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  • Managing virtual boundaries to enable lock-free concurrent region optimization of an integrated circuit

Managing virtual boundaries to enable lock-free concurrent region optimization of an integrated circuit

Номер патента: US09639654B2
Опубликовано: 02-05-2017
Автор(ы): Alexander J. Suess, Bijian Chen, David J. Hathaway, Jeffrey S. Piaget, Kerim Kalafala, Nathaniel D. Hieter
Принадлежит: International Business Machines Corp
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Integrated circuits with standard cell

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Integrated circuit for driving semiconductor device and power converter

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Power grid layout techniques on integrated circuits

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System and method for implementing and managing virtual networks

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Semiconductor integrated circuit

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Integrated circuit apparatus

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Driving circuit, integrated circuit, and liquid discharge apparatus

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Apparatus and method for direct power delivery to integrated circuit package

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Thermal modulation of an electronic device

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Method of making air bridges as interelectrode connections of integrated circuits

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On-chip emf isolation of an integrated circuit coupled with photoconductive semiconductor switch under an on-chip faraday cage

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Integrated circuit chip and package

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Fabrication method, varactor, and integrated circuit

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Method for making a solder between metallic balls of an electronic component andmounting lands of a circuit and soldering furnace therefor

Номер патента: AU2002217225A1. Автор: Claude Bonet. Владелец: LAir Liquide SA a Directoire et Conseil de Surveillance pour lEtude et lExploitation des Procedes Georges Claude. Дата публикации: 2002-06-24.

Interconnect structures for integrated circuits and their formation

Номер патента: US20160042995A1. Автор: Vishal Sipani,Ming-chuan Yang,Tyler G. HANSEN. Владелец: Micron Technology Inc. Дата публикации: 2016-02-11.

Air-Core Transformer Package with Ferrite Electro-Magnetic Interference (EMI) Shielding of Integrated-Circuit (IC) Chip

Номер патента: US20230290736A1. Автор: Chik Wai (David) Ng,Wai Kit (Victor) SO,Kwun Yuan (Godwin) HO,Ki Hin (Gary) CHOI,Tin Ho (Andy) Wu. Владелец: High Tech Technology Ltd. Дата публикации: 2023-09-14.

Transfer molding of integrated circuit packages

Номер патента: US20050275091A1. Автор: Marie-Claude Paquet,Catherine Dufort,Marie-France Boyaud,Real Tetreault. Владелец: International Business Machines Corp. Дата публикации: 2005-12-15.

Manufacturing method and integrated circuit having a light path to a pixilated element

Номер патента: WO2009113004A2. Автор: Benoit Bataillou,Viet Nguyen Hoang,Radu Surdeanu. Владелец: NXP B.V.. Дата публикации: 2009-09-17.

Integrated circuit package system with leadframe substrate

Номер патента: SG142329A1. Автор: Cheonhee Lee,Youngnam Choi. Владелец: Stats Chippac Ltd. Дата публикации: 2008-05-28.

Integrated circuit to dielectric substrate transition

Номер патента: EP4395066A2. Автор: Ekrem Oran,Fatih Kocer,Arun Raj,Santosh Anil Kudtarkar,Christoph Maximilian STEINBRECHER,Sacid Oruc. Владелец: Analog Devices International ULC. Дата публикации: 2024-07-03.

Integrated circuit assembly cleaning apparatus and method

Номер патента: US20020134408A1. Автор: John Pratt,William Hanna,Pamela Christison,Lawrence Houdek,Russell Bjorlie,Perry Pierce. Владелец: AGILENT TECHNOLOGIES INC. Дата публикации: 2002-09-26.

Electronic device for regulating a variable capacitance of an integrated circuit

Номер патента: US20110074221A1. Автор: Germano Nicollini,Pierangelo Confalonieri,Federico Guanziroli. Владелец: STMICROELECTRONICS SRL. Дата публикации: 2011-03-31.

Efficient power management method in integrated circuit through a nanotube structure

Номер патента: US20110039398A1. Автор: Jonathan Byrn. Владелец: LSI Corp. Дата публикации: 2011-02-17.

Integrated circuits using guard rings for esd systems, and methods for forming the integrated circuits

Номер патента: US20170186741A9. Автор: Ming-Song Sheu,Jian-Hsing Lee,Yu-Chang Jong,Chun-Chien Tsai. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-06-29.

Integrated circuits using guard rings for esd systems, and methods for forming the integrated circuits

Номер патента: US20140299913A1. Автор: Ming-Song Sheu,Jian-Hsing Lee,Yu-Chang Jong,Chun-Chien Tsai. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2014-10-09.

Integrated circuits using guard rings for ESD systems, and methods for forming the integrated circuits

Номер патента: US9748361B2. Автор: Ming-Song Sheu,Jian-Hsing Lee,Yu-Chang Jong,Chun-Chien Tsai. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2017-08-29.

Etchant compositions for metal-containing films and methods of manufacturing integrated circuit devices using the etchant compositions

Номер патента: US20210115334A1. Автор: Kihun Song,Hyosan Lee,Minjung Kim,Jungmin Oh,Hyojoong YOON,Jongwook Baek. Владелец: Dongwoo Fine Chem Co Ltd. Дата публикации: 2021-04-22.

Direct cooling device for integrated circuit and manufacturing method thereof

Номер патента: US20240266253A1. Автор: Hyun Wook Jung,Jong Won Lim,Min Soo Kang,Sung Jae Chang,Ho Kyun Ahn,Sang Heung LEE,Hae Cheon Kim,Seong Il Kim,Hyoung Soon Lee,Il Gyu CHOI,Jun Rae PARK. Владелец: Republic Of Korea Defense Acquisition Program Administration. Дата публикации: 2024-08-08.

Integrated circuit and power supply circuit

Номер патента: US12095380B2. Автор: Shinji Matsumoto. Владелец: Fuji Electric Co Ltd. Дата публикации: 2024-09-17.

Integrated circuit connection using an electrically conductive adhesive

Номер патента: EP1062848A2. Автор: Steve Garcia. Владелец: Medallion Tech LLC. Дата публикации: 2000-12-27.

Integrated circuit to dielectric substrate transition

Номер патента: EP4395066A3. Автор: Ekrem Oran,Fatih Kocer,Arun Raj,Santosh Anil Kudtarkar,Christoph Maximilian STEINBRECHER,Sacid Oruc. Владелец: Analog Devices International ULC. Дата публикации: 2024-09-25.

Integrated circuit power device with automatic removal of defective devices

Номер патента: WO1991018417A1. Автор: Bantval Jayant Baliga. Владелец: North Carolina State University. Дата публикации: 1991-11-28.

Through-silicon via layout for multi-die integrated circuits

Номер патента: US12107076B2. Автор: Edward Chang,Alan D. Smith,Jasmeet Singh Narang,John Wuu,Wonjun Jung,Tyrone HUANG,Christopher KLEMENT. Владелец: Advanced Micro Devices Inc. Дата публикации: 2024-10-01.

Integrated circuit packages to minimize stress on a semiconductor die

Номер патента: US20240304569A1. Автор: Bernard Stenson,Padraig Liam FITZGERALD,Michael John Flynn,Michael James TWOHIG,Oliver Kierse,Laurence Brendan O'Sullivan,Ramji Sitaraman Lakshmanan et al.. Владелец: Analog Devices International ULC. Дата публикации: 2024-09-12.

Integrated circuit device and fabrication method thereof

Номер патента: US12132011B2. Автор: PURAKH Raj Verma,Chia-Huei Lin,Kuo-Yuh Yang,Chu-Chun Chang. Владелец: United Microelectronics Corp. Дата публикации: 2024-10-29.

Method and device for removing integrated circuits

Номер патента: US09987836B2. Автор: Wei Wang,LONG Yan,Jun Zhang,Yong Sun,Daocheng Zhu,Zhiyu QIAN,Xianzhen TANG. Владелец: Hefei Xinsheng Optoelectronics Technology Co Ltd. Дата публикации: 2018-06-05.

Integrated circuit having slot via and method of forming the same

Номер патента: US09984964B2. Автор: Wei-Cheng Lin,Jiann-Tyng Tzeng,Charles Chew-Yuen Young,Praneeth NARAYANASETTI. Владелец: Taiwan Semiconductor Manufacturing Co TSMC Ltd. Дата публикации: 2018-05-29.

Improvement in the Manner of Folding Letter Paper, Circulars, At Home Cards and the like to enable same to be Folded and Secured ready for Transmission without the use of an Envelope.

Номер патента: GB190406495A. Автор: James Coulthred Thompson,Sydney Edwin Thomas. Владелец: Individual. Дата публикации: 1905-02-16.

Power control of an integrated circuit memory

Номер патента: US20120002499A1. Автор: Chong Yew Keong,Kinkade Martin Jay,Yeung Gus. Владелец: . Дата публикации: 2012-01-05.

Systems and Methods for Minimizing Static Leakage of an Integrated Circuit

Номер патента: US20120001684A1. Автор: Caplan Randy J.,Schwake Steven J.. Владелец: MOSAID TECHNOLOGIES INCORPORATED. Дата публикации: 2012-01-05.

Method for Packaging Electronic Devices and Integrated Circuits

Номер патента: US20120003791A1. Автор: . Владелец: WAFER-LEVEL PACKAGING PORTFOLIO LLC. Дата публикации: 2012-01-05.

IMAGE CODING APPARATUS, IMAGE CODING METHOD, PROGRAM, AND INTEGRATED CIRCUIT

Номер патента: US20120002022A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

INTEGRATED CIRCUIT DEVICE WITH WELL CONTROLLED SURFACE PROXIMITY AND METHOD OF MANUFACTURING SAME

Номер патента: US20120001238A1. Автор: Ouyang Hui,Fan Wei-Han,Tsai Ming-Huan,Cheng Chun-Fai. Владелец: Taiwan Semiconductor Manufacturing Company, Ltd.. Дата публикации: 2012-01-05.

FREQUENCY SPECIFIC CLOSED LOOP FEEDBACK CONTROL OF INTEGRATED CIRCUITS

Номер патента: US20120001651A1. Автор: Burr James B.,Koniaris Kleanthes G.. Владелец: . Дата публикации: 2012-01-05.

GATE ELECTRODE AND GATE CONTACT PLUG LAYOUTS FOR INTEGRATED CIRCUIT FIELD EFFECT TRANSISTORS

Номер патента: US20120001271A1. Автор: YAMADA Satoru,Chae Kyo-Suk,CHOI Young-Jin,Kim Wook-Je,HAN Sang-Yeon. Владелец: . Дата публикации: 2012-01-05.

ARRANGEMENT FOR SENSING WEIGHT OF AN OCCUPYING ITEM IN A VEHICULAR SEAT

Номер патента: US20120001463A1. Автор: Breed David S.,Johnson Wendell C.,DuVall Wilbur E.. Владелец: . Дата публикации: 2012-01-05.

RETRIEVAL SOCK ATTACHABLE TO AN ASSOCIATED RETAINING PLATE AND FLOOR PLATE OF AN AMMUNITION MAGAZINE

Номер патента: US20120000107A1. Автор: Philbin Kevin. Владелец: . Дата публикации: 2012-01-05.

REPRODUCER, INTEGRATED CIRCUIT, REPRODUCTION METHOD, APPLICATION PROGRAM, RECORDING MEDIUM, RECORDER, AND RECORDING METHOD

Номер патента: US20120002949A1. Автор: Sasaki Taiji,Matsuura Yasuyuki,Kiyosawa Yuta,Matsumoto Tomohiro. Владелец: . Дата публикации: 2012-01-05.

METHOD OF FABRICATING AN INTEGRATED CIRCUIT DEVICE

Номер патента: US20120003806A1. Автор: . Владелец: Taiwan Semiconductor Manufacturing Company, Ltd.. Дата публикации: 2012-01-05.

IMAGE MANAGEMENT DEVICE, IMAGE MANAGEMENT METHOD, PROGRAM, RECORDING MEDIUM, AND INTEGRATED CIRCUIT

Номер патента: US20120002881A1. Автор: . Владелец: . Дата публикации: 2012-01-05.

Integrated circuit housing

Номер патента: RU2457575C2. Автор: Алексей Викторович Горьков,Вячеслав Сергеевич Серегин,Лариса Владимировна Пилавова,Вячеслав Леонидович Троицкий. Владелец: ЗАО "Научно-производственное объединение "НИИТАЛ". Дата публикации: 2012-07-27.

METHOD AND SYSTEM FOR ALIGNMENT OF INTEGRATED CIRCUITS

Номер патента: US20120001340A1. Автор: . Владелец: GENERAL ELECTRIC COMPANY. Дата публикации: 2012-01-05.

INTEGRATED CIRCUIT WAFER DICING METHOD

Номер патента: US20120003817A1. Автор: Lin Ching-San,Wu Kun-Tai,Wang Chih-Chao. Владелец: . Дата публикации: 2012-01-05.

Integrated circuit device for implementing a distributed, ledger-based processing and recording of an electronic financial transaction

Номер патента: PH22016050001U1. Автор: Renato C Valencia. Владелец: Renato C Valencia. Дата публикации: 2017-06-02.

Integrated circuit device for implementing a distributed, ledger-based processing and recording of an electronic financial transaction

Номер патента: PH22016050001Y1. Автор: Renato C Valencia. Владелец: Renato C Valencia. Дата публикации: 2017-06-02.

OPTIMIZATION OF MULTIPLE CANDIDATES IN MEDICAL DEVICE OR FEATURE TRACKING

Номер патента: US20120004533A1. Автор: . Владелец: Slemens Corporation. Дата публикации: 2012-01-05.

Supply mechanism for the chuck of an integrated circuit dicing device

Номер патента: SG140606A1. Автор: Yang Hae Choon. Владелец: ROKKO SYSTEMS PTE LTD. Дата публикации: 2008-03-28.

Method for determination of heat-transfer resistance for digital integrated circuits

Номер патента: RU2490657C2. Автор: Вячеслав Андреевич Сергеев,Виктор Васильевич Юдин,Владимир Александрович Ламзин. Владелец: Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Ульяновский государственный технический университет". Дата публикации: 2013-08-20.

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