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Номер патента: CN114227528A
Опубликовано: 25-03-2022
Автор(ы): 段贤明, 熊超
Принадлежит: Yangtze Memory Technologies Co Ltd
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Temperature control in chemical mechanical polish

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Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing

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Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing

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Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

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