ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE
22-12-2005 дата публикации
Номер:
WO2005121266A1
Автор: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi, KATOGI, Shigeki, SUTOU, Houko, IZAWA, Hiroyuki, SHIRASAKA, Toshiaki, YUSA, Masami, KOBAYASHI, Takanobu
Принадлежит: Hitachi Chemical Co., Ltd.
Контакты:
Номер заявки: JP04-01-200597
Дата заявки: 08-06-2005
Disclosed is an adhesive composition containing a thermoplastic resin, a radically polymerizable compound, a radical polymerization initiator and a radical polymerization modifier. The adhesive composition can be cured sufficiently quickly at low temperatures while exhibiting sufficiently stable adhesion strength, and has a wide process margin for curing. Also disclosed are a circuit connecting material, a connecting structure for circuit members and a semiconductor device.[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38]
