Methods of forming integrated circuit chips having vertically extended through-substrate vias therein

14-01-2014 дата публикации

Номер:

US8629059B2

Автор: Ho-Jin Lee, Ju-Il Choi, Kang-Wook Lee, Myeong-Soon Park, Son-Kwan Hwang

Принадлежит: SAMSUNG ELECTRONICS CO LTD

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/7 H01L21/76 H01L21/768 H01L21/7689 H01L21/76898 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/0404 H01L2224/04042 H01L2224/06 H01L2224/061 H01L2224/0618 H01L2224/06181 H01L2224/1 H01L2224/13 H01L2224/130 H01L2224/1300 H01L2224/13009 H01L2224/16 H01L2224/161 H01L2224/1614 H01L2224/16145 H01L2224/162 H01L2224/1622 H01L2224/16225 H01L2224/4 H01L2224/48 H01L2224/481 H01L2224/4814 H01L2224/48145 H01L2225 H01L2225/H01L2225/0 H01L2225/06 H01L2225/065 H01L2225/0651 H01L2225/06513 H01L2225/0654 H01L2225/06541 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/481 H01L23/5 H01L23/52 H01L23/522 H01L23/5226 H01L23/528 H01L25 H01L25/H01L25/0 H01L25/06 H01L25/065 H01L25/0657 H01L25/5 H01L25/50 H01L29 H01L292 H01L2924 H01L2924/H01L2924/1 H01L2924/15 H01L2924/153 H01L2924/1531 H01L2924/15311

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/481 H01L25 H01L25/H01L25/1 H01L25/10 H01L25/105 H01L25/5 H01L25/50

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