публикации: 2023-11-08.

Aerosol methods for making chemical mechanical planarization (cmp) polishing pads

Номер патента: TW201825561A. Автор: 亞當 布羅德里克,道格拉斯A 布魯內. Владелец: 美商陶氏全球科技責任有限公司. Дата публикации: 2018-07-16.

Polishing pad sheet, polishing pad, and method for manufacturing semiconductor device

Номер патента: US12138736B2. Автор: Kyung Hwan Kim,Jang Won Seo,Jae In Ahn,Sung Hoon Yun. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-11-12.

Sloped polishing pad with hybrid cloth and foam surface

Номер патента: US09682461B2. Автор: David Givens. Владелец: Showroom Polishing Systems LLC. Дата публикации: 2017-06-20.

Method and apparatus for wireless transfer of chemical-mechanical planarization measurements

Номер патента: US6827630B2. Автор: Scott E. Moore. Владелец: Micron Technology Inc. Дата публикации: 2004-12-07.

Chemical mechanical planarization membrane

Номер патента: US11850702B2. Автор: Chien-Wei Chang,Tzi-Yi Shieh,Ren-Dou Lee,Cheng-Ping Chen,Tsung-Lung Lai,Sheng-Tai Peng. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-12-26.

Method and apparatus for conditioning polishing pad

Номер патента: US09731401B2. Автор: Nobuyuki Takahashi,Toru Maruyama. Владелец: Ebara Corp. Дата публикации: 2017-08-15.

Polishing pad with hybrid cloth and foam surface

Номер патента: US09687964B2. Автор: David Givens. Владелец: Showroom Polishing Systems LLC. Дата публикации: 2017-06-27.

Abrasive particles for mechanical polishing

Номер патента: RU2356926C2. Автор: Цзя-Ни ЧУ,Джеймс Нил ПРАЙОР. Владелец: У.Р. Грэйс Энд Ко.-Конн.. Дата публикации: 2009-05-27.

In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection

Номер патента: CA2036102C. Автор: Gabriel Lorimer Miller,Eric Richard Wagner. Владелец: American Telephone and Telegraph Co Inc. Дата публикации: 1995-04-04.

Method and apparatus for wireless transfer of chemical-mechanical planarization measurements

Номер патента: US6352466B1. Автор: Scott E. Moore. Владелец: Micron Technology Inc. Дата публикации: 2002-03-05.

Guanidinium-based polyionic liquids and their use as additives for chemical mechanical planarization slurries

Номер патента: WO2024073211A1. Автор: Xiaobo Shi,Peer Kirsch,Gregor Larbig. Владелец: Versum Materials US, LLC. Дата публикации: 2024-04-04.

Methods of cleaning cmp polishing pads

Номер патента: US20180169830A1. Автор: Charles J. Benedict,Aaron E. Lorin,Ryan Bortner. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2018-06-21.

Detection of diamond contamination in polishing pad and reconditioning system therefor

Номер патента: US20060166607A1. Автор: Laertis Economikos,John Fitzsimmons. Владелец: International Business Machines Corp. Дата публикации: 2006-07-27.

Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad

Номер патента: EP1447841B1. Автор: Nobuo c/o JSR Corporation Kawahashi,Kou c/o Jsr Corporation Hasegawa,Hiroshi c/o JSR Corporation Shiho. Владелец: JSR Corp. Дата публикации: 2010-04-28.

Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad

Номер патента: EP1447841A4. Автор: Nobuo Kawahashi,Kou Hasegawa,Hiroshi Shiho. Владелец: JSR Corp. Дата публикации: 2007-08-15.

Semiconductor substrate polishing with polishing pad temperature control

Номер патента: EP4169058A1. Автор: Masaaki Ikeda. Владелец: GlobalWafers Co Ltd. Дата публикации: 2023-04-26.

Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods

Номер патента: US09687960B2. Автор: Paul D. Butterfield,Shou-sung Chang,Bum Jick KIM. Владелец: Applied Materials Inc. Дата публикации: 2017-06-27.

Systems and methods for mechanical polishing

Номер патента: WO2023086464A1. Автор: J. Louie MENESES,Davide MARTINO. Владелец: Sybridge Technologies U.S. Inc.. Дата публикации: 2023-05-19.

Systems and methods for mechanical polishing

Номер патента: CA3237893A1. Автор: J. Louie MENESES,Davide MARTINO. Владелец: Sybridge Technologies US Inc. Дата публикации: 2023-05-19.

Cleaning process of wafer polishing pad and cleaning nozzle

Номер патента: US20230126122A1. Автор: Ching-Wen Teng,Wen Yi Tan,Shih-Jie Lin,Kuo Liang Huang. Владелец: United Semiconductor Xiamen Co Ltd. Дата публикации: 2023-04-27.

Apparatus and method for shaping polishing pads

Номер патента: MY133665A. Автор: Robert J Walsh. Владелец: Memc Electronic Materials. Дата публикации: 2007-11-30.

Polishing pad with foundation layer and window attached thereto

Номер патента: US09868185B2. Автор: William C. Allison,Diane Scott,Jose Arno,Paul Andre Lefevre. Владелец: Cabot Microelectronics Corp. Дата публикации: 2018-01-16.

Surface property measuring apparatus for polishing pad, surface property measuring method for polishing pad, and surface property judging method for polishing pad

Номер патента: US20240075579A1. Автор: Toshifumi Kimba,Hisanori Matsuo,Nobuyuki Takada,Kohei Ohshima. Владелец: Ebara Corp. Дата публикации: 2024-03-07.

Method and apparatus for conditioning polishing pad

Номер патента: US20150231760A1. Автор: Nobuyuki Takahashi,Toru Maruyama. Владелец: Ebara Corp. Дата публикации: 2015-08-20.

Method of cleaning a polishing pad conditioner and apparatus for performing the same

Номер патента: US20020119613A1. Автор: Min-Gyu Kim,Min-Soo Yang. Владелец: Individual. Дата публикации: 2002-08-29.

A preconditioner for a polishing pad and method for using the same

Номер патента: IE960095A1. Автор: James Michael Mullins. Владелец: Motorola Inc. Дата публикации: 1996-08-07.

Polishing apparatus and method of determining a time to replace polishing pad

Номер патента: US20230356350A1. Автор: Hiroaki Nishida,Yuta Suzuki,Taro Takahashi,Tsuneo Torikoshi,Hirofumi OTAKI. Владелец: Ebara Corp. Дата публикации: 2023-11-09.

Container for drying and storing polishing pads

Номер патента: US20220017262A1. Автор: Jason LAMONT. Владелец: Individual. Дата публикации: 2022-01-20.

Self-healing polishing pad

Номер патента: US20200039022A1. Автор: Kei-Wei Chen,Yen-Ting Chen,Chun-Hao Kung,Hui-Chi Huang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2020-02-06.

Self-healing polishing pad

Номер патента: US20230118617A1. Автор: Kei-Wei Chen,Yen-Ting Chen,Chun-Hao Kung,Hui-Chi Huang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-04-20.

Detection of diamond contamination in polishing pad and reconditioning system therefor

Номер патента: US7473159B2. Автор: Laertis Economikos,John Fitzsimmons. Владелец: International Business Machines Corp. Дата публикации: 2009-01-06.

A polishing pad and method of producing the same

Номер патента: EP1792330A1. Автор: Alex Cooper,Yevgeny Bederak. Владелец: Universal Photonics Inc. Дата публикации: 2007-06-06.

Composition for polishing pad and polishing pad

Номер патента: US12122013B2. Автор: Jong Wook YUN,Jang Won Seo,Eun Sun JOENG,Hyeyoung HEO. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-10-22.

Method and apparatus for conditioning a polishing pad with sonic energy

Номер патента: US20020086620A1. Автор: Michael Lacy. Владелец: Lam Research Corp. Дата публикации: 2002-07-04.

Polishing pad with foundation layer and window attached thereto

Номер патента: MY191753A. Автор: Diane Scott,Jose Arno,William C Allison,Paul Andre Lefevre. Владелец: Cmc Mat Inc. Дата публикации: 2022-07-14.

Device for conditioning polishing pads

Номер патента: US5486131A. Автор: Joseph V. Cesna,Anthony G. Van Woerkom. Владелец: Speedfam Corp. Дата публикации: 1996-01-23.

Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device

Номер патента: US20210260719A1. Автор: Yukiteru Matsui,Akifumi Gawase,Takahiko Kawasaki. Владелец: Toshiba Memory Corp. Дата публикации: 2021-08-26.

Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device

Номер патента: US20190283206A1. Автор: Yukiteru Matsui,Akifumi Gawase,Takahiko Kawasaki. Владелец: Toshiba Memory Corp. Дата публикации: 2019-09-19.

Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device

Номер патента: US11883926B2. Автор: Yukiteru Matsui,Akifumi Gawase,Takahiko Kawasaki. Владелец: Kioxia Corp. Дата публикации: 2024-01-30.

Methods and systems for polishing pad control

Номер патента: US10960513B2. Автор: Ezio Bovio,Emanuele Corsi. Владелец: GlobalWafers Co Ltd. Дата публикации: 2021-03-30.

Methods and systems for polishing pad control

Номер патента: US20180304436A1. Автор: Ezio Bovio,Emanuele Corsi. Владелец: GlobalWafers Co Ltd. Дата публикации: 2018-10-25.

Apparatus for manufacturing polishing pad and method of manufacturing polishing pad using the same

Номер патента: US20140366396A1. Автор: Bong-su Ahn,Jungsik CHOI,Jin-Su Jeong,Youngjun JANG. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2014-12-18.

Polishing pad and preparing method of semiconductor device

Номер патента: US20240300066A1. Автор: Jong Wook YUN,Jang Won Seo,Chang Gyu Im,Joon Ho An. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-09-12.

Polishing pad and system

Номер патента: CA2441383C. Автор: Robert Piombini. Владелец: Saint Gobain Abrasives Inc. Дата публикации: 2006-01-24.

Method and apparatus for improved conditioning of polishing pads

Номер патента: US5941762A. Автор: Yuli Verhovsky,Michael A. Ravkin,Ilya A. Ravkin. Владелец: Individual. Дата публикации: 1999-08-24.

Methods and systems for polishing pad control

Номер патента: US10946493B2. Автор: Ezio Bovio,Emanuele Corsi. Владелец: GlobalWafers Co Ltd. Дата публикации: 2021-03-16.

Methods and systems for polishing pad control

Номер патента: US20180304437A1. Автор: Ezio Bovio,Emanuele Corsi. Владелец: GlobalWafers Co Ltd. Дата публикации: 2018-10-25.

Polishing pad, double-side polishing device, and double-side polishing method for wafer

Номер патента: US20240009799A1. Автор: Junichi Ueno. Владелец: Shin Etsu Handotai Co Ltd. Дата публикации: 2024-01-11.

Integrated abrasive polishing pads and manufacturing methods

Номер патента: US11980992B2. Автор: YAN Zhao,Rajeev Bajaj,Fred C. Redeker,Sivapackia Ganapathiappan,Daniel REDFIELD,Nag B. Patibandla,Ashavani Kumar,Ashwin CHOCKALINGAM,Boyi FU,Mario Dagio CORNEJO,Amritanshu SINHA,Ranga Rao Arnepalli. Владелец: Applied Materials Inc. Дата публикации: 2024-05-14.

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Номер патента: US20230110921A1. Автор: Jong Wook YUN,Jang Won Seo,Eun Sun JOENG,Sung Hoon Yun. Владелец: SK Enpulse Co Ltd. Дата публикации: 2023-04-13.

Polishing pad with improved wettability and method for preparing same

Номер патента: US20230330806A1. Автор: JANGWON SEO,Sunghoon YUN,Jong Wook YUN,Chang Gyu Im. Владелец: SK Enpulse Co Ltd. Дата публикации: 2023-10-19.

Use of abrasive tape conveying assemblies for conditioning polishing pads

Номер патента: US5944585A. Автор: Ronald J. Nagahara,Dawn M. Lee. Владелец: LSI Logic Corp. Дата публикации: 1999-08-31.

Additive manufacturing of polishing pads

Номер патента: US11965103B2. Автор: Rajeev Bajaj,Sivapackia Ganapathiappan,Hou T. Ng,Daniel REDFIELD,Nag B. Patibandla,Sudhakar Madhusoodhanan,Uma SRIDHAR,Yingdong Luo,Daihua Zhang,Ashwin Murugappan Chockalingam. Владелец: Applied Materials Inc. Дата публикации: 2024-04-23.

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Номер патента: US11883925B2. Автор: Hiroshi Kurihara,Ryuma Matsuoka,Yamato TAKAMIZAWA,Satsuki Narushima. Владелец: Fujibo Holdins Inc. Дата публикации: 2024-01-30.

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Номер патента: US20240149389A1. Автор: Hiroshi Kurihara,Teppei Tateno,Ryuma Matsuoka,Satsuki YAMAGUCHI,Yamato TAKAMIZAWA. Владелец: Fujibo Holdins Inc. Дата публикации: 2024-05-09.

Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method

Номер патента: CN100537143C. Автор: 川桥信夫,志保浩司,下山裕司,保坂幸生. Владелец: JSR Corp. Дата публикации: 2009-09-09.

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Номер патента: KR20070070094A. Автор: 히데끼 니시무라,게이스께 구리야마,다까후미 시미즈,쇼에이 츠지. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2007-07-03.

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Номер патента: TWI290505B. Автор: Nobuo Kawahashi,Hiroshi Shiho,Yukio Hosaka,Yuuji Shimoyama. Владелец: JSR Corp. Дата публикации: 2007-12-01.

Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method

Номер патента: KR100640141B1. Автор: 노부오 가와하시,히로시 시호,유끼오 호사까,유우지 시모야마. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2006-10-31.

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Номер патента: US20240217055A1. Автор: YU Bao. Владелец: Changxin Memory Technologies Inc. Дата публикации: 2024-07-04.

Interlocking chemical mechanical polishing system

Номер патента: US20020185467A1. Автор: John Boyd,Xuyen Pham,Sridharan Srivatsan,K. Ramanujam. Владелец: Lam Research Corp. Дата публикации: 2002-12-12.

Chemical mechanical polishing pad having sealed window

Номер патента: TW201020068A. Автор: Darrell String,Jon William Turley. Владелец: Rohm & Haas Elect Mat. Дата публикации: 2010-06-01.

Chemical mechanical polishing pad with micro-holes

Номер патента: TW592888B. Автор: Jae-Seok Kim,In-Ha Park,Tae-Kyoung Kwon. Владелец: Sk Evertec Co Ltd. Дата публикации: 2004-06-21.

Chemical mechanical polishing pad having sealed window

Номер патента: EP2177315B1. Автор: Darrell String,Jon William Turley. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2011-06-29.

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Номер патента: TW590854B. Автор: Tae-Kyoung Kwon,Jaeseok Kim,Inha Park. Владелец: Sk Evertec Co Ltd. Дата публикации: 2004-06-11.

Polishing pad having sealing barrier to protect fluid permeation onto window for a chemical mechanical polishing apparatus

Номер патента: KR100532440B1. Автор: 부재필,이상선,김진국,김종복. Владелец: 삼성전자주식회사. Дата публикации: 2005-11-30.

Method of manufacturing chemical mechanical polishing pad and polishing pad

Номер патента: CN1970232B. Автор: 志保浩司,西村秀树,保坂幸生,田野裕之. Владелец: JSR Corp. Дата публикации: 2010-09-29.

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Номер патента: CN2915378Y. Автор: 文卡塔·R·巴拉伽纳,蒂莫西·詹姆斯·多诺休,罗麦恩·比优·德·洛莫尼. Владелец: Applied Materials Inc. Дата публикации: 2007-06-27.

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Номер патента: US09776300B2. Автор: Yuhua Tong,Bainian Qian,Julia KOZHUKH,Tony Quan Tran,Marty W. Degroot,George C. Jacob,Teresa Brugarolas Brufau,Fengji Yeh,David Michael Veneziale,Diego Lugo,Andrew Wank,Jeffrey B. Miller,Marc R. Stack. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-10-03.

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Номер патента: US20230347471A1. Автор: Teng-Chun Tsai,Ming-Shiuan She,Chun-Hung LIAO,An-Hsuan Lee,Shen-Nan Lee,Chen-Hao WU. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-02.

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Номер патента: US20180148537A1. Автор: Michael E. Mills,Bryan E. Barton. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2018-05-31.

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Номер патента: US09630293B2. Автор: Bainian Qian,Julia KOZHUKH,Tony Quan Tran,George C. Jacob,Teresa Brugarolas Brufau,Jeffrey James Hendron,Diego Lugo,Jeffrey B. Miller,Marc R. Stack. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-04-25.

Double-sided adhesive tape for adhering polishing pad allowing easy air bubble discharge, and chemical-mechanical polishing apparatus using same

Номер патента: EP4450577A1. Автор: JEONG Yeon Jeong,Seung Geun Kim,Byung Ju Min,Seok Ji HONG,Kang Mun Cho. Владелец: KPX CHEMICAL CO Ltd. Дата публикации: 2024-10-23.

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Номер патента: US11591495B2. Автор: Yi Guo,Tony Quan Tran. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-02-28.

Composition for chemical-mechanical polishing and chemical-mechanical polishing method

Номер патента: US12104087B2. Автор: Pengyu Wang,Yasutaka Kamei,Norihiko Sugie,Yuuya YAMADA. Владелец: JSR Corp. Дата публикации: 2024-10-01.

Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith

Номер патента: US12064846B2. Автор: Michael E. Mills,Teresa Brugarolas Brufau,Bryan E. Barton,Annette M. Crevasse,Vere O. Archibald. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2024-08-20.

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Номер патента: RU2661219C2. Автор: Аллен С. БЬЮЛИК,Хидеаки НИСИЗАВА,Казуки МОРИЯМА,Коити ЙОСИДА,Сундзи ЕЗАВА,Селванатхан АРУМУГАМ. Владелец: РОМ ЭНД ХААС ЭЛЕКТРОНИК МАТИРИАЛЗ СиЭмПи ХОЛДИНГЗ, ИНК.. Дата публикации: 2018-07-13.

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Номер патента: US20230203344A1. Автор: Kouhei Yoshio,Yuuya YAMADA. Владелец: JSR Corp. Дата публикации: 2023-06-29.

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Номер патента: US12006446B2. Автор: Tetsuya Kamimura. Владелец: Fujifilm Corp. Дата публикации: 2024-06-11.

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Номер патента: US20180104792A1. Автор: Hyo-san Lee,Myung-Ki Hong,Joo-Han LEE,Sung-Oh Park,Yung-Jun Kim,Kyu-min Oh,Sun-gyu PARK,Seh-Kwang Lee,Chan-ki Yang. Владелец: EHWA Diamond Industrial Co Ltd. Дата публикации: 2018-04-19.

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Номер патента: US20240254365A1. Автор: Yasutaka Kamei,Kohei Nishimura,Koki Ishimaki,Shuhei Nakamura. Владелец: JSR Corp. Дата публикации: 2024-08-01.

Formulations for chemical mechanical polishing pads with high planarization efficiency and CMP pads made therewith

Номер патента: US12064845B2. Автор: Teresa Brugarolas Brufau,Bryan E. Barton. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2024-08-20.

Chemical mechanical polishing pads for improved removal rate and planarization

Номер патента: US20230294240A1. Автор: Bainian Qian,George C. Jacob,Nan-Rong Chiou,Jonathan G. Weis. Владелец: Rohm and Haas Electronic Materials CMP Holdings, Inc.. Дата публикации: 2023-09-21.

Chemical-mechanical polishing composition and chemical-mechanical polishing method using the same

Номер патента: US20240263039A1. Автор: Hiroshi Kitamura,Tsuyoshi Masuda,Yoshiyuki Matsumura,Akihisa NAMIKI. Владелец: Entegris Inc. Дата публикации: 2024-08-08.

Polishing liquid and chemical mechanical polishing method

Номер патента: US20200354609A1. Автор: Tetsuya Kamimura. Владелец: Fujifilm Corp. Дата публикации: 2020-11-12.

Chemical mechanical polishing pad and preparation thereof

Номер патента: US20230112228A1. Автор: Bainian Qian,Michael E. Mills,Lyla M. El-Sayed,Bradley K. Taylor,Robert M. Blomquist,Kancharla-Arun REDDY,Shijing Xia. Владелец: DuPont Electronics Inc. Дата публикации: 2023-04-13.

Adapative endpoint method for pad life effect on chemical mechanical polishing

Номер патента: US20130146224A1. Автор: Hui-Chi Huang,Chu-An Lee,Peng-Chung Jangjian. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2013-06-13.

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Номер патента: US20230193080A1. Автор: Sang Kyun Kim,Byung Keun Hwang,Hyo San LEE,Yea Rin Byun,In Kwon Kim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-06-22.

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Номер патента: SG11201901582QA. Автор: Yongqi Hu,Thomas Lawrence Terry. Владелец: Applied Materials Inc. Дата публикации: 2019-03-28.

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Номер патента: US20030089456A1. Автор: Sue-ryeon Kim,Seung-un Kim,Seung-ki Chae,Je-Gu Lee. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2003-05-15.

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Номер патента: CN111318955A. Автор: 李善雄. Владелец: Xia Tai Xin Semiconductor Qing Dao Ltd. Дата публикации: 2020-06-23.

Chemical mechanical polishing tool with robot access to cassettes

Номер патента: EP3504731A1. Автор: Yongqi Hu,Thomas Lawrence Terry. Владелец: Applied Materials Inc. Дата публикации: 2019-07-03.

Chemical mechanical polishing tool with robot access to cassettes

Номер патента: US20180056479A1. Автор: Yongqi Hu,Thomas Lawrence Terry. Владелец: Applied Materials Inc. Дата публикации: 2018-03-01.

Slurry composition for chemical mechanical polishing

Номер патента: US20230104949A1. Автор: Sangkyun Kim,Hyosan Lee,Sanghyun Park,Yearin BYUN,Inkwon KIM,Wonki HUR. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-04-06.

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Номер патента: US20240308022A1. Автор: JANGWON SEO,Jong Wook YUN,Min Gyeong JI. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-09-19.

Polishing pad and preparation method thereof

Номер патента: EP4431237A1. Автор: JANGWON SEO,Jong Wook YUN,Min Gyeong JI. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-09-18.

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Номер патента: US11759909B2. Автор: Kyung Hwan Kim,Jang Won Seo,Jae In Ahn,Sung Hoon Yun,Kang Sik MYUNG. Владелец: SK Enpulse Co Ltd. Дата публикации: 2023-09-19.

Pad-in-a-bottle (pib) technology for copper and through-silicon via (tsv) chemical-mechanical planarization (cmp)

Номер патента: US20230287242A1. Автор: Xiaobo Shi,Ara Philipossian,Mark O'Neill,Yasa Sampurno,John Langan. Владелец: Versum Materials US LLC. Дата публикации: 2023-09-14.

Porous polishing pad and process for producing the same all fees

Номер патента: US11772236B2. Автор: Sunghoon YUN,Hye Young HEO,Jong Wook YUN,Jang Won Seo,Jaein AHN. Владелец: SK Enpulse Co Ltd. Дата публикации: 2023-10-03.

Aliphatic uv cured polyurethane optical endpoint detection windows with high uv transparency for cmp polishing pads

Номер патента: US20190144713A1. Автор: Matthew R. Gadinski. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2019-05-16.

High oxide film removal rate shallow trench (STI) chemical mechanical planarization (CMP) polishing

Номер патента: US12091581B2. Автор: Xiaobo Shi,Hongjun Zhou,Mark Leonard O'Neill,Krishna P. Murella,Joseph D. ROSE. Владелец: Versum Materials US LLC. Дата публикации: 2024-09-17.

Chemical mechanical planarization for shallow trench isolation

Номер патента: WO2024173029A1. Автор: Xiaobo Shi,Hongjun Zhou,LU Gan,Krishna P. Murella,Joseph D. ROSE. Владелец: Versum Materials US, LLC. Дата публикации: 2024-08-22.

High Oxide Removal Rates Shallow Trench Isolation Chemical Mechanical Planarization Compositions

Номер патента: US20240297049A1. Автор: Xiaobo Shi,Hongjun Zhou,Krishna P. Murella,Joseph D. ROSE. Владелец: Versum Materials US LLC. Дата публикации: 2024-09-05.

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Номер патента: US09711381B2. Автор: Sen-Hou Ko,Lakshmanan Karuppiah. Владелец: Applied Materials Inc. Дата публикации: 2017-07-18.

Porous polishing pad and preparation method thereof

Номер патента: KR20190121009A. Автор: 허혜영,안재인,윤종욱,서장원,윤성훈. Владелец: 에스케이씨 주식회사. Дата публикации: 2019-10-25.

Recycle method and device for recycle of waste water containing suspension from semiconductor processing process, in particular, chemical-mechanical finishing

Номер патента: RU2520474C2. Автор: Франц БРУММЕР. Владелец: Хигхк-Фэктори Гмбх. Дата публикации: 2014-06-27.

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Номер патента: US12076832B2. Автор: Hye Young HEO,Jong Wook YUN,Jang Won Seo,Eun Sun JOENG. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-09-03.

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Номер патента: US20100035521A1. Автор: Mitsuru Kato,Chihiro Okamoto,Shinya Kato,Hirofumi Kikuchi. Владелец: Kuraray Co Ltd. Дата публикации: 2010-02-11.

Polishing pad and method for production thereof, as well as a method of producing a polished article

Номер патента: RU2736460C2. Автор: Шин ТОКУШИГЕ,Кейсуке НАКАСЕ,Хироши КАШИВАДА,Татсуя ЯМАДА,Кеничи КОЙКЕ,Йосуке НАРАДА. Владелец: Фудзибо Холдингс, Инк.. Дата публикации: 2020-11-17.

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Номер патента: US11878388B2. Автор: Ching-Hua Hsieh,Yi-Yang Lei,Kuan-Cheng Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-01-23.

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Номер патента: US20170341204A1. Автор: Takuya Sasaki,Yuki Tanaka. Владелец: Shin Etsu Handotai Co Ltd. Дата публикации: 2017-11-30.

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Номер патента: US20240227118A9. Автор: Hiroshi Kurihara,Teppei Tateno,Satsuki YAMAGUCHI,Yamato TAKAMIZAWA,Keisuke Ochi,Tetsuaki KAWASAKI. Владелец: Fujibo Holdins Inc. Дата публикации: 2024-07-11.

Polishing pad and manufacturing method therefor

Номер патента: EP2698809A1. Автор: Fumio Miyazawa,Kouki ITOYAMA. Владелец: Fujibo Holdins Inc. Дата публикации: 2014-02-19.

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Номер патента: US20230111352A1. Автор: Jang Won Seo,Eun Sun JOENG,Jae In Ahn,Sung Hoon Yun. Владелец: SK Enpulse Co Ltd. Дата публикации: 2023-04-13.

Determination of substrate layer thickness with polishing pad wear compensation

Номер патента: US12090599B2. Автор: Kun Xu,Jun Qian,Benjamin Cherian,Kiran Lall Shrestha. Владелец: Applied Materials Inc. Дата публикации: 2024-09-17.

Soft polishing pad for polishing a semiconductor substrate

Номер патента: MY164313A. Автор: Ping Huang,William Allison,Diane Scott,Robert Kerprich,Richard Frentzel. Владелец: Cabot Microelectronics Corp. Дата публикации: 2017-12-15.

Heterogeneous fluoropolymer mixture polishing pad

Номер патента: US11897082B2. Автор: Joseph So,Matthew R. Gadinski. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2024-02-13.

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Номер патента: US20210129284A1. Автор: Jong Wook YUN,Jang Won Seo,Eun Sun JOENG. Владелец: SKC Solmics Co Ltd. Дата публикации: 2021-05-06.

Polishing pad and method for manufacturing polishing pad

Номер патента: US20240131653A1. Автор: Hiroshi Kurihara,Teppei Tateno,Satsuki YAMAGUCHI,Yamato TAKAMIZAWA,Keisuke Ochi,Tetsuaki KAWASAKI. Владелец: Fujibo Holdins Inc. Дата публикации: 2024-04-25.

Polishing pad and method for manufacturing polishing pad

Номер патента: US20240149390A1. Автор: Hiroshi Kurihara,Yoshihide Kawamura,Teppei Tateno,Satsuki YAMAGUCHI,Yamato TAKAMIZAWA,Keisuke Ochi,Tetsuaki KAWASAKI. Владелец: Fujibo Holdins Inc. Дата публикации: 2024-05-09.

Polyurethane for polishing layers, polishing layer and polishing pad

Номер патента: EP3892418A1. Автор: Mitsuru Kato,Chihiro Okamoto,Shinya Kato. Владелец: Kuraray Co Ltd. Дата публикации: 2021-10-13.

Determination of substrate layer thickness with polishing pad wear compensation

Номер патента: US20230381912A1. Автор: Kun Xu,Jun Qian,Benjamin Cherian,Kiran Lall Shrestha. Владелец: Applied Materials Inc. Дата публикации: 2023-11-30.

Additive manufacturing of polishing pads

Номер патента: US20230256560A1. Автор: Rajeev Bajaj,Sivapackia Ganapathiappan,Daniel REDFIELD,Nag B. Patibandla,Uma SRIDHAR,Yingdong Luo,Mayu Felicia Yamamura,Ashwin Murugappan Chockalingam. Владелец: Applied Materials Inc. Дата публикации: 2023-08-17.

Determination of substrate layer thickness with polishing pad wear compensation

Номер патента: US11780047B2. Автор: Kun Xu,Jun Qian,Benjamin Cherian,Kiran Lall Shrestha. Владелец: Applied Materials Inc. Дата публикации: 2023-10-10.

Additive manufacturing of polishing pads

Номер патента: EP4028440A1. Автор: Sivapackia Ganapathiappan,Srobona SEN,Atul Bhaskar Chaudhari. Владелец: Applied Materials Inc. Дата публикации: 2022-07-20.

Additive manufacturing of polishing pads

Номер патента: US12006442B2. Автор: Sivapackia Ganapathiappan,Srobona SEN,Atul Bhaskar Chaudhari. Владелец: Applied Materials Inc. Дата публикации: 2024-06-11.

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Номер патента: KR100508300B1. Автор: 정만섭. Владелец: (주)디디다이아. Дата публикации: 2005-08-17.

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Номер патента: TWI767681B. Автор: 拉吉菲 巴札,泰倫斯Ｙ 李,貝瑞李 秦. Владелец: 美商應用材料股份有限公司. Дата публикации: 2022-06-11.

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Номер патента: TW202323015A. Автор: 拉吉菲 巴札,泰倫斯Ｙ 李,貝瑞李 秦. Владелец: 美商應用材料股份有限公司. Дата публикации: 2023-06-16.

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Номер патента: TW202140246A. Автор: 拉吉菲 巴札,泰倫斯Ｙ 李,貝瑞李 秦. Владелец: 美商應用材料股份有限公司. Дата публикации: 2021-11-01.

Chemical Mechanical Polishing Pad, Production Method Thereof, and Chemical Mechanical Polishing Process

Номер патента: KR100661445B1. Автор: 노부오 가와하시,고 하세가와,다까히로 오까모또,히로시 시호,히로유끼 미야우찌,고우지 가와하라. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2006-12-27.

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Номер патента: KR100737201B1. Автор: 노부오 가와하시,고우 하세가와,다까히로 오까모또,히로시 시호,유끼오 호사까,히로유끼 미야우찌. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2007-07-10.

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Номер патента: EP1591201B1. Автор: Nobuo Kawahashi,Kou Hasegawa,Hiroshi Shiho,Yukio Hosaka,Takahiro Okamoto,Hiroyuki Miyauchi. Владелец: JSR Corp. Дата публикации: 2006-11-15.

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Номер патента: EP1591201A1. Автор: Nobuo Kawahashi,Kou Hasegawa,Hiroshi Shiho,Yukio Hosaka,Takahiro Okamoto,Hiroyuki Miyauchi. Владелец: JSR Corp. Дата публикации: 2005-11-02.

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Номер патента: TW201020066A. Автор: Darrell String,Mary Jo Kulp. Владелец: Rohm & Haas Elect Mat. Дата публикации: 2010-06-01.

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Номер патента: EP2177313B1. Автор: Darrell String,Mary Jo Kulp. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2012-09-12.

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Номер патента: US09799578B2. Автор: Dominic J. Benvegnu,Boguslaw A. Swedek,David J. Lischka. Владелец: Applied Materials Inc. Дата публикации: 2017-10-24.

Pad conditioner for improving removal rate and roughness of polishing pad and chemical mechanical polishing apparatus using the same

Номер патента: KR100693251B1. Автор: 이동준,강경문,소재현,안봉수,문성택. Владелец: 삼성전자주식회사. Дата публикации: 2007-03-13.

POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS FOR POLISHING A WORKPIECE, AND METHOD OF POLISHING A WORKPIECE USING THE CHEMICAL MECHANICAL POLISHING APPARATUS

Номер патента: US20140004772A1. Автор: ITO Kenya,ISHII Yu,TAKAHASHI Shozo,SUZUKI Mika. Владелец: EBARA CORPORATION. Дата публикации: 2014-01-02.

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Номер патента: US20040092112A1. Автор: Chia-Lin Hsu,Teng-Chun Tsai,Shao-Chung Hu. Владелец: United Microelectronics Corp. Дата публикации: 2004-05-13.

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Номер патента: WO2010019339A2. Автор: Yulin Wang,Alpay Yilmaz,Roy Nangoy. Владелец: Applied Materials, Inc.. Дата публикации: 2010-02-18.

Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures

Номер патента: EP1307909A2. Автор: William J. Campbell. Владелец: Advanced Micro Devices Inc. Дата публикации: 2003-05-07.

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Номер патента: DE102006057075A1. Автор: Volker Dr. Herold,Steffen Dipl.-Ing. Eckner. Владелец: Friedrich Schiller Universtaet Jena FSU. Дата публикации: 2008-06-05.

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Номер патента: US20240208005A1. Автор: Jongsu Kim,Sungyong PARK,Hoseop Choi,Jubong LEE,Hyunjoon Park,Bongki PARK,Eunsun PARK. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-06-27.

Chemical mechanical polishing (CMP) method using under pad and polishing pad with different compression regions

Номер патента: JP4286344B2. Автор: サン・シー・キム,レイ・ピン・ライ,ラジブ・バジャジ,アダム・マンゾニー. Владелец: NXP USA Inc. Дата публикации: 2009-06-24.

Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring

Номер патента: US20040171331A1. Автор: William Dyson,Tanlin Dickey,Scott Chin,Gerald Maloney,John Geraghty. Владелец: Individual. Дата публикации: 2004-09-02.

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Номер патента: US20240269799A1. Автор: Jian Zhang,Haifeng Zhou. Владелец: Shanghai Huali Integrated Circuit Corp. Дата публикации: 2024-08-15.

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Номер патента: KR100726507B1. Автор: 로버트디. 툴레스,시드니 후에이. Владелец: 어플라이드 머티어리얼스, 인코포레이티드. Дата публикации: 2007-06-11.

Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool

Номер патента: US20060014479A1. Автор: Viet Nguyen Hoang,Herma Van Kranenburg,Albert Hof,Pierre Woerlee. Владелец: Individual. Дата публикации: 2006-01-19.

Tungsten chemical mechanical polishing method using fixed polishing pad and tungsten layer chemical mechanical polishing solution for chemical mechanical polishing using fixed polishing pad

Номер патента: JP4010112B2. Автор: ダイネッシュ チョップラ，,スコット， ジー． メイクル，. Владелец: マイクロン テクノロジー， インク．. Дата публикации: 2007-11-21.

Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: US6206756B1. Автор: Dinesh Chopra,Scott G. Meikle. Владелец: Micron Technology Inc. Дата публикации: 2001-03-27.

Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: US6273786B1. Автор: Dinesh Chopra,Scott G. Meikle. Владелец: Micron Technology Inc. Дата публикации: 2001-08-14.

Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: WO2000028585A1. Автор: Dinesh Chopra,Scott G. Meikle. Владелец: MICRON TECHNOLOGY, INC.. Дата публикации: 2000-05-18.

Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: KR100443458B1. Автор: 디네쉬 코프라,스코트지. 메이클. Владелец: 미크론 테크놀로지,인코포레이티드. Дата публикации: 2004-08-09.

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Номер патента: US20210066086A1. Автор: MOON Deuk Kyu,Jung Moon Il,KIM Do Yoon,TAKAI Kenji,YOON Min Hee. Владелец: . Дата публикации: 2021-03-04.

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Номер патента: EP4229104A4. Автор: Ping Huang,Chen-Chih Tsai,Eric S Moyer. Владелец: CMC Materials LLC. Дата публикации: 2024-08-28.

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Номер патента: US20070077871A1. Автор: Moo-Yong Park,Tai-Hyoung Kim,Choon-goang Kim,Dong-Il Kim. Владелец: Individual. Дата публикации: 2007-04-05.

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Номер патента: US11964358B2. Автор: Kei-Wei Chen,Chun-Hao Kung,Hui-Chi Huang,Ching-hsiang Tsai,Shang-Yu Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-04-23.

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Номер патента: US20240217054A1. Автор: Kei-Wei Chen,Chun-Hao Kung,Hui-Chi Huang,Ching-hsiang Tsai,Shang-Yu Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-07-04.

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Номер патента: US20210205950A1. Автор: Kei-Wei Chen,Chun-Hao Kung,Hui-Chi Huang,Ching-hsiang Tsai,Shang-Yu Wang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2021-07-08.

A method and apparatus for stabilizing the process temperature during chemical mechanical polishing

Номер патента: EP1165288A1. Автор: Wilbur C. Krusell,Anil K. Pant,Erik H. Engdahl,Robert G. Boehm. Владелец: Lam Research Corp. Дата публикации: 2002-01-02.

Endpoint detection in chemical mechanical polishing using multiple spectra

Номер патента: WO2009134865A2. Автор: Thomas H. Osterheld,Harry Q. Lee,Jun Qian,Sivakumar Dhandapani,Zhize Zhu. Владелец: Applied Materials, Inc.. Дата публикации: 2009-11-05.

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Номер патента: TW200938604A. Автор: Kazuo Nishimoto,Tomotaka Shinoda. Владелец: JSR Corp. Дата публикации: 2009-09-16.

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Номер патента: US20110117821A1. Автор: Kazuo Nishimoto,Tomotaka Shinoda. Владелец: JSR Corp. Дата публикации: 2011-05-19.

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Номер патента: WO2011093195A1. Автор: 和男 西元,太一 阿部,達慶 河本,志保　浩司. Владелец: Jsr株式会社. Дата публикации: 2011-08-04.

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Номер патента: TW201139633A. Автор: Kazuo Nishimoto,Hiroshi Shiho,Taichi Abe,Tatsuyoshi Kawamoto. Владелец: JSR Corp. Дата публикации: 2011-11-16.

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Номер патента: JP5207002B2. Автор: 和男 西元,智隆 篠田. Владелец: JSR Corp. Дата публикации: 2013-06-12.

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Номер патента: US8652350B2. Автор: Kazuo Nishimoto,Tomotaka Shinoda. Владелец: JSR Corp. Дата публикации: 2014-02-18.

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: WO2000028586A3. Автор: Dinesh Chopra. Владелец: Micron Technology Inc. Дата публикации: 2000-10-12.

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: US20010016469A1. Автор: Dinesh Chopra. Владелец: Individual. Дата публикации: 2001-08-23.

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Номер патента: AU1724500A. Автор: Dinesh Chopra. Владелец: Micron Technology Inc. Дата публикации: 2000-05-29.

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Номер патента: US6276996B1. Автор: Dinesh Chopra. Владелец: Micron Technology Inc. Дата публикации: 2001-08-21.

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

Номер патента: WO2000028586A2. Автор: Dinesh Chopra. Владелец: MICRON TECHNOLOGY, INC.. Дата публикации: 2000-05-18.

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Номер патента: US6676484B2. Автор: Dinesh Chopra. Владелец: Micron Technology Inc. Дата публикации: 2004-01-13.

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Номер патента: EP1138069A2. Автор: Dinesh Chopra. Владелец: Micron Technology Inc. Дата публикации: 2001-10-04.

Polyurethane, composition for forming polishing layer containing the same, chemical mechanical polishing pad, and chemical mechanical polishing method using the same

Номер патента: JPWO2010146982A1. Автор: 岡本　隆浩,力丸 桑原,隆浩 岡本. Владелец: JSR Corp. Дата публикации: 2012-12-06.

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Номер патента: EP2006890A9. Автор: Gaku Minamihaba,Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi. Владелец: JSR Corp. Дата публикации: 2009-07-22.

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Номер патента: JP5013732B2. Автор: 学 南幅,大 福島,博之 矢野,和一 内倉,裕貴 仕田,裕一 橋口,佳邦 竪山. Владелец: JSR Corp. Дата публикации: 2012-08-29.

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Номер патента: US20090124172A1. Автор: Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi,Gaku Minamihara. Владелец: JSR Corp. Дата публикации: 2009-05-14.

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Номер патента: EP2006890A4. Автор: Gaku Minamihaba,Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi. Владелец: JSR Corp. Дата публикации: 2011-02-16.

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Номер патента: KR101330960B1. Автор: 히로유끼 야노,가꾸 미나미하바,가즈히또 우찌꾸라,히로따까 시다,유우이찌 하시구찌,다이 후꾸시마,요시꾸니 다떼야마. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2013-11-18.

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Номер патента: US20110250756A1. Автор: Gaku Minamihaba,Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi. Владелец: JSR Corp. Дата публикации: 2011-10-13.

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Номер патента: TW200801168A. Автор: Yano Hiroyuki,Gaku Minamihaba,Dai Fukushima,Hirotaka Shida,Kazuhito Uchikura,TATEYAMA Yoshikuni,Yuuichi Hashiguchi. Владелец: Toshiba Kk. Дата публикации: 2008-01-01.

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Номер патента: EP2006890A2. Автор: Gaku Minamihaba,Dai Fukushima,Hiroyuki Yano,Yoshikuni Tateyama,Hirotaka Shida,Kazuhito Uchikura,Yuuichi Hashiguchi. Владелец: JSR Corp. Дата публикации: 2008-12-24.

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Номер патента: JP6870928B2. Автор: ユリア・コジューフ,ユファ・トン,アンドリュー・ワンク,ディエゴ・ルーゴ,マーク・アール・スタック,デイビッド・マイケル・ヴェネツィアーレ,マーティー・ディグルート,ジョージ・シー・ジェイコブ,ジェフリー・ビー・ミラー,バイニャン・チャン,テレサ・ブルガロラス・ブルファウ,トニー・クアン・トラン,フェンジィ・イエ. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2021-05-12.

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Номер патента: JPWO2007116770A1. Автор: 裕貴 仕田,彰浩 竹村,池田　正俊,正俊 池田. Владелец: JSR Corp. Дата публикации: 2009-08-20.

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Номер патента: WO2012161202A1. Автор: 穣 竹越,加藤　充,知大 岡本,晋哉 加藤. Владелец: 株式会社クラレ. Дата публикации: 2012-11-29.

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Номер патента: US20090302266A1. Автор: Hirotaka Shida,Akihiro Takemura,Masatoshi Ikeda. Владелец: JSR Corp. Дата публикации: 2009-12-10.

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Номер патента: KR101406642B1. Автор: 히로따까 시다,아끼히로 다께무라,마사또시 이께다. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2014-06-11.

Composition for chemical mechanical polishing, chemical mechanical polishing method, and method for manufacturing particles for chemical mechanical polishing

Номер патента: WO2021124771A1. Автор: 達也 山中,鵬宇 王,康二 中西. Владелец: Jsr株式会社. Дата публикации: 2021-06-24.

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Номер патента: EP2006891A1. Автор: Hirotaka Shida,Akihiro Takemura,Masatoshi Ikeda. Владелец: JSR Corp. Дата публикации: 2008-12-24.

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Номер патента: EP2006891A4. Автор: Hirotaka Shida,Akihiro Takemura,Masatoshi Ikeda. Владелец: JSR Corp. Дата публикации: 2011-02-23.

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Номер патента: EP1962334A1. Автор: Norihiko Ikeda,Tomikazu Ueno. Владелец: JSR Corp. Дата публикации: 2008-08-27.

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Номер патента: EP1962334A4. Автор: Norihiko Ikeda,Tomikazu Ueno. Владелец: JSR Corp. Дата публикации: 2010-11-17.

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Номер патента: US20090165395A1. Автор: Norihiko Ikeda,Tomikazu Ueno. Владелец: JSR Corp. Дата публикации: 2009-07-02.

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Номер патента: IL229522A0. Автор: . Владелец: Kuraray Co. Дата публикации: 2014-01-30.

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Номер патента: JP5182483B2. Автор: 富和 植野,憲彦 池田. Владелец: JSR Corp. Дата публикации: 2013-04-17.

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Номер патента: KR101276026B1. Автор: 노리히꼬 이께다,도미까즈 우에노. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2013-06-19.

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Номер патента: US8157877B2. Автор: Norihiko Ikeda,Tomikazu Ueno. Владелец: JSR Corp. Дата публикации: 2012-04-17.

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Номер патента: US09586305B2. Автор: Yuhua Tong,Bainian Qian,Julia KOZHUKH,Tony Quan Tran,Marty W. Degroot,George C. Jacob,Teresa Brugarolas Brufau,Fengji Yeh,David Michael Veneziale,Diego Lugo,Andrew Wank,Jeffrey B. Miller,Marc R. Stack. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2017-03-07.

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Номер патента: US20240316608A1. Автор: Shao-Hua Hu,Hsin-Hui Chou,Ya-Min Hsieh,Wen-Ming Cheng,Hsing-Wen HSIEH,Chin-An KUAN. Владелец: Transcene Corp. Дата публикации: 2024-09-26.

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Номер патента: US20230326736A1. Автор: Kei-Wei Chen,Gin-Chen Huang,Ying-Tsung Chen,Ya-Ting Tsai,Ssutzu Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-10-12.

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Номер патента: US20230215926A1. Автор: SEUNGJAE LEE,Ilyoung Yoon,JaEung Koo,Boun Yoon,Joongsuk Oh,Kangchun LEE,Junhwan Yim,Huiteak Hong. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-07-06.

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Номер патента: US11766759B2. Автор: Sunghoon YUN,Hye Young HEO,Jong Wook YUN,Jang Won Seo,Jaein AHN. Владелец: SK Enpulse Co Ltd. Дата публикации: 2023-09-26.

Chemical-mechanical process to reduce the contamination caused by gases and products resulting from the combustion of fossil fuels, petroleum and its by-products

Номер патента: CA2397221A1. Автор: Rafael Vidal Fernandez. Владелец: Individual. Дата публикации: 2003-02-09.

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Номер патента: US20130023639A1. Автор: Harald Rust. Владелец: Entex Rust and Mitschke GmbH. Дата публикации: 2013-01-24.

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Номер патента: US7037854B2. Автор: Robert Z. Bachrach,Jeffrey D. Chinn. Владелец: Applied Materials Inc. Дата публикации: 2006-05-02.

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Номер патента: US20150191578A1. Автор: Harald Rust. Владелец: Entex Rust and Mitschke GmbH. Дата публикации: 2015-07-09.

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Номер патента: US20240263080A1. Автор: JANGWON SEO,Chang Gyu Im. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-08-08.

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Номер патента: US8091705B1. Автор: David L. McCutchen. Владелец: Individual. Дата публикации: 2012-01-10.

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Номер патента: EP4410857A1. Автор: JANGWON SEO,Chang Gyu Im. Владелец: SK Enpulse Co Ltd. Дата публикации: 2024-08-07.

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Номер патента: US20220195258A1. Автор: Tadashi Abe. Владелец: Toyochem Co Ltd. Дата публикации: 2022-06-23.

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Номер патента: RU2687649C2. Автор: Валентина Александровна Гайдедей. Владелец: Общество с ограниченной ответственностью "КРОКУС НАНОЭЛЕКТРОНИКА". Дата публикации: 2019-05-15.

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Номер патента: US09659796B2. Автор: Ming-Che Ho,Cheng Hsun Chan. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-05-23.

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Номер патента: US12098301B2. Автор: Tetsuya Kamimura. Владелец: Fujifilm Corp. Дата публикации: 2024-09-24.

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Номер патента: US09676966B2. Автор: Akitoshi Yoshida,Haruki Nojo,Pascal Berar,Hirofumi Kashihara. Владелец: Air Products and Chemicals Inc. Дата публикации: 2017-06-13.

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Номер патента: WO2024081201A1. Автор: Brian Reiss,Elliot KNAPTON,Alex Villani-Gale. Владелец: CMC Materials LLC. Дата публикации: 2024-04-18.

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Номер патента: US20240317621A1. Автор: Shao-Hua Hu,Hsin-Hui Chou,Ya-Min Hsieh,Wen-Ming Cheng,Hsing-Wen HSIEH,Chin-An KUAN. Владелец: Individual. Дата публикации: 2024-09-26.

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Номер патента: US20230123263A1. Автор: Ungyu Paik,Hyun Goo Kang,Dong Hyeok Kim,Cheolmin SHIN,Taeseup SONG,Jong Young Cho. Владелец: Industry University Cooperation Foundation IUCF HYU. Дата публикации: 2023-04-20.

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Номер патента: US09718991B2. Автор: Song Yuan Chang,Ming Hui Lu,Ming Che Ho,Wen Cheng Liu,Yi Han Yang. Владелец: Uwiz Technology Co Ltd. Дата публикации: 2017-08-01.

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Номер патента: US7138654B2. Автор: Tu-Hao Yu,Yu-Chia Chen,Pai-Hsuan Sun. Владелец: Winbond Electronics Corp. Дата публикации: 2006-11-21.

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Номер патента: US20210009859A1. Автор: Jae Ik Lee,Jae Woo Lee,Ji Hye Kim,Bo Hyeok Choi. Владелец: KCTech Co Ltd. Дата публикации: 2021-01-14.

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Номер патента: RU2605941C2. Автор: Бастиан Мартен НОЛЛЕР,Южуо ЛИ,Беттина ДРЕШЕР,Кристоф ЖИЛЛО. Владелец: БАСФ СЕ. Дата публикации: 2016-12-27.

Economical and environmentally friendly chemical mechanical polishing for III-V compound semiconductor device fabrication

Номер патента: US09601482B1. Автор: Alexander Reznicek,Devendra K. Sadana,Keith E. Fogel,Charan V. Surisetty. Владелец: International Business Machines Corp. Дата публикации: 2017-03-21.

Chemical-mechanical polishing (cmp) composition comprising benzotriazole derivatives as corrosion inhibitors

Номер патента: RU2669598C2. Автор: Южуо ЛИ,Роберт РАЙХАРДТ,Мартин КАЛЛЕР,Михаэль ЛАУТЕР,Андреас КЛИПП. Владелец: БАСФ СЕ. Дата публикации: 2018-10-12.

Method for forming aluminum bumps by sputtering and chemical mechanical polishing

Номер патента: US20020142604A1. Автор: Cheng-Wei Lee. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2002-10-03.

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Номер патента: US20240180324A1. Автор: Liqing Wen,Le Lu,Jhih-Fong Lin,Deng-Gao Chen. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2024-06-06.

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Номер патента: RU2627711C1. Автор: Алексей Сергеевич Кашуба,Медина Рефатовна Лакманова,Анна Владимировна Погожева. Владелец: Акционерное общество "НПО "Орион". Дата публикации: 2017-08-10.

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Номер патента: US20220315800A1. Автор: Jimmy Granstrom. Владелец: Fujimi Inc. Дата публикации: 2022-10-06.

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Номер патента: RU2579597C2. Автор: Южуо ЛИ,Виджай Иммануэль РАМАН,Михаэль ЛАУТЕР,Шиям Сундар ВЕНКАТАРАМАН,Даниэль Кво-Хунг ШЕН. Владелец: БАСФ СЕ. Дата публикации: 2016-04-10.

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Номер патента: US20240194732A1. Автор: Sharath Hegde,Gary Ding,Matthew J. Prince,Walid M. Hafez,Inki Kim,Amitesh Shrivastava,Anurag A. Jain,Caitlin M. Kilroy. Владелец: Intel Corp. Дата публикации: 2024-06-13.

Pad-in-a-bottle and single platen chemical mechanical-planarization for back-end applications

Номер патента: EP4430655A1. Автор: Xiaobo Shi,Mark Leonard O'Neill,Robert Vacassy,John G. LANGAN,Ara Philipossian,Yasa Sampurno,James A. Schlueter. Владелец: Versum Materials US LLC. Дата публикации: 2024-09-18.

Aqueous polishing composition and method for chemical-mechanical polishing of substrates having polysilicon and silicon oxide dielectric films

Номер патента: RU2573672C2. Автор: Шиам Сундар ВЕНКАТАРАМАН,Южуо ЛИ,Джеа-Джу ЧУ,Вей Лан Уиллиам ЧИУ,Харви Уэйн ПИНДЕР. Владелец: БАСФ СЕ. Дата публикации: 2016-01-27.

Water polishing composition and method of chemical-mechanical polishing of substrate materials for electric, mechanical and optical devices

Номер патента: RU2577281C2. Автор: Шиам Сундар ВЕНКАТАРАМАН,Южуо ЛИ,Джеа-Джу ЧУ,Харви Уэйн ПИНДЕР,ИБРАХИМ Шейк Ансар УСМАН. Владелец: БАСФ СЕ. Дата публикации: 2016-03-10.

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Номер патента: RU2643541C9. Автор: Южуо ЛИ,Вей Лан Уильям ЧИУ,Роберт РАЙХАРДТ,Михаэль ЛАУТЕР. Владелец: БАСФ СЕ. Дата публикации: 2018-03-16.

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Номер патента: RU2643541C2. Автор: Южуо ЛИ,Вей Лан Уильям ЧИУ,Роберт РАЙХАРДТ,Михаэль ЛАУТЕР. Владелец: БАСФ СЕ. Дата публикации: 2018-02-02.

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Номер патента: US20230352310A1. Автор: Sang Kyun Kim,Hyo San LEE,In Kwon Kim,Yearin BYUN. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2023-11-02.

Pad-ln-a-bottle chemical mechanical planarization polishing with cost-effective non-porous solid polishing pads

Номер патента: EP4430134A1. Автор: Xiaobo Shi,Mark Leonard O'Neill,Robert Vacassy,John G. LANGAN,Ara Philipossian,Yasa Sampurno,James A. Schlueter. Владелец: Versum Materials US LLC. Дата публикации: 2024-09-18.

Composition for chemical-mechanical polishing containing polyvinyl phosphon acid and derivatives thereof

Номер патента: RU2598046C2. Автор: Шиам Сундар ВЕНКАТАРАМАН,ИБРАХИМ Шейк Ансар УСМАН,Виджай Иммануил РАМАН,Южио ЛИ,Кристиан ШАДЕ,Исон Ю-Шен СУ. Владелец: БАСФ СЕ. Дата публикации: 2016-09-20.

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Номер патента: RU2589482C2. Автор: Виджай Иммануэль РАМАН,Франк РИТТИГ,Юйчжо ЛИ,Вей Лан Уильям ЧИУ. Владелец: БАСФ СЕ. Дата публикации: 2016-07-10.

Composition for chemical-mechanical polishing (cmp), containing non-ionic surfactant and aromatic compound containing acid group

Номер патента: RU2636511C2. Автор: Южуо ЛИ,Роберт РАЙХАРДТ,Михаэль ЛАУТЕР. Владелец: БАСФ СЕ. Дата публикации: 2017-11-23.

Mechanisms for forming oxide layer over exposed polysilicon during a chemical mechanical polishing (CMP) process

Номер патента: US09711374B2. Автор: William Weilun HONG,Ying-Tsung Chen,Chih-Yu Chang,Che-Hao Tu. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-07-18.

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Номер патента: US09601489B2. Автор: Chan-Hong Chern,Chih-Chang Lin,Jacklyn CHANG,Julie Tran. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-03-21.

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Номер патента: RU2631875C2. Автор: Бастиан Мартен НОЛЛЕР,Южуо ЛИ,Михаэль ЛАУТЕР,Роланд ЛАНГЕ. Владелец: БАСФ СЕ. Дата публикации: 2017-09-28.

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Номер патента: RU2582904C1. Автор: Екатерина Алексеевна Ковалишина. Владелец: Открытое акционерное общество "Центральный научно-исследовательский институт "Электрон". Дата публикации: 2016-04-27.

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Номер патента: US11718769B2. Автор: Yi Guo. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2023-08-08.

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Номер патента: US20240087907A1. Автор: Shan Hu,Eric Chih-Fang Liu,Henan ZHANG,Sangita Kumari,Peter Delia. Владелец: Tokyo Electron Ltd. Дата публикации: 2024-03-14.

Cerium oxide particles, making process thereof and use thereof in chemical mechanical polishing

Номер патента: US20240158251A1. Автор: Lauriane D'ALENCON,Marie PLISSONNEAU,Valerie Buissette,Réka TOTH,Mickaël BOUDOT. Владелец: Rhodia Operations SAS. Дата публикации: 2024-05-16.

Planarization of a polysilicon layer surface by chemical mechanical polish to improve lithography and silicide formation

Номер патента: US20020072219A1. Автор: Steven Avanzino,Stephen Park. Владелец: Advanced Micro Devices Inc. Дата публикации: 2002-06-13.

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Номер патента: US20240318040A1. Автор: Seungho Park,Sanghyun Park,Boyun KIM,Yearin BYUN,Jeongwon Lim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2024-09-26.

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Номер патента: US20110306211A1. Автор: Yi Guo,Zhendong Liu,Kancharla-Arun Kumar Reddy,Guangyun Zhang. Владелец: Rohm and Haas Electronic Materials CMP Holdings Inc. Дата публикации: 2011-12-15.

Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of n-vinyl-homopolymers and n-vinyl copolymers

Номер патента: MY177867A. Автор: Yongqing Lan,Peter Przybylski,Zhenyu Bao,Julian Prol?. Владелец: BASF SE. Дата публикации: 2020-09-23.

Planarization of a polysilicon layer surface by chemical mechanical polish to improve lithography and silicide formation

Номер патента: US6548336B2. Автор: Steven C. Avanzino,Steven K. Park. Владелец: Advanced Micro Devices Inc. Дата публикации: 2003-04-15.

Methods for planarizing a substrate using a combined wet etch and chemical mechanical polishing (CMP) process

Номер патента: US12100598B2. Автор: Shan Hu,Eric Chih-Fang Liu,Henan ZHANG,Sangita Kumari,Peter Delia. Владелец: Tokyo Electron Ltd. Дата публикации: 2024-09-24.

Chemical-mechanical polishing composition and method for using the same

Номер патента: IL176669A0. Автор: . Владелец: Cabot Microelectronics Corp. Дата публикации: 2006-10-31.

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Номер патента: US20240002698A1. Автор: Julian Proelss,Michael Lauter,Haci Osman GUEVENC,Leonardus Leunissen,Reza M. Golzarian,Te Yu Wei,Wei Lan Chiu. Владелец: BASF SE. Дата публикации: 2024-01-04.

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Номер патента: US20240117220A1. Автор: Brian Reiss,Elliot KNAPTON,Alex Villani-Gale. Владелец: CMC Materials LLC. Дата публикации: 2024-04-11.

Process for chemical-mechanical polishing of iii-v semiconductor materials

Номер патента: CA1044580A. Автор: Robert J. Walsh. Владелец: Monsanto Co. Дата публикации: 1978-12-19.

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Номер патента: US11898063B2. Автор: Wenting Zhou. Владелец: Anji Microelectronics Shanghai Co Ltd. Дата публикации: 2024-02-13.

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Номер патента: US11725117B2. Автор: Julian Proelss,Michael Lauter,Haci Osman GUEVENC,Leonardus Leunissen,Reza M. Golzarian,Te Yu Wei,Wei Lan Chiu. Владелец: BASF SE. Дата публикации: 2023-08-15.

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Номер патента: US20230416570A1. Автор: Julian Proelss,Michael Lauter,Haci Osman GUEVENC,Leonardus Leunissen,Reza M. Golzarian,Te Yu Wei,Wei Lan Chiu. Владелец: BASF Corp. Дата публикации: 2023-12-28.

Aqueous polishing composition and method for chemical-mechanical polishing of substrates, containing film based on silicon oxide dielectric and based on polycrystalline silicon

Номер патента: RU2588620C2. Автор: Шиам Сундар ВЕНКАТАРАМАН,Исон Юй-Шен СУ,Аренд Йоукэ КИНГМА,Бастиан Мартен НОЛЛЕР. Владелец: БАСФ СЕ. Дата публикации: 2016-07-10.

Chemical mechanical polishing solution

Номер патента: US11746257B2. Автор: JIAN Ma,Kai Song,Ying Yao,Jianfen JING,Xinyuan CAI,Guohao WANG,Junya YANG,Pengcheng BIAN. Владелец: Anji Microelectronics Shanghai Co Ltd. Дата публикации: 2023-09-05.

Chemical-mechanical polishing proximity correction method and correction pattern thereof

Номер патента: US20050142877A1. Автор: Tu-Hao Yu,Yu-Chia Chen,Pai-Hsuan Sun. Владелец: Winbond Electronics Corp. Дата публикации: 2005-06-30.

Removal of defects by in-situ etching during chemical-mechanical polishing processing

Номер патента: EP4235751A2. Автор: Scott B. Singer,Joseph C. Boisvert,Daniel C. Law,Christopher M. Fetzer. Владелец: Boeing Co. Дата публикации: 2023-08-30.

Removal of defects by in-situ etching during chemical-mechanical polishing processing

Номер патента: EP4235751A3. Автор: Scott B. Singer,Joseph C. Boisvert,Daniel C. Law,Christopher M. Fetzer. Владелец: Boeing Co. Дата публикации: 2023-11-15.

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Номер патента: US20230348753A1. Автор: Jeong Ho Lee,Seok Joo Kim. Владелец: Soulbrain Co Ltd. Дата публикации: 2023-11-02.

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Номер патента: US11787974B2. Автор: Jae Hyun Kim,Jong Dai Park,Min Gun Lee,Sung Hoon Jin,Jae Hong Yoo,Kyu Soon SHIN,Goo Hwa LEE,Weoun Gyuen MOON,Gyeong Sook CHO. Владелец: Dongjin Semichem Co Ltd. Дата публикации: 2023-10-17.

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Номер патента: US20210340405A1. Автор: Jae Hyun Kim,Jong Dai Park,Min Gun Lee,Sung Hoon Jin,Jae Hong Yoo,Kyu Soon SHIN,Goo Hwa LEE,Weoun Gyuen MOON,Gyeong Sook CHO. Владелец: Dongjin Semichem Co Ltd. Дата публикации: 2021-11-04.

Chemical mechanical polishing for hybrid bonding

Номер патента: US20230268308A1. Автор: Chandrasekhar MANDALAPU,Cyprian Emeka Uzoh,Jeremy Alfred Theil,Gaius Gillman Fountain, Jr.. Владелец: Adeia Semiconductor Bonding Technologies Inc. Дата публикации: 2023-08-24.

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Номер патента: US11999877B2. Автор: Jimmy Granstrom. Владелец: Fujimi Inc. Дата публикации: 2024-06-04.

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Номер патента: US20080029478A1. Автор: Teng-Chun Tsai,Hsiao-Ling Lu,Chia-Jung Hsu,Art Yu. Владелец: United Microelectronics Corp. Дата публикации: 2008-02-07.

Cerium oxide chemical mechanical polishing slurry composition that enhanced polishing non-uniformity

Номер патента: KR20060123878A. Автор: 박종대,공현구,이봉상,손정현. Владелец: 주식회사 동진쎄미켐. Дата публикации: 2006-12-05.

Method of fabricating self-aligned contact pad using chemical mechanical polishing process

Номер патента: US20070072407A1. Автор: Bo-Un Yoon,Chang-ki Hong,Joon-Sang Park,Ho-Young Kim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2007-03-29.

Slurry for chemical mechanical polishing

Номер патента: US20040021125A1. Автор: Yasuaki Tsuchiya,Shin Sakurai,Kenichi Aoyagi,Toshiji Taiji,Tomoyuki Ito. Владелец: NEC Electronics Corp. Дата публикации: 2004-02-05.

Method of fabricating self-aligned contact pad using chemical mechanical polishing process

Номер патента: US7781281B2. Автор: Bo-Un Yoon,Chang-ki Hong,Joon-Sang Park,Ho-Young Kim. Владелец: SAMSUNG ELECTRONICS CO LTD. Дата публикации: 2010-08-24.

Method of fabricating self-aligned contact pad using chemical mechanical polishing process

Номер патента: US20100124817A1. Автор: Bo-Un Yoon,Chang-ki Hong,Joon-Sang Park,Ho-Young Kim. Владелец: Individual. Дата публикации: 2010-05-20.

Surface conversion in chemical mechanical polishing

Номер патента: US11804378B2. Автор: Chih-Chao Yang,Cornelius Brown Peethala,Donald F Canaperi,Raghuveer R Patlolla,Mary Breton. Владелец: International Business Machines Corp. Дата публикации: 2023-10-31.

Chemical mechanical polishing composition

Номер патента: US11993729B2. Автор: Yongqing Lan,Sheik Ansar Usman Ibrahim,Julian Proelss,Michael Lauter,Max SIEBERT,Haci Osman GUEVENC,Leonardus Leunissen,Te Yu Wei,Christian Daeschlein,Reza M Golzarian. Владелец: BASF SE. Дата публикации: 2024-05-28.

Composition for chemical mechanical polishing

Номер патента: KR20010096326A. Автор: 김석진,이길성,이재석,장두원. Владелец: 안복현. Дата публикации: 2001-11-07.

Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing

Номер патента: TWI634956B. Автор: 陳輝. Владелец: 應用材料股份有限公司. Дата публикации: 2018-09-11.

Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing

Номер патента: TW201501820A. Автор: Hui Chen. Владелец: Applied Materials Inc. Дата публикации: 2015-01-16.

Cerium oxide particles, making process thereof and use thereof in chemical mechanical polishing

Номер патента: EP4305121A1. Автор: Lauriane D'ALENCON,Marie PLISSONNEAU,Valerie Buissette,Réka TOTH,Mickaël BOUDOT. Владелец: Rhodia Operations SAS. Дата публикации: 2024-01-17.

Cerium oxide particles, making process thereof and use thereof in chemical mechanical polishing

Номер патента: EP4304984A1. Автор: Lauriane D'ALENCON,Marie PLISSONNEAU,Valerie Buissette,Réka TOTH,Mickaël BOUDOT. Владелец: Rhodia Operations SAS. Дата публикации: 2024-01-17.

Chemical mechanical planarization slurry and method of polishing a substrate

Номер патента: WO2023240260A1. Автор: Lin Fu,Renjie Zhou,Stephen BOTTIGLIERI,Chun-Lung Kuan. Владелец: SAINT-GOBAIN CERAMICS & PLASTICS, INC.. Дата публикации: 2023-12-14.

Method for chemical mechanical polishing of semiconductor device

Номер патента: KR100732308B1. Автор: 권판기,이상익. Владелец: 주식회사 하이닉스반도체. Дата публикации: 2007-06-25.

Composition for post chemical-mechanical-polishing cleaning

Номер патента: WO2017211653A1. Автор: Andreas Klipp,Peter Przybylski,Julian Proelss,Michael Lauter,Max SIEBERT,Haci Osman GUEVENC,Leonardus Leunissen,Christian Daeschlein,Ivan GARCIA ROMERO. Владелец: BASF SE. Дата публикации: 2017-12-14.

Composition for post chemical-mechanical-polishing cleaning

Номер патента: WO2017108748A2. Автор: Andreas Klipp,Peter Przybylski,Julian Proelss,Michael Lauter,Max SIEBERT,Haci Osman GUEVENC,Leonardus Leunissen,Te Yu Wei,Christian DÄSCHLEIN,Roelf-Peter BAUMANN. Владелец: BASF SE. Дата публикации: 2017-06-29.

Fabrication of volcano-shaped field emitters by chemical-mechanical polishing (CMP)

Номер патента: US6008064A. Автор: Heinz H. Busta. Владелец: American Energy Services Inc. Дата публикации: 1999-12-28.

Use of stop layer for chemical mechanical polishing of CU damascene

Номер патента: US6051496A. Автор: Syun-Ming Jang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2000-04-18.

Alignment method for used in chemical mechanical polishing process

Номер патента: US5933744A. Автор: Tsu Shih,Chung-Long Chang,Jeng-Horng Chen,Jui-Yu Chang. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 1999-08-03.

Chemical-mechanical polishing for shallow trench isolation

Номер патента: US5958795A. Автор: Juan-Yuan Wu,Water Lur,Coming Chen. Владелец: United Microelectronics Corp. Дата публикации: 1999-09-28.

Negatively charged silica particles, method of producing such particles, compositions comprising such particles, and a method of chemical-mechanical polishing using such particles

Номер патента: WO2023180216A1. Автор: Eric Jacquinot,Frédéric GUILLAUD. Владелец: Merck Patent GmBH. Дата публикации: 2023-09-28.

Cerium oxide particles, making process thereof and use thereof in chemical mechanical polishing

Номер патента: US20240158250A1. Автор: Lauriane D'ALENCON,Marie PLISSONNEAU,Valerie Buissette,Réka TOTH,Mickaël BOUDOT. Владелец: Rhodia Operations SAS. Дата публикации: 2024-05-16.

Chemical mechanical planarization slurry and method of polishing a substrate

Номер патента: US20230399543A1. Автор: Lin Fu,Renjie Zhou,Stephen BOTTIGLIERI,Chun-Lung Kuan. Владелец: Saint Gobain Ceramics and Plastics Inc. Дата публикации: 2023-12-14.

Chemical-mechanical contouring (CMC) method for forming a contoured surface

Номер патента: US5940956A. Автор: Stephen G. Jordan. Владелец: Aiwa Co Ltd. Дата публикации: 1999-08-24.

Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing

Номер патента: EP1936674A3. Автор: Junaid Ahmed Siddiqui,Rachel Dianne Mcconnell,Saifi Usmani. Владелец: DuPont Air Products NanoMaterials LLC. Дата публикации: 2010-04-28.

Amphiphilic abrasive particles and their use for chemical mechanical planarization

Номер патента: WO2024129435A1. Автор: Gerhard Jonschker. Владелец: Versum Materials US, LLC. Дата публикации: 2024-06-20.

Method for improving Uniformity of Chemical-Mechanical Planarization Process

Номер патента: US20130273669A1. Автор: Tao Yang,Chao Zhao,Junfeng Li. Владелец: Institute of Microelectronics of CAS. Дата публикации: 2013-10-17.

Chemical mechanical planarization polishing for shallow trench isolation

Номер патента: EP4413088A1. Автор: Xiaobo Shi,Hongjun Zhou,Krishna P. Murella,Joseph D. ROSE. Владелец: Versum Materials US LLC. Дата публикации: 2024-08-14.

Chemical mechanical planarization using amino-polyorganosiloxane-coated abrasives

Номер патента: WO2023178286A1. Автор: Gerhard Jonschker,Matthias Stender,René LUTZ. Владелец: Versum Materials US, LLC. Дата публикации: 2023-09-21.

Carbon and boron implantation for backside chemical mechanical planarization control

Номер патента: US20240266175A1. Автор: Yan Zhang,Jae Young Lee,Naushad Variam,Johannes M. van Meer. Владелец: Applied Materials Inc. Дата публикации: 2024-08-08.

Tri azole- and/or tri azoli um-based polymers and copolymers as additives for chemical mechanical planarization slurries

Номер патента: EP4408944A1. Автор: Xiaobo Shi,Peer Kirsch,Matthias Stender,Matthias Hengst,Gregor Larbig. Владелец: Versum Materials US LLC. Дата публикации: 2024-08-07.

Chemical-mechanical-planarization (cmp) slurry quality control process and particle size distribution measuring systems

Номер патента: WO1999056106A9. Автор: Todd A Cerni,Scott Waisanen,Dennis Knowlton. Владелец: Particle Measuring Syst. Дата публикации: 2000-01-27.

Chemical-mechanical-planarization (cmp) slurry quality control process and particle size distribution measuring systems

Номер патента: EP1076814A1. Автор: Todd A. Cerni,Scott Waisanen,Dennis Knowlton. Владелец: Particle Measuring Systems Inc. Дата публикации: 2001-02-21.

Chemical-mechanical starch conversion

Номер патента: CA1117107A. Автор: Thomas L. Small,Richard D. Harvey,Thomas L. Gallaher,Raymond L. Mullikin. Владелец: Grain Processing Corp. Дата публикации: 1982-01-26.

Method for production of chemical-mechanical wood mass

Номер патента: RU2401350C2. Автор: Кай Эрик Йоханнес ВИКМАН,Майя ПИТКЯНЕН,Пирита СУОРТАМО,Оле НИКУЛЛ,Аули ЛАУРИЛА-ЛУММЕ. Владелец: М-Риал Ойй. Дата публикации: 2010-10-10.

Tri azole- and/or tri azoli um-based polymers and copolymers as additives for chemical mechanical planarization slurries

Номер патента: WO2023056324A1. Автор: Xiaobo Shi,Peer Kirsch,Matthias Stender,Matthias Hengst,Gregor Larbig. Владелец: Versum Materials US, LLC. Дата публикации: 2023-04-06.

Stable chemical mechanical planarization polishing compositions and methods for high rate silicon oxide removal

Номер патента: WO2023178003A1. Автор: LU Gan,Maitland GRAHAM,Ramon BERNASCONI,Maxwell WARNEKE. Владелец: Versum Materials US, LLC. Дата публикации: 2023-09-21.

Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography

Номер патента: US11884859B2. Автор: Agnes Derecskei,Matthias Stender,Bradley J. Brennan. Владелец: Versum Materials US LLC. Дата публикации: 2024-01-30.

Polycationic polymer or copolymer having different cation types for slurries in chemical mechanical planarization

Номер патента: WO2023201189A1. Автор: Xiaobo Shi,Matthias Hengst,Gregor Larbig. Владелец: Versum Materials US, LLC. Дата публикации: 2023-10-19.

Modified water-soluble polysaccharides having different cation types for slurries in chemical mechanical planarization

Номер патента: WO2024073209A1. Автор: Xiaobo Shi,Gregor Larbig,Inbal DAVIDI,Sana MA. Владелец: Versum Materials US, LLC. Дата публикации: 2024-04-04.

Phosphonium based polymers and copolymers as additives for chemical mechanical planarization slurries

Номер патента: EP4352120A1. Автор: Xiaobo Shi,Matthias Stender,Gregor Larbig,Inbal DAVIDI. Владелец: Versum Materials US LLC. Дата публикации: 2024-04-17.

Chemical mechanical planarization (cmp) for copper and through-silicon via (tsv)

Номер патента: EP4259736A1. Автор: Xiaobo Shi,Hongjun Zhou,Rung-Je Yang,Robert Vacassy,Keh-Yeuan LI,Ming Shih Tsai. Владелец: Versum Materials US LLC. Дата публикации: 2023-10-18.

Method of chemical-mechanical treatment of waste waters from operation of tanneries

Номер патента: WO2010009684A1. Автор: Artur BRODSKΫ,Jan NOVOTNΫ,Vetezslav Mazur,Sosorbaramy Altangerel,Yundendorjiin Enkhbold. Владелец: Eurosound Spol. S.R.O.. Дата публикации: 2010-01-28.

Bottom leads chemical mechanical planarization for tmr magnetic sensors

Номер патента: WO2021040806A1. Автор: Ming Jiang,Ronghui ZHOU,Yuankai Zheng,Ming Mao,Chih-Ching Hu,Yung-Hung Wang,Chen-Jung Chien. Владелец: WESTERN DIGITAL TECHNOLOGIES, INC.. Дата публикации: 2021-03-04.

Methods for reducing scratch defects in chemical mechanical planarization

Номер патента: US20230377898A1. Автор: William Weilun HONG,Ying-Tsung Chen,Wan-Chun Pan. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2023-11-23.

Chemical Mechanical Planarization (CMP) For Copper And Through-Silicon Via (TSV)

Номер патента: US20240006189A1. Автор: Xiaobo Shi,Hongjun Zhou,Rung-Je Yang,Robert Vacassy,Keh-Yeuan LI,Ming Shih Tsai. Владелец: Versum Materials US LLC. Дата публикации: 2024-01-04.

Bottom Leads Chemical Mechanical Planarization for TMR Magnetic Sensors

Номер патента: US20210057638A1. Автор: Ming Jiang,Ronghui ZHOU,Yuankai Zheng,Ming Mao,Chih-Ching Hu,Yung-Hung Wang,Chen-Jung Chien. Владелец: Western Digital Technologies Inc. Дата публикации: 2021-02-25.

Electrochemical-mechanical polishing composition and method for using the same

Номер патента: WO2005118736A1. Автор: Jian Zhang,David Schroeder,Vlasta Brusic,Michael Richardson. Владелец: Cabot Microelectronics Corporation. Дата публикации: 2005-12-15.

Method for manufacturing magnetic-disk substrate, method for manufacturing magnetic disk, raw material for polishing pad, and method for manufacturing substrate

Номер патента: MY182511A. Автор: Yuji YAMASHIRO,Takumi Kuhara. Владелец: Hoya Corp. Дата публикации: 2021-01-25.

Patterning method of lift-off using mechanical polishing

Номер патента: KR101814277B1. Автор: 이진균,손종찬. Владелец: 인하대학교 산학협력단. Дата публикации: 2018-01-02.

Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method

Номер патента: US20080318427A1. Автор: Hirotaka Shida,Kazuhito Uchikura,Eiichirou KUNITANI. Владелец: JSR Corp. Дата публикации: 2008-12-25.

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Номер патента: US8470195B2. Автор: Hirotaka Shida,Kazuhito Uchikura,Eiichirou KUNITANI. Владелец: JSR Corp. Дата публикации: 2013-06-25.

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Номер патента: KR101469994B1. Автор: 가즈히또 우찌꾸라,히로따까 시다,에이이찌로 구니따니. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2014-12-05.

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Номер патента: EP2017318A3. Автор: Hirotaka Shida,Kazuhito Uchikura,Eiichirou KUNITANI. Владелец: JSR Corp. Дата публикации: 2010-01-13.

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Номер патента: EP2017318B1. Автор: Eiichirou c/o JSR Corporation Kunitani,Hirotaka c/o JSR Corporation Shida,Kazuhito c/o JSR Corporation Uchikura. Владелец: JSR Corp. Дата публикации: 2012-05-30.

Preparation set for chemical mechanical polishing aqueous dispersion, preparation method for chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method

Номер патента: TW200900491A. Автор: Hirotaka Shida,Kazuhito Uchikura,Eiichirou KUNITANI. Владелец: JSR Corp. Дата публикации: 2009-01-01.

EROSION INHIBITOR FOR CHEMICAL MECHANICAL POLISHING, SLURRY FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD

Номер патента: US20140154884A1. Автор: Kato Shinya,KATO Mitsuru,OKAMOTO Chihiro,TAKEGOSHI Minori. Владелец: KURARAY CO., LTD.. Дата публикации: 2014-06-05.

Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion

Номер патента: EP1724317B1. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Kazuhito Uchikura. Владелец: JSR Corp. Дата публикации: 2008-10-22.

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Номер патента: EP1724317A1. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Kazuhito Uchikura. Владелец: JSR Corp. Дата публикации: 2006-11-22.

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Номер патента: US8480920B2. Автор: Hirotaka Shida,Akihiro Takemura,Taichi Abe. Владелец: JSR Corp. Дата публикации: 2013-07-09.

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Номер патента: US20090291620A1. Автор: Masayuki Motonari,Eiichirou KUNITANI,Atsushi Baba,Shoei Tsuji. Владелец: JSR Corp. Дата публикации: 2009-11-26.

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Номер патента: US8262435B2. Автор: Masayuki Motonari,Eiichirou KUNITANI,Atsushi Baba,Shoei Tsuji. Владелец: JSR Corp. Дата публикации: 2012-09-11.

Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device

Номер патента: US20100221918A1. Автор: Hirotaka Shida,Akihiro Takemura,Mitsuru Meno,Yuuji Shimoyama. Владелец: JSR Corp. Дата публикации: 2010-09-02.

Aqueous dispersion for chemical mechanical polishing and method for preparing the same, kit for preparing aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method for semiconductor device

Номер патента: WO2009031389A1. Автор: Hirotaka Shida,Akihiro Takemura,Mitsuru Meno,Yuuji Shimoyama. Владелец: JSR Corporation. Дата публикации: 2009-03-12.

Chemical mechanical polishing aqueous dispersion and preparation method thereof, kit for preparing chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method of semiconductor device

Номер патента: JPWO2009031389A1. Автор: 裕貴 仕田,充 目野,彰浩 竹村,裕司 下山. Владелец: JSR Corp. Дата публикации: 2010-12-09.

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Номер патента: US20060276041A1. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Kazuhito Uchikura. Владелец: JSR Corp. Дата публикации: 2006-12-07.

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Номер патента: KR101248708B1. Автор: 마사유끼 하또리,노부오 가와하시,가즈히또 우찌꾸라. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2013-03-28.

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Номер патента: EP2123726A1. Автор: Masayuki Motonari,Eiichirou KUNITANI,Atsushi Baba,Shoei Tsuji. Владелец: JSR Corp. Дата публикации: 2009-11-25.

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Номер патента: EP1700893B1. Автор: Nobuo JSR Corporation Kawahashi,Masayuki Hattori,Kazuhito JSR CORPORATION Uchikura. Владелец: JSR Corp. Дата публикации: 2008-10-01.

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Номер патента: JP5408437B2. Автор: 裕貴 仕田,彰浩 竹村. Владелец: JSR Corp. Дата публикации: 2014-02-05.

Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing

Номер патента: US20040132305A1. Автор: Akihiro Takemura,Masayuki Hattori,Atsushi Shigeta,Nobuo Kawahashi,Kazuo Nishimoto,Naoto Miyashita,Tatsuaki Sakano,Yoshitaka Matsui,Kazuhiko Ida. Владелец: JSR Corp. Дата публикации: 2004-07-08.

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Номер патента: US7005382B2. Автор: Akihiro Takemura,Masayuki Hattori,Atsushi Shigeta,Nobuo Kawahashi,Kazuo Nishimoto,Naoto Miyashita,Tatsuaki Sakano,Yoshitaka Matsui,Kazuhiko Ida. Владелец: JSR Corp. Дата публикации: 2006-02-28.

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Номер патента: WO2009133793A1. Автор: 裕貴 仕田,英一郎 國谷,崇文 清水,馬場　淳. Владелец: Jsr株式会社. Дата публикации: 2009-11-05.

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Номер патента: TWI296282B. Автор: Akihiro Takemura,Masayuki Hattori,Atsushi Shigeta,Nobuo Kawahashi,Kazuo Nishimoto,Naoto Miyashita,Tatsuaki Sakano,Yoshitaka Matsui,Kazuhiko Ida. Владелец: Toshiba Kk. Дата публикации: 2008-05-01.

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Номер патента: US20100252774A1. Автор: Hirotaka Shida,Akihiro Takemura,Taichi Abe. Владелец: JSR Corp. Дата публикации: 2010-10-07.

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Номер патента: EP1416025A1. Автор: Akihiro Takemura,Masayuki Hattori,Atsushi Shigeta,Nobuo Kawahashi,Kazuo Nishimoto,Naoto Miyashita,Tatsuaki Sakano,Yoshitaka Matsui,Kazuhiko Ida. Владелец: JSR Corp. Дата публикации: 2004-05-06.

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Номер патента: WO2009098951A1. Автор: Hirotaka Shida,Akihiro Takemura. Владелец: JSR Corporation. Дата публикации: 2009-08-13.

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Номер патента: TW200734435A. Автор: Masayuki Motonari,Eiichirou KUNITANI. Владелец: JSR Corp. Дата публикации: 2007-09-16.

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Номер патента: US20060201914A1. Автор: Masayuki Hattori,Nobuo Kawahashi,Kazuhito Uchikura. Владелец: JSR Corp. Дата публикации: 2006-09-14.

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Номер патента: KR101610976B1. Автор: 히로타카 시다,다카후미 시미즈,아츠시 바바,에이치로 구니타니. Владелец: 제이에스알 가부시끼가이샤. Дата публикации: 2016-04-08.

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Номер патента: KR100729267B1. Автор: 홍창기,최석헌,손윤호,정용주,임동현,고화영,허장은. Владелец: 삼성전자주식회사. Дата публикации: 2007-06-15.

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Номер патента: TW200700545A. Автор: Masayuki Hattori,Tomohisa Konno,Nobuo Kawahashi,Kazuhito Uchikura. Владелец: JSR Corp. Дата публикации: 2007-01-01.

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Номер патента: TW201000614A. Автор: Hirotaka Shida,Takafumi Shimizu,Eiichirou KUNITANI,Atsushi Baba. Владелец: JSR Corp. Дата публикации: 2010-01-01.

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