Forming through-silicon-vias for multi-wafer integrated circuits

01-01-2012 дата публикации

Номер:

TW201201323A

Автор: Bin Xie, Pui Chung Simon Law, Yat Kit Tsui

Принадлежит: Hk Applied Science & Tech Res

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/7 H01L21/76 H01L21/768 H01L21/7689 H01L21/76898 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/02 H01L2224/023 H01L2224/0237 H01L2224/02371 H01L2224/03 H01L2224/034 H01L2224/0345 H01L2224/05 H01L2224/055 H01L2224/0555 H01L2224/05558 H01L2224/056 H01L2224/0566 H01L2224/05666 H01L2224/08 H01L2224/081 H01L2224/0814 H01L2224/08145 H01L2224/2 H01L2224/24 H01L2224/241 H01L2224/2414 H01L2224/24145 H01L2224/7 H01L2224/73 H01L2224/732 H01L2224/7321 H01L2224/73217 H01L2224/8 H01L2224/80 H01L2224/808 H01L2224/8089 H01L2224/80896 H01L2224/82 H01L2224/821 H01L2224/8210 H01L2224/82101 H01L2224/9 H01L2224/94 H01L2224/97 H01L2225 H01L2225/H01L2225/0 H01L2225/06 H01L2225/065 H01L2225/0651 H01L2225/06513 H01L2225/0654 H01L2225/06541 H01L2225/0655 H01L2225/06551 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/481 H01L24 H01L24/H01L24/0 H01L24/03 H01L24/05 H01L24/2 H01L24/24 H01L24/8 H01L24/80 H01L24/82 H01L24/9 H01L24/94 H01L24/97 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0657 H01L25/5 H01L25/50 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/01 H01L2924/010 H01L2924/0102 H01L2924/01029 H01L2924/1 H01L2924/10 H01L2924/102 H01L2924/1025 H01L2924/10253 H01L2924/14

IPC - классификация

H H0 H01 H01L H01L2 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0657 H01L25/1 H01L25/10 H01L25/105 H01L25/5 H01L25/50

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