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Semiconductor chip mounting body, method of manufacturing semiconductor chip mounting body and electronic device

Номер патента: US20100244224A1
Опубликовано: 30-09-2010
Автор(ы): Akihiko Happoya, Akira Tanaka, Minoru Takizawa, Mitsuyoshi Tanimoto
Принадлежит: Toshiba Corp
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