Free-edge semiconductor chip bending
Номер патента: EP3278363A1
Опубликовано: 07-02-2018
Автор(ы): Andrew Keefe, Geoffrey P. Mcknight, Guillermo Herrera
Принадлежит: Microsoft Technology Licensing LLC
Опубликовано: 07-02-2018
Автор(ы): Andrew Keefe, Geoffrey P. Mcknight, Guillermo Herrera
Принадлежит: Microsoft Technology Licensing LLC
Реферат: Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.
Free-edge semiconductor chip bending
Номер патента: WO2016161223A1. Автор: Andrew Keefe,Guillermo Herrera,Geoffrey P. Mcknight. Владелец: Microsoft Technology Licensing, LLC. Дата публикации: 2016-10-06.