Semiconductor Fin cutting process and structures formed thereby

21-05-2024 дата публикации

Номер:

US0011990375B2

Автор: Shih-Wen Huang, Jaming Chang, Kai Hung Cheng, Chia-Hui Lin, Jei Ming Chen

Принадлежит: Taiwan Semiconductor Manufacturing Co., Ltd.

Контакты:

Номер заявки: 16-27-1785

Дата заявки: 29-06-2022

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/0 H01L21/02 H01L21/021 H01L21/0214 H01L21/02148 H01L21/0215 H01L21/02159 H01L21/0216 H01L21/02164 H01L21/0217 H01L21/02178 H01L21/0218 H01L21/02181 H01L21/02183 H01L21/02186 H01L21/02189 H01L21/022 H01L21/0228 H01L21/7 H01L21/76 H01L21/762 H01L21/7622 H01L21/76224 H01L21/768 H01L21/7683 H01L21/76831 H01L21/76837 H01L21/78 H01L21/8 H01L21/82 H01L21/823 H01L21/8234 H01L21/82343 H01L21/823431 H01L21/82348 H01L21/823481 H01L27 H01L27/H01L27/0 H01L27/08 H01L27/088 H01L27/0886 H01L29 H01L29/H01L29/0 H01L29/06 H01L29/065 H01L29/0653 H01L29/6 H01L29/66 H01L29/665 H01L29/6654 H01L29/66545 H01L29/6656 H01L29/667 H01L29/6679 H01L29/66795 H01L29/7 H01L29/78 H01L29/785 H01L29/7855

IPC - классификация

G G0 G01 G01S G01S1 G01S1/G01S1/6 G01S1/64 H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/0 H01L21/02 H01L21/7 H01L21/76 H01L21/762 H01L21/78 H01L21/8 H01L21/82 H01L21/823 H01L21/8234 H01L27 H01L27/H01L27/0 H01L27/08 H01L27/088 H01L27/1 H01L27/14 H01L27/148 H01L29 H01L29/H01L29/0 H01L29/06 H01L29/6 H01L29/66 H01L29/665 H01L29/6654 H01L29/66545

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