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Methods of packaging semiconductor devices and packaged semiconductor devices

Номер патента: US09406650B2
Опубликовано: 02-08-2016
Автор(ы): Hung-Jung Tu, Shih-Hui Wang, Shin-puu Jeng, Tu-Hao Yu, Wen-Chih Chiou, Yu-Liang Lin
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Method of making interconnections for semiconductor device

Номер патента: RU2421847C1. Автор: Сергей Александрович Гаврилов,Сергей Владимирович Дубков,Дмитрий Геннадьевич Громов,Андрей Евгеньевич Миронов,Алексей Сергеевич Шулятьев. Владелец: Государственное образовательное учреждение высшего профессионального образования Московский государственный институт электронной техники (технический университет) (МИЭТ). Дата публикации: 2011-06-20.

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