Enhanced base die heat path using through-silicon vias

27-04-2023 дата публикации

Номер:

US20230128903A1

Автор: Aaron MCCANN, Kyle Arrington, Nicholas Neal, Shankar Devasenathipathy, Weston Bertrand, Zhimin Wan

Принадлежит: Intel Corp

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L22 H01L222 H01L2224 H01L2224/H01L2224/1 H01L2224/16 H01L2224/161 H01L2224/1614 H01L2224/16145 H01L2224/7 H01L2224/73 H01L2224/732 H01L2224/7325 H01L2224/73253 H01L2225 H01L2225/H01L2225/0 H01L2225/06 H01L2225/065 H01L2225/0651 H01L2225/06513 H01L2225/06517 H01L2225/0656 H01L2225/06562 H01L2225/0658 H01L2225/06589 H01L23 H01L23/H01L23/3 H01L23/31 H01L23/310 H01L23/3107 H01L23/36 H01L23/367 H01L23/3672 H01L23/3675 H01L23/3677 H01L23/37 H01L23/373 H01L23/3736 H01L23/3738 H01L23/4 H01L23/42 H01L23/43 H01L23/433 H01L23/48 H01L23/481 H01L23/49 H01L23/498 H01L23/4982 H01L23/49827 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0652 H01L25/0657 H01L25/1 H01L25/18

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/3 H01L23/36 H01L23/367 H01L23/3677 H01L23/4 H01L23/42 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0657

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